This application is a continuation-in-part of application Ser. No. 581,258, filed Feb. 17, 1984, (now abandoned).
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| Entry |
|---|
| P. Kraynak et al., "Wafer-Chip Assembly for Large-Scale Integration," IEEE Transactions on Electron Devices, vol. ED-15, No. 9, Sep. 1968, pp. 660-663. |
| Pending U.S. patent application Ser. No. 581,259, filed Feb. 17, 1984 (K. K. Ng et al, 2-11). |
| Pending U.S. patent application Ser. No. 581,336, filed Feb. 17, 1984 (K. K. Ng et al, 3-12). |
| Pending U.S. patent application Ser. No. 581,260, filed Feb. 17, 1984 (K. K. Ng et al, 4-13). |
| Pending U.S. patent application Ser. No. 582,079, filed Feb. 21, 1984 (K. L. Tai, 8). |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 581258 | Feb 1984 |