1. Technical Field
Embodiments generally relate to the mitigation of output voltage ripple in voltage regulators. In particular, embodiments relate to the use of current mode control to mitigate output voltage ripple.
2. Discussion
While the conventional switched capacitor voltage regulator (SCVR) may represent a magnetic-less alternative to inductor-based regulators with regard to CMOS (complementary metal oxide semiconductor) processing and SoC (system on chip) applications, a number of challenges remain. For example, solutions to mitigate voltage ripple in SCVRs could be applicable for only a subset of operating conditions and might present difficulties with regard to overdesign, routing and/or capacitance real estate.
The various advantages of the embodiments of the present invention will become apparent to one skilled in the art by reading the following specification and appended claims, and by referencing the following drawings, in which:
Embodiments may provide for a method of mitigating output voltage ripple in a voltage regulator having at least one switch in which a comparison is conducted between a reference voltage and an output voltage from the regulator. The method can also provide for adjusting an instantaneous voltage of the switch based on the comparison. In one example, adjusting the instantaneous voltage generates a matching condition between the voltage regulator current and the current of a load coupled to the voltage regulator.
Embodiments may also provide for an apparatus including a voltage regulator having a switch, and an error amplifier to conduct a comparison between a reference voltage and an output voltage from the voltage regulator. The error amplifier can also adjust an instantaneous voltage of the switch based on the comparison.
Other embodiments could include a system having a processor core, a switched capacitor voltage regulator (SCVR) coupled to the processor core, an error amplifier and a voltage regulator. The SCVR may include a plurality of switches, wherein the SCVR is to use the switches to generate an output voltage based on an input voltage. The error amplifier can conduct a comparison between a reference voltage and the output voltage, and adjust an instantaneous voltage of each of the plurality of switches based on the comparison. The adjustment may generate a matching condition between the SCVR current and the processor core current, wherein the matching condition completely eliminates ripple in the output voltage.
Generally, adjusting the instantaneous voltage of the output switch 12 can generate a matching condition between the current of the voltage regulator and the load current, wherein the matching condition can eliminate ripple in the output voltage. For example, if the output voltage is the voltage across an output capacitor (Cout) coupled to the output node of the voltage regulator, an equation for the output voltage may be given by,
Where Vinitial is the output voltage across the capacitor at the start of each switching period at steady state. Assuming that Vref=Vinitial, the small signal output of the error amplifier 14 may be given by,
Where A is the small signal gain of the error amplifier 14. If the output DC level of the error amplifier 14 is designed to be Vref, then the gate to source voltage of the switch 12 may be expressed as,
Thus, in the illustrated example, the current through the switch 12 exponentially converges to the load current value in each switching period. This convergence can represent a matching condition between the current of the voltage regulator and the load current, wherein the rate of convergence may be inversely proportional to 1/Cout, A, and switch transconductance.
For example,
Turning now to
The instantaneous voltage of each of the switches S1-S9 (output switches S2, S3, S6 and S7, in particular) could be adjusted based on a comparison between a reference voltage and the output voltage, as already discussed with regard to switch 12 (
Turning now to
The current control feedback loop 56 may include one or more error amplifiers to conduct a comparison between the reference voltage and the output voltage, and to adjust the instantaneous voltage of one or more internal switches of the regulator 54 based on the comparison, as already discussed. As a result, the current of the regulator 54 can be forced to converge toward the current drawn by the core 58 during each switching period so that the ripple in the output voltage is negligible.
The processor 44 may be coupled to the memory 48, radios 50, and user interface devices 52 through the GMIO control 46. The GMIO control 46 may include one or more blocks (e.g., chips or units within an integrated circuit) to perform various interface control functions (e.g., memory control, graphics control, I/O interface control, and the like). These circuits may be implemented on one or more separate chips and/or may be partially or wholly implemented within the processor 44.
The memory 48 can include one or more memory blocks to provide additional RAM to the processor 44. It may be implemented with any suitable memory including but not limited to dynamic RAM (DRAM), static RAM (SRAM), flash memory, or the like. The radios 50 may wirelessly couple the processor 44 to a wireless network (not shown). The user interface devices 52 may include one or more devices such as a display, keypad, mouse, etc. to allow a user to interact with and perceive information from the system 42. The GMIO control 46, memory 48, radios 50 and/or user interface devices 52 may also include one or more switched capacitor regulators such as the regulator 54.
As already noted, the system 42 may implement a variety of different computing devices or other appliances with computing capability. Such devices include but are not limited to test systems, design/debug tools, laptop computers, notebook computers, PDAs, cellular phones, audio and/or video media players, desktop computers, servers, and the like. The system 42 could constitute one or more complete computing systems or alternatively, it could constitute one or more components useful within a computing system.
Thus, the above-described techniques could be used to implement CMOS-based SCVRs that can be used in a wide variety of operating conditions, minimize routing and real estate issues, function as “magnetic-less” circuits and are amenable for on die regulation. Moreover, high conversion efficiency can be realized in SoC applications without a heavy dependency on output capacitance. Indeed, the techniques can be deployed for applications—such as CPU (central processing unit) voltage regulations—that may require small ripple, programmable output voltages and largely varying load conditions. Simply put, solutions described herein can enable single bound control to achieve zero ripple independently of the operating conditions and without the need for larger capacitance.
Embodiments described herein are applicable for use with all types of semiconductor integrated circuit (“IC”) chips. Examples of these IC chips include but are not limited to processors, controllers, chipset components, programmable logic arrays (PLA), memory chips, network chips, and the like. In addition, in some of the drawings, signal conductor lines are represented with lines. Some may be thicker, to indicate more constituent signal paths, have a number label, to indicate a number of constituent signal paths, and/or have arrows at one or more ends, to indicate primary information flow direction. This, however, should not be construed in a limiting manner. Rather, such added detail may be used in connection with one or more exemplary embodiments to facilitate easier understanding of a circuit. Any represented signal lines, whether or not having additional information, may actually comprise one or more signals that may travel in multiple directions and may be implemented with any suitable type of signal scheme, e.g., digital or analog lines implemented with differential pairs, optical fiber lines, and/or single-ended lines.
Example sizes/models/values/ranges may have been given, although embodiments of the present invention are not limited to the same. As manufacturing techniques (e.g., photolithography) mature over time, it is expected that devices of smaller size could be manufactured. In addition, well known power/ground connections to IC chips and other components may or may not be shown within the figures, for simplicity of illustration and discussion, and so as not to obscure certain aspects of the embodiments of the invention. Further, arrangements may be shown in block diagram form in order to avoid obscuring embodiments of the invention, and also in view of the fact that specifics with respect to implementation of such block diagram arrangements are highly dependent upon the platform within which the embodiment is to be implemented, i.e., such specifics should be well within purview of one skilled in the art. Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the invention, it should be apparent to one skilled in the art that embodiments of the invention can be practiced without, or with variation of, these specific details. The description is thus to be regarded as illustrative instead of limiting.
The term “coupled” is used herein to refer to any type of relationship, direct or indirect, between the components in question, and may apply to electrical, mechanical, fluid, optical, electromagnetic, electromechanical or other connections. In addition, the terms “first”, “second”, etc. are used herein only to facilitate discussion, and carry no particular temporal or chronological significance unless otherwise indicated.
Those skilled in the art will appreciate from the foregoing description that the broad techniques of the embodiments of the present invention can be implemented in a variety of forms. Therefore, while the embodiments of this invention have been described in connection with particular examples thereof, the true scope of the embodiments of the invention should not be so limited since other modifications will become apparent to the skilled practitioner upon a study of the drawings, specification, and following claims.
The present application is related to U.S. patent application Ser. No. 12/566,730 filed Sep. 25, 2009.