Claims
- 1. An electrically conductive composite consisting essentially of:(1) an organic binder portion consisting essentially of: (a) a first liquid epoxy resin selected from the group consisting of novolac epoxy, bisphenol-A-based epoxy, and mixtures thereof; (b) a second liquid polyglycol epoxy; and (c) at least one epoxy curing agent; and (2) a conductive powder.
- 2. The composite according to claim 1, where the conductive powder comprises nickel powder.
- 3. The composite according to claim 1, wherein the first liquid epoxy resin of the organic binder portion is present in an amount of greater than 50% by weight of the organic binder portion and the polyglycol epoxy of the organic binder portion is present in an amount of less than 50% by weight of the organic binder portion.
- 4. The composite according to claim 1, wherein the at least one epoxy curing agent is selected from the group consisting of: acids, amines, anhydrides, and free radical initiators.
- 5. The composite according to claim 1, wherein the at least one epoxy curing agent comprises lewis acid catalyst.
- 6. The composite according to claim 1, wherein the at least one epoxy curing agent is present in an amount of less than 10% by weight of the electrically conductive composite.
- 7. The composite according to claim 1, wherein the conductive powder is present in an amount between 50% and 70% by weight of the electrically conductive composite.
- 8. The composite according to claim 1, wherein the conductive powder comprises nickel powder, the nickel powder possessing an average particle surface area of about 0.75 m2/g.
- 9. The composite according to claim 1, wherein the polyglycol epoxy is a polyglycol epoxy flexibilizer, the polyglycol epoxy flexibilizer being present in an amount less than 50% by weight of the organic binder portion.
- 10. A method of manufacturing an electrically conductive composite, the method comprising the steps of:(1) preparing an epoxy solution consisting essentially of an organic binder portion consisting essentially of: (a) a first liquid epoxy resin selected from the group consisting of novolac epoxy, bisphenol-A-based epoxy, and mixtures thereof; and (b) a second liquid polyglycol epoxy; (2) adding at least one epoxy curing agent and a conductive powder into the epoxy solution to form a mixture; and (3) processing the mixture in at least one equipment selected from the group consisting of a laminator, a press, a mixer, and an autoclave.
- 11. The method according to claim 10, wherein the step of adding the at least one epoxy curing agent and the conductive powder into the epoxy solution comprises mixing the at least one epoxy curing agent and the conductive powder into the epoxy solution.
- 12. The method according to claim 11, wherein the mixing is one of mixing by hand and mixing by a machine.
Parent Case Info
This application is a division of application Ser. No. 08/896,874 filed Jul. 21, 1997, now a U.S. Pat. No. 6,191,681 which is hereby incorporated by reference in its entirety.
US Referenced Citations (7)
Number |
Name |
Date |
Kind |
4780371 |
Joseph et al. |
Oct 1988 |
A |
5313184 |
Grueter et al. |
May 1994 |
A |
5378407 |
Chandler et al. |
Jan 1995 |
A |
5382938 |
Hansson et al. |
Jan 1995 |
A |
5614881 |
Duggal et al. |
Mar 1997 |
A |
5912308 |
Das et al. |
Jun 1999 |
A |
6191681 |
Cole et al. |
Feb 2001 |
B1 |
Foreign Referenced Citations (1)
Number |
Date |
Country |
0640995 |
Jun 1997 |
EP |