Patent Grant
10081065
The present invention relates to a cutting tool in which a coating layer is formed on the surface of a base body having a rod shape and to method for manufacturing a cut product using the cutting tool.
Cutting tools in which a coating layer made from diamond is formed as a film on the surface of the base body are a well-known technology. Patent Document 1, for example, discloses tools such as a drill or an end mill in which a diamond layer is formed as a film on the surface of a base body having a rod shape. Moreover, Patent Document 2 discloses a wear-resistant tool member in which an Si-containing diamond-like carbon film is formed on the surface of a base body, and the carbon film has a graded composition in which the Si content ratio changes in the thickness direction of the coating layer.
Patent Document 1: Japanese Unexamined Patent Application Publication No. H11-058106A
Patent Document 2: Japanese Unexamined Patent Application Publication No. 2010-194628A
However, in the drill that is coated with a diamond layer disclosed in Patent Document 1, the coating layer on the cutting edges on the tip side of the drill is prone to wear. Meanwhile, there has been increased demand for better chip discharge performance from the chip discharge grooves located rearward of the tip. Even when using the coating layer disclosed in Patent Document 2 in which the diamond-like carbon film has a graded composition in the thickness direction of the coating layer, it was not previously possible to satisfy both of the abovementioned requirements at the same time.
Therefore, the present invention aims to provide a cutting tool such as a drill or an end mill in which a cutting edge is formed in the tip of a base body having a rod shape and in which a coating layer exhibits the required performance for both the cutting edge and the chip discharge section.
A first embodiment of the cutting tool having a rod shape of the present invention includes a cutting edge being at least in a tip portion of the cutting tool and a chip discharge section being adjacent to the cutting edge and extending rearward from the tip portion. The cutting tool further includes a base body and a coating layer being on a surface of the base body and composed of a mixed phase of diamond and graphite. A diamond content ratio of the coating layer at a rear portion located 10 mm rearward of a tip is less than a diamond content ratio of the coating layer at the tip portion.
A second embodiment of the cutting tool having a rod shape of the present invention includes a cutting edge being at least in a front tip portion of the cutting tool and a chip discharge groove being adjacent the cutting edge and extending rearward from a tip. The cutting tool further includes a base body made from a hard alloy, the hard alloy containing a hard phase and a bonding phase and a coating layer being on a surface of the base body and containing diamond. A bonding phase content ratio at the surface portion of the base body at a tip section of the tip portion that includes the cutting edge is less than 0.9 times a bonding phase content ratio in an internal portion of the base body at a tip section. A bonding phase content ratio at the surface portion of the base body at a groove section that includes the chip discharge groove is from 0.9 to 1.1 times the bonding phase content ratio of the internal portion of the base body at a groove section. The surface of the base body either is exposed to an external environment or includes the coating layer on at least a portion thereof.
A third embodiment of the cutting tool of the present invention includes a base body having a central rotation axis and a cutting edge being at least from a center portion to a peripheral portion of the base body as viewed from a tip side thereof. The cutting tool further includes a coating layer being on a surface of the base body and contains diamond. An SP3 peak intensity ratio at the center portion is less than an SP3 peak intensity ratio at the peripheral portion when a Raman spectroscopy analysis is performed on a surface of the diamond layer in order to obtain a peak intensity ratio of an intensity of an SP3 peak to a total intensity of a peaks originating from the diamond.
In the first embodiment of the cutting tool of the present invention, the diamond content ratio at the cutting edge in the tip portion of the base body is high, thereby increasing the hardness of the coating layer and making it possible to reduce wear on the coating layer formed on the cutting edge. Moreover, in the portion rearward of the tip portion of the base body (hereinafter, simply “rear portion”), the graphite content ratio is high. Diamond grains grow in polyhedral shapes, and therefore as the content ratio of diamond grains increases, recesses and protrusions are formed in the surface of the coating layer. Meanwhile, graphite does not negatively impact the smoothness of the coating layer even when formed as a film. Therefore, in the rear portion of the base body where the graphite content ratio is high, the surface of the coating layer is smooth, thereby improving chip discharge performance.
In the second embodiment of the cutting tool of the present invention, the content ratio of a bonding phase that impedes growth of the diamond layer is lower at the cutting edge than in the internal portion of the base body, thereby facilitating growth of the diamond layer and increasing the adhesion of the diamond layer to the surface. This makes it possible to reduce progression of wear on the cutting edge. Meanwhile, in the diamond layer that contains high-hardness diamond grains, the diamond grains grow in polyhedral shapes, and therefore the diamond grains grow protruding out from the surface of the diamond layer and form recesses and protrusions in the surface of the coating layer. However, the chip discharge performance of the chip discharge grooves must be improved, and therefore not having a diamond layer in the chip discharge grooves results in better cutting performance. Therefore, the adhesion of the diamond layer can be intentionally reduced in the chip discharge grooves so that the diamond layer is not formed thereon or so that the diamond layer peels off at an early stage. This makes the surface of the chip discharge grooves smooth and improves chip discharge performance.
In the third embodiment of the cutting tool of the present invention, the SP3 peak intensity ratio at the center portion of the base body as viewed from the tip side thereof (hereinafter, simply “center portion”) is low. In other words, the μm-order diamond content ratio is low, and therefore the diamond grains that grow in polygonal shapes do not protrude out from the surface of the diamond layer and make the surface of the diamond layer rough. This makes it possible to keep the surface of the diamond layer flat at the center portion. Moreover, the hardness of the diamond layer on the center portion is low, and therefore the surface of the diamond layer at the center portion of the cutting edge becomes even flatter immediately after the initial cuts are made. This reduces cutting resistance at the center portion, thereby making it possible to prevent breakage of the tool. Meanwhile, the SP3 peak intensity ratio at the peripheral portions of the base body as viewed from the tip side thereof (hereinafter, simply “peripheral portions”) is high. In other words, the μm-order diamond content ratio is high, and therefore the wear resistance of the diamond layer is high.
In other words, in the cutting tool of the present invention, at the cutting edges and particularly at the peripheral portions of the cutting edges, where higher wear resistance is required, the diamond content ratio is increased in order to increase wear resistance. Meanwhile, at the center portion of the base body as viewed from the tip side, at the rear portion of the base body, and along the chip discharge grooves, where good chip discharge performance and sliding properties are required, the diamond content ratio is decreased in order to improve the chip discharge performance and sliding properties. As a result, the cutting tool can be satisfactorily used in cutting processes over the long term.
Next, a cutting tool (here, a solid drill) according to Embodiment 1 of the present invention will be described with reference to the drawings. As illustrated in
In the present embodiment, a coating layer 6 composed of a mixed-phase of diamond and graphite is formed on the surface of a base body 5 of the drill 1. Moreover, as illustrated in
Furthermore, in the present embodiment, the coating layer 6 contains more diamond in the tip portion A than in a rear portion C located 10 mm rearward of the tip. As a result, the diamond content ratio at the cutting edges 2 located in the tip portion A of the base body 5 is high, thereby increasing the hardness of the coating layer 6 and making it possible to reduce wear on the coating layer 6 formed on the cutting edges 2. Moreover, the graphite content ratio rearward of the tip portion A of the base body 5 is high, thereby making the surface of the coating layer 6 very smooth. As a result, the chip discharge grooves 4 are also very smooth, thereby improving chip discharge performance. Furthermore, in the present embodiment, the diamond content ratio decreases as moving rearwards from the tip portion A (that is, towards the rear end B). In the present invention, “rear portion C” refers to the region centered on a point 10 mm rearward of the tip, and the size of this region is determined according to the spot diameter as obtained by any of a variety of analyses.
A polishing process such as a brushing treatment or a blasting treatment may be applied to the tip portion side of the drill 1 in order to smooth the surface of the coating layer 6. In this case as well, the surfaces of the chip discharge grooves 4 are difficult to polish, and the surface of the coating layer 6 is difficult to smooth.
In the present embodiment, the average grain size of the diamond on the rear portion C is smaller than the average grain size of the diamond on the tip portion A. As a result, the surface of the rear side portion of the coating layer 6 is smoother, thereby improving the chip discharge performance of the chip discharge grooves 4. Note that the average grain size of the diamond in the coating layer 6 can be calculated by observing the crystal system in the surface of the coating layer 6 with a scanning electron microscope and then using a Luzex image analysis method. Furthermore, in the present embodiment, the average grain size of the diamond decreases as moving rearwards from the tip portion A.
In the present embodiment, the thickness of the coating layer 6 on the rear portion C is less than the thickness of the coating layer 6 on the tip portion A. As a result, the coating layer 6 is thick at the cutting edges 2, thereby increasing the wear resistance of the coating layer 6 at the cutting edges 2. Meanwhile, the film formation speed is slower in the chip discharge grooves 4 that run rearward from the tip portion A, and the coating layer 6 gets formed more finely and smoothly in these regions. This prevents deterioration of the state of the surface of the coating layer 6. Moreover, unless explicitly mentioned otherwise, in the present embodiment the “thickness” of the coating layer 6 refers to the thickness t measured further outwards than the chip discharge grooves 4 on the outer peripheral surface of the drill 1 as illustrated in
In the present embodiment, the thickness of the coating layer 6 on the rear portion C is less than the thickness of the coating layer 6 on the tip portion A (not illustrated in the figures). This makes it possible to reduce wear on the coating layer 6 at the cutting edges 2 and also makes it easier to maintain the smoothness of the coating layer 6 on the chip discharge grooves 4. Here, it is preferable that the ratio (tB/tA) of the film thickness tB of the coating layer 6 on the rear portion located 10 mm rearward of the tip to the film thickness tA (not illustrated in the figures) of the coating layer 6 on the tip portion A be from 0.2 to 0.8, and it is particularly preferable that this ratio be from 0.4 to 0.8. Moreover, it is preferable that the film thickness tA be from 5 to 12 μm.
The diamond and graphite content ratios of the coating layer 6 can be measured using a Raman spectroscopy analysis. More specifically, this ratio can be obtained by measuring the intensity of the diamond peak SP3 near 1333 cm−1 and the intensity of the graphite peak SP2 near 1400 to 1600 cm−1. These peak intensities should be measured with the laser beam used for the Raman spectroscopy analysis being incident orthogonal to the surface of the coating layer 6 and set to a spot diameter of 1 to 100 μm. To account for local variation in the peak intensities, if a spot diameter less than or equal to 10 μm is used, the peak intensities should be measured in at least three locations and then averaged.
Moreover, an additional coating layer (not illustrated in the figures) may be layered between the base body 5 and the coating layer 6 that is made from the mixed crystal diamond-graphite material.
Examples of materials suitable for use as the base body 5 include cemented carbide alloys and cermets made from a hard phase composed primarily of tungsten carbide or titanium carbonitride and a bonding phase composed primarily of an iron group metal such as cobalt or nickel, as well as other hard materials such as ceramics composed primarily of silicon nitride or aluminum oxide. Among these, a cemented carbide alloy with excellent damage resistance is most suitable.
It should be noted that the cutting tool of the present invention is not limited to the drill in the embodiment described above. The cutting tool may also be an end mill in which the main body of the tool is rod-shaped, end cutting edges are formed in the tip, and peripheral cutting edges are formed on the tip side of the periphery and in which chip discharge grooves 4 run adjacent to the end cutting edges and peripheral cutting edges from the tip portion rearwards. In addition, the present invention may also be suitably applied to indexable cutting edge-type drills and end mills in which the cutting edges are formed as a separate member and then attached to a prescribed position on the tip portion of a holder. Furthermore, the cutting tool may also be a boring tool in which a cutting edge is formed running from the tip portion of a main body having a rod shape to the tip portion side of a side face and a rake face that functions as a chip discharge section is formed adjacent to the cutting edge. When the cutting tool is a boring tool, the chip discharge section does not necessarily need to be spiral-shaped chip discharge grooves and may instead be a curved breaker surface formed extending from the tip portion A to a rearward portion.
Next, a cutting tool (here, a solid drill) according to Embodiment 2 of the present invention will be described. Descriptions of aspects of the configuration of Embodiment 2 that are the same as Embodiment 1 will be omitted here. Like in Embodiment 1 and as illustrated in
In the drill 10, the cutting speed of a center portion 12 as viewed from a tip portion A side of the cutting edges 2 (hereinafter, simply “center portion 12”) is zero or is lower than that of peripheral portions 13 as viewed from the tip portion A side of the cutting edges 2 (hereinafter, simply “peripheral portions 13”), and therefore the center portion 12 tends to experience abrasive wear. As a result, the cutting resistance tends to be higher at the center portion 12 of the cutting edges 2, which can cause breakage of the drill 10. Meanwhile, the cutting speed of the peripheral portions 13 of the cutting edges 2 is higher than that of the center portion 12 of the cutting edges 2, and therefore the peripheral portions 13 of the cutting edges 2 tend to be more prone to wear.
In the present embodiment, when the surface of the coating layer 6 is analyzed using Raman spectroscopy and the peak intensity ratio of the SP3 peak relative to all peaks originating from diamond is obtained, the SP3 peak intensity ratio at the center portion 12 which includes the central rotation axis O of the tip portion A and the nearby areas is lower than the SP3 peak intensity ratio at the peripheral portions 13. This makes it possible to enhance the sliding properties of the coating layer 6 at the center portion 12 and also makes it possible to reduce the grain size of the phases constituting the coating layer 6 in this area and thereby make the surface of the coating layer 6 more flat. In addition, the SP3 peak intensity ratio and the hardness of the coating layer 6 are both low at the center portion 12, and therefore the surface of the coating layer 6 at the center portion 12 becomes even flatter immediately after the initial cuts are made. This reduces cutting resistance at the center portion 12 of the cutting edges 2, thereby making it possible to prevent breakage of the drill 10. In other words, the SP3 peak intensity ratio increases as the μm-order diamond content ratio increases. Therefore, the μm-order diamond content ratio at the center portion 12 is low, and the nanodiamond and graphite content ratios are higher (note that the presence of nanodiamond and graphite reduces the SP3 peak intensity ratio).
Meanwhile, the SP3 peak intensity ratio is high at the peripheral portions 13 of the cutting edges 2, and therefore the coating layer 6 exhibits high wear resistance. As a result, the cutting tool can be satisfactorily used in cutting processes over the long term. Note that in the present invention, “center portion 12” refers to the region inside the web thickness represented by the circle c in
When measuring the SP3 peak intensity ratio using Raman spectroscopy, the intensity of the SP3 peak near 1333 cm−1 originating from μm-order diamond, the intensity of the nanodiamond peak near 1145 cm−1 originating from nm-order diamond, and the intensity of the SP2 peak near 1400 to 1600 cm−1 originating from graphite created due to breakdown of the crystal structure of the diamond are measured. Note that peak intensities should be measured as the highest value of each peak. The SP3 peak intensity ratio is the ratio of the intensity of the SP3 peak to the sum total of the intensities of all three peaks. Moreover, it is preferable that the grain size of the μm-order diamond be from 0.5 to 20 μm, and it is preferable that the average grain size of the μm-order diamond be from 0.8 to 3 μm. Furthermore, it is preferable that the grain size of the nanodiamond be from 1 to 200 nm, and it is preferable that the average grain size of the nanodiamond be from 10 to 100 nm.
There are two primary configurations in which the SP3 peak intensity ratio at the center portion 12 can be lower than the SP3 peak intensity ratio at the peripheral portions 13. In the first configuration, the peak intensity ratio of the nanodiamond peak originating from nanodiamond at the center portion 12 is higher than the peak intensity ratio of the nanodiamond peak at the peripheral portions 13. In other words, in this configuration the average grain size of the diamond at the center portion 12 is less than the average grain size of the diamond at the peripheral portions 13.
Nanodiamond exhibits better sliding properties than μm-order diamond, thereby making it possible to reduce the cutting resistance of the coating layer 6 at the center portion 12 of the cutting edges 2. Moreover, diamond tends to grow in polygonal shapes as grain growth proceeds. When the average grain size of the diamond is low, the amount of diamond protruding out from the surface of the coating layer 6 is low, the surface roughness of the coating layer 6 is small, and the surface of the coating layer 6 is smooth. This makes it possible to further reduce the cutting resistance of the coating layer 6 at the center portion 12 of the cutting edges 2. Diamond also tends to become harder as grain growth proceeds, and therefore when the average grain size of the diamond is low, the hardness of the coating layer 6 decreases, and the surface of the coating layer 6 tends to become even smoother immediately after the initial cuts are made. This also makes it possible to further reduce the cutting resistance of the coating layer 6 at the center portion 12 of the cutting edges 2. Meanwhile, on the peripheral portions 13, the average grain size of the diamond is larger, and therefore the diamond is harder, and both the hardness and wear resistance of the coating layer 6 are improved. Note that the average grain size of the diamond in the coating layer 6 can be calculated by observing the crystal system in the surface or a cross section of the coating layer 6 with a scanning electron microscope or a transmission electron microscope and then using a Luzex image analysis method.
In the second configuration in which the SP3 peak intensity ratio at the center portion 12 is made to be lower than the SP3 peak intensity ratio at the peripheral portions 13, the peak intensity ratio of the SP2 peak originating from graphite at the center portion 12 is larger than the peak intensity ratio of the SP2 peak at the peripheral portions 13. In other words, the SP2 peak is the peak originating from graphite created due to breakdown of the crystal structure of diamond. Therefore, in this configuration, the graphite content ratio at the center portion 12 is greater than the graphite content ratio at the peripheral portions 13.
Graphite exhibits better sliding properties than diamond, thereby making it possible to reduce the cutting resistance of the coating layer 6 at the center portion 12 of the cutting edges 2. Moreover, graphite does not exhibit grain growth, and therefore when the graphite content ratio increases, the surface roughness of the coating layer 6 decreases and the surface of the coating layer 6 becomes smoother. This makes it possible to further reduce the cutting resistance of the coating layer 6 at the center portion 12 of the cutting edges 2. Graphite is also softer than diamond, and therefore increasing the graphite content ratio decreases the hardness of the coating layer 6 at the center portion 12 and makes the surface of the coating layer 6 become even smoother immediately after the initial cuts are made. This also makes it possible to further reduce the cutting resistance of the coating layer 6 at the center portion 12 of the cutting edges 2. Meanwhile, at the peripheral portions 13, the μm-order diamond content ratio of the coating layer 6 is higher, and therefore both the hardness and wear resistance of the coating layer 6 are improved.
The coating layer 6 may be a single-layer film or a multilayer film that includes at least two layers that exhibit different SP3 peak intensity ratios. In this case, the SP3 peak intensity ratio of the surface of the coating layer 6 at the center portion 12 should still be lower than the SP3 peak intensity ratio at the peripheral portions 13. One example of a method for achieving this is to make the nanodiamond peak intensity ratio at the center portion 12 greater than the nanodiamond peak intensity ratio at the peripheral portions 13, for example. More specifically, a first layer that contains nanodiamond is formed over the entire tip portion A of the drill 10 that includes the center portion 12 and the peripheral portions 13, and a second layer that contains μm-order diamond is formed everywhere except for on the center portion 12. Alternatively, a first layer that contains μm-order diamond may be formed over the entire tip portion A of the drill 10 that includes the center portion 12 and the peripheral portions 13, a second layer that contains nanodiamond may be formed only on the center portion 12 and not on the peripheral portions 13. In this configuration, the surface of the coating layer 6 is constituted by the nanodiamond-containing first layer at the center portion 12 and is constituted by the second layer that contains the μm-order diamond of the coating layer 6 at the peripheral portions 13. Therefore, the SP3 peak intensity ratio at the center portion 12 is less than the SP3 peak intensity ratio at the peripheral portions 13.
Next, a cutting tool (here, a solid drill) according to Embodiment 3 of the present invention will be described. Descriptions of aspects of the configuration of Embodiment 3 that are the same as Embodiment 1 or Embodiment 2 will be omitted here. Like in Embodiment 1 and as illustrated in
A base body 5 is made from a hard alloy that contains a hard phase and a bonding phase. Examples of hard alloys include materials such as cemented carbide alloys in which the bonding phase is made from an iron group metal and the hard phase is made from tungsten carbide and cermets in which the hard phase is made from titanium carbonitride. In the present embodiment, the bonding phase content ratio is from 5 to 15 mass %, or more particularly from 6 to 8 mass %.
In the present embodiment, in the region of a tip portion A where the cutting edges 2 are formed, the bonding phase content ratio of the surface portion of the base body 5 in that region is less than 0.9 times the bonding phase content ratio of the internal portion of the base body 5 in that region, and a coating layer 6 is formed on the surface of the base body 5 in that region. In other words, the surface of the base body 5 is covered by the coating layer 6 at the cutting edges 2. In the present embodiment, the bonding phase content ratio of the surface portion of the base body 5 at the cutting edges 2 is from 0.1 to 0.3 times the bonding phase content ratio of the internal portion of the base body 5 at the cutting edges 2.
Meanwhile, in the region where the chip discharge grooves 4 are formed, the bonding phase content ratio of the surface portion of the base body 5 in that region is from 0.9 to 1.1 times the bonding phase content ratio of the internal portion of the base body 5 in that region, and the surface of the base body 5 in that region is either exposed to the external environment or has the coating layer 6 formed thereon. In other words, along the chip discharge grooves 4, the surface of the base body 5 is exposed, or the surface of the base body 5 is covered by the coating layer 6. This increases the adhesion of the coating layer 6 to the surface of the base body 5 at the cutting edges 2, thereby making it possible to reduce progression of wear on the cutting edges 2. Along the chip discharge grooves 4, the coating layer 6 is not formed or exhibits poor adhesion to the base body 5 and therefore quickly peels off. This makes the surfaces of the chip discharge grooves 4 smoother, thereby improving chip discharge performance.
In
Moreover, the coating layer 6 is formed extending from the tip portion A of the drill 20 to near the ends of the chip discharge grooves 4, and the remaining rearward portion of the base body 5 is left uncoated. Moreover, a polishing process such as a brushing treatment or a blasting treatment may be applied to the tip portion side of the drill 20 in order to smooth the surface of the coating layer 6 at the cutting edges 2. In this case, even if the coating layer 6 is formed on the surfaces of the chip discharge grooves 4, the adhesion thereto is poor, and therefore the coating layer 6 peels off and exposes the base body 5. Moreover, because the surfaces of the chip discharge grooves 4 are located in positions that are difficult to polish, the surfaces of the chip discharge grooves 4 do not get excessively polished, and the smoothness of the surface of the base body 5 along the chip discharge grooves 4 is not prone to damage. Moreover, a polishing process such as a brushing treatment or a blasting treatment may be applied to the tip portion side of the base body prior to forming the coating layer 6 thereon in order to adjust the surface roughness of the base body 5 at the cutting edges 2.
In the present embodiment, the average grain size of diamond grains in the coating layer 6 at the cutting edges 2 is from 0.4 to 3 μm. This increases the hardness of the coating layer 6 and prevents the surface of the coating layer 6 from becoming excessively rough, thereby reducing increases in the cutting resistance of the cutting edges 2 and reducing the potential for breakage of the drill 20. Furthermore, in the present embodiment, when the chip discharge grooves 4 are covered by the coating layer 6, the average grain size of the diamond in the coating layer 6 on the chip discharge grooves 4 is less than the average grain size of the diamond in the coating layer 6 at the cutting edges 2. This makes the surface of the rear side portion of the coating layer 6 smoother, thereby improving the chip discharge performance of the chip discharge grooves 4 even during the initial cuts. Note that the average grain size of the diamond in the coating layer 6 can be calculated by observing the crystal system in the surface of the coating layer 6 with a scanning electron microscope and then using a Luzex image analysis method.
Moreover, in the present embodiment, the interface roughness of the surface of the base body 5 at the cutting edges 2 is from 0.12 to 1.5 μm, and the interface roughness of the surface of the base body 5 along the chip discharge grooves 4 is from 0.01 to 0.1 μm. This makes it possible to optimize the adhesion of the coating layer 6 both at the cutting edges 2 and along the chip discharge grooves 4. The interface roughness can be measured by observing a cross section that includes the interface between the base body 5 and the coating layer 6 using an SEM, tracing out the interface between the base body 5 and the coating layer 6, and calculating the maximum height Ry of the traced interface as defined in JISB0601.
Furthermore, in the present embodiment, the diamond content ratio of the coating layer 6 relative to the graphite content ratio therein is higher in the coating layer 6 at the cutting edges 2 than in the coating layer 6 on the chip discharge grooves 4. Moreover, the coating layer 6 on the chip discharge grooves 4 is thinner than the coating layer 6 at the cutting edges 2. This optimizes the surface roughness of the coating layer 6 at the cutting edges 2 and on the chip discharge grooves 4 before cutting processes, thereby reducing application of excessive cutting resistance even during the initial cuts. Moreover, in the present embodiment the coating layer 6 does not necessarily have to be formed on the surfaces of the chip discharge grooves 4, and the surfaces of the chip discharge grooves 4 may be constituted by the exposed base body 5.
The “thickness of the coating layer 6 at the cutting edges 2” refers to the thickness of the coating layer 6 on the tip portion of the drill 20 (including the position of the rotation axis O). When the chip discharge grooves 4 are covered by the coating layer 6, the “thickness of the coating layer 6 on the chip discharge grooves 4” refers to the thickness of the coating layer 6 at the deepest portions in the chip discharge grooves 4 in a cross section taken orthogonal to the rotation axis O. “Deepest portions in the chip discharge grooves 4” refers to the positions on the surface of the base body 5 that are closest to the rotation axis O. Moreover, the “web thickness” is the diameter of the circle that is centered on the rotation axis O and traced out by these positions that are closest to the rotation axis O (that is, the circle c with the maximum diameter that can be drawn within the drill 20).
In the present embodiment, the ratio (t2/t1) of the film thickness t2 of the coating layer 6 on the chip discharge grooves 4 to the film thickness t1 (not illustrated in the figure) of the coating layer 6 at the cutting edges 2 is from 0.2 to 0.8. This makes it possible to reduce wear on the coating layer 6 at the cutting edges 2 and also makes it possible to maintain the smoothness of the coating layer 6 on the chip discharge grooves 4. Moreover, the diamond and graphite content ratios of coating layer 6 can be measured using a Raman spectroscopy analysis. More specifically, this ratio can be obtained by measuring the intensity of the diamond peak SP3 near 1333 cm−1 and the intensity of the graphite peak SP2 near 1400 to 1600 cm−1.
It should be noted that the cutting tool of the present invention is not limited to the drill in the embodiment described above. The cutting tool may also be an end mill in which the main body of the tool is rod-shaped, end cutting edges are formed in the tip, and peripheral cutting edges are formed on the tip side of the periphery and in which chip discharge grooves run adjacent to the end cutting edges and peripheral cutting edges from the tip portion rearwards. In this case, it is preferable that in the peripheral cutting edges, regions of less than or equal to 50 μm in width on the rake face side of ridge lines form the cutting edges described above.
<Method for Manufacturing>
Next, a method for manufacturing the drill according to Embodiment 1 as described above will be described.
First, a centerless grinding process is applied to the surface of a rod-shaped base body, and then a sharpening process is applied to give the base body a drill shape. A polishing process may be applied to the cutting edge side of the base body as desired. Next, an etching process that includes an acid treatment and an alkali treatment is applied to the surface of the base body, thereby producing a drill-shaped base body.
Then, a coating layer is formed as a film on the surface of the base body. A hot filament CVD process may be suitably applied as the film formation method for the coating layer. Next, the details of one example of a film formation method will be described. A film formation device 30 includes a chamber 31, and a sample platform 33 on which to set samples 32 (here, the etched base bodies) is formed inside the chamber 31. In the present embodiment, the base bodies 32 having a rod shape are set in a vertically upright orientation with the tip portions facing up. In
Furthermore, heaters 34 such as a filaments are arranged surrounding the base bodies 32. The heaters 34 are connected to a power supply 35 arranged outside of the chamber 31. In the present embodiment, a plurality of heaters 34 are used, and the arrangement of these heaters 34 as well as the current supplied to each are adjusted such that the temperature of the base bodies 32 having a rod shape set on the sample platform 33 varies in the lengthwise direction of the base bodies 32. More specifically, the heaters 34 are adjusted such that the temperature of the base bodies 32 is highest as the tip portions thereof and such that the temperature gradually decreases towards the rear sides of the base bodies 32. Furthermore, the heaters 34 are supported by supports 39.
A source gas inlet 36 and a gas exhaust outlet 37 are formed in the chamber 31. A vacuum is drawn on the chamber 31, and then hydrogen gas and methane gas are supplied to the chamber 31 via the source gas inlet 36 and blown over the base bodies 32, thereby making it possible to obtain cutting tools in which the ratio of the mixture of diamond to graphite varies in the lengthwise direction of the base bodies 32.
Next, an example of a method for manufacturing the drill according to Embodiment 2 as described above will be described. Descriptions of aspects of the configuration of Embodiment 2 that are the same as Embodiment 1 will be omitted here. First, a drill-shaped base body is produced. In the present embodiment, as a first method of reducing the SP3 peak intensity ratio at the center portion 12, a method in which a masking agent such as a resin is applied to the center portion 12 when etching the surface of the base body after polishing and the etching process is applied to the surface of the base body can be used. This method makes it possible to control the etching process such that the bonding phase content ratio of the surface of the base body does not decrease at the center portion 12. This reduces diamond grain growth on the center portion 12 when later forming the coating layer that contains diamond and increases the graphite content ratio.
As a second method of reducing the SP3 peak intensity ratio at the center portion 12, the base body 5 may be immersed in a cobalt-containing solution 40 after the etching process such that, as illustrated in
Next, the coating layer is formed. As a third method of reducing the SP3 peak intensity ratio at the center portion 12, after forming a first layer that contains nanodiamond over the entire tip portion A of the drill 10, the center portion 12 of the drill 10 may be masked by applying a carbon slurry or the like, and then a second layer that contains μm-order diamond may be formed. In this method, the second layer formed on the center portion 12 is removed along with the mask after the film formation process is complete. In the present embodiment, the first layer and the second layer are formed at the same temperature; however, the magnitude of the vacuum is adjusted to 0.5 to 2 kPa while forming the first layer, and the magnitude of the vacuum is adjusted to 3 to 5 kPa while forming the second layer. Furthermore, the ratio of methane used (in terms of volume percent) while forming the first layer is adjusted to be higher than the ratio of methane used while forming the second layer. This ensures that the first layer exhibits a nanodiamond peak and that the second layer does not exhibit an SP3 peak when performing the Raman spectroscopy analysis. Furthermore, this results in the average grain size of the diamond in the first layer being at least an order of magnitude less than the average grain size of the diamond in the second layer.
Next, an example of a method for manufacturing the drill according to Embodiment 3 as described above will be described. Descriptions of aspects of the configuration of Embodiment 3 that are the same as Embodiment 1 or Embodiment 2 will be omitted here. First, a drill-shaped base body is produced. In the present embodiment, the base body 5 is immersed in an acid solution 41 during the acid treatment of the etching process such that, as illustrated in
<Production Method for a Cut Workpiece>
Next, an example of a method for manufacturing a cut workpiece according to the present embodiment using the drill 1 as described above will be described in detail with reference to
The method for manufacturing the cut workpiece according to the present embodiment includes the following steps (i) to (iv).
(i) Positioning the drill 1 above the prepared workpiece 50 (
(ii) Rotating the drill 1 about the rotation axis O in the rotation direction indicated by the arrow r, and moving the drill 1 in the Y direction towards the workpiece 50 (
(iii) Continuing to move the drill 1 towards the workpiece 50 until the cutting edges 2 of the rotating drill 1 come into contact with a prescribed position on the surface of the workpiece 50, and drilling a hole (a through hole) 51 in the workpiece 50 as illustrated in
(iv) Moving the drill 1 in the Z direction in order to remove the drill 1 from the through hole 51 formed in the workpiece 50 (
The steps described above make it possible for the drill 1 to exhibit excellent hole-drilling performance. Moreover, when drilling multiple holes, the step in which the cutting edges 2 of the drill 1 are brought into contact with the workpiece 50 may be repeated at different locations on the workpiece 50 with the drill 1 kept in the rotating state for the entire process.
Starting with a tungsten carbide (WC) powder with an average grain size of 0.5 μm, 10 mass % of metallic cobalt (Co) powder, 0.2 mass % of titanium carbide (TiC) powder, and 0.8 mass % of chromium carbide (Cr3C2) were added. The resulting mixture was blended together, molded into a cylindrical shape, and sintered. Next, the cylinder was ground into a drill shape, and the surface was cleaned with an alkali, an acid, and distilled water (in that order) to produce a drill base body with a diameter of 6 mm, a cutting length of 10 mm, a web thickness 3 mm thick, and two cutting edges.
This base body was placed in the film formation device illustrated in
Then, a vacuum was drawn on the reaction chamber, and a reactive gas with a composition of 97 v % hydrogen to 3 v % methane was supplied to the reaction chamber via an inlet in order to form the coating layer. The crystal structure of the resulting coating layer was then analyzed at the tip of the drill and at the positions 5 mm and 10 mm rearward of the tip using Raman scattering spectroscopy in order to estimate the diamond content ratio at each position from the SP3 peak intensity ratio (SP3/(SP3+SP2)) between the intensities of the diamond peak SP3 near 1333 cm−1 and the graphite peak SP2 near 1400 to 1600 cm−1.
Moreover, the coating layer formed on the surface of the drill was observed with an SEM, and the average grain size of the diamond was calculated using a Luzex image analysis method. In addition, cross sections of the coating layer at the tip of the drill and at the positions 5 mm and 10 mm rearward of the tip were observed using an SEM in order to measure the thickness of the coating layer at each position. The results are shown in Table 1.
Furthermore, a cutting test was performed using the drills produced as described above under the following cutting conditions in order to evaluate cutting performance. The results are shown in Table 2.
Cutting process: Drilling a hole (a through hole)
Workpiece: CFRP
Cutting speed (feed): 100 mm/minute
Feed rate: 0.075 mm/cutting edge
Through hole dimensions: 8 mm in depth, 6 mm in diameter
Coolant: dry
Evaluation method: After drilling 1500 holes, measure width of wear region on tips of cutting edges (simply “wear width” in the table), count number of holes that have burrs, and verify state of drill once it is no longer able to drill holes.
As shown in Tables 1 and 2, Sample No. 4 (for which the diamond content ratio at the tip of the base body and at the position 10 mm rearward of the tip was the same) exhibited poor chip discharge performance and tended to become clogged with chips, thereby placing excess load on the drill and eventually resulting in breakage. Moreover, Sample No. 5 exhibited poor wear resistance along the cutting edges and was only able to drill a small number of holes.
In contrast, Samples No. 1 to 3 (for which the diamond content ratio was higher at the tip of the base body than at the position 10 mm rearward of the tip) all exhibited good wear resistance along the cutting edges, good chip discharge performance, and were able to drill a large number of holes.
Drill base bodies were produced the same as in Working Example 1. Moreover, for Samples No. II-1 to II-3, after the etching process, the drill base bodies were immersed in a cobalt chloride (CoCl2) methanol solution such that only the center portions thereof were immersed, and then the base bodies were removed from the solution and cleaned with distilled water. For Sample No. II-4, a mask was applied to the center portion of the drill prior to the acid treatment, and then the acid treatment was performed. For Sample No. II-7, after the acid treatment, the drill base body was immersed in the cobalt chloride (CoCl2) methanol solution such that the entire tip portion side thereof was immersed, and then the base body was removed from the solution and cleaned with distilled water. These conditions are noted in the Treatment column of Table 3.
Next, coating layers were formed on the base bodies the same as in Working Example 1. For Sample No. II-5, prior to forming the coating layer, the film-forming temperature of the tip portion was adjusted to 820° C. and the film-forming temperature of the position 3 mm rearward of the tip of the drill base body was adjusted to 650° C. A vacuum of 0.8 kPa in magnitude was drawn on the reaction chamber, and a reactive gas with a composition of 94 v % hydrogen to 6 v % methane was supplied to the reaction chamber via an inlet in order to form a nanodiamond-containing first layer. Then, a mask was applied to the center portion, and a second layer was formed for the coating layer described above.
Next, the crystal structures of the resulting coating layers were analyzed at the center and peripheral portions of the tip portion of each drill using Raman scattering spectroscopy. For the center portion, the region including the central rotation axis O was measured. For the peripheral portions 13, the regions nearest to the outermost positions on the cutting edges as viewed from the tip side (the dashed line regions in
Moreover, the coating layers formed on the surfaces of the drills were observed with a SEM or a TEM, and the average grain size of the diamond was calculated using a Luzex image analysis method. Furthermore, cross sections of the coating layers at the outermost positions of the peripheral portions as viewed from the tip of the drill were observed using an SEM at the tip (point p in
Furthermore, a cutting test was performed using the drills produced as described above under the following cutting conditions in order to evaluate cutting performance. The results are shown in Table 5.
Cutting process: Drilling a hole (a through hole) 6 mm in diameter
Workpiece: CFRP, 8 mm depth
Cutting speed (feed): 200 mm/minute
Feed rate: 0.075 mm/rev
Coolant: dry
Evaluation method: 100 drills of each sample type were evaluated, and the number of drills that suffered early breakage before 100 holes had been drilled were counted. Furthermore, with the drills that did not suffer early breakage, 1500 additional holes were drilled, and the width of the wear region on the tips of the cutting edges (simply “wear width” in the table) was measured for each drill and then averaged for each sample type. In addition, the number of holes drilled before burrs started to form and the drill was no longer able to drill holes was counted for each drill and then averaged for each sample type (the Number of Holes Drilled column in the table).
As shown in Tables 3 to 5, for Samples No. II-6 and II-9 (for which the center portions were not immersed in the CoCl2 solution nor was a mask applied to the center portions before the etching process, and therefore the SP3 peak intensity ratio at the center portions was equal to the SP3 peak intensity ratio at the peripheral portions), the cutting resistance at the center portion of the tip portion was high, the number of drills that suffered breakage was large, and the number of holes drilled was small. Moreover, Samples No. II-7 and II-10 (for which the entire base body was immersed in the CoCl2 solution during the etching process) exhibited excessive wear at the peripheral portions.
In contrast, Samples No. II-1 to II-5 and II-8 (for which the SP3 peak intensity ratio at the center portion was lower than the SP3 peak intensity ratio at the peripheral portion) all exhibited no breakage and good wear resistance at the peripheral portions and were able to drill a large number of holes.
Starting with a tungsten carbide (WC) powder with an average grain size of 0.5 μm, 7.0 mass % of a metallic cobalt (Co) powder and 0.8 mass % of a chromium carbide (Cr3C2) powder were added, and drill base bodies were produced using the same method as in Working Example 1.
Next, as illustrated in
The crystal structures of the resulting coating layers were then analyzed at the tip of the drill and at positions 5 mm and 10 mm rearward of the tip using Raman scattering spectroscopy in order to estimate the diamond content ratio at each position from the SP3 peak intensity ratio (SP3/(SP3+SP2)) between the intensities of the diamond peak SP3 near 1333 cm−1 and the graphite peak SP2 near 1400 to 1600 cm−1. Moreover, the coating layer formed on the surface of the drill was observed with an SEM, and the average grain size of the diamond was calculated using a Luzex image analysis method. In addition, cross sections of the coating layers on the cutting edges at the tip of the drill and on the chip discharge grooves at a position 3 mm rearward of the tip were observed using an SEM in order to measure the thickness of the coating layer at each position. In the tables, the thickness at the cutting edges is listed as t1 and the thickness on the chip discharge grooves is listed as t2. Moreover, the interface roughness at each position was obtained from these SEM images by tracing out the interfaces between the base bodies and the coating layers and then calculating the maximum height Ry of the traced interfaces as defined in JISB0601. Furthermore, an EPMA analysis was performed in order to measure the ratio of bonding phase (Co) contained relative to the total amount of metal in the cemented carbide alloy at the surface of the base body at the cutting edges of the drill tip (the “Cutting edge e” column in the table), at the surface of the base body at the chip discharge grooves (that is, at the position 3 mm rearward from the tip of the drill) (the “Chip discharge grooves g” column in the table), and in the center portion of the 3 mm rearward position (the “Internal portion i” column in the table). The results are shown in Tables 6 to 8.
Furthermore, a cutting test was performed using the drills produced as described above under the following cutting conditions in order to evaluate cutting performance. The results are shown in Table 8.
Cutting process: Drilling a hole (a through hole)
Workpiece: CFRP
Cutting speed (feed): 120 mm/minute
Feed rate: 0.075 mm/cutting edge
Through hole dimensions: 8 mm in depth, 6 mm in diameter
Coolant: dry
Evaluation method: After drilling 1000 holes (or after the last hole drilled for samples that become unable to drill any more holes before 1000 holes), measure width of wear region on tips of cutting edges (simply “wear width” in the table), count number of holes that have burrs, and verify state of each drill once it is no longer able to drill holes.
As shown in Tables 6 to 8, in Sample No. III-6 (for which the base body was not etched and the bonding phase content ratio of the surface portion of the base body at the cutting edges was equal to or greater than 0.9 times the bonding phase content ratio of the internal portion of the base body), the coating layer separated from the cutting edges at an early stage, the cutting edges exhibited poor wear resistance, and the drill was only able to drill a small number of holes. Moreover, in Sample No. III-7 (for which both the cutting edges and the chip discharge grooves were immersed in the acid solution during the etching process, and the bonding phase content ratio of the surface portion of the base body along the chip discharge grooves was less than 0.9 times the bonding phase content ratio of the internal portion of the base body), the surfaces of the chip discharge grooves were rough, the chip discharge performance was poor, and the drill tended to become clogged with chips, thereby putting an excessive load on the drill and eventually causing breakage.
In contrast, in Samples No. III-1 to III-5 and III-8 (for which the ratio e/i between the ratios of bonding phase contained at the cutting edges was less than 0.9 and the ratio g/i between the ratios of bonding phase contained along the chip discharge grooves was from 0.9 to 1.1) all exhibited good wear resistance along the cutting edges and good chip discharge performance and were able to drill a large number of holes. Moreover, in Sample No. III-5, the coating layer partially separated from the surfaces of the chip discharge grooves, leaving the base body exposed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2013-204365 | Sep 2013 | JP | national |
| 2014-014431 | Jan 2014 | JP | national |
| 2014-110313 | May 2014 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2014/076106 | 9/30/2014 | WO | 00 |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO2015/046573 | 4/2/2015 | WO | A |
| Number | Name | Date | Kind |
|---|---|---|---|
| 20070104953 | Sugita | May 2007 | A1 |
| 20080019787 | Sampath | Jan 2008 | A1 |
| Number | Date | Country |
|---|---|---|
| 63-33570 | Feb 1988 | JP |
| 11-058106 | Mar 1999 | JP |
| 2003-80413 | Mar 2003 | JP |
| 2010-194628 | Sep 2010 | JP |
| 2012-139799 | Jul 2012 | JP |
| 201 21 61 87 | Aug 2012 | JP |
| Entry |
|---|
| English translation of JP 201 21 61 873 A, Aug. 2012. |
| Veres, M., et al., “Spatially resolved near-infrared excited Raman spectroscopy of nanocrystalline diamond films,” Diamond and Related Materials (www.sciencedirect.com), Jan. 14, 2008, pp. 515-519. |
| International Search Report (Form PCT/ISA/210) dated Jan. 6, 2015, issued for PCT/JP2014/076106. |
| Number | Date | Country | |
|---|---|---|---|
| 20160243625 A1 | Aug 2016 | US |
