Deposition ring of a process kit for semiconductor substrate processing

Information

  • Patent Grant
  • D1069863
  • Patent Number
    D1,069,863
  • Date Filed
    Thursday, August 4, 2022
    3 years ago
  • Date Issued
    Tuesday, April 8, 2025
    8 months ago
  • US Classifications
    Field of Search
    • US
    • D15 138
    • D15 140
    • D15 141
    • D15 144
    • D15 1441
    • D15 1442
    • D15 199
    • D13 118
    • D13 182
    • D13 184
    • D13 199
    • CPC
    • H01J37/32623
    • H01J37/32633
    • H01J37/32642
    • H01J37/32715
    • H01J37/32733
    • H01J37/32743
    • H01J37/32897
    • H01J37/3414
    • H01J37/3423
    • H01L21/00
    • H01L21/0226
    • H01L21/02263
    • H01L21/02266
    • H01L21/02269
    • H01L21/02271
    • H01L21/02631
    • H01L21/67
    • H01L21/67005
    • H01L21/67011
    • H01L21/67017
    • H01L21/67063
    • H01L21/67075
    • H01L21/67098
    • H01L21/67115
    • H01L21/67742
    • H01L2221/67
    • H01L2221/68363
    • C23C14/34
    • C23C14/35
    • C23C16/00
    • C23C16/458
    • C23C16/44
    • C23C16/04
    • C23C16/4582
    • C23C16/4583
    • C23C16/4585
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a top isometric view of a deposition ring of a process kit for semiconductor substrate processing, according to the novel design.



FIG. 2 is a bottom isometric view thereof.



FIG. 3 is a top plan view thereof.



FIG. 4 is a bottom plan view thereof.



FIG. 5 is a left elevation view thereof, enlarged to more clearly show details.



FIG. 6 is a right elevation view thereof, enlarged to more clearly show details.



FIG. 7 is a back elevation view thereof, enlarged to more clearly show details; and,



FIG. 8 is a front elevation view thereof, enlarged to more clearly show details.


Claims
  • The ornamental design for a deposition ring of a process kit for semiconductor substrate processing, as shown and described.
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