Patent Grant
9845642
Embodiments of the present disclosure relate to polycrystalline diamond compact (PDC) cutting elements for use in earth-boring tools having one or more regions in which metal solvent catalyst is present within interstitial spaces between diamond grains in the polycrystalline diamond, and one or more regions in which no metal solvent catalyst is present between diamond grains in the polycrystalline diamond.
Earth-boring tools for forming wellbores in subterranean earth formations generally include a plurality of cutting elements secured to a body. For example, fixed cutter earth-boring rotary drill bits (also referred to as “drag bits”) include a plurality of cutting elements that are fixedly attached to a bit body of the drill bit. Similarly, roller cone earth-boring rotary drill bits include cones that are mounted on bearing pins extending from legs of a bit body such that each cone is capable of rotating about the bearing pin on which it is mounted. A plurality of cutting elements may be mounted to or otherwise provided on each cone of the drill bit.
The cutting elements used in such earth-boring tools often include polycrystalline diamond compact (often referred to as “PDC”) cutting elements, which are cutting elements that include cutting faces of a polycrystalline diamond material. Polycrystalline diamond material is material that includes inter-bonded grains or crystals of diamond. In other words, polycrystalline diamond material includes direct, inter-granular bonds between the grains or crystals of diamond. The terms “grain” and “crystal” are used synonymously and interchangeably herein.
Polycrystalline diamond compact cutting elements are formed by sintering and bonding together relatively small diamond grains under conditions of high temperature and high pressure in the presence of a catalyst (such as, for example, cobalt, iron, nickel, or alloys and mixtures thereof) to form a layer or “table” of polycrystalline diamond material on a cutting element substrate. These processes are often referred to as high temperature/high pressure (or “HTHP”) processes. The cutting element substrate may comprise a cermet material (i.e., a ceramic metal composite material) such as, for example, cobalt cemented tungsten carbide. In such instances, the cobalt (or other catalyst material) in the cutting element substrate may be swept into the diamond grains during sintering and serve as the catalyst material for forming the inter-granular diamond-to-diamond bonds between, and the resulting diamond table from, the diamond grains. In other methods, powdered catalyst material may be mixed with the diamond grains prior to sintering the grains together in a HTHP process.
Upon formation of a diamond table using a HTHP process, catalyst material may remain in interstitial spaces between the grains of diamond in the resulting polycrystalline diamond table. The presence of the catalyst material in the diamond table may contribute to thermal damage in the diamond table when the cutting element is heated during use, due to friction at the contact point between the cutting element and the formation.
Polycrystalline diamond compact cutting elements in which the catalyst material remains in the diamond table are generally thermally stable up to a temperature of about seven hundred and fifty degrees Celsius (750° C.), although internal stress within the cutting element may begin to develop at temperatures exceeding about four hundred degrees Celsius (400° C.) due to a phase change that occurs in cobalt at that temperature (a change from the “beta” phase to the “alpha” phase). Also beginning at about four hundred degrees Celsius (400° C.), there is an internal stress component that arises due to differences in the thermal expansion of the diamond grains and the catalyst metal at the grain boundaries. This difference in thermal expansion may result in relatively large tensile stresses at the interface between the diamond grains, and contributes to thermal degradation of the microstructure when polycrystalline diamond compact cutting elements are used in service. Differences in the thermal expansion between the diamond table and the cutting element substrate to which it is bonded further exacerbate the stresses in the polycrystalline diamond compact. This differential in thermal expansion may result in relatively large compressive and/or tensile stresses at the interface between the diamond table and the substrate that eventually lead to the deterioration of the diamond table, cause the diamond table to delaminate from the substrate, or result in the general ineffectiveness of the cutting element.
Furthermore, at temperatures at or above about seven hundred and fifty degrees Celsius (750° C.), some of the diamond crystals within the diamond table may react with the catalyst material causing the diamond crystals to undergo a chemical breakdown or conversion to another allotrope of carbon. For example, the diamond crystals may graphitize at the diamond crystal boundaries, which may substantially weaken the diamond table. Also, at extremely high temperatures, in addition to graphite, some of the diamond crystals may be converted to carbon monoxide and carbon dioxide.
In order to reduce the problems associated with differences in thermal expansion and chemical breakdown of the diamond crystals in polycrystalline diamond cutting elements, so called “thermally stable” polycrystalline diamond compacts (which are also known as thermally stable products, or “TSPs”) have been developed. Such a thermally stable polycrystalline diamond compact may be formed by leaching the catalyst material (e.g., cobalt) out from interstitial spaces between the inter bonded diamond crystals in the diamond table using, for example, an acid or combination of acids (e.g., aqua regia). A substantial amount of the catalyst material may be removed from the diamond table, or catalyst material may be removed from only a portion thereof. Thermally stable polycrystalline diamond compacts in which substantially all catalyst material has been leached out from the diamond table have been reported to be thermally stable up to temperatures of about twelve hundred degrees Celsius (1,200° C.). It has also been reported, however, that such fully leached diamond tables are relatively more brittle and vulnerable to shear, compressive, and tensile stresses than are non-leached diamond tables. In addition, it is difficult to secure a completely leached diamond table to a supporting substrate. In an effort to provide cutting elements having diamond tables that are more thermally stable relative to non-leached diamond tables, but that are also relatively less brittle and vulnerable to shear, compressive, and tensile stresses relative to fully leached diamond tables, cutting elements have been provided that include a diamond table in which the catalyst material has been leached from a portion or portions of the diamond table. For example, it is known to leach catalyst material from the cutting face, from the side of the diamond table, or both, to a desired depth within the diamond table, but without leaching all of the catalyst material out from the diamond table.
In one embodiment, a cutting element may include a substrate and a volume of polycrystalline diamond material affixed to the substrate at an interface. The volume of polycrystalline diamond material may include a front cutting face with at least one substantially planar portion and at least one recess. The at least one recess may extend from a plane defined by the at least one substantially planar portion a first depth into the volume of polycrystalline diamond material in an axial direction parallel to a central axis of the cutting element. The volume of polycrystalline diamond material may include a region including a catalyst material disposed in interstitial spaces between diamond grains of the volume of polycrystalline diamond material, and the region including the catalyst material may extend through the volume of polycrystalline diamond material from the interface to an exposed surface of the volume of polycrystalline diamond material within the at least one recess of the front cutting face. The volume of polycrystalline diamond material may also include at least one region substantially free of the catalyst material. The at least one region substantially free of the catalyst material may extend from the at least one substantially planar portion of the front cutting face a second depth into the volume of polycrystalline diamond material in the axial direction.
In another embodiment, a cutting element may include a substrate and a volume of polycrystalline diamond material affixed to the substrate at an interface. The volume of polycrystalline diamond material may include a front cutting face with at least one substantially planar portion and at least one recess. The at least one recess may extend from a plane defined by the at least one substantially planar portion a first depth into the volume of polycrystalline diamond material in an axial direction parallel to a central axis of the cutting element. The volume of polycrystalline diamond may also include a region including a catalyst material disposed in interstitial spaces between diamond grains of the volume of polycrystalline diamond material, and at least one region substantially free of the catalyst material. The at least one region substantially free of the catalyst material may extend from the at least one substantially planar portion of the front cutting face a second depth into the volume of polycrystalline diamond material in the axial direction. The at least one region substantially free of the catalyst material may extend from a lowermost region of an exposed surface of the volume of polycrystalline diamond material within the at least one recess a third depth into the volume of polycrystalline diamond material in the axial direction.
In another embodiment, a method of fabricating a cutting element may include providing a volume of polycrystalline diamond material comprising diamond grains and a catalyst material disposed in interstitial spaces between the diamond grains. The volume of polycrystalline diamond material may include a front cutting face with at least one substantially planar portion and at least one recess. The recess may extend a first depth into the volume of polycrystalline diamond material in an axial direction parallel to a central axis of the cutting element. The method may also include forming at least one region substantially free of the catalyst material within the volume of polycrystalline diamond material. The region may extend from the at least one substantially planar portion of the front cutting face a second depth into the volume of polycrystalline diamond material in the axial direction, wherein the second depth is greater than the first depth.
While the specification concludes with claims particularly pointing out and distinctly claiming what are regarded as embodiments of the present invention, various features and advantages of disclosed embodiments may be more readily ascertained from the following description when read with reference to the accompanying drawings, in which:
The illustrations presented herein are not actual views of any particular material, cutting element, or earth-boring tool, but are merely idealized representations employed to describe embodiments of the present disclosure.
The front cutting face 110 may include one or more substantially planar portions. For example, in the embodiment of
The volume of polycrystalline diamond material 104 may also include a recess 116 formed in the front cutting face 110. In some embodiments, the recess 116 may be formed with a substantially annular geometry in a plane of the front cutting face 110. As a non-limiting example, the recess 116 may be formed substantially concentric with the generally cylindrical lateral sidewall 118, as shown in
As non-limiting examples, the front cutting face 110 may have any of the configurations described in U.S. Patent Publication No. 2013/0068538 A1, published on Mar. 21, 2013, in the name of DiGiovanni et al., U.S. Patent Publication No. 2013/0068534 A1, published on Mar. 21, 2013, in the name of DiGiovanni et al., and U.S. Patent Publication No. 2011/0259642 A1, published on Oct. 27, 2011, in the name of DiGiovanni et al., the disclosure of each of which is incorporated herein in its entirety by this reference.
The volume of polycrystalline diamond material 104 may include grains or crystals of diamond that are bonded directly together by inter-granular diamond-to-diamond bonds, as previously described. Interstitial regions or spaces between the diamond grains may be filled with additional materials, as discussed further below, or may be air-filled voids. The polycrystalline diamond material may be primarily comprised of diamond grains. For example, diamond grains may comprise at least about seventy percent (70%) by volume of the volume of the polycrystalline diamond material. In additional embodiments, the diamond grains may comprise at least about eighty percent (80%) by volume of the volume of polycrystalline diamond material, and in yet further embodiments, the diamond grains may comprise at least about ninety percent (90%) by volume of the volume of the polycrystalline diamond material.
The cutting element substrate 102 may be formed from a material that is relatively hard and resistant to wear. For example, the cutting element substrate 102 may be formed from and include a ceramic-metal composite material (which are often referred to as “cermet” materials). The cutting element substrate 102 may include a cemented carbide material, such as a cemented tungsten carbide material, in which tungsten carbide particles are cemented together in a metallic binder material. The metallic binder material may include, for example, cobalt, nickel, iron, or alloys and mixtures thereof.
Referring now to
At least one region of the volume of polycrystalline diamond material 104 may be substantially free of the catalyst material 304 (
The at least one region of the volume of polycrystalline diamond material 104 substantially free of the catalyst material 304 (
The recess 116 may have an arcuate shape in a cross-sectional plane normal to the plane of the front cutting face 110 (e.g., the cross-sectional plane of
The recess 116 may extend a first depth D1 from a plane defined by the substantially planar portions 112, 114 of the front cutting face 110 into the volume of polycrystalline diamond material 104 in the direction parallel to the central axis Ac of the cutting element 100. As a non-limiting example, the first depth D1 may extend from the plane of the substantially planar portions 112, 114 of the front cutting face 110 into the volume of polycrystalline diamond material 104 a depth of between about 0.0254 mm (0.001 inch) and 2.54 mm (0.1 inch). In other embodiments, the first depth D1 may be less than about 0.0254 mm or greater than about 2.54 mm.
The regions 204 and 206 substantially free of the catalyst material 304 (
In some embodiments, the region 204 may include a portion 205 proximate the cutting edge 106 (
The interface 202 between the volume of polycrystalline diamond material 104 and the cutting element substrate 102 may have a planar or a non-planar shape. As one non-limiting example, the interface 202 may include a substantially annular protrusion 208 extending from the cutting element substrate 102 and a complementary annular recess 210 extending into the volume of polycrystalline diamond material 104. The interface geometry shown in
As used herein, the term “catalyst material” refers to any material that is capable of catalyzing the formation of inter-granular diamond-to-diamond bonds in a diamond grit or powder during an HTHP process in the manufacture of polycrystalline diamond. By way of example, the catalyst material 302 may include cobalt, iron, nickel, or an alloy or mixture thereof, which catalyst materials are often referred to as “metal solvent catalyst materials.” The catalyst material 302 may comprise other than elements from Group VIIIA of the Periodic Table of the Elements.
The polycrystalline diamond material 300 (
Referring now to
Referring now to
The leached region 704 may extend substantially continuously over a surface of the volume of polycrystalline diamond material 104 defined by the front cutting face 110. The leached region 704 may extend from a plane defined by the substantially planar portions 112 and 114 of the front cutting face 110 into the volume of polycrystalline diamond material 104 a substantially uniform depth, e.g., depth D8 shown in
Thus, the leached region 704 may meet an unleached region 701 at a substantially planar boundary 706 within the volume of polycrystalline diamond material 104. The substantially planar boundary 706 may extend substantially continuously through the volume of polycrystalline diamond 104. In some embodiments, as shown in
In other embodiments, the leached region 704 may meet the unleached region 701 at a non-planar boundary within the volume of polycrystalline diamond material 104, or a boundary including planar portions and non-planar portions within the volume of polycrystalline diamond material 104.
As shown in
The mask portions 806 and 808 may comprise a layer of material that is impermeable to a leaching agent used to leach catalyst material 304 out from the interstitial spaces between the diamond grains 302 within what will become a leached region within the polycrystalline diamond material 300 (
After forming or otherwise providing the mask portions 806 and 808 on the cutting element 800, the volume of polycrystalline diamond material 804 including the cutting face 110 may then be immersed in or otherwise exposed to a leaching agent (e.g., an acid, aqua regia, etc.), such that the leaching agent may be allowed to leach and remove the catalyst material 304 (e.g., metal solvent catalyst) out from the interstitial spaces between the diamond grains 302 (
A particular depth of a leached region, e.g., depth D2 (
Because the mask portion 806, 808 only covers the surface of the volume of polycrystalline diamond material 804, the leaching agent may diffuse into and through interstitial spaces between diamond grains of the polycrystalline diamond material 804 from behind the mask. Thus, the geometrical boundaries of the leached regions may not be precisely coextensive with the unmasked areas, e.g., regions 204 and 206 (
After exposing the volume of polycrystalline diamond material 804 and the mask portions 806, 808 to the leaching agent for the desired time to form one or more leached regions, the mask portions 806, 808 may be removed from the cutting element 800 and the cutting element 800 may be used on an earth-boring tool.
A cutting element 100, 500, or 600 as previously described with reference to
In some embodiments, portions of the cutting element 800 may be reintroduced to the leaching agent following removal of the mask portions 806 and 808. For example, a cutting element similar to cutting element 700 (
Embodiments of cutting elements of the present disclosure, such as the cutting elements 100, 500, 600, and 700 as previously described herein with reference to
Embodiments of cutting elements of the present disclosure, such as the cutting elements 100, 500, 600, and 700 as previously described herein with reference to
The bit body 902 may include internal fluid passageways (not shown) that extend between a face 903 of the bit body 902 and a longitudinal bore (not shown), which extends through the shank 904, the extension 908, and partially through the bit body 902. Nozzle inserts 924 also may be provided at the face 903 of the bit body 902 within the internal fluid passageways. The bit body 902 may further include a plurality of blades 916 that are separated by junk slots 918. In some embodiments, the bit body 902 may include gage wear plugs 922 and wear knots 928. A plurality of cutting elements 100 as previously disclosed herein (
The cutting elements 100 are positioned to cut a subterranean formation being drilled while the drill bit 900 is rotated under weight-on-bit (WOB) in a bore hole about centerline L900.
The cutting elements 100, 500, 600, and 700 described herein, or any other cutting elements according to the present disclosure, may be used on other types of earth-boring tools. As non-limiting examples, embodiments of cutting elements of the present disclosure also may be used on cones of roller cone drill bits, on reamers, mills, bi-center bits, eccentric bits, coring bits, and so-called “hybrid bits” that include both fixed cutters and rolling cutters.
Additional non-limiting example embodiments of the disclosure are set forth below.
A cutting element, comprising: a substrate; and a volume of polycrystalline diamond material affixed to the substrate at an interface, the volume of polycrystalline diamond material comprising: a front cutting face with at least one substantially planar portion and at least one recess, the at least one recess extending from a plane defined by the at least one substantially planar portion a first depth into the volume of polycrystalline diamond material in an axial direction parallel to a central axis of the cutting element; a region including a catalyst material disposed in interstitial spaces between diamond grains of the volume of polycrystalline diamond material, the region including the catalyst material extending through the volume of polycrystalline diamond material from the interface to an exposed surface of the volume of polycrystalline diamond material within the at least one recess of the front cutting face; and at least one region substantially free of the catalyst material, wherein the at least one region substantially free of the catalyst material extends from the at least one substantially planar portion of the front cutting face a second depth into the volume of polycrystalline diamond material in the axial direction.
The cutting element of Embodiment 1, wherein the at least one region substantially free of the catalyst material comprises two discrete regions substantially free of the catalyst material, and wherein the region including the catalyst material is disposed at least partially between the two discrete regions substantially free of the catalyst material.
The cutting element of Embodiment 2, wherein the at least one substantially planar portion of the front cutting face comprises two discrete substantially planar portions, and wherein each of the two discrete regions substantially free of the catalyst material extends from a respective one of the two discrete substantially planar portions of the front cutting face the second depth into the volume of polycrystalline diamond material in the axial direction.
The cutting element of any one of Embodiments 1 through 3, wherein the at least one region substantially free of the catalyst material extends to an exposed surface of the volume of polycrystalline diamond material proximate a cutting edge formed between the front cutting face and a generally cylindrical lateral side surface of the cutting element.
The cutting element of any one of Embodiments 1 through 5, wherein the second depth is less than the first depth.
The cutting element of any one of Embodiments 1 through 5, wherein the second depth is substantially equal to the first depth.
The cutting element of any one of Embodiments 1 through 5, wherein the second depth is greater than the first depth.
The cutting element of Embodiment 7, wherein the second depth is at least about ten percent (10%) greater than the first depth.
The cutting element of Embodiment 7 or 8, wherein the second depth is greater than the first depth by at least about 0.0254 mm (0.001 inch).
An earth-boring tool, comprising: a body; and the cutting element of any one of Embodiments 1 through 9 affixed to the body.
The earth-boring tool of Embodiment 10, wherein the earth-boring tool is a fixed-cutter drill bit.
A cutting element, comprising: a substrate; and a volume of polycrystalline diamond material affixed to the substrate at an interface, the volume of polycrystalline diamond material comprising: a front cutting face with at least one substantially planar portion and at least one recess, the at least one recess extending from a plane defined by the at least one substantially planar portion a first depth into the volume of polycrystalline diamond material in an axial direction parallel to a central axis of the cutting element; a region including a catalyst material disposed in interstitial spaces between diamond grains of the volume of polycrystalline diamond material; and at least one region substantially free of the catalyst material, wherein the at least one region substantially free of the catalyst material extends from the at least one substantially planar portion of the front cutting face a second depth into the volume of polycrystalline diamond material in the axial direction, and wherein the at least one region substantially free of the catalyst material extends from a lowermost region of an exposed surface of the volume of polycrystalline diamond material within the at least one recess a third depth into the volume of polycrystalline diamond material in the axial direction.
The cutting element of Embodiment 12, wherein the third depth is less than the second depth.
The cutting element of Embodiment 12 or 13, wherein the at least one region substantially free of catalyst material extends substantially continuously over a surface of the volume of polycrystalline diamond material defined by the front cutting face.
The cutting element of Embodiment 14, wherein the at least one region substantially free of catalyst material and the region including the catalyst material meet at a substantially planar boundary extending substantially continuously through the volume of polycrystalline diamond material.
The cutting element of Embodiment 15, wherein the substantially planar boundary extends normal to the axial direction.
An earth-boring tool, comprising: a body; and the cutting element of any one of Embodiments 12 through 16 affixed to the body.
A method of fabricating a cutting element, comprising: providing a volume of polycrystalline diamond material comprising diamond grains and a catalyst material disposed in interstitial spaces between the diamond grains, the volume of polycrystalline diamond material comprising a front cutting face with at least one substantially planar portion and at least one recess, the at least one recess extending a first depth into the volume of polycrystalline diamond material in an axial direction parallel to a central axis of the cutting element; and forming at least one region substantially free of the catalyst material within the volume of polycrystalline diamond material, the region extending from the at least one substantially planar portion of the front cutting face a second depth into the volume of polycrystalline diamond material in the axial direction, wherein the second depth is greater than the first depth.
The method of Embodiment 18, wherein removing the catalyst material from a region of the volume of polycrystalline diamond material comprises: applying a mask material resistant to a leaching agent to a surface of the volume of polycrystalline diamond material within the at least one recess of the front cutting face; and introducing at least a portion of the volume of polycrystalline diamond material and the mask material to the leaching agent.
The method of Embodiment 19, further comprising removing at least a portion of the mask material from the at least one recess and subsequently reintroducing at least a portion of the previously masked portion of the volume of polycrystalline diamond material to the leaching agent.
Although the foregoing description contains many specifics, these are not to be construed as limiting the scope of the present invention, but merely as providing certain exemplary embodiments. Similarly, other embodiments of the invention may be devised that do not depart from the spirit or scope of the present disclosure. For example, features described herein with reference to one embodiment also may be provided in others of the embodiments described herein. The scope of the invention is, therefore, indicated and limited only by the appended claims and their legal equivalents, rather than by the foregoing description. All additions, deletions, and modifications to the disclosed embodiments, which fall within the meaning and scope of the claims, are encompassed by the present disclosure.
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