Claims
- 1. A pressure sensitive pre-cured adhesive having improved temperature adhesion at a temperature of at least 300.degree. F. prepared by heat curing of a composition comprising:
- a thermoplastic elastomeric component comprising about 50-100 parts of a diblock copolymer having the structure A-B and about 0-50 parts of a lineary or radial triblock copolymer having the structure A-B-A wherein A is a thermoplastic polymer block selected from the group consisting of styrene and styrene homologues and B is an elastomeric polymer block of isoprene, about 25-150 parts per 100 parts of a tackifier resin for said elastomeric component, and about 5-40 parts of a heat reactive phenolic resin curing agent for said adhesive, all of said parts being parts by weight of the thermoplastic elastomeric component.
- 2. The composition of claim 1 which comprises about 60-80 parts of the diblock copolymer and about 20-40 parts of the triblock copolymer per 100 parts by weight of the thermoplastic elastomeric component.
- 3. The composition of claim 1 wherein the styrene A-blocks comprise less than or equal to 25 percent by weight of the thermoplastic elastomeric component.
- 4. The composition of claim 1 wherein the styrene A-blocks constitute about 10-18 percent by weight of the diblock copolymer.
- 5. The composition of claim 1 wherein the A-blocks constitute about 5-25 percent by weight of the A-B-A triblock copolymer.
- 6. The composition according to claim 5 wherein the A-blocks constitute about 10-20 percent by weight of the A-B-A triblock copolymer.
- 7. The composition according to claim 1 wherein the curing agent is present in an amount of about 2-35 parts per 100 parts by weight of the thermoplastic elastomeric component.
- 8. The composition according to claim 7 wherein the curing agent is present in the amount of about 7-20 parts per 100 parts by weight of the thermoplastic elastomeric component.
- 9. The composition of claim 1 wherein said curing agent is a phenol-formaldehyde resin.
Parent Case Info
This application is a continuation of Ser. No. 08/140,762, filed Oct. 21, 1993, now abandoned.
US Referenced Citations (16)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0223879 |
Nov 1985 |
JPX |
Continuations (1)
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Number |
Date |
Country |
Parent |
140762 |
Oct 1993 |
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