Patent Grant
10406557
Embodiments of the present disclosure relate to a curing apparatus and a curing method.
Flexible display is an important development direction of a next-generation display technology, and the Flexible display has characteristics such as good flexibility, no fragility, small thickness, small weight, low power consumption, good portability and so on, and has wide application prospect in these fields such as e-book, mobile communication, laptop computer, television, public information and so on.
A flexible substrate made of a PI (polyimide) adhesive for example is used as a base substrate for fabricating a flexible display device. A method for preparing the flexible substrate by using the PI adhesive is as follows: coating the PI adhesive on a glass substrate, and then sending the glass substrate into a curing chamber to cure the PI adhesive. During the curing process, in order to prevent organic substances from being oxidized and discharge organic gases generated in the PI adhesive in time, it is necessary to continuously supply a large amount of N2. During the curing process described above, it is very easy to produce an eddy in corners of the curing chamber and the like places, so that the organic gases in such positions are hard to be discharged, and further easily condense into particles on the flexible substrate, which results in defects of the flexible substrate.
According to embodiments of the disclosure, a curing apparatus is provided. The curing apparatus comprises: a chamber, configured for accommodating a substrate provided with a polyimide adhesive; an air extracting unit, configured for evacuating the chamber; and a heating unit, configured for performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber during a evacuating process of the air extracting unit so as to remove organic gases from the polyimide adhesive, and performing a second heating on the substrate after the first heating so as to cure the polyimide adhesive.
For example, the curing apparatus further comprises an air supplying unit, configured for supplying nitrogen to the chamber after the first heating and before the second heating, so that a second predetermined pressure is reached in the chamber.
For example, the second predetermined pressure is greater than the first predetermined pressure.
For example, the first predetermined pressure is 20 Pa to 30 Pa, and the second predetermined pressure is 1000 Pa to 2000 Pa.
For example, the curing apparatus further comprises a cooling unit, configured for cooling the substrate after the second heating.
For example, the cooling unit cools the substrate by circulating nitrogen in the chamber.
For example, the chamber includes an opening for placing and taking out the substrate and a shutting member for opening and closing the opening.
For example, the curing apparatus further comprises an air cylinder, wherein the shutting member opens and closes the opening under a control of the air cylinder.
For example, a sealing ring is provided on a periphery of the opening or the shutting member.
For example, the curing apparatus comprises the plurality of chambers in a stacked arrangement, each of the chambers configured for accommodating one substrate.
For example, the curing apparatus comprises a plurality of air extracting units, each of the chambers being connected with one air extracting unit.
For example, the curing apparatus further comprises a cooling unit, configured for cooling the substrate after the second heating.
For example, the cooling unit cools the substrate by circulating nitrogen in the plurality of chambers or circulating the nitrogen in each chamber.
For example, a temperature of the first heating is 200° C. to 300° C., and a temperature of the second heating is 400° C. to 500° C.
For example, the chamber is provided with an exhaust unit, and the exhaust unit is connected with the air extracting unit.
For example, the exhaust includes a plurality of exhausting pipes and a connecting part for connecting the plurality of exhausting pipes, a plurality of pores are distributed on each exhausting pipe, and the air extracting unit is connected with the connecting part.
According to the embodiments of the disclosure, a curing method is provided. The method comprises: placing a substrate provided with a polyimide adhesive into a chamber; evacuating the chamber; performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber in the process of evacuating the chamber, to remove organic gases from the polyimide adhesive; and performing a second heating on the substrate, to cure the polyimide adhesive.
For example, after the first heating and before the second heating, the method further comprises: supplying nitrogen to the chamber, so that a second predetermined pressure is reached in the chamber.
For example, after the second heating, the method further comprises: cooling the substrate.
In order to clearly illustrate the technical solution of the embodiments of the present disclosure, the drawings of the embodiments will be briefly described in the following; it is obvious that the described drawings are only related to some embodiments of the present disclosure and thus are not limitative of the present disclosure.
In order to make objects, technical details and advantages of the embodiments of the present disclosure apparent, the technical solutions of the embodiments will be described in a clearly and fully understandable way in connection with the drawings related to the embodiments of the present disclosure. It is obvious that the described embodiments are just a part but not all of the embodiments of the present disclosure. Based on the described embodiments herein, those skilled in the art can obtain other embodiment(s), without any inventive work, which should be within the scope of the present disclosure.
Embodiments of the present disclosure provide a curing apparatus, and the curing apparatus comprises: a chamber, configured for accommodating a substrate provided with a polyimide (PI) adhesive; an air extracting unit, configured for evacuating the chamber; a heating unit, configured for performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber during a evacuating process of the air extracting unit so as to remove organic gases from the PI adhesive, and performing a second heating on the substrate after the first heating so as to cure the PI adhesive.
In the curing apparatus according to the embodiments of the present disclosure, the process of removing organic gases from the PI adhesive is performed during evacuating the chamber by the air extracting unit, so that the organic gases can be discharged effectively. In this way, not only a possibility of the organic gases being condensed into particles can be effectively reduced, but also process time required for discharging the organic gases can be reduced, and a production cost can be greatly reduced for it is not necessary to continuously supply the nitrogen.
For example, the air extracting unit 2 is a vacuum pump. For example, the heating unit 3 is a heater of resistance type.
For example, the exhaust unit 11 is arranged on a top portion of the chamber 1.
A structure of the chamber 1 for example is shown in
For example, after the substrate 4 is placed in the chamber, the chamber is evacuated by the air extracting unit 2; in the case that the first predetermined pressure is reached in the chamber, the heating unit 3 performs the first heating on the substrate, so that the PI adhesive generates organic gases; in the process of performing the first heating, the chamber is continuously evacuated by the air extracting unit, so that the pressure in the chamber is kept and finally the organic gases anywhere in the chamber are discharged in time.
After the predetermined time, the organic gases in the PI adhesive are removed from the PI adhesive by the first heating. And then, the air extracting unit 2 stops evacuating the chamber; meanwhile, the heating unit continuously heats the substrate to perform the second heating to cure the PI adhesive.
For example, the curing apparatus in the embodiments of the present disclosure further comprises an air supplying unit 8, which is configured for supplying nitrogen to the chamber after the first heating and before the second heating, so that the second predetermined pressure is reached in the chamber; and the second predetermined pressure is greater than the first predetermined pressure. The nitrogen is supplied into the chamber by the air supplying unit 8 to serve as a transmitting medium of thermal energy, and thus it is easily to transmit the thermal energy to the substrate and cure the PI adhesive provided on the substrate. For example, the first predetermined pressure is 20 Pa to 30 Pa; for example, the first predetermined pressure is 22 Pa, 25 Pa, 28 Pa and so on. For example, the second predetermined pressure is 1000 Pa to 2000 Pa; for example, the second predetermined pressure is 1300 Pa, 1500 Pa, 1800 Pa and so on. For example, an air inlet is arranged on a side wall of the chamber, and the air supplying unit 8 supplies the nitrogen to the chamber through the air inlet, so that the pressure in the chamber is kept in the range of 1000 Pa to 2000 Pa.
For example, in order to further shortening the process time, the curing apparatus in the embodiments of the present disclosure further comprises a cooling unit, which is configured for cooling the substrate after the second heating.
Referring to
A lateral view of the heating furnace 100 is shown in
A cooling unit 5 is configured for cooling the substrate after the PI is cured. For example, the cooling unit 5 cools the substrate in a manner of circulating the nitrogen in the whole heating furnace or in a manner of circulating the nitrogen in each chamber, so that the pressure in the chamber is same as an external environment pressure. After the substrate is cooled, the opening of the chamber is opened, so as to take out the substrate.
The curing apparatus according to the embodiments of the present disclosure for example is applied to fabricate a flexible substrate. In the process of curing the PI adhesive, the process of removing the organic gases from the PI adhesive is performed during evacuating the chamber by the air extracting unit, so that the organic gases are discharged effectively, a possibility of the organic gases being condensed into particles is effectively reduced, and finally the quality of the PI adhesive is improved. The process of removing the organic gases from the PI adhesive is performed during evacuating the chamber by the air extracting unit, so that process time required for discharging the organic gases is reduced, and a production cost is greatly reduced for it is not necessary to continuously supply the nitrogen.
After curing the PI adhesive, the cured PI adhesive for example is used as a base substrate for fabricating a flexible display device, and the components (e.g., OLED) of the flexible display device are formed on the base substrate. As described above, since the quality of the cured PI adhesive is improved, the performance of the flexible display device is improved accordingly.
The embodiments of the present disclosure further provide a curing method, which comprises: placing a substrate provided with a polyimide (PI) adhesive into a chamber; evacuating the chamber; performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber in the process of evacuating the chamber, to remove organic gases from the PI adhesive; and performing a second heating on the substrate, to cure the PI adhesive.
The chamber is evacuated at the time of the first heating, and the chamber is not evacuated at the time of the second heating.
For example, after the first heating and before the second heating, the method further comprises: supplying nitrogen to the chamber, so that a second predetermined pressure is reached in the chamber. For example, the first predetermined pressure is 20 Pa to 30 Pa; for example, the first predetermined pressure is 22 Pa, 25 Pa, 28 Pa and so on. For example, the second predetermined pressure is 1000 Pa to 2000 Pa; for example, the second predetermined pressure is 1300 Pa, 1500 Pa, 1800 Pa and so on.
For example, after the second heating, the method further comprises: cooling the substrate. For example, cooling is performed in a manner of circulating the nitrogen.
The foregoing embodiments merely are exemplary embodiments of the present disclosure, and not intended to define the scope of the present disclosure, and the scope of the present disclosure is determined by the appended claims.
The present application claims priority of Chinese Patent Application No. 201510617156.9 filed on Sep. 24, 2015, the present disclosure of which is incorporated herein by reference in its entirety as part of the present application.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2015 1 0617156 | Sep 2015 | CN | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 6673155 | Nagashima | Jan 2004 | B2 |
| 20150323249 | Wang et al. | Nov 2015 | A1 |
| Number | Date | Country |
|---|---|---|
| 103008203 | Apr 2013 | CN |
| 103278966 | Sep 2013 | CN |
| 103707451 | Apr 2014 | CN |
| 103730331 | Apr 2014 | CN |
| 103949386 | Jul 2014 | CN |
| 2014-199806 | Oct 2014 | JP |
| Entry |
|---|
| Online translation of CN 103707451A; publication date: Apr. 9, 2014. |
| The First Chinese Office Action dated Apr. 18, 2017, Appln. No. 201510617156.9. |
| The Second Chinese Office Action dated Sep. 21, 2017; Appln. No. 201510617156.9. |
| Number | Date | Country | |
|---|---|---|---|
| 20170087587 A1 | Mar 2017 | US |
