Claims
- 1. An aqueous epoxy resin composition comprising an aqueous epoxy resin dispersion and/or water-dilutable poly-functional epoxide compounds and water, and a curing agent obtained by reaction of an adduct (A) of at least one polyepoxide (A.sub.1) and at least one polyalkylene polyether polyol (A.sub.2), with
- I. a reaction product of an amine (B) and an epoxide (C)
- or
- II. an amine (B), and subsequent reaction with an epoxide (C),
- the amount of amine (B) being chosen that the H atoms on the nitrogen are present in a 2- to 10-fold excess, based on the epoxide groups in (A).
- 2. The aqueous epoxy resin composition of claim 1 wherein the adduct (A) is modified with a secondary amine (A.sub.3) prior to the subsequent reaction.
- 3. The aqueous epoxy resin composition of claim 1 wherein the epoxide compounds (C) employed are aliphatic and/or cycloaliphatic mono- or diepoxides and/or aromatic monoepoxides in an equivalent ratio of reactive epoxide groups in (C) to N--H groups in (B) of (0.05-0.5):1.
- 4. The aqueous epoxy resin composition of claim 1 wherein the epoxide compounds (C) employed are at least one member of the group consisting of n-butyl glycidyl ether, 2-ethylhexyl glycidyl ether, cyclohexane dimethanol diglycidyl ether and polypropylene glycol diglycidyl ether, with the number of repeating polyoxypropylene units being from 2 to 12.
- 5. The aqueous epoxy resin composition of claim 1 wherein component (A.sub.1) is a water-insoluble polyepoxide compound and component (A.sub.2) is a water-soluble polyoxyalkylene glycol.
- 6. The aqueous epoxy resin composition of claim 2 wherein a (cyclo) aliphatic or araliphatic, secondary amine is employed as the secondary amine (A.sub.3) in an amount of up to 0.5 equivalent based on the epoxide groups contained in the adduct of (A.sub.1) and (A.sub.2).
- 7. The aqueous epoxy resin composition of claim 1 wherein the polyamine (B) is aliphatic, cycloaliphatic, araliphatic and/or heterocyclic amine, by themselves or as a mixture thereof.
- 8. The aqueous epoxy resin composition of claim 1 wherein the curing agent is brought to a solids content of 99-20% by weight with water.
- 9. The aqueous epoxy resin composition of claim 1 additionally containing paint additives selected from the group consisting of pigments, pigment pastes, fillers, antioxidants, preservatives, flow agents, thickeners, wetting agents, foam suppressants, reactive diluents, plasticizers, catalysts, protective colloids and acrylic dispersions.
- 10. The composition of claim 5 wherein (A.sub.1) is at least one member selected from the group consisting of the diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, cyclohexane dimethanol and the reaction product of bisphenol A and propylene oxide and component (A.sub.2) is polyethylene glycol.
- 11. The aqueous epoxy resin composition of claim 6 wherein the amount of (A.sub.3) is 0.02 to 0.25 equivalent.
- 12. The aqueous epoxy resin composition of claim 7 wherein the polyamine is at least one member of the group consisting of isophorone diamine, cyclcohexane diamine, m-xylene diamine and [5,2,1,0.sup.2,6 ]-tricyclodecane diamine.
Priority Claims (1)
Number |
Date |
Country |
Kind |
43 03 562.0 |
Feb 1993 |
DEX |
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PRIOR APPLICATION
This application is a division of U.S. patent application Ser. No. 192,868 filed Feb. 7, 1994, U.S. Pat. No. 5,539,023.
Divisions (1)
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Number |
Date |
Country |
Parent |
192868 |
Feb 1994 |
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