TREA

DENSE VERTICALLY SEGMENTED SILICON COATING FOR LOW DEFECTIVITY IN HIGH-TEMPERATURE RAPID THERMAL PROCESSING

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Information

  • Patent Application
  • 20230295789
  • Publication Number
    20230295789
  • Date Filed
    March 15, 2022
    2 years ago
  • Date Published
    September 21, 2023
    a year ago
Information
Abstract
This application generally relates to a chamber component for a thermal processing chamber comprising a base component having a coating disposed thereon, the coating having a base component having a coating disposed thereon, the coating includes a surface, a thickness, and a plurality of cracks extending from the surface of the coating through at least 40 percent of the thickness of the coating.
Description
Claims
  • 1. A chamber component for a thermal processing chamber, comprising: a base component having a coating disposed thereon, the coating comprising: a surface,a thickness, anda plurality of cracks extending from the surface of the coating through at least 40 percent of the thickness of the coating.
  • 2. The chamber component of claim 1, wherein the plurality of cracks extend between 60 and 100 percent of the thickness of the coating.
  • 3. The chamber of component of claim 2, wherein the plurality of cracks comprises between 8 and 20 cracks per 100 µm2 of surface area.
  • 4. The chamber component of claim 3, wherein the plurality of cracks each has a length between 1 µm and 200 µm.
  • 5. The chamber component of claim 2, wherein the total average length of the plurality of cracks is between 8 nm and 14 nm per 1 µm 2 surface area.
  • 6. The chamber component of claim 2, wherein the average spacing between the plurality of cracks is between 70 µm and 125 µm.
  • 7. The chamber component of claim 1, wherein the coating is one of an air plasma sprayed silicon coating, a low pressure plasma sprayed silicon coating, or a vacuum plasma sprayed silicon coating.
  • 8. A support ring for use in a thermal processing chamber, the support ring having a coating disposed thereon, the coating comprising: a surface,a thickness, anda plurality of cracks extending from the surface of the coating through at least 40 percent of the thickness of the coating, wherein the average spacing between the plurality of cracks is between 70 µm and 125 µm.
  • 9. The support ring of claim 10, wherein the plurality of cracks comprises between 8 and 20 cracks per 100 µm2 of surface area.
  • 10. The support ring of claim 10, wherein the plurality of cracks each has a length between 1 µm and 200 µm.
  • 11. The support ring of claim 10, wherein the total average length of the plurality of cracks is between 8 nm and 14 nm per 1 µm 2 surface area.
  • 12. The support ring of claim 10, wherein the average spacing between the plurality of cracks is between 70 µm and 125 µm.
  • 13. The support ring of claim 10, wherein the plurality of cracks comprises between 12 and 18 cracks per 100 µm2 of surface area.
  • 14. A thermal processing chamber, comprising: a chamber body comprising a base, one or more side walls, and a lid enclosing a processing volume; anda substrate support comprising a support cylinder, a support ring, and an edge ring disposed within the processing volume, wherein the support ring has a coating disposed thereon, wherein the coating comprises: a surface,a thickness, anda plurality of cracks extending from the surface of the coating through at least 40 percent of the thickness of the coating.
  • 15. The thermal processing chamber of claim 14, wherein the plurality of cracks extend between 60 and 100 percent of the thickness of the coating.
  • 16. The thermal processing chamber of claim 15, wherein the plurality of cracks comprises between 8 and 20 cracks per 100 um2 of surface area.
  • 17. The thermal processing chamber of claim 15, wherein the plurality of cracks each has a length between 1 µm and 200 µm.
  • 18. The thermal processing chamber of claim 14, wherein the total average length of the plurality of cracks is between 14 nm and 20 nm per 1 µm 2 surface area.
  • 19. The thermal processing chamber of claim 13, wherein the total average length of the plurality of cracks is between 8 nm and 14 nm per 1 µm 2 surface area.
  • 20. The thermal processing chamber of claim 13, wherein the average spacing between the plurality of cracks is between 70 µm and 125 µm.