Data storage devices such as disk drives comprise a disk and a head connected to a distal end of an actuator arm which is rotated about a pivot by a voice coil motor (VCM) to position the head radially over the disk. The disk comprises a plurality of radially spaced, concentric tracks for recording user data sectors and servo sectors. The servo sectors comprise head positioning information (e.g., a track address) which is read by the head and processed by a servo control system to control the actuator arm as it seeks from track to track.
In the embodiment of
Any suitable defect scan operation may be executed to detect defects on the disk 18. In one embodiment, the defect scan comprises writing a periodic pattern (e.g., a 2T pattern) to the disk 18, and then reading the periodic pattern to evaluate the resulting sinusoidal read signal 36. The periodic pattern may be written to any suitable segment on the disk, such as a data sector of a data track, or a “wedge” comprising the segment of a track between consecutive servo sectors. In the absence of a defect, the sinusoidal read signal 36 will exhibit an expected amplitude and phase. When the head 16 passes over a defect, the defect will induce a disturbance in the sinusoidal read signal.
In the embodiment of
Regardless as to how a defect on the disk 18 is detected, in one embodiment when a defect is detected it may be due to a defect in the read element of the head 16 rather than to an actual defect on the disk. For example, in one embodiment the head 16 may comprise a magnetoresistive (MR) read element which exhibits a change in resistance in the presence of the magnetic field emanating from the disk, for example, when reading a periodic pattern from the disk during the defect scan. An MR read element may exhibit a defect referred to as baseline popping which is a form of instability (resistance change) due to structural damage, scratches on the active pole, pin layer damage, or improper application of the bias current or voltage. In one embodiment, the read element may exhibit a defective response (e.g., baseline popping) sporadically. Therefore if the control circuitry 22 executed a suitable manufacturing test of the read element to determine whether the head is defective, it may take an extensive amount of time to accurately make the determination. The read element may be stressed in order to expedite the manufacturing test, such as by increasing the bias applied to an MR read element, but stressing the read element may itself damage the read element rendering it defective.
Accordingly, in one embodiment the read element of the head 16 may be evaluated by evaluating the result of a defect scan of the disk. Since the defect scan is typically executed over substantially the entire disk surface, it increases the probability of detecting the sporadic occurrence of read element malfunctions by verifying the detected defects after the defect scan. That is, if a defect detected during the normal defect scan is not again detected during the verification scan, it may be assumed that the detected defect was due to a read element malfunction rather than due to a defect on the disk. This is illustrated in the example of
In one embodiment, during the defect scan the signature in the read signal corresponding to a malfunctioning read element may resemble a particular type of defect on the disk. For example, the signature caused by baseline popping of an MR read element may resemble the drop-in defect shown in
If after the defect scan the drop-in counter exceeds a threshold (block 126), the head is determined to be defective (block 128) without performing the verification scan. That is, if there is an excessive number of drop-in defects detected during the defect scan, it is assumed that a significant number of the drop-in defects were caused by a malfunctioning read element and therefore the head is assumed to be defective without needing to perform the verification scan. If the number of drop-in defects is less than the threshold at block 126, then each drop-in defect in the defect log is processed during the verification scan (block 130). When a false drop-in defect is detected during the verification scan (block 132), a false defect counter is incremented (block 134). When all of the drop-in defects have been evaluated (block 136), the false defect counter is compared to a threshold (block 138). If the false defect counter exceeds the threshold, the head is determined to be defective (block 128); otherwise the head passes the verification scan (block 140). In one embodiment, the false defect counter may exceed the threshold during the verification scan and therefore the verification scan may terminate early since the head can be declared defective as soon as the false defect counter exceeds the threshold at block 136. Similarly, the initial defect scan may terminate early if the number of drop-in defects exceeds the threshold since the head may be declared defective as soon as the drop-in counter exceeds the threshold at block 126.
Any suitable control circuitry may be employed to implement the flow diagrams in the above embodiments, such as any suitable integrated circuit or circuits. For example, the control circuitry may be implemented within a read channel integrated circuit, or in a component separate from the read channel, such as a disk controller, or certain operations described above may be performed by a read channel and others by a disk controller. In one embodiment, the read channel and disk controller are implemented as separate integrated circuits, and in an alternative embodiment they are fabricated into a single integrated circuit or system on a chip (SOC). In addition, the control circuitry may include a suitable preamp circuit implemented as a separate integrated circuit, integrated into the read channel or disk controller circuit, or integrated into a SOC.
In one embodiment, the control circuitry comprises a microprocessor executing instructions, the instructions being operable to cause the microprocessor to perform the flow diagrams described herein. The instructions may be stored in any computer-readable medium. In one embodiment, they may be stored on a non-volatile semiconductor memory external to the microprocessor, or integrated with the microprocessor in a SOC. In another embodiment, the instructions are stored on the disk and read into a volatile semiconductor memory when the disk drive is powered on. In yet another embodiment, the control circuitry comprises suitable logic circuitry, such as state machine circuitry.
While the above examples concern a disk drive, the various embodiments are not limited to a disk drive and can be applied to other data storage devices and systems, such as magnetic tape drives, solid state drives, hybrid drives, etc. In addition, some embodiments may include electronic devices such as computing devices, data server devices, media content storage devices, etc. that comprise the storage media and/or control circuitry as described above.
The various features and processes described above may be used independently of one another, or may be combined in various ways. All possible combinations and subcombinations are intended to fall within the scope of this disclosure. In addition, certain method, event or process blocks may be omitted in some implementations. The methods and processes described herein are also not limited to any particular sequence, and the blocks or states relating thereto can be performed in other sequences that are appropriate. For example, described tasks or events may be performed in an order other than that specifically disclosed, or multiple may be combined in a single block or state. The example tasks or events may be performed in serial, in parallel, or in some other manner. Tasks or events may be added to or removed from the disclosed example embodiments. The example systems and components described herein may be configured differently than described. For example, elements may be added to, removed from, or rearranged compared to the disclosed example embodiments.
While certain example embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions disclosed herein. Thus, nothing in the foregoing description is intended to imply that any particular feature, characteristic, step, module, or block is necessary or indispensable. Indeed, the novel methods and systems described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the embodiments disclosed herein.
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