Current sensor supporting structure

Information

  • Patent Grant
  • 6760206
  • Patent Number
    6,760,206
  • Date Filed
    Friday, March 16, 2001
    23 years ago
  • Date Issued
    Tuesday, July 6, 2004
    19 years ago
Abstract
An electrical switchgear device includes a conductor, a base, and a current sensor positioned to detect current in the conductor and attached to the base using a support element. The device also includes an apparatus mounted to the base to interrupt current through the conductor when a signal from the current sensor indicates a predetermined condition. A housing positioned on the base encapsulates the current sensor, the support element, the current interrupting apparatus, and a portion of the conductor.
Description




TECHNICAL FIELD




This invention relates to current sensors used in electrical switchgear.




BACKGROUND




Current sensors are used in the electric power industry to measure current flowing in electrical systems. In particular, current sensors may be used in electrical switchgear such as circuit breakers, reclosers, and switches to determine when a fault has occurred in the electrical system.




SUMMARY




In one general aspect, an electrical switchgear device includes a conductor, a base, and a current sensor positioned to detect current in the conductor and attached to the base using a support element. The device also includes an apparatus mounted to the base to interrupt current through the conductor when a signal from the current sensor indicates a predetermined condition. A housing positioned on the base encapsulates the current sensor, the support element, the current interrupting apparatus, and the conductor.




Embodiments may include one or more of the following features. The housing may include a solid insulating material. The support element may include a rigid tube. The support element may be bent at an end coupled to the current sensor. The bent end of the support element may include a support strip shaped to match a curvature of the current sensor.




The current sensor may include a sensor conductor that produces a signal. The support element may be hollow—in this case, the sensor conductor is drawn through the support element to control circuitry. The sensor conductor and the support element may be hermetically sealed. The support element may be hermetically sealed to the base.




The support element may be metallic or non-metallic. In either case, the support element may be coated with a semi-conductive paint.




The housing may encapsulate the current sensor, the support element, the current interrupting apparatus, and the conductor such that there is no dielectric interface between the current sensor and the conductor.




In another general aspect, a method of producing an electrical switchgear device includes securing a support element to a current sensor. The current sensor is mounted relative to a main conductor by securing the support element to a surface of a mold that houses a current interrupter and a portion of the conductor. A prepared material is injected into the mold to encapsulate the support element, the current sensor, the conductor, and the current interrupter. The injected material is permitted to solidify to form a housing.




Embodiments may include one or more of the following features. The support element may be secured to the current sensor by drawing sensor conductors from the current sensor through a hollow passage of the support element. The support element may be secured to the current sensor by bending a first end of the support element and attaching to the first end a support strip shaped to match a curvature of the current sensor. The support element may be secured to the current sensor by securing the support strip to the current sensor.




The support element may be secured to the surface of the mold by connecting a second end of the support element to a post positioned at the surface of the mold. The second end of the support element may be connected to the post by hermetically sealing the second end to the post. The second end of the support element may be connected to the post by drawing sensor conductors from the current sensor through a hollow passage of the post. The method may include removing the mold from the housing and securing the housing to a tank that houses additional components.




The electrical switchgear exhibits improved overall dielectric performance because all of the components are encased into a single housing with no dielectric interfaces. Moreover, the electrical switchgear exhibits a longer life because of reduced failure associated with dielectric breakdown at interfaces. Manufacturing of the electrical switchgear is more economical due to simplification of the current sensor design.




The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below. Other features and advantages will be apparent from the description, the drawings, and the claims.











DESCRIPTION OF DRAWINGS





FIG. 1

is a cross section of an electrical switchgear with an exemplary mounting device for a current sensor.





FIG. 2

is a side view of a three-phase electrical switchgear of FIG.


1


.





FIG. 3

is a front view of the three-phase electrical switchgear of FIG.


2


.





FIG. 4

is a flowchart of a procedure for forming a housing of the electrical switchgear of

FIGS. 1-3

.





FIG. 5

is a cross section of an electrical switchgear that includes an improved current sensor mounting system.





FIG. 6

is a perspective view of a mold used in forming the electrical switchgear of FIG.


8


.





FIGS. 7-9

are perspective views of alternative mounting devices for current sensors used with electrical switchgear.





FIGS. 10 and 11

are perspective views of current sensors used in the electrical switchgear of

FIGS. 5 and 6

.





FIG. 12

is a perspective view of a three-phase electrical switchgear that incorporates the electrical switchgear of

FIGS. 5 and 6

.





FIG. 13

is a flowchart of a procedure for forming a housing of the electrical switchgear of FIGS.


5


and


6


.











Like reference symbols in the various drawings indicate like elements.




DETAILED DESCRIPTION




The invention provides improved techniques for supporting a current sensor in electrical switchgear. For ease of explaining the improved technique, electrical switchgear constructed according to a current technique are discussed relative to

FIGS. 1-4

, prior current sensor mounting systems are discussed relative to

FIGS. 7-9

, and electrical switchgear constructed according to the improved technique is discussed relative to

FIGS. 5

,


6


, and


10


-


13


.




Referring to

FIGS. 1 and 2

, electrical switchgear


100


includes a current interrupter


105


, an insulated operating rod


110


, and a conductor


115


encapsulated in a solid polymer that makes up a housing


120


. The housing


120


is mounted on a tank or base


130


that houses additional components. For example, in electrical switchgear


100


, the tank


130


typically houses an electro-magnetic actuator mechanism, a latching mechanism, and a motion control circuit.




The housing


120


is manufactured of a solid polymer such as an epoxy or other solid insulating material. Solid dielectric insulation eliminates the need for insulating gas or liquid, thereby greatly reducing switch life-cycle maintenance costs. The solid dielectric insulation may be made of a cycloaliphatic epoxy component and an anhydride hardener, mixed with silica flour filler.




A current sensor


135


is mounted externally to the housing


120


and is partially supported by a coupler


140


attached to the tank


130


. The current sensor


135


measures direction and magnitude of current flowing though the conductor


115


based on the principle of induction. The current sensor


135


is typically formed from a conductor wound around a magnetic core. In this way, alternating current through the conductor


115


induces a current through the conductor in the current sensor


135


. Wires from the current sensor


135


are directed through the coupler


140


and into the tank


130


to the appropriate control or relay circuitry. Before mounting, the current sensor


135


is also encased in a housing


145


using a solid polymer.




Referring also to

FIG. 3

, the electrical switchgear


100


may be implemented in a three-phase electrical switchgear power system


300


. In this case, electrical switchgear


100


is used for each phase of the power system. The three electrical switchgear


100


are mounted on a tank


305


that is designed like tank


130


to hold the additional components.




Referring also to

FIG. 4

, the housing


120


may be formed using a procedure


400


for casting. In one implementation, the procedure


400


is an automatic pressure gelation (APG) procedure. Initially, cycloaliphatic epoxy material is prepared, for example, by preheating and degassing in special equipment provided with vacuum (step


405


). The mold houses the current interrupter


105


and conductor


115


, as shown in FIG.


1


. Then, the preheated and degassed material is pumped under pressure into the mold at a higher temperature, which provides the necessary energy to disrupt the equilibrium of the system to start gelation and crosslinking processes in the material (step


410


). When the desired crosslinking and gelation of the material is completed, an encapsulation or housing


120


is formed (step


415


) and then removed from the mold (step


420


). The gelation and crosslinking processes provide a housing


120


with a desired glass transition temperature, which enhances its dielectric and mechanical properties and enhances its ultraviolet protection and weather resistance. Alternatively, the housing


120


may be molded by other procedures, for example, vacuum casting.




After the housing is removed from the mold (step


420


), the current sensor housing


145


(which contains the current sensor


135


) is mounted to the conductor


115


portion that extends from the housing


120


and the coupler


140


is mounted to the tank


130


(step


425


). The current sensor housing


145


may be formed using a procedure similar to procedure


400


. The current sensor


135


is then connected to appropriate control or relay circuitry associated with the electrical switchgear (step


430


).




Referring to

FIGS. 5 and 6

, electrical switchgear


500


is similar in design and operation to electrical switchgear


100


in many respects. The switchgear differ primarily with respect to the positioning, design, and manufacture of current sensor


505


. In electrical switchgear


500


, the current sensor


505


is mounted relative to conductor


115


prior to molding of the current sensor


505


or the conductor


115


.




Prior electrical switchgear designs that employ a system of mounting the current sensor to the conductor prior to molding are shown as mounting systems


700


,


800


,


900


in

FIGS. 7-9

. However, these other mounting systems


700


,


800


, and


900


cause dielectric problems between the surface of the current sensor and the conductor. Often, the dielectric failure rate of mounting systems


700


,


800


, and


900


may be high.




Referring to

FIG. 7

, in mounting system


700


, the current sensor


135


is pre-cast into a molding


705


and is supported directly on the conductor


115


through an opening


710


. However, this mounting system


700


may cause dielectric failures subsequent to molding along an interface between the pre-cast sensor and the epoxy material that forms the electrical switchgear housing.




As shown in

FIG. 8

, in mounting system


800


, the current sensor


135


is supported on the conductor


115


using elastic bands


805


such as rubber bands or O-rings. Although mounting system


800


is fast and inexpensive, dielectric failures may occur following casting of the current sensor


135


because the epoxy material shrinks as it cures and leaves small cracks or deformations along the elastic bands


805


. One way to address this problem is to ensure that the thermal coefficient of expansion of the elastic bands is close to or matches that of the epoxy.




Referring also to

FIG. 9

, in mounting system


900


, the current sensor


135


is mounted on a stand


905


that is positioned on an inner surface of the current sensor mold. The stand


905


is encapsulated along with the current sensor


135


during molding. When using this approach, care must be taken to ensure that the stand


905


does not move out of place during the molding process, which could cause damage or marring of the mold surface. The material used in the stand


905


must be one capable of withstanding molding temperatures. Again, the presence of a dielectric interface may cause problems.




Referring again to

FIGS. 5 and 6

, the electrical switchgear


500


includes a current sensor


505


mounted directly to tank


130


by a support element


507


, with this mounting being done prior to molding. An expanded mold


600


(

FIG. 6

) is shaped to include the current interrupter


105


, the conductor


115


, and the current sensor


505


. After molding, a housing


510


encapsulates the current interrupter


105


, the conductor


115


, the current sensor


505


, and the support element


507


. As discussed below, this current sensor mounting system eliminates or significantly reduces dielectric interfaces that may cause subsequent failures.





FIGS. 10 and 11

show the current sensor


505


and the support element


507


separate from the housing


510


. The support element


507


may include a passage through which conductors


1000


from the current sensor


505


are drawn and connected to appropriate circuitry in the switchgear


500


. The current sensor


505


may be painted with a semi-conductive paint or covered with semi-conductive tape to guarantee an intimate ground contact to the epoxy surface surrounding current sensor


505


.




In one implementation, the support element


507


may be made of a non-metallic rigid tube. In this case, the tube may be painted with a semi-conductive paint to shield any air that may be within the tube. In another implementation, the support element


507


may be made of a metallic rigid tube, which may be coated with a semi-conductive paint to provide shielding if the epoxy tends to pull away from the tube during subsequent curing or temperature cycling extremes.




To facilitate attachment of the support element


507


to the current sensor


505


, a first end of the support element


507


may be bent. A support strip


1005


may be secured to the first end of the support element


507


and formed to match the curvature of the current sensor


505


. The support strip


1005


may be metallic or coated, as needed. The support strip


1005


may be secured to the current sensor


505


using any suitable device, such as semi-conductive tape


1010


, that shields air that may be trapped between the support strip


1005


and the current sensor


505


.




Referring again to

FIGS. 5 and 6

, the other end of the support element


507


connects with a short post


520


at the bottom of the mold. The short post


520


is hollow, to permit passage of the conductors


1000


from the support element


507


to the switchgear circuitry. The short post


520


and the support element


507


may be sealed where they meet using any suitable material, such as, silicone rubber tubing. Additionally, the conductors


1000


and the support element


507


may be sealed where they meet using, for example, an appropriately sized silicone rubber washer and a coating of room temperature vulcanizing rubber. Epoxy or other materials may be used to seal the support element


507


to short post


520


or the conductors


1000


to the support element


507


. In any case, these sealing materials are selected to withstand preheat and molding temperatures that typically reach around 155° C. and to prevent unwanted air flow.




Referring to

FIG. 12

, electrical switchgear


500


may be implemented in a three-phase electrical switchgear system


1200


. In this case, electrical switchgear


500


is positioned on each phase of the power system. Electrical switchgear


500


are mounted on a tank


1205


that houses additional components.




Referring also to

FIGS. 5 and 13

, the housing


510


may be molded using a procedure


1300


for encapsulating the current interrupter


105


, conductor


115


, current sensor


505


, and support element


507


. In one implementation, the procedure


1300


is an automatic pressure gelation (APG) procedure. Initially, the current sensor


505


is assembled in relation to the conductor


115


by securing the support element


507


to the mold


900


(step


1305


). In this way, the mold


600


houses the current interrupter


105


, conductor


115


, current sensor


505


, and support element


507


. The epoxy material is prepared, for example, by preheating and degassing in special equipment provided with vacuum (step


1310


). Then, the prepared material is pumped under pressure into the expanded mold


600


at a higher temperature (step


1315


). The higher temperature provides the necessary energy to disrupt the equilibrium of the system to start gelation and crosslinking processes in the material. When the processes are complete, the housing


510


is formed (step


1320


) and the formed housing


510


is removed from the expanded mold


600


(step


1325


). Alternatively, the housing


510


may be cast by other procedures, for example, vacuum casting.




In any case, the design and mounting of the current sensor


505


and the procedure


1300


for forming the housing


510


reduce or eliminate the dielectric problems between the surface of the current sensor and the conductor. In particular, the current sensor


505


design and mounting eliminates a dielectric interface between the current sensor


505


and the conductor


115


. Dielectric failure rates within the housing


510


may be significantly reduced. Moreover, dielectric failure rates approaching 0% are possible with additional modifications to a shielding of the current sensor


505


.




The current sensor


505


may be connected to appropriate control or relay circuitry associated with the electrical switchgear at any appropriate time before, during, or after procedure


1300


.




A number of embodiments of the invention have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the invention. Accordingly, other embodiments are within the scope of the following claims. For example, the current sensor support structure of

FIGS. 5

,


6


, and


10


-


13


may be implemented in any electrical switchgear such as fault interrupters, reclosers, breakers, or switches.



Claims
  • 1. An electrical switchgear device comprising:a conductor; a base; a current sensor positioned to detect current in the conductor and attached to the base with a support element; an apparatus mounted to the base to interrupt current through the conductor when a signal from the current sensor indicates a predetermined condition; and a housing positioned on the base and encapsulating the current sensor, the support element, the current interrupting apparatus, and the conductor.
  • 2. The device of claim 1 wherein the housing comprises a solid insulating material.
  • 3. The device of claim 1 wherein the support element comprises a rigid tube.
  • 4. The device of claim 1 wherein the support element is bent at an end coupled to the current sensor.
  • 5. The device of claim 4 wherein the bent end of the support element includes a support strip shaped to match a curvature of the current sensor.
  • 6. The device of claim 1 wherein the current sensor includes a sensor conductor that produces the signal.
  • 7. The device of claim 6 wherein the support element is hollow and the sensor conductor is drawn through the support element to control circuitry.
  • 8. The device of claim 6 wherein the sensor conductor and the support element are hermetically sealed.
  • 9. The device of claim 1 wherein the support element is hermetically sealed to the base.
  • 10. The device of claim 1 wherein the support element is metallic.
  • 11. The device of claim 1 wherein the support element is non-metallic.
  • 12. The device of claim 1 wherein the support element is coated with a semi-conductive paint.
  • 13. The device of claim 1 wherein the housing encapsulates the current sensor, the support element, the current interrupting apparatus, and the conductor such that there are no dielectric interfaces between the current sensor and the conductor that could lead to a dielectric failure.
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