This application claims priority to and the benefit of Korean Patent Application No. 10-2018-0026892 filed on Mar. 7, 2018, the disclosure of which is incorporated herein by reference in its entirety.
The present invention relates to a circuit configured to allow a current to be reused.
In a circuit which operates at a high voltage, N-channel metal oxide semiconductor (NMOS) transistors or NMOS transistors and P-channel metal oxide semiconductor (PMOS) transistors are interposed between a top voltage rail and a bottom voltage rail to perform target functions and are electrically connected. A voltage and a current provided from the top voltage rail are applied to the transistors so that the transistors serve the target functions. The current passing through the transistors is provided to the bottom voltage rail.
In a conventional circuit, a current provided to a bottom voltage rail is not reused but is flushed to a ground or reference potential, and thus power is consumed. As an example, in a circuit configured to operate between a top voltage of 9 V and a bottom voltage of 2 V, a current collected by the bottom voltage of 2 V is not reused and flows to a reference or ground potential, and thus power is consumed. An object of an embodiment is to reuse the current collected from the bottom voltage rail of a high voltage circuit to reduce unnecessary power consumption.
An aspect of the present invention provides a display apparatus including a first circuit configured to process a signal between a first top voltage and a first bottom voltage, a second circuit configured to process a signal between a second top voltage and a second bottom voltage, and a second circuit power source configured to receive a current provided by the first circuit and provide the second top voltage to the second circuit.
The above and other objects, features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing exemplary embodiments thereof in detail with reference to the accompanying drawings, in which:
Since descriptions related to the present invention are provided as exemplary embodiments for describing structures and functions thereof, it should not be interpreted that the scope of the present invention is limited to the embodiments described in the specification. That is, since the embodiments are susceptible to various modifications and alternative forms, it should be understood that the scope of the invention covers equivalents falling within the spirit of the present invention.
Meanwhile, terms described in the specification should be understood as follows.
The terms first, second, and the like are used herein to distinguish one element from another element, and the scope of the present invention is not limited thereto. For example, a first element could be termed a second element and a second element could be similarly termed a first element.
The singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes,” and/or “including,” when used herein, specify the presence of stated features, integers, steps, operations, elements, components, and/or groups thereof but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
The term “and/or” used to describe the embodiments of the present invention is used to indicate each and all thereof. For example, it should be understood that the expression “A and/or B” indicates all of “A, B, and A and B”.
While the embodiments of the present invention are described, in a case in which it is determined that a plurality of elements configured to perform similar functions need to be distinguished, symbols such as a, b, c, 1, 2, 3, and the like are added thereto to describe the elements, but in a case in which a plurality of elements do not need to be distinguished, symbols may not be added to describe the elements.
While the embodiments are described, a single line, a differential line, and a bus are not distinguished. However, in a case in which a single ended signal line, a differential signal line, and a bus need to be distinguished, they are distinguished and described.
Unless otherwise defined, all terms used herein are to be interpreted as is customary in the art to which this invention belongs. It should be further understood that terms in common usage should also be interpreted as is customary in the relevant art and not in an idealized or overly formal sense unless expressly so defined herein.
Hereinafter, examples of a current reuse circuit according to a present embodiment will be described with reference to the accompanying drawings.
The shift register sequentially shifts and outputs start pulses (SP). The data latch latches up and provides image data, and the S/H register samples an image signal, which is lathed up, according to the SP and holds the sampled data to provide the sampled date to the level shifter.
The level shifter receives digital bits to provide an output signal of which a level is shifted to swing between an upper limit voltage and a lower limit voltage. As an example, the DAC receives a gamma voltage, converts the output signal provided by the level shifter to an analog signal, and provides the analog signal to the amplifier, and the amplifier amplifies the analog signal and provides the analog signal to the display panel such that an image corresponding to the input data is displayed. As another example, the DAC receives a voltage as an upper limit voltage in which an upper headroom voltage is added on an upper limit value of a gamma voltage and a voltage as a lower limit voltage in which the gamma voltage is decreased by a lower headroom voltage.
The low voltage area and the high voltage area may be formed in triple well structures. The triple well structures includes a deep N well (DNW) formed in a P-type substrate, an N well (NW) in which a P-channel metal oxide semiconductor (PMOS) transistor is disposed in the DNW, and a P well (PW) in which an N-channel metal oxide semiconductor (NMOS) transistor is disposed. As an example of the triple well which is not illustrated, the PW is formed in the DNW, and the NW in which the PMOS transistor is disposed is formed in the PW.
Low driving voltages VDD,LV and VSS,LV which are lower than driving voltages provided to the high voltage area are provided to the low voltage area. According to the embodiment illustrated in
The high voltage area has the triple well structure, and PMOS device and NMOS device are respectively disposed in the NW and the PW included in the triple well structure.
As one embodiment, the top voltage VDD,HV provided through the rail of the top voltage VDD,HV may be greater than a top voltage VDD,LV of the LV circuit 500, and the bottom voltage VSS,HV provided through a rail of the bottom voltage VSS,HV may be greater than the top voltage VDD,LV of the LV circuit 500. In addition, the bottom voltage VSS,HV is a voltage that is not 0 V and may have a voltage value which is greater than a reference voltage or ground voltage.
As one embodiment, the LV circuit 500 and the HV circuit 400 may be electrically separated from each other by different DNWs in the semiconductor substrate sub (see
As one embodiment, a range of a voltage processed in the HV circuit 400 is generally higher than a level of a voltage provided to the LV circuit 500. Accordingly, in the circuit divided by the DNWs, the PW may be biased to a voltage which is higher than the ground voltage, and the bottom voltage VSS,HV may be higher than 0 V.
Since the HV circuit 400 stably operates when the bottom voltage VSS,HV is a low impedance, the bottom voltage VSS,HV may be connected to a power rail which is externally provided.
In the embodiment illustrated in
As another embodiment, when the bottom voltage VSS,HV has to be 2 V or less due to a wide dynamic range of the HV circuit 400, the power rail configured to provide the bottom voltage VSS,HV may be connected to a power source configured to provide 1.8 V.
In an embodiment illustrated in
As another embodiment, when a voltage of 2 V or less is needed to be provided as the bottom voltage VSS,HV due to the wide dynamic range of the HV circuit 400, the bottom power selection switch SWext2 is turned on so that the power rail configured to provide the bottom voltage VSS,HV may be connected to a power source VDD,EXT configured to provide 1.8 V.
In the embodiment illustrated in
In an embodiment illustrated in
In an embodiment which is not illustrated, when it is enough that a voltage VDD,EXT4 having a voltage value which is higher than that of the voltage VDD,EXT3 is provided as the bottom voltage of the HV circuit 400 in the dynamic range of the HV circuit 400, the first dynamic range securing switch SWhd1 may be turned on and the second dynamic range securing switch SWhd2 may be turned on.
According to an embodiment illustrated in
As one embodiment, it may be determined that the top voltage VDD,LV provided to the LV circuit 500 by the low voltage source LDO is 0.9 V, 1 V, 1.2 V, 1.8 V, and the like according to kinds of elements used in the LV circuit 500. The top voltage VDD,LV provided to the low voltage source LDO may be the same as the bottom voltage VSS,HV of the HV circuit 400.
As one embodiment, a voltage value of the bottom voltage VSS,HV of the HV circuit may be higher than that of the top voltage VDD,LV provided to the LV circuit. In addition, the top voltage VDD,LV provided to the low voltage source LDO may be determined according to the bottom voltage VSS,LV of the HV circuit 400.
According to the embodiments illustrated in
When a current iLV is provided to the LV circuit 500 from the low voltage source LDO and the HV circuit 400 does not provide the current iHV,REUSE to the low voltage source LDO, a power source has to provide a current iVDD,ext to the low voltage source. However, when the HV circuit 400 provides the current iHV,REUSE to the low voltage source LDO, a current provided by the power source may be decreased by the current iHV,REUSE, and thus power consumption can be decreased.
Referring to
Control units may include a comparator (not shown) configured to receive and compare a target voltage VIN and a load voltage VOUT to output the result, and a logic gate (not shown) configured to receive an active signal and an output signal of the comparator and perform a logical operation thereon.
Referring to
Referring to
In the case of a display driving circuit, since a plurality of data amplifiers. simultaneously charge or discharge a capacitive load, a peak value of a consumed current is high. Accordingly, a di/dt noise is generated according to a voltage drop (IR drop) of a power terminal and/or a change in a current according to time, and a source voltage provided to the circuits may change.
As an embodiment, noise influences on the main circuits used to drive data may decrease when the top voltage VDD,HV and the bottom voltage VSS,HV are provided to the pre-driver and the top voltage VDD,HV and a ground voltage as the bottom voltage is provided to other circuits other than the pre-driver. In addition, when top voltages VDD,HV and VDD,HV′ are divided in a chip and connected to each other through a ferrite bead or a resistor at the outside of the chip, the top voltages VDD,HV and VDD,HV′ may be connected from a viewpoint of a direct current (DC), but may be separated from a viewpoint of an alternating current (AC) to decrease the noise influence. In addition, since the current may be reused using the pre-driver, there is an advantage in that current consumption may decrease.
According to another embodiment which is not illustrated, the HV circuit 400 may be a display pixel and a data driving line connected to a source drive and act as a capacitive load. As an embodiment, the source drive may provide a high voltage to the data driving line and the display pixel connected to the data driving line to charge the voltage in the data driving line and the display pixel in order to drive the pixel, and, when a low voltage is provided, charges charged in the capacitive load may be flushed in the form of current through the rail of the bottom voltage VSS,HV connected to the data amplifier and may be provide to the current reuse circuit 10.
The LV circuit 500 is a circuit configured to receive the top voltage VDD,LV to operate. As an embodiment, the top voltage VDD,LV may be a voltage which is lower than or equal to the bottom voltage VSS,HV. As an embodiment, the LV circuit 500 may be a digital logic circuit of which power consumption is low. When the present embodiment is applied to a display circuit, the LV circuit may be a digital logic circuit such as a timing controller.
When a time in which the top voltage VDD,HV reaches a target voltage level is greater than a time in which the bottom voltage VSS,HV reaches a target voltage level in an initial operation stage of the HV circuit 400, a current which should be provided to the low voltage source LDO may flow backward from the bottom voltage toward the top voltage. The backflow prevention circuit 700 prevents a backflow of a current. As an embodiment, the control circuit (not shown) may include a level detector configured to compare the top voltage VDD,HV with a predetermined voltage level and control the backflow prevention switch SWr using a detected result.
According to a conventional technology, a current provide to a rail of a bottom voltage VSS,HV in a HV circuit 400 is provide to a ground voltage. Accordingly, since the current are not reused, power consumption is high. However, according to the present embodiments, since the HV circuit 400 provides a current provided to the rail of the bottom voltage VSS,HV to the LV circuit 500, a current needed to drive the LV circuit 500 can be decreased, and thus power consumption can be decreased.
The present invention has been described with reference to the embodiments illustrated in the drawings, but the embodiments are only examples, and it will be understood by those skilled in the art that another embodiment including various changes and equivalents may be made from the embodiments. Therefore, the scope of the present invention will be defined by the appended claims.
Number | Date | Country | Kind |
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10-2018-0026892 | Mar 2018 | KR | national |