Claims
- 1. A phenolic cyanate resin of the formula: ##STR6## wherein: q and r are the same or different and are whole numbers from 0 to 3 with the proviso that the sum of q and r at each occurrence is equal to 3;
- Z is --O(R).sub.y CN, or --OH and --O(R).sub.y CN;
- y is 0 or 1; O and p are the same or different at each occurrence and are positive whole numbers from 0 to 4, with the proviso that the sum of O and p is equal to 4;
- --X-- is a divalent radical which is substituted to the phenyl groups at the para positions, meta positions, ortho and meta positions, para and ortho positions or para and meta positions with respect to the --Z group such that the mole percent of --X-- substituted at the ortho position is less than about 76 mole percent based on the total number of phenyl groups substituted to the --X-- moiety;
- --R-- is divalent radical;
- R.sub.3 is the same or different at each occurrence and is a substituent other than hydrogen; and
- n is 0 or a positive whole number greater than or equal to 1wherein on maintaining a 20 gram sample of said resin at a temperature of about 20.degree. C. for more than about 3 days no more than about 20% by weight of said sample is converted into components which are insoluble in a 100 gram sample of tetrahydrofuran at a temperature of about 20.degree. C.
- 2. A resin according to claim 1, wherein --X-- is substituted to the phenyl groups at the para and ortho positions.
- 3. A resin according to claim 2, wherein y is 0.
- 4. A resin according to claim 3 wherein said mole percent is equal to or less than about 75.
- 5. A resin according to claim 4 wherein said mole percent is from about 40 to about 75.
- 6. A resin according to claim 5 wherein said mole percent is from about 45 to about 70.
- 7. A resin according to claim 6 wherein said mole percent is from about 55 to about 65.
- 8. A resin according to claim 3 wherein on maintaining a 20 gram sample of said resin at a temperature of about 20.degree. C. for a period of more than or about 14 days no more than about 20% by weight of said sample is converted into components which are insoluble in a 100 gram sample of tetrahydrofuran at a temperature of about 20.degree. C.
- 9. A resin according to claim 8 wherein on maintaining a 20 gram sample of said resin at a temperature of about 20.degree. C. for a period of up to about 21 days no more than about 20% by weight of said sample is converted into components which are insoluble in a 100 gram sample of tetrahydrofuran at a temperature of about 20.degree. C.
- 10. A resin according to claim 8 wherein on maintaining a 20 gram sample of said resin at a temperature of about 20.degree. C. for a period of more than or about 90 days no more than about 20% by weight of said sample is converted into components which are insoluble in a 100 gram sample of tetrahydrofuran at a temperature of about 20.degree. C.
- 11. A resin according to claim 9, having a gel time of greater than 3 minutes at 155.degree. C. and no or substantially no volatiles generated during gel times measurements.
- 12. A resin of claim 11 wherein gel time is equal to or greater than 10 minutes.
- 13. A resin of claim 12 wherein the gel time is equal to or greater than 20 minutes.
- 14. A phenolic triazine resin derived from the cyanato group containing phenolic resin recited in claim 1.
- 15. A resin according to claim 3 wherein from about 20 to about 100 mole percent of Z are --O--R).sub.y CN.
- 16. A resin according to claim 13 wherein from about 80 to about 100 mole percent of Z are --O--R).sub.y CN.
- 17. A resin according to claim 3 wherein X is substituted at the ortho and para positions with respect to the --Z group of the phenyl moiety and is substituted or unsubstituted methylene or phenyldialkylene, wherein permissible substituents are alkyl groups having from 1 to about 10 carbon atoms, halogen, benzene, or furyl.
- 18. A resin according to claim 16 wherein X is the same or different and is substantiated or unsubstituted methylene or phenyldialkylene wherein permissible substituents are alkyl groups having from 1 to 10 carbon atoms, benzene, halogen or furfuryl, or X is a a moiety of the formula:
- --O--, --SO.sub.2 --, --S--, --S--S--, --C(O)--, --C(O)O-- or --OC(O)--.
- 19. A resin according to claim 18 wherein --X-- is unsubstituted methylene or methylene substituted with one or more alkyl having 1 to about 10 carbon atoms, benzene, halogen and furyl, or is a moiety of the formula: ##STR7##
- 20. A resin according to claim 19 where --X-- is unsubstituted methylene or methylene substituted with alkyl, benzene or furyl.
- 21. A resin according to claim 20 wherein --X-- is methylene.
- 22. A resin according to claim 21 wherein n is from 1 to about 10, wherein the number average molecular weight of said resin is from about 320 to about 1700.
- 23. A resin according to claim 22 wherein n is from 1 to about 8.
- 24. A resin according to claim 22 wherein n is from 1 to about 5.
- 25. A resin according to claim 3 wherein:
- o is 0 or 1; and
- p is 2 to 4.
- 26. A resin according to claim 3 wherein:
- q is 0 or 1; and
- r is 2 to 3.
- 27. A resin according to claim 22 wherein R.sub.3 is alkyl.
- 28. A resin according to claim 27 wherein o and q are the same or different at each occurrence and are 0 or 1, p is 3 or 4 and r is 2 or 3.
- 29. A completely cured composition formed by cyclotrimerization of the composition of claim 3.
- 30. A partially cured composition formed by cyclotrimerization of the composition of claim 3.
- 31. An incompletely cured composition formed by cyclotrimerization of the composition of claim 3.
- 32. A resin according to claim 3 containing one or more fillers.
- 33. A resin blend comprising one or more cyanate resins of claim 3 and one or more thermoplastic or thermosetting resins.
- 34. A resin blend according to claim 33 comprising one or more fillers.
- 35. A resin according to claim 3 which when completely cured forms a phenolic triazine which exhibits a thermal decomposition temperature of at least about 400.degree. C.
- 36. A resin according to claim 35 wherein said temperature is at least about 450.degree. C.
- 37. A resin according to claim 28 wherein R.sub.3 is alkyl.
- 38. A resin according to claim 37 wherein R.sub.3 is methyl.
- 39. A resin according to claim 22 or 36 wherein:
- q and o are 0;
- p is 4; and
- r is 3.
- 40. A resin according to claim 39 wherein said number average molecular weight is from about 320 to about 900.
- 41. A resin according to claim 39 wherein said number average molecular weight is from about 900 to about 1700.
- 42. Phenolic triazine derived from the cyanato group containing phenolic resin of claim 39.
- 43. A resin according to claim 39 further comprising one or more fillers.
- 44. A resin blend comprising one or more cyanate resins of claim 40 and one or more thermoplastic resins, thermosetting resins or a combination thereof.
- 45. A resin blend according to claim 44 which further comprises one or more fillers.
RELATED APPLICATIONS
This application is a continuation-in-part application of U.S. patent application Ser. No. 271,198 filed Jan. 15, 1988 now U.S. Pat. No. 4,978,727 which is a continuation-in-part application of U.S. patent application 041,018 filed Mar. 23, 1987 now abandoned claiming priority of PCT/US87/00123 filed Jan. 15, 1987, which is a continuation-in-part of U.S. patent application Ser. No. 821,658, filed Jan. 23, 1986, now abandoned; and U.S. patent Ser. No. 104,700 filed on Oct. 5, 1987 now U.S. Pat. No. 4,831,086.
US Referenced Citations (18)
Foreign Referenced Citations (13)
Number |
Date |
Country |
0180649 |
Oct 1984 |
EPX |
147548 |
Jul 1985 |
EPX |
1094453 |
Feb 1959 |
DEX |
1251023 |
May 1965 |
DEX |
1720740 |
Sep 1971 |
DEX |
2533322 |
Feb 1976 |
DEX |
WO8805443 |
Jul 1988 |
IBX |
WO9103507 |
Mar 1991 |
IBX |
58-34822 |
Mar 1983 |
JPX |
59-149918 |
Aug 1984 |
JPX |
1174654 |
Aug 1986 |
JPX |
8503713 |
Aug 1985 |
WOX |
8704443 |
Jul 1987 |
WOX |
Non-Patent Literature Citations (2)
Entry |
Kunstoffe, Bd, 58, pp. 827-832 (1968) by R. Kubens et al. |
Dokl. and Adak, Nauk SSSR, vol. 202, pp. 347-350 (1972) by V. V. Kovhak et al. |
Continuation in Parts (3)
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Parent |
271198 |
Jan 1988 |
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Parent |
41018 |
Mar 1987 |
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821658 |
Jan 1989 |
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