Information
-
Patent Grant
-
6265859
-
Patent Number
6,265,859
-
Date Filed
Monday, September 11, 200024 years ago
-
Date Issued
Tuesday, July 24, 200123 years ago
-
Inventors
-
Original Assignees
-
Examiners
- Wong; Peter S.
- Vu; Bao Q.
Agents
- Murphy, Exq.; James J.
- Winstead Sechrest & Minick
-
CPC
-
US Classifications
Field of Search
US
- 323 315
- 323 313
- 323 312
- 323 314
-
International Classifications
-
Abstract
A current mirror 100 includes a current mirroring transistor 103 having a selected aspect ratio for conducting a mirrored current of a selected mirroring ratio with respect to a reference current. A plurality of reference current transistors 201 are disposed in parallel with current mirroring transistor 103, each of the reference current transistors 201 having a current path coupled to a source 105 of the reference current and a selected aspect ratio. A switch 207 is coupled to a control terminal of a selected reference current transistor 201a, for selectively turning on and turning off a selected reference current transistor 201a to adjust the mirroring ratio.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates in general to electronic circuitry and in particular, to current mirroring circuitry and methods.
2. Description of the Related Art
Current mirrors have many applications, including those in analog circuits such as operational amplifiers, comparators, band gap references, and the like. In one common current mirroring technique, a reference current is generated and then replicated (mirrored) through parallel weighted current paths using a set of matched transistors of appropriate aspect ratios. The resulting set of graduated currents can then, for example, be used to bias or drive other circuits in the device in varying ratios.
One of the drawbacks of using parallel transistors in current mirrors is their sensitivity to such factors as power supply variation, operating temperature variation, and fabrication process tolerances. Temperature and power supply variation can cause the currents to drift from their nominal design values, unless suitable compensation is provided for making the current paths track with the temperature and power supply changes. Fabrication process variations can cause the conductance of the transistors, and hence the accuracy in the current mirroring, to vary from wafer to wafer or even between circuits on the same wafer. For example, even if the channel width to length ratios of the transistors are held well within design tolerances, other factors such as differences in oxide thickness, carrier mobility and carrier doping levels can still cause variation in transistor conductivity.
Given the usefulness of current mirrors in a wide range of electronic circuit applications, better techniques are needed for compensating for temperature, process, and/or power supply variation in circuits employing current mirrors.
SUMMARY OF THE INVENTION
According to the principles of the present invention, a current mirror is disclosed which includes a current mirroring transistor having a selected aspect ratio for conducting a mirrored current of a selected mirroring ratio with respects to a reference current. A plurality of reference current transistors are disposed in parallel with the current mirroring transistor, each of the reference current transistors having a current path coupled to a source of the reference current and a selected aspect ratio. A switch is coupled to a control terminal of a selected one of the reference current transistors for selectively turning on and turning off the selected reference current transistor to adjust the mirroring ratio.
The inventive concepts provide an efficient mechanism for compensating for fabrication process, variation in current sourcing devices. Among other things, these concepts can be used to tune the mirroring ratios in a current mirror such that a precise current mirroring is possible. Additionally, these concepts can be implemented using a minimum amount of additional hardware and can be applied on a device by device basis.
BRIEF DESCRIPTION OF THE DRAWINGS
For a more complete understanding of the present invention, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
FIG. 1
is a diagram of exemplary circuitry embodying current mirroring techniques according to the inventive concepts;
FIG. 2
shows in detail the reference current compensation circuitry;
FIG. 3
illustrates a preferred means of implementing switches; and
FIG. 4
depicts an exemplary non-volatile programmable element based on a polyfuse which is suitable for programming the final states of switches S
3
-S
4
.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The principles of the present invention and their advantages are best understood by referring to the illustrated embodiment depicted in
FIG. 1-4
of the drawings, in which like numbers designate like parts.
FIG. 1
is a diagram of exemplary circuitry
100
embodying current mirroring techniques according to the inventive concepts. Circuitry
100
includes a pair of analog circuit blocks
110
a
and
101
b
which could include, for example, operational amplifiers, comparators, analog to digital converters, digital to analog converters, or similar circuitry requiring graduated or differing current levels. It should be noted that blocks
101
could also comprise digital circuitry, or mixed analog-digital circuitry.
The illustrated current mirror comprises three matched p-channel transistors
102
-
104
and a reference current source
105
. Here, circuitry
100
operates from a high voltage rail at a voltage Vdd and a low voltage rail at ground. The gate source voltages of transistors
102
-
104
are set at voltage Vdd-Vb
1
, where Vb
1
is the chosen bias voltage. It should be recognized that in alternate embodiments, transistors
102
-
104
may be n-channel field effect transistors or bipolar devices.
For purposes of illustration, it will be assumed that the designed reference current I
REF
, as well as the current through transistor
102
, has a value I (i.e. I
REF
=I). Additionally, it will be assumed that the mirrored currents through transistors
103
and
104
have been respectively chosen to be
4
I and
6
I. (These values have been chosen for convenience and clarity in the present discussion, and may vary between actual applications). In the illustrated circuit, the channel width to length (aspect) ratios of transistors
102
-
104
are correspondingly m, 4 m, and 6 m. Thus, when the reference current I
REF
is made to flow through transistor
102
, the currents flowing through transistors
103
and
104
are correspondingly proportional as a function of their W/L ratios with respect to the W/L ratio of transistor
102
, since the gate- source voltages of all three transistors are identical.
According to the inventive principles, the mirroring ratios, and therefore the mirrored currents, are tuned for each current mirror on the wafer during wafer test. This capability is supported by reference current measurement circuitry
200
and mirrored currents compensation circuitry
211
, shown in detail in FIG.
2
. In the embodiment shown in
FIG. 2
, transistor
102
is constructed from a set of parallel p-channel transistors
201
a
-
201
e
which have length to width ratios which sum to some multiple of m given above in FIG.
1
. In this case, five transistors, each with a width to length ratio of 0.25 m, will be considered for discussion purposes. As discussed further below, the W/L ratio of transistor
102
is directly proportional to the combined W/L ratios of those transistors
201
which are turned-on and conducting in the operating mode.
Reference current measurement circuitry
200
comprises a first set of switches
202
-
203
, respectively labeled S
1
-S
2
, for disabling node
204
, at the sources of transistors
201
a
-
201
e
and gates of transistors
201
c
-
201
d
, from reference current source
105
and coupling the reference current source
105
to a test pint
206
. As will be discussed further, switches S
1
-S
2
enable measurement of the reference current I
REF
by an external tester
209
during a test mode.
A second set of switches,
207
and
208
, respectively labeled S
3
and S
4
, are provided for selectively coupling the gates of transistors
201
a
and
201
b
with Node
204
, and generally allow for adjustment of the mirrored ratios and tuning of the mirrored current.
With switch S
4
turned-on and switch S
3
turned-off, the overall circuit configuration is the same as shown in
FIG. 1
(i.e., the aspect ratios between transistors
102
-
104
are at their nominal values in m:4 m:6 m). On the other hand, when both switches S
3
and S
4
are turned-off, the W/L ratio of transistor
102
is only 0.75 m which results in the new mirroring ratios of 0.75 m:4 m: 6 m. The resulting currents through transistors
102
-
104
are now respectively I, 4/0.75 I and 6/0.75 I. Alternatively, with both switches S
3
and S
4
turned-on, the W/L ratio of transistor
102
becomes 1.25 m. In this case, the mirrored ratios for transistors
102
-
104
are 1.25 m:4 m 6 m leading to the corresponding mirrored currents of I:4/1.25 I:6/1.25 I. Hence, nearly a 25% increase or decrease in the desired mirror current is achieved for the case where transistors
201
each have a 0.25 m W/L ratio and two transistors
201
a,b
can be programmed to an on or off state.
During the test mode, switches S
1
and S
4
are turned-on and conducting. At the same time, switches S
2
and S
3
are turned-off. In this configuration, the current ratios are I:4I:6:I through transistors
102
-
104
respectively. External tester
209
is then used to measured the reference current I
REF
. The deviation of the reference current measured from the designed (expected) reference current can then be determined.
If the actual current flow deviates from the designed current flow, switches S
3
and S
4
then used to make the appropriate adjustment. For example, if the measured reference current is too high with respects to the designed value, then the current mirroring ratios must be lowered. In this case, switch S
3
is turned-on (closed) such that transistor
201
a
conducts current. The total W/L ratio for transistor
102
is now 1.25 m and the mirroring ratios between transistors
102
-
104
are I:4/1.25 m:6/1.25 m. On the other hand, if the measured current is too low, the current mirroring ratios must be increased. In this case, switch S
4
is also turned-off (opened), so that neither transistors
201
a
nor
201
b
is conducting. The total W/L ratio for transistor
102
in this case is 0.75 m and the resulting mirroring ratios are I:4/0.75 m:6/0.75 m, for transistors
102
-
104
, respectively. Once the proper current has been established, corresponding bits are set, as discussed below, in register to fix switches S
3
and S
4
in the selected configuration.
It should be noted that while two switches (S
3
and S
4
) and two associated transistors (
201
a,b
) are provided for current adjustment in the illustrated embodiment, more switches and/or transistors can be provided to increase the available adjustment resolution. Additionally, the aspect ratios of transistors
201
can also be changed, as required, to change the resolution. For example, the addition of each switch/transistor combination in parallel with the existing transistors
201
, an additional adjustment step of 0.25I in the current mirroring ratio is available (assuming that the aspect ratios of each additional transistor
201
is 0.25 m)
To transition to the normal operating mode, switch S
1
is opened (turned-off) and switch S
2
is closed (turned-on). Non-volatile register bits can be set to maintain switches S
1
-S
2
in the normal operating configuration after the reference current mirror ratio adjustments are complete.
FIG. 3
illustrates a preferred means of implementing switches S
3
and S
4
. In this case, each switch
208
/
209
includes an inverter
301
and a pair of p-channel transistors
302
and
303
coupled in a push-pull configuration with their common source/drain node controlling the gate of the corresponding transistor
201
a
or
201
b
. For example, consider the case of switch
208
(S
3
) and transistor
201
a
. When the control signal S
3
is in a logic high state, the associated pull-up transistor
302
a
is on and pulls-up the gate of transistor
201
a
to the high voltage rail, thus turning transistor
201
a
off. Pull-down transistor
303
a
is off. On the other hand, when S
3
is in a logic low state, pull-up transistor
302
a
is off and pull down transistor
303
a
is on, pulling-down the gate of transistor
201
to the low-voltage rail and turning transistor
201
a
on. Switch S
4
works in a similar fashion in controlling the gate of transistor
201
b.
FIG. 4
depicts an exemplary non-volatile programmable element
400
based on a polyfuse
401
which is suitable for programming the final states of switches S
3
-S
4
. Advantageously, programmable element
400
can be used in devices which do not include EPROM or EEPROM.
Programming element
400
proceeds as follows. Initially, the control signals +FUSE and ENABLE, presented at the inputs of AND gate
402
, are in a logic low state. Consequently, transistor
403
is initially turned-off. Sense and drive circuitry
404
operates such that the switches S
3
-S
4
are in their default state described above (i.e. S
2
and S
3
are off for test and switches S
1
and S
4
on for test).
Assume that measured reference current is lower than the expected (design) reference current. In this case, additional current mirror ratio is required by opening (turning-off) switch
54
. The ENABLE signal for the element
400
controlling switch S
4
transitions to a logic high state. Similarly, the corresponding signal FUSE transitions to a logic high state such that the associated transistor
403
turn-on and the resulting current conduction blows fuse
401
. Sense and drive circuitry
404
senses the change in state of fuse
401
and turns-off switch S
4
.
Switch S
2
can be closed in the normal mode and switch S
3
opened in a similar fashion. It should be noted that switch S
2
can be driven by an invertor controlled by the state of the programmable element controlling switch S
1
.
The switching structure of S
1
and S
2
is such that it also can be used to characterize the analog circuitry
101
a
-
101
b
for various bias current values to find their optimum performance. This feature is especially beneficial when the fabrication process ‘mean’ shifts. By keeping S
1
and S
2
both ‘closed,’ the external test system
209
is made to source or sink additional current text through test pin
206
. Performance measurement of analog circuitry
101
a
-
101
b
is now made and appropriate switch settings S
3
-S
4
of
211
identified.
In sum, the inventive concepts allow for the current mirroring ratios in a current mirror circuit to be set with varying degrees of accuracy. Depending on the number of switches and transistors used, as discussed above, the precision of the fabrication technology, and the given application. These principles are not limited to the current mirror example described above. One particular application in which the inventive concepts can advantageously be applied is in analog to digital (A/D) and digital to analog (D/A) converters. Here, a selected I/O pin is used to observe the signal or conversion gain, which can then be corrected by switching in or out additional output transistors.
Although the invention has been described with reference to a specific embodiments, these descriptions are not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternative embodiments of the invention will become apparent to persons skilled in the art upon reference to the description of the invention. It should be appreciated by those skilled in the art that the conception and the specific embodiment disclosed may be readily utilized as a basis for modifying or designing other structures for carrying out the same purposes of the present invention. It should also be realized by those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the invention as set forth in the appended claims.
It is therefore, contemplated that the claims will cover any such modifications or embodiments that fall within the true scope of the invention.
Claims
- 1. A current mirror comprising:a current mirroring transistor having a selected aspect ratio for conducting a mirrored current of a selected mirroring ratio with respects to a reference current; a plurality of reference current transistors disposed in parallel with said current mirroring transistor, each of said reference current transistors having a current path coupled to a source of said reference current and a selected aspect ratio; and a switch coupled to a control terminal of a selected one of said reference current transistors for selectively turning-on and turning-off said selected reference current transistor to adjust said mirroring ratio.
- 2. The current mirror of claim 1 and further comprising test switching circuitry for measuring said reference current in a test mode.
- 3. The current mirror of claim 1 wherein an initial state of said switch is closed and said switch is opened to increase said mirrored current ratio.
- 4. The current mirror of claim 1 wherein an initial state of said switch is open and said switch is closed to decrease said mirrored current ratio.
- 5. The current mirror of claim 1 wherein said aspect ratio of said plurality of transistors is substantially equal.
- 6. The current mirror of claim 2 wherein said test switching circuitry comprises a first switch for selectively decoupling said current paths of said reference transistors from said source of said reference current and a second switch for connecting said source of said reference current with a test system.
- 7. A current mirror comprising:a first plurality of parallel transistors each having an aspect ratio selected for conducting a corresponding amount of current mirrored from a reference current in a selected mirroring ratio; a second plurality of transistors for setting the mirroring ratio, a switch selectively coupling a current path of each of said second plurality of transistors to a current source in an operating mode and decoupling said current paths from said current source in a test mode; and compensation circuitry for varying a combined aspect ratio of said second plurality of transistors comprising: a plurality of switches each controlling a voltage at control terminal of a corresponding one of said second plurality of transistors; a switch for coupling an external test device and said current source in said test mode to measure said reference current; and a plurality of programmable elements for setting a state of each of said plurality of switches.
- 8. The current mirror of claim 7 wherein said first and second pluralities of transistors comprise field effect transistors.
- 9. The current mirror of claim 8 wherein said field effect transistors comprise p-channel field effect transistors.
- 10. The current mirror of claim 7 wherein said plurality of programmable elements comprise a plurality of fuses.
- 11. The current mirror of claim 7 wherein said plurality of switches each comprise a pair of transistors coupled in a push-pull configuration.
- 12. The current mirror of claim 7 wherein the aspect ratio of said second plurality of transistors is substantially equal.
- 13. The current mirror of claim 7 wherein each of said plurality of switches comprises:a first transistor for pulling down the control terminal of the corresponding one of said second plurality of transistors to a low voltage in response to a control signal; and a second transistor for pulling up the control terminal of the corresponding one of said second plurality of transistors to a high voltage in response to a complement of said control signal.
- 14. An integrated circuit comprising:processing circuitry operating in response to a plurality of currents comprising: a first plurality of parallel transistors of selected aspect ratios each for supplying a corresponding one of said currents by mirroring a reference current in a selected mirroring ratio; a second plurality of transistors disposed in parallel with said first plurality of transistor and coupled to a source of said reference current for setting said mirroring ratios; a set of switches for selectively turning-on and turning-off selected ones of said second plurality of transistors to vary said mirroring ratios; and circuitry allowing measurement said reference current in a test mode.
- 15. The integrated circuit of claim 14 wherein said processing circuitry comprises analog circuitry.
- 16. The integrated circuit of claim 14 wherein said circuitry for allowing measurement comprises a first switch for selectively decoupling said second plurality of transistors from said source of said reference current and a second switch for selectively coupling said source of said reference current with an external test device.
- 17. The integrated circuit of claim 14 wherein said circuitry for generating comprises a current mirror.
- 18. The integrated circuit of claim 14 wherein said processing circuitry comprises a digital to analog converter.
- 19. The integrated circuit of claim 14 wherein said processing circuitry comprises a digital to analog converter.
- 20. The integrated circuit of claim 14 and further comprising a set of fuses for setting a state of set of switches for operation in an operating mode.
- 21. A method of compensating for variation in a reference current in an integrated circuit comprising the steps of:providing a plurality of parallel transistors having current paths coupled to a reference current source, each having a selected aspect ratio; coupling the reference current source to an external tester using on-chip switches in a test mode; measuring the reference current; and in response to said step of measuring, selectively turning-on and turning-off the plurality of parallel transistors to obtain a selected total aspect ratio.
- 22. The method of claim 21 wherein said step of selectively turning-on and turning-off comprises the substep of:programming a set of non-volatile storage elements, each storage element controlling a state of a switch selectively turning-on and turning-off a corresponding one the plurality of transistors.
US Referenced Citations (5)