This disclosure relates generally to equipment utilized and operations performed in conjunction with a subterranean well and, in one example described below, more particularly provides a cutter for use in well tools.
Well tools (such as, drill bits and reamers) can include cutters for cutting into formation rock. However, in some situations, cutters can become damaged. Damaged cutters can reduce a rate of penetration through formation rock and can require time-consuming (and, thus, expensive) replacement. Therefore, it will be appreciated that improvements are continually needed in the art of constructing cutters for use in well tools.
Representatively illustrated in
In the
Many other well tools could be included in the drill string 14. Different combinations, arrangements and numbers of well tools can be used in other examples. Therefore, the scope of this disclosure is not limited to any particular type, number, arrangement or combination of well tools.
The well tool 24 is used as an example in the further description below to demonstrate how the principles of this disclosure can be applied in actual practice. However, it should be clearly understood that the scope of this disclosure is not limited to manufacture of drill bits or any other particular type of well tool. Any well tool which includes one or more cutting structures may potentially benefit from the principles of this disclosure.
In
The drill bit depicted in
The cutting layer 28 can comprise a polycrystalline diamond compact (PDC) “insert,” and the substrate 32 can comprise a tungsten carbide material. However, the scope of this disclosure is not limited to any particular materials and/or structures used in the cutters 30.
In the
With the cutter 30 displacing to the left as viewed in
In the
Note that, opposite the leading face 40 on the cutting layer 28 is a trailing face 44. In this example, the leading and trailing faces 40, 44 comprise circular planar surfaces on the cutting layer 28, which is in the form of a solid cylinder, and the leading and trailing faces are parallel to each other. However, the scope of this disclosure is not limited to any particular shapes or orientation of the cutting layer 28 and/or leading and trailing faces 40, 44.
The substrate 32 completely covers the trailing face 44 and partially covers the leading face 40. In this manner, the substrate 32 can support the cutting layer 28 whether the cutter 30 is displacing in its normal direction (as indicated by arrow 36), or in a reverse direction.
With the cutter 30 displacing as depicted in
Thus, no matter the direction in which the cutter 30 contacts the formation rock 34, the cutting layer 28 is supported by the substrate 32 in compression. This feature of the cutter 30 can substantially reduce the incidence of chipping or cracking of the cutting layer 28, and substantially reduce separation of the cutting layer from the substrate 32.
In
In a method of manufacturing the cutter 30, the cutting layer 28 can be separately formed, and then embedded in a powdered tungsten carbide matrix material appropriately placed in a mold. A jig can be used to position the cutting layer 28 in the mold. The matrix material can then be sintered.
Suitable tungsten carbide materials include D63™ and PREMIX 300™, marketed by HO Starck of Newton, Mass. USA. Various types of tungsten carbide may be used, including, but not limited to, stoichiometric tungsten carbide particles, cemented tungsten carbide particles, and/or cast tungsten carbide particles. Other matrix materials may be used, as well.
The matrix material can comprise a blend of matrix powders. A binding agent (such as, copper, nickel, iron, alloys of these, an organic tackifying agent, etc.) can be mixed with the matrix material prior to loading the matrix material into the mold.
An effective binding agent can be any material that would bind, soften or melt at the sintering temperatures, and not burn off or degrade at those temperatures. High-temperature binding agents can comprise compositions having softening temperatures of about 260° C. (500° F.) and above. As used herein, the term “softening temperature” refers to the temperature above which a material becomes pliable, which is typically less than a melting point of the material.
Examples of suitable high-temperature binding agents can include copper, nickel, cobalt, iron, molybdenum, chromium, manganese, tin, zinc, lead, silicon, tungsten, boron, phosphorous, gold, silver, palladium, indium, titanium, any mixture thereof, any alloy thereof, and any combination thereof. Non-limiting examples may include copper-phosphorus, copper-phosphorous-silver, copper-manganese-phosphorous, copper-nickel, copper-manganese-nickel, copper-manganese-zinc, copper-manganese-nickel-zinc, copper-nickel-indium, copper-tin-manganese-nickel, copper-tin-manganese-nickel-iron, gold-nickel, gold-palladium-nickel, gold-copper-nickel, silver-copper-zinc-nickel, silver-manganese, silver-copper-zinc-cadmium, silver-copper-tin, cobalt-silicon-chromium-nickel-tungsten, cobalt-silicon-chromium-nickel-tungsten-boron, manganese-nickel-cobalt-boron, nickel-silicon-chromium, nickel-chromium-silicon-manganese, nickel-chromium-silicon, nickel-silicon-boron, nickel-silicon-chromium-boron-iron, nickel-phosphorus, nickel-manganese, and the like. Further, high-temperature binding agents may include diamond catalysts, e.g., iron, cobalt and nickel.
Certain matrix materials may not require binding agents. Matrix powders comprising iron, nickel, cobalt or copper can bond through solid state diffusion processes during the sintering process. Other matrix materials that have very high melting temperatures (e.g., W, WC, diamond, BN, and other nitrides and carbides) may utilize a binding agent, because the high temperatures which produce solid state diffusion may be uneconomical or undesirable.
It is not necessary for the matrix material to comprise tungsten carbide. A matrix powder or blend of matrix powders useful here generally lends erosion resistance to a resulting hard composite material, including a high resistance to abrasion and wear. The matrix powder can comprise particles of any erosion resistant materials which can be bonded (e.g., mechanically) with a binder to form a hard composite material. Suitable materials may include, but are not limited to, carbides, nitrides, natural and/or synthetic diamonds, steels, stainless steels, austenitic steels, ferritic steels, martensitic steels, precipitation-hardening steels, duplex stainless steels, iron alloys, nickel alloys, cobalt alloys, chromium alloys, and any combination thereof.
Binder materials may cooperate with the particulate material(s) present in the matrix powders to form hard composite materials with enhanced erosion resistance. A suitable commercially available binder material is VIRGIN BINDER 453D™ (copper-manganese-nickel-zinc), marketed by Belmont Metals, Inc.
The binder material may then be placed on top of the mold, and may be optionally covered with a flux layer. A cover or lid may be placed over the mold as necessary. The mold assembly and materials disposed therein may be preheated and then placed in a furnace.
When the melting point of the binder material is reached, the resulting liquid binder material infiltrates the matrix powder. The mold may then be cooled below a solidus temperature of the binder material to form the hard composite material. Additional details of an example method of forming a hard, erosion and impact resistant tungsten carbide structure can be found in International Application No. PCT/US12/39925, entitled “Manufacture of Well Tools with Matrix Materials.”
After the cutter 30 is removed from the mold, it can be secured onto a blade 26 (see
Other manufacturing procedures may be used for constructing the cutter 30. For example, the cutting layer 28 could be press-fit into the substrate 32, or other mechanical attachment methods or bonding techniques could be used. Thus, the scope of this disclosure is not limited to any particular process for manufacturing the cutter 30.
In
In
In
In
In
In
In
In this example, the substrate 32 is itself inclined to produce the back rake angle β1. The depth of cut DOC is determined by the combination of the distance by which the cutting layer 28 protrudes from the substrate 32, the back rake angle β1 (in this example, the angle of inclination of the substrate) and the leading angle α.
In
Note that the cutting layers 28 are positioned at an approximate middle of each of the cutting faces 56 of the blades 26. The substrate 32, extending both forward and rearward of the cutting layer 28 of each cutter 30, helps to stabilize the well tool 24 as it penetrates a formation rock.
In each of the
It may now be fully appreciated that the above disclosure provides significant advances to the art of constructing well tools with cutters. In examples described above, the cutters 30 are resistant to chipping and cracking of the cutting layers 28, and are resistant to separation of the cutting layers from the substrates 32. In addition, depth of cut can be more precisely controlled by varying certain parameters of the cutters 30.
The above disclosure provides to the art a well tool 24. In one example, the well tool 24 can comprise a cutter 30 including at least one cutting layer 28 and a substrate 32. The cutting layer 28 has a leading face 40, and the substrate 32 partially overlies the leading face 40.
The cutting layer 28 may be positioned approximately at a longitudinal middle of the substrate 32.
A depth of cut DOC of the cutter 30 can be determined by a distance δ1-3 by which the cutting layer 28 protrudes from the substrate 32.
The cutter 30 can comprise multiple cutting layers 28 in the substrate 32.
The cutting layer 28 may be embedded in the substrate 32.
The cutting layer 28 can have a trailing face 44 opposite the leading face 40, with the substrate 32 at least partially overlying the trailing face 44.
At least a portion of an interface 48 between the substrate 32 and the cutting layer 28 may be non-planar.
The cutting layer 28 can comprise a polycrystalline diamond compact (PDC). In other examples, other materials may be used in the cutting layer 28.
The substrate 32 can comprise a tungsten carbide material. In other examples, other materials may be used in the substrate 32.
The cutter 30 may be secured on a blade 26 of the well tool 24. In other examples, the cutter 30 can be secured to other portions of a well tool (such as, to a body or arm of the well tool).
A method of constructing a well tool 24 is also described above. In one example, the method can comprise: forming a cutter 30 by at least partially embedding at least one cutting layer 28 in a substrate 32; and securing the cutter 30 to the well tool 24.
The embedding step can include partially covering a leading face 40 of the cutting layer 28 with the substrate 32. The embedding step can include at least partially covering a trailing face 44 of the cutting layer 28 with the substrate 32.
The embedding step can include positioning the cutting layer 28 at an approximate longitudinal middle of the substrate 32.
The embedding step can include setting a depth of cut DOC of the cutter 30 by protruding the cutting layer 28 from the substrate 32 a predetermined distance δ1-3.
The forming step can include embedding multiple cutting layers 28 in the substrate 32.
The embedding step can include contacting the substrate 32 with a non-planar surface of the cutting layer 28.
The securing step can include securing the cutter 30 on a blade 26 of the well tool 24.
A drill bit (such as, well tool 24) is also described above. In one example, the drill bit can comprise a drill bit blade 26, and a cutter 30 secured on the drill bit blade 26. The cutter 30 can include a substrate 32 and at least one cutting layer 28 embedded in the substrate 32, with the substrate 32 overlying leading and trailing faces 40, 44 of the cutting layer 28.
The substrate 32 may only partially overly the leading face 40. The substrate 32 may completely overly the trailing face 44.
Although various examples have been described above, with each example having certain features, it should be understood that it is not necessary for a particular feature of one example to be used exclusively with that example. Instead, any of the features described above and/or depicted in the drawings can be combined with any of the examples, in addition to or in substitution for any of the other features of those examples. One example's features are not mutually exclusive to another example's features. Instead, the scope of this disclosure encompasses any combination of any of the features.
Although each example described above includes a certain combination of features, it should be understood that it is not necessary for all features of an example to be used. Instead, any of the features described above can be used, without any other particular feature or features also being used.
It should be understood that the various embodiments described herein may be utilized in various orientations, such as inclined, inverted, horizontal, vertical, etc., and in various configurations, without departing from the principles of this disclosure. The embodiments are described merely as examples of useful applications of the principles of the disclosure, which is not limited to any specific details of these embodiments.
In the above description of the representative examples, directional terms (such as “above,” “below,” “upper,” “lower,” etc.) are used for convenience in referring to the accompanying drawings. However, it should be clearly understood that the scope of this disclosure is not limited to any particular directions described herein.
The terms “including,” “includes,” “comprising,” “comprises,” and similar terms are used in a non-limiting sense in this specification. For example, if a system, method, apparatus, device, etc., is described as “including” a certain feature or element, the system, method, apparatus, device, etc., can include that feature or element, and can also include other features or elements. Similarly, the term “comprises” is considered to mean “comprises, but is not limited to.”
Of course, a person skilled in the art would, upon a careful consideration of the above description of representative embodiments of the disclosure, readily appreciate that many modifications, additions, substitutions, deletions, and other changes may be made to the specific embodiments, and such changes are contemplated by the principles of this disclosure. For example, structures disclosed as being separately formed can, in other examples, be integrally formed and vice versa. Accordingly, the foregoing detailed description is to be clearly understood as being given by way of illustration and example only, the spirit and scope of the invention being limited solely by the appended claims and their equivalents.
This application is a national stage under 35 USC 371 of International Application No. PCT/US13/58903, filed on 10 Sep. 2013, which claims priority to a U.S. Provisional Application No. 61/699,405, filed on 11 Sep. 2012. The entire disclosures of these prior applications are incorporated herein by this reference.
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/US2013/058903 | 9/10/2013 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2014/043071 | 3/20/2014 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
3153458 | William | Oct 1964 | A |
4339009 | Busby | Jul 1982 | A |
4499959 | Grappendorf | Feb 1985 | A |
4780274 | Barr | Oct 1988 | A |
4997049 | Tank | Mar 1991 | A |
5379854 | Dennis | Jan 1995 | A |
5487436 | Griffin | Jan 1996 | A |
5605198 | Tibbitts | Feb 1997 | A |
5871060 | Jensen et al. | Feb 1999 | A |
5944129 | Jensen | Aug 1999 | A |
6315066 | Dennis | Nov 2001 | B1 |
7426969 | Azar | Sep 2008 | B2 |
20060032677 | Azar et al. | Feb 2006 | A1 |
20060144621 | Tank et al. | Jul 2006 | A1 |
20060207802 | Zhang et al. | Sep 2006 | A1 |
20070278017 | Shen | Dec 2007 | A1 |
20080302577 | Pile | Dec 2008 | A1 |
20110171444 | Elkouby | Jul 2011 | A1 |
Number | Date | Country |
---|---|---|
0211642 | Feb 1987 | EP |
0546725 | Jun 1993 | EP |
2268768 | Jan 1994 | GB |
Entry |
---|
International Search Report and Written Opinion dated Nov. 22, 2013 for PCT Patent Application No. PCT/US13/058903, 15 pages. |
Warren, T.M. et al. “Torsional Resonance of Drill Collars with PDC Bits in Hard Rock”, SPE49204, dated Sep. 27-30, 1998, 13 pages. |
Extended European Search Report dated Aug. 16, 2016 for Application No. 13836464.1; 8 pages. |
Office Action received for Canadian Application No. 2884374, dated Apr. 11, 2016; 4 pages. |
International Preliminary Report on Patentability issued in PCT/US2013/058903; 12 pages, dated Mar. 26, 2015. |
Office Action received for Canadian Application No. 2884374, dated Feb. 6, 2017; 4 pages. |
Number | Date | Country | |
---|---|---|---|
20150000988 A1 | Jan 2015 | US |
Number | Date | Country | |
---|---|---|---|
61699405 | Sep 2012 | US |