Technical Information Bulletin, by Philadelphia Decal, (1993), pp. 1-2, (No month). |
“How to Use Decals in Decorating”, Philadelphia Ceramics, Inc., pp. 1-4, (No date). |
“The Making of A Decal”, The Plate Collector, Dec. 1985, pp. 33-35. |
Cavicchi et al., “Large Area Wraparound Cell Development”, IEEE, 1984, pp. 128-133, No month. |
Michaels et al., “Large Area, Low Cost Space Solar Cells with Optional Wraparound Contacts”, IEEE, 1981, pp. 225-227, No month. |
Mason et al., “Development of 2.7 mil BSF and BSFR Silicon Wrapthrough Solar Cells”, IEEE, 1990, pp. 1378-1382, No month. |
Gee et al., “Emitter Wrap-Through Solar Cell”, IEEE, 1993, pp. 265-270, No month. |
Thornhill, Final Report—Automated Fabrication of Back Surface Field Silicon Solar Cells with Screen Printed Wraparound Contacts, prepared for NASA, 1977, pp. 1-30, No month. |
Product Brochure for Formion®Formulated Ionomer, by A. Schulman Inc., Resisns, pp. 1-3, No date. |
The Rotary Press, newsletter from Philadelphia Decal, vol. I, Issue No. 2, Sep. 1993, pp. 1-2, No month. |
Baker et al., “Introduction of Acrylate Copolymer Based Ionomer Resins for Packaging Applications”, pp. 1-20, No date. |
Anonymous; “Decal Interconnection Bonding Method”; IBM Technical Disclosure Bulletin; vol. 10; No. 7; Dec. 1967; pp. 1074-1075; XP002088435. |
Anonymous; “Interconnection Decal Employing Silicon Adhesive” IBM Technical Disclosure Bulletin; vol. 10; No. 11; Apr. 1968; pp. 1667-1668; XP002088436. |
Anonymous; “Silicon-on-Silicon- The Integral Decal”; IBM Technical Disclosure Bulletin; vol. 33; No. 1A; Jun. 1990; pp. 174-175; XP002088437. |