Claims
- 1. A composition comprising
- (a) an epoxy resin of the formula ##STR8## in which Gly is a glycidyl ether group, Ar is a C.sub.6-20 aromatic moiety, L is a divalent cyclohexanenorbornane linking moiety, L' is a divalent cycloaliphatic linking moiety, and each of m and n is a number with the range of 0 to about 10; and
- (b) a curing agent for the epoxy resin.
- 2. The composition of claim 1 in which the curing agent comprises diaminodiphenyl sulfone.
- 3. The composition of claim 1 in which the curing agent comprises methylene dianiline.
- 4. The solid product of subjecting the composition of claim 1 to a temperature of at least about 150.degree. C. for at least about 0.25 hour.
Parent Case Info
This is a division, of application Ser. No. 029,192 , filed Mar. 10 , 1993, now U.S. Pat. No. 5,284,929.
US Referenced Citations (7)
Foreign Referenced Citations (3)
Number |
Date |
Country |
1-135858 |
|
JPX |
61-168618 |
Jul 1986 |
JPX |
62-39616 |
Feb 1987 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
29192 |
Mar 1993 |
|