BRIEF DESCRIPTION OF THE DRAWINGS
The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description made with reference to the accompanying drawings. In the drawings:
FIG. 1 is a perspective view of a current sensing device according to a first embodiment of the present invention;
FIGS. 2A and 2B are a plan view and a side view of the current sensing device viewed in directions IIA and IIB in FIG. 1;
FIG. 3 is a sectional side view of the current sensing device according to the first embodiment;
FIG. 4 is a schematic plan view showing a relation between the current sensing device and external magnetic field;
FIG. 5 is a graph showing magnitudes of the external magnetic fields (magnetic flux densities) relative to distance from a center of a gap in a magnetic core;
FIGS. 6A and 6B are a plan view and a side view of a current sensing device according to a second embodiment of the present invention;
FIG. 7 is a sectional side view of a current sensing device according to a third embodiment of the present invention;
FIG. 8 is a plan view of a current sensing device according to a fourth embodiment of the present invention;
FIG. 9 is a sectional side view of the current sensing device taken along a line IX-IX in FIG. 8; and
FIGS. 10A and 10B are a plan view and a side sectional view of a conventional current sensing device.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
First Embodiment
Referring first to FIG. 1, a current sensing device has a magnetic core 1 and a sensor package 10. The magnetic core 1 is a ring-shaped plate having a gap 1a. The magnetic core 1 surrounds a conductor wire 2. When an electric current If flows in the wire 2, magnetic flux φ flow in the core 1 and generate a magnetic field H in the gap 1a. The magnitude of the magnetic field H varies in correspondence to the magnitude of the current If. The sensor package 10 is disposed in the gap 1a to produce an output signal, which varies with the magnitude of the magnetic field H in the gap 1a.
As shown in FIGS. 2A, 2B and 3, the sensor package 10 has a lead frame 11, a semiconductor sensor chip 12, wires 13 and a package case made of a resin mold 15. The semiconductor sensor chip 12 is a Hall IC, which includes a magnetism-responsive Hall element 14 (shown by dotted line) and a signal processing circuits such as an amplifier circuit. The sensor chip 12 is mounted on the lead frame 11 and electrically connected to the lead frame 11 by the wires 13. These components 11, 12, 13 are molded in the resin mold 15. As known well, the sensor chip 12 produces a Hall voltage, which varies with the magnitude of the magnetic field H generated in the gap 1a. This voltage is amplified by the amplifier circuit and produced from the lead frame 11 to an external circuit.
The Hall element 14 is formed on a top surface of the sensor chip 12. This surface is defined as a Hall element forming surface 12a in FIG. 3. The sensor package 10 is disposed in the gap 1a in such a manner that the Hall element 14 of the sensor chip 12, specifically the Hall element forming surface 12a, is parallel to both end surfaces S1 and S2 of the magnetic core 1, which face each other, and positioned at the center of the gap 1a with the same distance D from the end surfaces S1 and S2. This arrangement is less susceptible to external magnetic fields for the following reasons.
For the analysis of influence of external magnetic fields, three orthogonal axes X, Y, Z are denoted as shown in FIG. 1. Further, as shown in FIG. 4, external magnetic fields in the directions X, Y, Z are denoted as Hx, Hy, Hz, respectively, and a deviation (distance) of the Hall element forming surface 12a from the center Gc of the gap 1a, that is, center between the end surfaces S1, S2, is denoted as ΔL. Influence of the external magnetic fields were measured based on the output voltage of the sensor chip 12 indicative of the magnetic field density B by changing the distance ΔL of the sensor chip 12 from the center Gc of the gap 1a for each external magnetic field Hx, Hy, Hz of the same fixed magnitude (1.0 mT), while not supplying any electric current in the conductive wire 2. In this measurement, the gap 1a (width is 2D) was 2.5 mm. The results of measurement are shown in FIG. 5.
As understood from FIG. 5, the output voltages of the sensor chip 12 were nearly zero and varied very little relative to the external magnetic fields Hx and Hz, wherever the position of the sensor chip 12 is deviated from the center Gc of the gap 1a. On the other hand, the output voltage of the sensor chip 12 was much larger and varied greatly when the external magnetic field Hy was applied than when the external magnetic field Hx or Hz was applied. This output voltage of the sensor chip 12 was nearly zero when the sensor chip 12 was positioned substantially on the center Gc of the gap 1a, that is, when the deviation ΔL was nearly zero. With this measurement, it is confirmed that the influence of the external magnetic fields is made negligibly small by positioning the Hall element 14 in the center of the gap 1a. Thus, the influence of the external magnetic field and hence the output error of the sensor chip 12 is reduced to a minimum by positioning the sensor chip 12 at the same distance from the end surfaces S1 and S2 of the magnetic core 1.
Second Embodiment
In a second embodiment, a positioning member 20 is used to regulate the position of the sensor package 10 as shown in FIGS. 6A and 6B. The positioning member 20 includes a rectangular plate part 21 and stopper parts 22, 23 extending from the plate part 21 in parallel in the same direction. The plate part 21 is positioned in parallel to the end surfaces S1, S2 of the magnetic core 1 and more closely to one end surface 1a than to the other end surface S2. The stopper parts 22, 23 are on opposing sides of the plate part 21 and extend in the direction Z, which is the thickness direction of the magnetic core 1. The resin mold 15 has a side surface 15a, which is parallel to the Hall element forming surface 12a. The sensor package 10 is fit between the stopper parts 22, 23 in such a manner that the side surface 15a of the resin mold 15 contacts the plate part 21. The positioning member 20 may be fixed to a base or the like (not shown) so that the Hall element forming surface 12a is automatically positioned on the center of the gap 1a when the sensor package 10 is fit in the space defined by the plate part 21 and the stopper parts 22, 23.
According to the second embodiment, in addition to reducing the influence of the external magnetic fields, the accuracy in positioning the sensor package 10 in the small gap 1a is enhanced. Specifically, since the plate part 21 is parallel to the end surfaces S1, S2 of the magnetic core 1, the Hall element 12 can be located easily at the same distance from the end surfaces S1, S2. Further, since the stopper parts 22, 23 restrict movement of the sensor package 10, the sensor package 10 can be assembled easily in the gap 1a.
Third Embodiment
In a third embodiment, as shown in FIG. 6, a lead frame 30 is bent to have a first part 30a for mounting the sensor chip 12 and a second part 30b extending outward from the resin mold 15. The parts 30a and 30b are in parallel to each other while having a step in the direction X, and the second part 30b for connection with an external device is closer to the center of the resin mold 15 in the direction X than the first part 30a is. According to this arrangement, since the second part 30b is positioned near the center of the gap 1a when the sensor chip 14 is positioned in the center of the gap 1a, the sensor package 10 can be assembled in the gap 1a easily.
To sense the current If by the sensor chip 12 with higher accuracy, it is necessary to shorten or narrow the gap 1a between the end surfaces S1 and S2. The Hall element 14 is therefore positioned in the center of the resin mold 15, that is, the Hall element forming surface 12a is spaced the same distance D1 from the opposing surfaces of the resin mold 15. The Hall element 14 is nearly on the same plane as the part 30b of the lead frame 30. Since the thickness of the resin mold 15 are the same on both sides of the Hall element forming surface 12a, the Hall element 14 thus molded substantially equally receives less thermal influence after being installed in the gap 1a.
Fourth Embodiment
In a fourth embodiment, as shown in FIGS. 8 and 9, the resin mold 15 has a con-cavity or recess 35 on a side surface facing the end surface S1 of the magnetic core 1. That is, the recess 35 is formed on one half part of the sensor package 10 which is opposite to the other half part, in which the lead frame 30 and the sensor chip 12 are embedded. The recess 35 faces the sensor chip 12 and has a width wider than that of the sensor chip 12. Since the resin mold 15 is thinned near the sensor chip 12, the volume of molding resin can be reduced. This sensor package 10 can be assembled with a positioning member (not shown) in the similar manner as in the second embodiment shown in FIGS. 6A and 6B.
(Modification)
In each of the above embodiments, the sensor chip 12 may include only a Hall element without any other signal processing circuits. Further, the Hall element may be either a lateral-type or a vertical-type. In addition, a magneto-resistive element may be used as a magnetism sensing element in place of the Hall element.
Patent Application
20080030190
