This is a continuation of U.S. application Ser. No. 07/698,508 U.S. Pat. No. 5,223,190 filed May 10, 1991.
Number | Name | Date | Kind |
---|---|---|---|
2662957 | Eisler | Dec 1953 | |
3794518 | Howell | Feb 1974 | |
3806841 | Brunner | Apr 1974 | |
3934198 | Milkovic | Jan 1976 | |
4155262 | Wong et al. | May 1979 | |
4390839 | Houston | Jun 1983 | |
4556843 | Milkovic et al. | Dec 1985 | |
4682102 | Milkovic | Jul 1987 | |
4738146 | Baumgartner et al. | Apr 1988 | |
4743875 | Murphy | May 1988 | |
4754219 | Milkovic | Jun 1988 | |
4786863 | Milkovic | Nov 1988 | |
4866559 | Cobb, III et al. | Sep 1989 | |
4919717 | Ambier et al. | Apr 1990 | |
4973937 | Weinstein et al. | Nov 1990 |
Entry |
---|
High Tech Ceramics, 1987, Caffin et al., "Chemical Preparation of NTC Thermistors with Low Resistivity and High Stability", pp. 1743-1751. |
Modern Developments in Powder Metallurgy, vol. 15, 1984, Rao et al., "High-Expansion Mn-Cu-Ni Alloy: Experimental P/M Approach", Metal Powder Industries Federation, Princeton, N.J., USA pp. 751-760. |
Number | Date | Country | |
---|---|---|---|
Parent | 698508 | May 1991 |