The present invention relates to a cutting tool. The present application claims priority to Japanese Patent Application No. 2017-159279 filed on Aug. 22, 2017, the entire contents of which are herein incorporated by reference.
Japanese Patent Laying-Open No. 2011-101910 describes a diamond-coated cutting tool including a substrate and a diamond layer that covers a surface of the substrate. A surface of the diamond layer at a cutting edge of the diamond-coated cutting tool has arithmetic mean roughness not smaller than 0.1 μm and not greater than 5 μm. At the cutting edge, an average thickness of the diamond layer on a flank is larger than an average thickness of the diamond layer on a rake face.
PTL 1: Japanese Patent Laying-Open No. 2011-101910
A cutting tool according to one manner of the present invention includes a substrate and a diamond layer that covers the substrate. The diamond layer includes a rake face and a flank continuous to the rake face. A ridgeline between the rake face and the flank forms a cutting edge. The substrate includes a top surface opposed to the rake face. When viewed in a direction perpendicular to the top surface, the rake face includes a plurality of protrusions. In a cross-section perpendicular to a direction of extension of the cutting edge, each of the plurality of protrusions includes an inclined portion and a curvature portion continuous to the inclined portion. In the cross-section, a height of the inclined portion in the direction perpendicular to the top surface increases as a distance from the cutting edge increases.
The diamond-coated cutting tool according to the background art is disadvantageous in its short tool lifetime.
One manner of the present invention was made to solve the problem as above, and an object thereof is to provide a cutting tool capable of achieving an improved tool lifetime.
According to one manner of the present invention, a cutting tool capable of achieving an improved tool lifetime can be provided.
Overview of embodiments of the present invention will initially be described.
(1) A cutting tool 100 according to one manner of the present invention includes a substrate 20 and a diamond layer 7 that covers substrate 20. Diamond layer 7 includes a rake face 12 and a flank 11 continuous to rake face 12. A ridgeline between rake face 12 and flank 11 forms a cutting edge 10. Substrate 20 includes a top surface 22 opposed to rake face 12. When viewed in a direction perpendicular to top surface 22, rake face 12 includes a plurality of protrusions 1. In a cross-section perpendicular to a direction of extension B of cutting edge 10, each of the plurality of protrusions 1 includes an inclined portion 2 and a curvature portion 3 continuous to inclined portion 2. In the cross-section, a height of inclined portion 2 in the direction perpendicular to top surface 22 increases as a distance from cutting edge 10 increases.
According to cutting tool 100 in (1), each of the plurality of protrusions 1 includes inclined portion 2 increasing in its height in the direction perpendicular to top surface 22 as a distance from cutting edge 10 increases. Therefore, chips can smoothly pass over inclined portion 2 of rake face 12. Consequently, ejectability of chips is improved. Therefore, damage to the cutting tool is lessened and a tool lifetime can be improved.
(2) In cutting tool 100 according to (1), when viewed in the direction perpendicular to top surface 22, an angle θ formed between a straight line D2 resulting from projection of a normal D3 to inclined portion 2 onto top surface 22 and a normal D1 to cutting edge 10 in a direction in parallel to top surface 22 may be not greater than 80°. A direction of ejection of chips can thus substantially be in parallel to the direction of the straight line resulting from projection of the normal to the inclined portion onto the top surface. Consequently, ejectability of chips is further improved.
(3) In cutting tool 100 according to (1) or (2), when viewed in the direction perpendicular to top surface 22, the plurality of protrusions 1 may be provided over an area within 2 mm from cutting edge 10. Chips are thus readily ejected in a most part of the area where chips pass.
(4) In cutting tool 100 according to any of (1) to (3), in the cross-section, cutting edge 10 may have a radius of curvature not smaller than 0.01 μm and not greater than 50 μm. Sharpness can thus be improved.
(5) A method of manufacturing cutting tool 100 according to one embodiment of the present invention includes steps below. Substrate 20 is covered with diamond layer 7. A part of diamond layer 7 is removed by ion beams. Cutting tool 100 includes rake face 12 and flank 11 continuous to rake face 12. Substrate 20 includes top surface 22 opposed to rake face 12 and a side surface 21 opposed to flank 11. In the covering substrate 20 with diamond layer 7, a surface of diamond layer 7 is formed with a plurality of protrusions 8. In the removing a part of diamond layer 7, a part of each of the plurality of protrusions 8 is removed by emission of ion beams from upper left in a direction inclined with respect to top surface 22, with top surface 22 facing up and a ridgeline 23 between top surface 22 and side surface 21 facing to the left.
According to the method of manufacturing cutting tool 100 in (5), a part of each of the plurality of protrusions 8 is removed by emission of ion beams from upper left in the direction inclined with respect to top surface 22 with top surface 22 facing up and ridgeline 23 between top surface 22 and side surface 21 facing to the left. A plurality of protrusions 1 can thus be formed. Each of the plurality of protrusions 1 includes inclined portion 2 increasing in its height in the direction perpendicular to top surface 22 as a distance from cutting edge 10 increases. Therefore, chips can smoothly pass over inclined portion 2 of rake face 12. Consequently, ejectability of chips is improved. Therefore, damage to the cutting tool is lessened and a tool lifetime is extended.
(6) In the method of manufacturing cutting tool 100 according to (5), the removing a part of diamond layer 7 may be performed without turning substrate 20. The plurality of protrusions 1 can thus be formed with a simplified method.
Details of embodiments of the present invention will be described below with reference to the drawings. The same or corresponding elements in the drawings below have the same reference characters allotted and description thereof will not be repeated. At least a part of the embodiments described below may optionally be combined.
A construction of cutting tool 100 according to a first embodiment will initially be described.
As shown in
As shown in
Substrate 20 mainly includes top surface 22 and side surface 21. Top surface 22 is opposed to rake face 12. Side surface 21 is opposed to flank 11. Substrate 20 is made, for example, of cemented carbide containing powders of tungsten carbide (WC) and a binder such as cobalt (Co). Substrate 20 is not limited to a substrate composed of cemented carbide but may be composed, for example, of cermet or ceramics. Diamond layer 7 contains, for example, diamond crystals. Diamond layer 7 may be composed, for example, of polycrystalline diamond.
As shown in
As shown in
First inclined portion 2 is inclined with respect to top surface 22. An angle ϕ1 of first inclined portion 2 with respect to top surface 22 is, for example, not smaller than 10° and not greater than 40°. An upper limit of angle ϕ1 is not particularly limited and it may be set, for example, to 80° or 30°. A lower limit of angle ϕ1 is not particularly limited and it may be set, for example, to 5° or 1°. As shown in
As shown in
As shown in
First inclined portion 2 includes a second outer peripheral portion 2a opposite to boundary portion 3a. When viewed in the direction perpendicular to top surface 22, second outer peripheral portion 2a is curved as protruding toward cutting edge 10. A width W4 of first inclined portion 2 in direction of extension B of cutting edge 10 may be greater than a width W2 of first inclined portion 2 in the direction perpendicular to direction of extension B of cutting edge 10 and in parallel to top surface 22. In the direction perpendicular to direction of extension B of cutting edge 10 and in parallel to top surface 22, width W2 of first inclined portion 2 may be greater than a width W3 of first curvature portion 3. In direction of extension B of cutting edge 10, width W4 of first inclined portion 2 may be substantially equal to the width of first curvature portion 3. Width W4 of first inclined portion 2 in direction of extension B of cutting edge 10 may substantially be equal to a width W1 of first protrusion 1 in the direction perpendicular to direction of extension B of cutting edge 10 and in parallel to top surface 22.
As shown in
As shown in
As shown in
A method of manufacturing a cutting tool according to the first embodiment will now be described.
Then, the step of removing a part of the diamond layer by ion beams (S20:
For example, EIS200-ER manufactured by Elionix Inc. can be employed as the ion etching apparatus. Conditions for ion etching include a time period of emission of ion beams for one hour and an applied voltage of 2500 V. When a diamond coating is generally removed by ion beams, the diamond coating is removed from substrate 20 while substrate 20 is turned around a revolution axis. In the method of manufacturing a cutting tool according to the present embodiment, however, the step of removing a part of the diamond layer is performed without turning substrate 20. In other words, a part of diamond layer 7 is removed while the substrate is held without varying the direction of emission of ion beams to top surface 22 of substrate 20. Rake face 12 including the plurality of first protrusions 1 is thus formed (see
A function and effect of the cutting tool according to the first embodiment will now be described.
According to cutting tool 100 in the first embodiment, each of the plurality of first protrusions 1 includes first inclined portion 2 increasing in its height in the direction perpendicular to top surface 22 as a distance from cutting edge 10 increases. Therefore, chips can smoothly pass over first inclined portion 2 of rake face 12. Consequently, ejectability of chips is improved. Therefore, damage to the cutting tool is lessened and a tool lifetime can be improved.
According to cutting tool 100 in the first embodiment, when viewed in the direction perpendicular to top surface 22, angle θ formed between straight line D2 resulting from projection of normal D3 to first inclined portion 2 onto top surface 22 and normal D1 to cutting edge 10 in the direction in parallel to top surface 22 is not greater than80°. A direction of ejection of chips can thus substantially be in parallel to the direction of straight line D2 resulting from projection of normal D3 to first inclined portion 2 onto top surface 22. Consequently, ejectability of chips is further improved.
According to cutting tool 100 in the first embodiment, when viewed in the direction perpendicular to top surface 22, the plurality of first protrusions 1 are provided over an area within 2 mm from cutting edge 10. Chips are thus readily ejected in a most part of the area where chips pass.
According to cutting tool 100 in the first embodiment, in the cross-section, cutting edge 10 has a radius of curvature not smaller than 0.01 μm and not greater than 50 μm. Sharpness can thus be improved.
According to the method of manufacturing cutting tool 100 in the first embodiment, a part of each of the plurality of protrusions 8 is removed by emission of ion beams from upper left in the direction inclined with respect to top surface 22 with top surface 22 facing up and the ridgeline between top surface 22 and side surface 21 facing to the left. The plurality of first protrusions 1 can thus be formed. Each of the plurality of first protrusions 1 includes first inclined portion 2 increasing in its height in the direction perpendicular to top surface 22 as a distance from cutting edge 10 increases. Therefore, chips can smoothly pass over first inclined portion 2 of rake face 12. Consequently, ejectability of chips is improved. Therefore, damage to the cutting tool is lessened and a tool lifetime is extended.
According to the method of manufacturing cutting tool 100 in the first embodiment, the step of removing a part of diamond layer 7 is performed without turning substrate 20. The plurality of first protrusions 1 can thus be formed with a simplified method.
A construction of cutting tool 100 according to a second embodiment will now be described. A feature different from that of cutting tool 100 according to the first embodiment will mainly be described below and similar description will not be repeated.
The cutting tool according to the second embodiment can be formed by emission of ion beams with direction of emission I of ion beams being inclined with respect to normal D1 to direction of extension B of ridgeline 23 when viewed in the direction perpendicular to top surface 22 in the step of removing a part of diamond layer 7 by ion beams (S20:
A construction of cutting tool 100 according to a third embodiment will now be described. A feature different from that of cutting tool 100 according to the first embodiment will mainly be described below and similar description will not be repeated.
As shown in
Second inclined portion 5 is inclined with respect to side surface 21. An angle ϕ2 of second inclined portion 5 with respect to side surface 21 may be equal to or different from angle ϕ1 of first inclined portion 2 with respect to top surface 22. Thickness T4 of the portion of diamond layer 7 in contact with side surface 21 in the direction perpendicular to side surface 21 may be substantially equal to or different from thickness T2 of the portion of diamond layer 7 in contact with top surface 22 in the direction perpendicular to top surface 22. Thickness T3 of a second projection in the direction perpendicular to side surface 21 may be substantially equal to or different from thickness T1 of each of the plurality of first protrusions 1 in the direction perpendicular to top surface 22. As shown in
The cutting tool according to the third embodiment can be formed by varying the direction of emission of ion beams to substrate 20 in the step of removing a part of diamond layer 7 by ion beams (S20:
Though an example where cutting tool 100 is a radius end mill is described in the first to third embodiments, cutting tool 100 is not limited to the radius end mill. Cutting tool 100 may be, for example, a rotary cutting tool such as a ball end mill or a drill.
Results of a cutting test using cutting tools of samples 1A to 1C will be described below. The cutting tools as samples 1A to 1C are initially prepared. Sample 1A is a cutting tool according to the first embodiment having a diameter of 12 mm (see
In the cross-section, a height of third inclined portion 32 in the direction perpendicular to top surface 22 decreases as a distance from cutting edge 10 increases. The height of third inclined portion 32 monotonously decreases as the distance from cutting edge 10 increases. When arrangement is such that top surface 22 faces up and ridgeline 23 between top surface 22 and side surface 21 faces to the left, third inclined portion 32 extends from upper left toward lower right. The cutting tool of sample 1B is otherwise similar in construction to the cutting tool of sample 1A.
Each of the plurality of fourth protrusions 41 is constituted of flat portion 42, fourth curvature portion 43, and fifth curvature portion 44. Fourth curvature portion 43 is located opposite to cutting edge 10 with respect to flat portion 42. Fifth curvature portion 44 is located on a side of cutting edge 10 with respect to flat portion 42. Flat portion 42 is located between fourth curvature portion 43 and fifth curvature portion 44. Each of the plurality of fourth protrusions 41 protrudes in the direction away from substrate 20.
In the cross-section, flat portion 42 is substantially in parallel to top surface 22. A height of fourth curvature portion 43 decreases as the distance from cutting edge 10 increases. A height of fifth curvature portion 44 increases as the distance form cutting edge 10 increases. The cutting tool of sample 1C is otherwise similar in construction to the cutting tool of sample 1A.
Conditions in the cutting test will now be described. A margin of CFRP having a thickness of 10 mm was cut by using these samples. Conditions for cutting include a cutting speed V=150 m/min., a feed rate f=0.48 mm/rev., and a total cutting length of 70 m. In an evaluation method, a size of wear in cutting edge 10 and rake face 12 of the tool after cutting by 70 m was checked. Table 1 shows results.
As shown in Table 1, amounts of wear of the rake faces of the cutting tools of samples 1A to 1C were 30 μm, 200 μm, and 60 μm, respectively. In the cutting tool of sample 1B, the diamond layer flaked away. The amount of wear of the rake face of the cutting tool of sample 1A was smallest. It was confirmed from the results above that the amount of wear of the rake face could be reduced by providing the inclined portion such that the height thereof in the direction perpendicular to the top surface increased as the distance from the cutting edge increased in the cross-section.
Results of a cutting test using cutting tools of samples 2A to 2C will be described below. The cutting tools as samples 2A to 2C are initially prepared. Samples 2A to 2C are cutting tools according to the second embodiment (see
Conditions in the cutting test will now be described. These samples were evaluated under the conditions in the cutting test as in Example 1. Table 2 shows results.
As shown in Table 2, amounts of wear of the rake faces of the cutting tools of samples 2A to 2C were 24 μm, 32 μm, and 40 μm, respectively. The amount of wear of the rake face was smaller as angle θ was smaller. It was confirmed that the amount of wear of the rake face was within an allowable range when angle θ was equal to or smaller than 80°.
Results of a cutting test using cutting tools of samples 3A to 3C will be described below. The cutting tools as samples 3A to 3C are initially prepared. Samples 3A to 3C are cutting tools according to the first embodiment (see
Conditions in the cutting test will now be described. These samples were evaluated under the conditions in the cutting test as in Example 1. Table 3 shows results.
As shown in Table 3, amounts of wear of the rake faces of the cutting tools of samples 3A to 3C were 29 μm, 32 μm, and 35 μm, respectively. The amount of wear of the rake face was smaller as distance L from the cutting edge was longer. It was confirmed that the amount of wear of the rake face was within an allowable range when the protrusions were provided over an area within 10 μm from the cutting edge.
Results of a cutting test using cutting tools of samples 4A to 4E will be described below. The cutting tools as samples 4A to 4E are initially prepared. Samples 4A to 4E are cutting tools according to the first embodiment (see
Conditions in the cutting test will now be described. These samples were evaluated under the conditions in the cutting test as in Example 1. Table 4 shows results.
As shown in Table 4, amounts of wear of the rake faces of the cutting tools of samples 4A to 4E were 40 μm, 24 μm, 22 μm, 35 μm, and 45 μm, respectively. Amounts of wear of the flanks of the cutting tools of samples 4A to 4E were 40 μm, 27 μm, 26 μm, 35 μm, and 45 μm, respectively. It was confirmed from the results above that the amount of wear of the rake face and the amount of wear of the flank were small within the range of the radius of curvature of the cutting edge not smaller than 0.01 μm and not greater than 50 μm.
It should be understood that the embodiments and the examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims rather than the description above and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
1 protrusion (first protrusion); 2 inclined portion (first inclined portion); 2a second outer peripheral portion; 3 curvature portion (first curvature portion); 3a boundary portion; 3b first outer peripheral portion; 4 second protrusion; 5 second inclined portion; 6 second curvature portion; 7 diamond layer; 10 cutting edge; 10aend cutting edge; 10b peripheral cutting edge; 11 flank; 11a first flank portion; 11b second flank portion; 12 rake face; 12a first rake face portion; 12b second rake face portion; 14 heel face; 15 first flute face; 17 second flute face; 19 shank; 20 substrate; 21 side surface; 22 top surface; 23 ridgeline; 31 third protrusion; 32 third inclined portion; 33 third curvature portion; 41 fourth protrusion; 42 flat portion; 43 fourth curvature portion; 44 fifth curvature portion; 100 cutting tool; A central axis; B direction of extension; D1 normal to cutting edge; D2 straight line; D3 normal to inclined portion; I direction of emission; L distance; T1, T2, T3, T4 thickness; Wl, W2, W3, W4 width
Number | Date | Country | Kind |
---|---|---|---|
2017-159279 | Aug 2017 | JP | national |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/JP2018/018739 | 5/15/2018 | WO | 00 |