This application is a continuation-in-part of application Ser. No. 581,258, filed Feb. 17, 1984, (now abandoned).
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---|---|---|---|
4124889 | Kaufman | Nov 1978 | |
4373183 | Means et al. | Feb 1983 | |
4375639 | Johnson, Jr. | Mar 1983 | |
4385350 | Hansen | May 1983 | |
4449183 | Flahive et al. | May 1984 | |
4453214 | Adcock | Jun 1984 | |
4472712 | Ault et al. | Sep 1984 | |
4482950 | Dshkhunian et al. | Nov 1984 | |
4482953 | Burke | Nov 1984 | |
4488218 | Grimes | Dec 1984 | |
4499538 | Finger et al. | Feb 1985 | |
4511959 | Nicolas | Apr 1985 | |
4533994 | Harrill et al. | Aug 1985 | |
4535330 | Carey et al. | Aug 1985 | |
4543629 | Carey et al. | Sep 1985 | |
4543630 | Neches | Sep 1985 | |
4549263 | Calder | Oct 1985 | |
4556939 | Read | Dec 1985 | |
4570217 | Allen et al. | Feb 1986 | |
4571675 | Stambaugh et al. | Feb 1986 | |
4590556 | Berger et al. | May 1986 | |
4626843 | Szeto et al. | Dec 1986 | |
4642630 | Beckner et al. | Feb 1987 |
Entry |
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P. Kraynak et al., "Wafer-Chip Assembly for Large-Scale Integration," IEEE Transactions on Electron Devices, vol. ED-15, No. 9, Sep. 1968, pp. 660-663. |
Pending U.S. patent application Ser. No. 581,259, filed Feb. 17, 1984 (K. K. Ng et al, 2-11). |
Pending U.S. patent application Ser. No. 581,336, filed Feb. 17, 1984 (K. K. Ng et al, 3-12). |
Pending U.S. patent application Ser. No. 581,260, filed Feb. 17, 1984 (K. K. Ng et al, 4-13). |
Pending U.S. patent application Ser. No. 582,079, filed Feb. 21, 1984 (K. L. Tai, 8). |
Number | Date | Country | |
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Parent | 581258 | Feb 1984 |