The present application relates in general to data communication systems, and more specifically to cables and connectors for transferring data between one system and another.
Data cables, their connectors, and connector form factors are often specified in industry standards related to specific data communication protocols. These industry standards usually take performance into account.
An aspect partially left to individual manufacturers is the final performance, provided that the minimums specified in an industry standard are met. The performance is impacted both by the raw cable and its connectors. Innovations, such as described in the present document, improve the quality of connectors without significant impact on their cost.
One example of a high-speed data cable is the quad small form-factor pluggable (QSFP) cable that supports hot-pluggable transceivers in 40 and 100 Gbits/second data communication systems. The data travels through four channels of nominally 10 or 25 Gbits/second each. The QSFP standard supports various communication protocols. QSFP connecters have 38 pins, including 4 high-speed transmit (TX) and 4 high-speed receive (RX) pairs. QSFP cables are often used in data centers, and to connect servers and switches. Embodiments of the invention are applicable to many industry standards for form factors that are used for high-speed data transmission. A few of those are small form-factor pluggable (SFP), QSFP, QSFP DD (double density), microQSFP, and miniature serial-attached small computer system interface high density (Mini-SAS HD).
Embodiments of the invention provide a connector printed circuit board (PCB) for high-speed signals carried in a differential data cable. The connector PCB comprises two high-speed cable connection pads on a first side. Two differential data cable conductors are electrically coupled to the high-speed cable connection pads. The connection pads are positioned in a symmetrically angled configuration to minimize differential data cable lead lengths and to minimize discontinuity for high-speed signals traveling between the differential data cable conductors and the high-speed cable connection pads. The connector PCB may further include a third pad positioned between the high-speed cable connection pads. A third differential data cable conductor electrically coupled to the third pad. The two high-speed cable connection pads are positioned symmetrically around the third pad.
The differential data cable may be a high-speed data twin-axial cable; the two differential data cable conductors may be signal wires; and the third differential data cable conductor may be a return signal wire, such as a drain wire or a twin-axial cable outer conductor. In some embodiments, the cable connection pads may be made with silver-plated copper.
The connector PCB may have a similar arrangement of pads and conductors (wires) on a second side. Embodiments may include a ground plane in between. The differential data cable may be placed over the ground plane and away from a connector PCB edge. Pads may include a bump to shorten wire lengths. Wires may be glued to the pads or bumps using a UV-curable adhesive. Cable conductors may be positioned in an angle with the connector PCB.
Various implementations will be described with reference to the drawings, in which:
Data cables, their connectors, and connector form factors are often specified in industry standards related to specific data communication protocols. These industry standards usually take performance into account. An aspect partially left to individual manufacturers is the final performance, provided that the minimums specified in an industry standard are met. The performance is impacted both by the raw cable and its connectors. Innovations, such as described in the present document, improve the quality of connectors without significant impact on their cost.
In some embodiments, the two high-speed cable connection pads 140 may surround a third cable connection pad 140 that connects a return signal wire to PCB 120's ground plane. The return signal wire may be a drain wire or outer conductor of the twin-axial cable pair. Distances between cable connection pads 140 may vary, depending on the embodiment. In some embodiments, connector pads 130, cable connection pads 140 and the PCB tracks may be made of silver-plated copper to improve connector 100's high-speed performance. Various embodiments minimize a discontinuity for high-speed signals traveling between the signal wires and cable connection pads 140 by using the angled configuration alone, the two high-speed cable connection pads 140 surrounding the third cable connection pad 140 alone, the cable connection pads 140 and the PCB tracks made of silver-plated copper alone, or any combination thereof.
The distances a and b in
In embodiments of the present invention in which the cables are positioned further from the edge of the board, the signal wires are angled slightly (
Although the invention may be described with respect to specific types of cables and connectors (e.g., QSFP and differential data cables), it should be apparent that many other types of cables and connector designs can be used with features described and claimed herein. For example, embodiments of the invention are suitable for any connector that conforms with an industry standard for connector form factors used for high-speed data transmission. Although the description has been described with respect to particular embodiments thereof, these particular embodiments are merely illustrative, and not restrictive. Embodiments of the invention may single out, or combine, any of the techniques described herein. Use of the techniques described herein does not in any way prevent the simultaneous use of conventional best practices such as keeping PCB traces short.
It will be understood that the invention disclosed and defined in this specification extends to all alternative combinations of two or more of the individual features mentioned or evident from the text or drawings. These different combinations constitute various alternative aspects of the invention.
Although the description has been described with respect to particular embodiments thereof, these particular embodiments are merely illustrative, and not restrictive.
It will also be appreciated that one or more of the elements depicted in the drawings/figures can also be implemented in a more separated or integrated manner, or even removed or rendered as inoperable in certain cases, as is useful in accordance with a particular application.
As used in the description herein and throughout the claims that follow, “a”, “an”, and “the” includes plural references unless the context clearly dictates otherwise. Also, as used in the description herein and throughout the claims that follow, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.
Thus, while particular embodiments have been described herein, latitudes of modification, various changes, and substitutions are intended in the foregoing disclosures, and it will be appreciated that in some instances some features of particular embodiments will be employed without a corresponding use of other features without departing from the scope and spirit as set forth. Therefore, many modifications may be made to adapt a particular situation or material to the essential scope and spirit.
This application claims priority from U.S. Provisional Patent Application Ser. No. 62/281,059, entitled “A Data Connector”, filed on Jan. 20, 2016, which is hereby incorporated by reference as if set forth in full in this application for all purposes.
Number | Date | Country | |
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62281059 | Jan 2016 | US |