Currently, the United States Navy uses standard connectors on fiber optic connector interfaces. These connectors, as well as other connectors, are difficult to inspect and clean, especially in an operational (fleet maintenance environment). Current proposals to fix this issue include a physical contact array connector and noncontact connectors. Neither types of connectors are designed for maintainability or meet U.S. Navy and Department of Defense interoperability needs.
The present invention is directed to a dematable expanded beam fiber optic connector that is a fiber optic connector, that includes a pin housing, a receptacle housing, and a slidable spring loaded receptacle lens assembly.
The present invention is directed to a dematable expanded beam fiber optic connector that allows easy cleaning and inspection.
It is a feature of the present invention to provide a dematable expanded beam fiber optic connector that is maintainable, readily cleanable, and keeps external contaminants away from its optical surfaces.
It is a feature of the present invention to provide a connector that is readily cleanable in a tight working space application environment. Applications include fiber optic backplanes, blind-mate equipment rack connections, and store and sensor interfaces. By eliminating the use of connector guide pins and guide pin sockets, and providing a relatively flat connector mating surface, the connector optical interface is readily cleanable using standard cleaning instruments and materials.
Additionally, the present invention provides sealing gasket(s) which prevent contaminants from entering any of the dematable connector optical interfaces.
These and other features, aspects and advantages of the present invention will become better understood with reference to the following description and appended claims, and accompanying drawings wherein:
The preferred embodiments of the present invention are illustrated by way of example below and as shown in
In the description of the present invention, the invention will be discussed in a military environment; however, this invention can be utilized for any type of application that utilizes a fiber optic connector.
In another embodiment of the invention, the dematable expanded beam fiber optic connector 10, as show in
In the preferred embodiment, as shown in
In one of the embodiments of the invention, the fiber optic ferrule assembly 500 contains a ferrule assembly gasket 560 to protect the slidable spring loaded receptacle lens assembly 400 and the fiber optic ferrule assembly 500 optical interface from external contaminants.
In another one of the embodiments of the invention, the non-spring loaded pin lens sleeve assembly 300 and the slidable spring loaded receptacle lens assembly 400 are axially aligned. Two (or more) elements are axially aligned when the axes of each element are put end to end, they form a substantially straight line. In addition, the invention may include a pin alignment sleeve 900 and a receptacle alignment sleeve 920. The pin alignment sleeve 900 envelops the non-spring loaded pin lens sleeve assembly 300, while the receptacle alignment sleeve 920 envelops the slidable spring loaded receptacle lens assembly 400 and may optionally envelop the fiber optic ferrule assembly 500. The pin alignment sleeve 900 and the receptacle alignment sleeve 920 may be axially aligned. In another embodiment, the dematable expanded beam fiber optic connector 10 includes a guide 605 for aligning the fiber optic ferrule assembly 500 and the slidable spring loaded receptacle lens assembly 400 such that optical communication between the fiber optic ferrule assembly 500 and the slidable spring loaded receptacle lens assembly 400 occurs.
When introducing elements of the present invention or the preferred embodiment(s) thereof, the articles “a,” “an,” “the,” and “said” are intended to mean there are one or ore of the elements. The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements.
Although the present invention has been described in considerable detail with reference to certain preferred embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the preferred embodiment(s) contained herein.
The invention described herein may be manufactured and used by or for the Government of the United States of America for governmental purposes without payment of any royalties thereon or therefor.
Number | Name | Date | Kind |
---|---|---|---|
4634214 | Cannon, Jr. | Jan 1987 | A |
4712861 | Lukas | Dec 1987 | A |
4747656 | Miyahara | May 1988 | A |
4824202 | Auras | Apr 1989 | A |
4991929 | Bowen | Feb 1991 | A |
5257332 | Pimpinella | Oct 1993 | A |
5329541 | Brown | Jul 1994 | A |
5337386 | Noll | Aug 1994 | A |
5574815 | Kneeland | Nov 1996 | A |
5640478 | Roller | Jun 1997 | A |
5692086 | Beranek | Nov 1997 | A |
5717801 | Smiley | Feb 1998 | A |
5745624 | Chan | Apr 1998 | A |
5857049 | Beranek | Jan 1999 | A |
5895019 | Ibarra | Apr 1999 | A |
5896481 | Beranek | Apr 1999 | A |
5907650 | Sherman | May 1999 | A |
5940562 | Henson | Aug 1999 | A |
6007255 | Krauter | Dec 1999 | A |
6024004 | Kosiarski | Feb 2000 | A |
6065882 | Roller | May 2000 | A |
6164837 | Haake | Dec 2000 | A |
6282349 | Griffin | Aug 2001 | B1 |
6394665 | Hayashi | May 2002 | B1 |
6409391 | Chang | Jun 2002 | B1 |
6618405 | Kimura | Sep 2003 | B2 |
6626582 | Farrar | Sep 2003 | B2 |
6712527 | Chan | Mar 2004 | B1 |
6932517 | Swayze | Aug 2005 | B2 |
7031567 | Grinderslev | Apr 2006 | B2 |
7344396 | Stagi | Mar 2008 | B2 |
7442045 | Di Stefano | Oct 2008 | B1 |
7503701 | Hiereth | Mar 2009 | B2 |
7621767 | Stagi | Nov 2009 | B2 |
7658629 | Stagi | Feb 2010 | B2 |
7674113 | Di Stefano | Mar 2010 | B2 |
7722261 | Kadar-Kallen | May 2010 | B2 |
7853144 | Beranek | Dec 2010 | B2 |
8023784 | Beranek | Sep 2011 | B1 |
8419293 | Zerfas | Apr 2013 | B2 |
8511909 | Kadar-Kallen | Aug 2013 | B2 |
8714836 | Daikuhara | May 2014 | B2 |
8827567 | Grinderslev | Sep 2014 | B2 |
8888378 | Zerfas | Nov 2014 | B2 |
9057847 | Lin | Jun 2015 | B2 |
9329350 | Zerfas | May 2016 | B2 |
9393081 | Hiereth | Jul 2016 | B2 |
9395496 | Byer | Jul 2016 | B2 |
9429713 | Thornton, Jr. | Aug 2016 | B2 |
9465173 | Becker | Oct 2016 | B2 |
9660757 | Beranek | May 2017 | B2 |
9823424 | Krawczyk | Nov 2017 | B2 |
20020081871 | Swayze | Jun 2002 | A1 |
20070049085 | Stagi | Mar 2007 | A1 |
20080050073 | Kadar-Kallen | Feb 2008 | A1 |
20080124962 | Stagi | May 2008 | A1 |
20080156508 | Stagi | Jul 2008 | A1 |
20080246957 | Beranek | Oct 2008 | A1 |
20080260379 | Beranek | Oct 2008 | A1 |
20090060529 | Beranek | Mar 2009 | A1 |
20090068858 | Di Stefano | Mar 2009 | A1 |
20090305523 | Di Stefano | Dec 2009 | A1 |
20100189395 | Kadar-Kallen | Jul 2010 | A1 |
20100247043 | Sugawara | Sep 2010 | A1 |
20110229076 | Beranek | Sep 2011 | A1 |
20130039622 | Grinderslev | Feb 2013 | A1 |
20130084042 | Bouchard | Apr 2013 | A1 |
20130093184 | Peirce | Apr 2013 | A1 |
20150374207 | Fukuoka | Dec 2015 | A1 |
20160365941 | Beranek | Dec 2016 | A1 |
20170052329 | Grinderslev | Feb 2017 | A1 |
20170160486 | Krawczyk | Jun 2017 | A1 |
20170285276 | Altshuler | Oct 2017 | A1 |
Number | Date | Country |
---|---|---|
0992343 | Apr 2000 | EP |
WO 2004097988 | Nov 2004 | WO |
WO 2005119319 | Dec 2005 | WO |
WO 2010124165 | Oct 2010 | WO |
WO 2013126529 | Aug 2013 | WO |
WO 2014151927 | Sep 2014 | WO |
Entry |
---|
Mark W. Beranek, “Fiber optic interconnect and optoelectronic packaging challenges for future generation avionics,” Proc. SPIE 6478, Photonics Packaging, Integration, and Interconnects VII, 647809 (Feb. 14, 2007). |
M. W. Beranek, “Future generation military avionics fiber optics photonics packaging challenges,” 2007 IEEE/AIAA 26th Digital Avionics Systems Conference, Dallas, TX, 2007, pp. 2.A.6-1-2.A.6-10. |
Michael D. Orr, Jim T. Hartley, Mark W. Beranek, Eric Y. Chan, Harold E. Hager, Chi-Shain Hong, “Universal detachable optical connector for military and commercial aerospace fiber optic modules,” Proc. SPIE 2691, Optoelectronic Packaging, (Mar. 29, 1996). |
SBIR Source available at: https://sbirsource.com/sbir/people/78682-mark-beranek, 2018. |
Navy SBIR—NAVAIR—2015—Multi-Wavelength and Built-in Test Capable Local Area Network Node Packaging, 2015, available at http://www.navysbir.com/n15_2/N152-090.htm. |
NAVAIR News, 2012, available at http://www.navair.navy.mil/index.cfm?fuseaction=home.NAVAIRNewsStory&id=5101. |
AVFOP2018—Avionics and Vehicle Fiber-optics and Phtonics Conference, 2018—available at http://ieee-avfop.org/2018-organizing-committee/. |
Navy SBIR—2009, Multichannel Fiber Optic Package Interface for Avionics, 2009. http://www.navysbir.com/n09_1/N091-039.htm. |
Navy—NAVSEA—Fiber Optic Component—2016. |
SPIE Profile—Mark W. Beranek—2018, available at https://www.spiedigitallibrary.org/profile/Mark.Beranek-7538. |