1. Field of the Invention
The present invention relates to an outward-appearance confirmation operation for a product or a part which is under fabrication. More particularly, it relates to a data processing apparatus, an inspection-operation assistance system, and a data processing method for assisting the efficiencies of condition determination operations of an inspection tool and an review tool. Here, the inspection tool is used for detecting foreign substances or pattern defects on the surface of an inspection target such as semiconductor wafer, photo mask, magnetic disc, or liquid-crystal board. The review tool is used for observing the defects such as the foreign substances.
2. Description of the Related Art
In semiconductor fabrication steps, the foreign substances or pattern defects on the wafer surface become a cause for product failures. On account of this, it becomes necessary to monitor all the time whether or not a problem exists in the fabrication apparatus and fabrication environment. This monitoring is performed by quantifying the defects such as the foreign substances, pattern defects, or outward-appearance failures detected by the inspection tool. Moreover, it becomes also necessary to confirm whether or not the defects will exert fatal influences on the product. This confirmation is performed by observing such factors as shapes of the defects using the review tool.
From conventionally, the review like this has been performed by human's visual checking. This has resulted in existence of the following problems: Namely, depending on a person who makes the observation, a bias exists in the classification result of the defect position or defect type of an observation target. Also, the definition of a defect to be observed could not be determined uniquely. In order to solve these problems, the introduction of such techniques as the Automatic Defect Review (: ADR) and the Automatic Defect Classification (: ADC) has recently started. In these techniques, the apparatus automatically makes judgments on the size, shape, and type of a defect using the image processing technologies. For example, in observing (i.e., reviewing) an inspected part (e.g., a pattern on a chip formed on a semiconductor wafer) using a SEM review tool to which the SEM (: Scanning Electron Microscopy) is applied, a system has been devised which allows the operation to be efficiently performed while reducing a load imposed on its operator (refer to, e.g., JP-A-10-135288).
In recent years, in accompaniment with the miniaturization of machining dimensions of semiconductor devices, defects have become more and more miniaturized. Also, depending on an inspection condition of the inspection tool for extracting the defects, there exist defects extractable thereby and ones not extractable thereby. In the situation like this, there have existed the increasingly growing needs for changing the inspection condition of the inspection tool to output a plurality of defects extracted at the time of each inspection condition in a manner of being collected at one time. Also, in accompaniment with the high-sensitivity implementation of the inspection tool, output noise from the inspection tool becomes larger. Accordingly, in some cases, the number of the defects detected by the one-time inspection turns out to exceed tens of thousands. In order to eliminate this noise, there has been known a methodology of classifying the defects during the inspection and eliminating the noise by using the RDC (: Real-Time Defect Classification) function on the inspection tool. This methodology, however, requires that comparative check be made between the maximum amount of information available which is outputted from the inspection tool and the maximum amount of information available which is outputted from the review tool in order to determine the defect detection condition in the inspection tool and a condition at the time of exerting the RDC function for eliminating the noise. The proposals (e.g., JP-A-2001-156141(FIG. 2)) have been made concerning the technique for facilitating the defect analysis by organizing the defect ID (: Identification number) information and coordinate information outputted from the inspection tool and the ADR information and ADC information outputted from the review tool. No consideration, however, has been given up to the above-described RDC function.
As described above, the operation of detecting an outward-appearance failure is of the utmost importance in enhancing the yield. Meanwhile, in accompaniment with the miniaturization of the semiconductor devices, the inspection tool is requested to exhibit a capability or performance of being capable of detecting the outward-appearance failure more sensitively. As a result, an inspection tool which is capable of detecting the outward-appearance failure with a high sensitivity is now making its debut. This high-sensitivity implementation of the inspection tool has made it possible to detect microscopic defects. In accompaniment therewith, however, the number of the defects thus detected is becoming enormous. In accompaniment herewith, further, the number of defects that must be confirmed in a review operation for confirming the shape of the outward-appearance failure is also becoming enormous. Accordingly, the information amount which must be fed back for determining the inspection condition and the RDC condition is increasing at an explosive rate. Consequently, it is becoming more and more difficult to accurately determine the inspection condition. From conventionally, in many cases, the comparative-check operation between the information from the inspection tool and the information from the review tool has been performed by human's handwork. This has resulted in a problem that the comparative-check method comes to differ depending on a person who performs the operation, and that a variation occurs in the inspection condition determined based on the comparative-check result.
It is an object of the present invention to make it possible to easily acquire the information which becomes a guideline for determining the inspection condition. Also, it is another object thereof to implement an efficiency improvement in the defect extraction by shortening a time needed until the determination of the inspection condition.
A mode for carrying out the present invention is as follows: A data processing apparatus connected to an inspection tool and an review tool via a network, or an inspection-operation assistance system including the inspection tool, the review tool, and the data processing apparatus. The data processing apparatus automatically receives inspection result file from the inspection tool and image information from the review tool. Moreover, the data processing apparatus makes the comparative check between the defect, image, and attribute information outputted from the inspection tool and the defect, image, and attribute information observed in the review tool. Finally, the data processing apparatus displays, on its display window, both of the above-described information in a manner of being organized and arranged side by side.
A concrete mode of the present invention is as follows: The data processing apparatus selects at least one selection condition for selecting inspection result file to be displayed on the display window, or arbitrarily combines selection conditions through the selection. In more detail, at least the one selection condition is selected based on coordinate data on defects detected by the inspection tool. Otherwise, at least the one selection condition is determined based on the presence or absence of images of the defects acquired by the review tool.
Another concrete mode of the present invention is as follows: The data processing apparatus displays, on the display window, defect attribute parameters of the defects as the inspection result file outputted from the inspection tool. Otherwise, the data processing apparatus displays, on the display window, images of the defects as the inspection result file outputted from the inspection tool. In more detail, the defect attribute parameters or the images of the defects are acquired using a plurality of inspection conditions.
Still another concrete mode of the present invention is as follows: The data processing apparatus displays, on the display window, classification information on the defects classified by the review tool based on the inspection result file from the inspection tool.
Another mode for carrying out the present invention is as follows: A data processing method is disclosed which includes steps of performing transfer/reception of information and images with an review tool, the review tool acquiring images of outward appearance of defects based on inspection result file from an inspection tool, wherein the inspection tool detecting the defects of a target to be detected and outputting first defect information as the inspection result file, and displaying the defect information from the inspection tool and second defect information from the review tool including the images in such a manner that both of the first and second defect information are arranged side by side on a display window.
A more concrete mode of this data processing method is the inclusion of a step of selecting at least one selection condition for selecting defect information to be displayed on the display window, or arbitrarily combining selection conditions through the selection. In more detail, at least the one selection condition is selected based on coordinate data on defects detected by the inspection tool. Otherwise, at least the one selection condition is determined based on the presence or absence of images of the defects acquired by the review tool.
Another concrete mode of this data processing method is the inclusion of a step of displaying, on the display window, defect attribute parameters of the defects as the inspection result file outputted from the inspection tool, or displaying, on the display window, images of the defects as the inspection result file outputted from the inspection tool. In more detail, the defect attribute parameters or the images of the defects are acquired using a plurality of inspection conditions.
Still another concrete mode of this data processing method is the inclusion of a step of displaying, on the display window, classification information on the defects classified by the review tool based on the inspection result file from the inspection tool.
According to the present invention, it becomes possible to easily acquire the information which becomes a guideline for determining the inspection condition. Also, it becomes possible to implement an efficiency improvement in the defect extraction by shortening a time needed until the determination of the inspection condition.
Other objects, features and advantages of the invention will become apparent from the following description of the embodiments of the invention taken in conjunction with the accompanying drawings.
Hereinafter, referring to
Inspection result file 21 acquired when the pattern inspection has been performed are managed in the data processing apparatus 3, using the lot ID, wafer ID, inspection step, and inspection time-and-date. Examples of the inspection result file 21 are defect coordinate information, defect ADR-image information, defect attribute information (i.e., RDC information), and the like. Examples of the conceivable defect attribute information are information mentioned in
The wafers, whose pattern inspection has been terminated, are transferred to the review tool 2 for observing the pattern defect. The review tool 2 extracts a predetermined wafer from within each lot, then performing the review. At the time of performing the review, the review tool 2 acquires the inspection result file 21 from the data processing apparatus 3, using, as key information, the information on the wafer which is the review target (i.e., the lot ID, wafer ID, and inspection step). This inspection result file 21 includes not only the defect ID and coordinate data, but also the ADR image acquired at the time of the inspection.
The inspection result file 21 outputted from the pattern inspection tool 1 are enormous amount of data. Consequently, defect coordinate information. 22b or 23b, which are extracted by the data processing apparatus 3 using a plurality of filter functions, are transmitted to an optical review tool 24 or a SEM (Scanning Electron Microscope) review tool 25 via the communications line 4.
Based on the extracted defect coordinate information 22b or 23b, the optical review tool 24 or the SEM review tool 25 acquires an image of the defect-detecting portion. Then, using the image, the review tool 24 or 25 performs the defect classification by an ADC function mounted on each review tool. Moreover, as ADR/ADC information 22a or 23a, the resultant defect classification information are transmitted to the data processing apparatus 3 via the communications line 4.
Next, referring to
In order to allow these two kinds of large amount of information (i.e., the inspection/image data outputted from the inspection-tool side, and the ADR/ADC information outputted from the review-tool side) to be displayed in a manner of being arranged side by side, a window 30 illustrated in
The window 30 includes the following configuration components: A table 31, pull-down menus 32 and 33 for selecting an image to be displayed, a magnification setting section 46 for changing display magnification, a die-index specification display section 40 for filtering information to be displayed, a button 41 for individually displaying detailed information for each defect, a button 42 for selecting attribute range of a defect to be displayed, a button 43 for displaying attribute graph of a defect displayed, a button 44 for selecting defect attributes to be displayed on the table 31, a button 45 for printing the table 31 by printer, and, as a button for selecting defect information to be displayed, a button 48 for directly selecting a defect. Here, on the table 31, a defect-ID display field 34 for displaying defect IDs outputted from the inspection-apparatus side, and ADR image 35 and defect attribute information 38 outputted therefrom, and ADR image 36 and ADC classification information 37 outputted from the observation-apparatus side are all displayed as one list under a title 39. Also, on the table 31, an arbitrary location is displayable using a scroll bar 47. Comparative check is made between the coordinates of defects whose inspection has been performed using a plurality of inspection conditions. Then, with respect to defects which are judged to be the same defect, information thereon are displayed in a manner of being arranged side by side in the same column within the table 31. Fields of the ADR image 35 and the ADR image 36 have become blank fields for the defect IDs with no image.
As units for permitting an arbitrary location to be displayed easily, the scroll bar 47 and further, the magnification setting section 46 for changing the window display magnification are prepared within the present window. The display magnification is arbitrarily settable, and accordingly it is possible to permit a wider range of the table 31 to be displayed as is illustrated in
On the table 31, clicking on the title 39 allows the information included within the table to be sorted in an ascendant or descendant order on the basis of information on a title clicked on. This sorting makes it possible to immediately understand what types of defects have what types of attributes. This sorting also makes it possible to immediately confirm in what manner a defect seemingly appears which the operator really wishes to find out, and whether or not a defect which the operator is now watching is a pseudo defect.
In this example of this table 31, although the information associated with a single defect ID are displayed in a manner of being arranged side by side in the transverse direction, arranging the information side by side in the longitudinal direction is also allowable, of course.
Next, referring to
Double-clicking on chip specification of the die-index specification display section 40 within the window 30 in
Pressing a button 41 for the detailed display within the window 30 in
Next, clicking on the button 42 for the attribute filtering within the window 30 in
Pressing the button 43 within the window 30 in
Next, pressing the button 44 within the window 30 in
According to the present invention, the following processing apparatus is used on the condition that it is made possible to output the RDC attributes from the inspection tool: Namely, the processing apparatus processes the data outputted from the inspection tool and the one outputted from the review tool, then displaying the defect IDs, their image data, and RDC attributes in a manner of being organized and arranged side by side. Meanwhile, determination of the defect detection condition has been becoming increasingly difficult in accompaniment with development of the miniaturization design rule of semiconductor devices. However, the use of the above-described processing apparatus results in implementation of tremendous effects thereon, such as immediately providing clues for optimizing the inspection condition, and eventually, drastically decreasing the time needed until the optimization of the inspection condition.
It should be further understood by those skilled in the art that although the foregoing description has been made on embodiments of the invention, the invention is not limited thereto and various changes and modifications may be made without departing from the spirit of the invention and the scope of the appended claims.
Number | Date | Country | Kind |
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2004-335271 | Nov 2004 | JP | national |
Number | Name | Date | Kind |
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5544256 | Brecher et al. | Aug 1996 | A |
7113628 | Obara et al. | Sep 2006 | B1 |
7116816 | Tanaka et al. | Oct 2006 | B2 |
20040223639 | Sato | Nov 2004 | A1 |
Number | Date | Country |
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10-135288 | May 1998 | JP |
2001-156141 | Jun 2001 | JP |
2004-134758 | Apr 2004 | JP |
2004-146716 | May 2004 | JP |
2004-281681 | Oct 2004 | JP |
Number | Date | Country | |
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20060111879 A1 | May 2006 | US |