BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a plane schematic view of a current converter in prior arts;
FIG. 2 is a three-dimensional exploded view of a first preferred embodiment of the present invention;
FIG. 3, which is a three-dimensional schematic view of the first preferred embodiment of the present invention;
FIG. 4 is a three-dimensional schematic back view of the first preferred embodiment of the present invention;
FIG. 5 is a three-dimensional schematic back view of a second preferred embodiment of the present invention;
FIG. 6 is a three-dimensional schematic view of welding the Hall sensing component of the second preferred embodiment of the present invention;
FIG. 7 is a three-dimensional view of the second preferred embodiment of the present invention;
FIG. 8 is a vertical sectional view of the second preferred embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
With reference to FIG. 2, which is a three-dimensional exploded view of a first preferred embodiment of the present invention. The current sensor of the present invention mainly comprises a PCB 10, a C-type core 20, a coil 30, a Hall sensing component 40, and a plurality of terminals 50; wherein the PCB 10 has an electric circuit 11 and the plurality of terminals 50 thereon, the terminals 50 elongate to outside along a direction parallel to the PCB 10 from the electric circuit 11, an elongating member 12 of the PCB 10 is protruded toward the C-type core 20, the Hall sensing component 40 is then welded on the electric circuit 11 of the PCB 10; the C-type core 20 opposite to the PCB 10 has an open 22, the open 22 forms an inner slot 21 inward, the C-type core 20 located on a side of the open 22 is a front bending portion 23; the coil 30 encircles the C-type core 20, two ends 31 of the coil 30 extend to outside of the PCB 10 for connecting and assembling other PCBs; the Hall sensing component 40 and the electric circuit 11 are on the same surface of the PCB 10, and the Hall sensing component 40 is firmly welded on the PCB 10.
With reference to FIG. 3, which is a three-dimensional schematic view of the first preferred embodiment of the present invention. The plurality of terminals 50 extend to a circumference of the PCB 10 so as to connect circuits as well as the two ends 31 of the coil 30, the C-type core 20 is stacked by a plurality of sheet materials, the inner slot 21, the open 22, and the front bending portion 23 on the open 22 of the C-type core are formed therein, the elongating member 12 is protruded on the C-type core of the PCB 10 and extended into a bottom portion of the inner slot 21 of the C-type core 20.
Referring to FIG. 3 and FIG. 4, wherein FIG. 4 is a three-dimensional schematic back view of the first preferred embodiment of the present invention. In the sequence of assembling, the electric circuit 11 of the PCN 10 is organized first. Due to the Hall sensing component 40 and the electric circuit 11 are on the same surface of the PCB 10, the Hall sensing component 40 and the electric circuit 11 are electrically connected each other. The terminals 50 elongate to the PCB for electric connection as well. The coil 30 encircles the C-type core 20, and the open 22 of the C-type core 20 is embedded on the elongating member 12 of the PCB 10; hence a bottom surface 211 of the inner slot 21 of the C-type core is stuck on a back surface of the PCB 10, and it makes that the C-type core 20 perpendicularly embeds to the horizontal PCB 10. The back surface 13 of the PCB 10 and a side wall 24 of the C-type core 20 are welded together, as shown in FIG. 4. The front bending portion 23 of the C-type core is then properly opposite to the Hall sensing component 40, as shown in FIG. 3. Doing so finishes a welding portion 60. The welding portion 60 features that having a larger area for easy welding, and the effect of the welding is stable so as to achieve a high manufacturing yields. Further, the C-type core 20 is firmly welded to the PCB 10 by means of a wire 25.
According to the structure aforesaid, which has the features of fast manufacturing, stable welding, high manufacturing yields, and low cost.
With reference to FIG. 5 to FIG. 8, which are a three-dimensional schematic back view of a second preferred embodiment of the present invention, a three-dimensional schematic view of welding the Hall sensing component of the second preferred embodiment of the present invention, a three-dimensional view of the second preferred embodiment of the present invention, and a vertical sectional view of the second preferred embodiment of the present invention. The PCB 10 has a slot 14 thereon, the slot 14 is located where the Hall sensing component 40 sticks on the PCB 10, as shown in FIG. 5. Such that, the Hall sensing component 40 directly and perpendicularly is welded on the PCB 10 by means of the plurality of terminals 41, as shown in FIG. 6. And the plurality of terminals 41 are bended so as to let the Hall sensing component 40 be embedded in the slot 14, as shown in FIG. 7. Hence, according to the assembled position of the Hall sensing component 40, the thickness of the PCB 10 is reduced. Continuously the entire thickness is relatively smaller, as shown in FIG. 8. The open 22 of the C-type core 20 has a smaller gap in order to make the C-type core 20 be closer to the Hall sensing component 40. So that magnetic flux impedance may be smaller.
The Hall sensing component 40 comprises a body 401 and a plurality of terminals 41; wherein a side of the Hall sensing component 40 has the plurality of terminals 41 protruding outward, or, both sides of the Hall sensing component 40 correspondingly have the plurality of terminals 41 protruding outward, as shown in FIG. 2.
Follows express the improvements of the present invention:
1. The present invention may not drilling any welding hole and fast assemble the core; on the other hand, the core is quickly welded with stable welding so as to achieve a high manufacturing yields.
2. The present invention mainly uses that the front bending portion is properly opposite to the Hall sensing component while the C-type core embedding in the PCB, and a larger welding space is between the core and the PCB so as to have an easy and stable welding. Further that, having no welding holes greatly increases the speed of manufacturing to promote manufacturing yields.
3. The Hall sensing component of the present invention may install in the slot of the PCB in order to diminish the entire thickness, therefore the open of the C-type core is reduced either, and the magnetic flux impedance may be smaller since the C-type core is closer to the Hall sensing component.
While the invention has been described by way of example and in terms of a preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Patent Application
20070279175
