The present invention may be further understood with reference to the following description and the appended drawings, wherein like elements are referred to with the same reference numerals. The present invention describes a desiccant arrangement for a computing device. The exemplary embodiments of the present invention will be described with reference to use of the desiccant arrangement in a mobile computing unit. However, those of skill in the art will understand that the desiccant arrangement of the present invention may also be utilized by stationary computing device in which condensation, moisture and/or fog may be problematic. For example, internal temperature changes within the stationary computing device may generate moisture when the stationary computing device is used in high or low temperature environments.
When the MU 5 is not in use, it is typically coupled to a charger located in a controlled temperature environment, e.g., a warehouse, a store room, etc. When the MU 5 is removed from the controlled temperature environment and used in the low or high temperature environment, moisture (e.g., condensation, fog, etc.) may be form in air within the housing 10 as a function of the temperature change. The moisture can negatively impact use of the MU 5 by, for example, shorting electrical components, fogging up optical elements such as a display screen 20, a touch panel, a scan window 25, a lens of an imager, a mirror, etc.
The exemplary embodiments of the present invention provides a desiccant arrangement 30 to absorb moisture in the air within the housing 10 of the MU 5. In one exemplary embodiment, the desiccant arrangement 30 comprises an enclosure 35 which encases one or more desiccants 40. The enclosure 35 may be, for example, a perforated cage allowing air to circulate through the desiccants 40 so that any moisture in the air is absorbed. Those of skill in the art will understand that the enclosure 35 may be formed from any material which is permeable to water vapor
The enclosure 35 may be mounted to a main assembly stack in the housing 10 which includes the PCB 15. In this manner, the desiccants 40 may be sandwiched between the enclosure 35 and the PCB 15, as shown in
The enclosure 35 may be permanently or temporarily mounted to the main assembly stack of the MU 5. For example, an adhesive or soldering/welding may be used to affix the enclosure 35 permanently to the main assembly stack. In the alternative, the enclosure 35 may be mechanically fastened (e.g., screws) or hingedly coupled to the main assembly stack so that the enclosure 35 is temporarily or removably coupled to the main assembly stack. In this manner, the desiccants 40 may be replaced after a predetermined time period. In any embodiment, the enclosure 35 may be mechanically, chemically or electrically mounted within the housing 10 of the MU 5.
In an alternative exemplary embodiment, the desiccants 40 may be disposed individually (or in groups) in predetermined locations throughout the housing 10. In this embodiment, less space may be required than encasing all of the desiccants 40 under the enclosure 35. Thus, the desiccants 40 may be disposed in locations adjacent to components likely to be effected by the moisture, e.g., the display screen 20, the touch panel, the scan window 25, etc.
In a further exemplary embodiment, the desiccants 40 may be disposed on a door which provides access to the sealed housing 10. In this embodiment, the desiccants 40 may be easily replaced when they have become saturated.
The desiccants 40 may be comprised of any one or combination of substances that absorbs water which include, but are not limited to, silica gel, calcium sulfate, montmorillonite clay, molecular sieves, etc.
It will be apparent to those skilled in the art that various modifications may be made in the present invention, without departing from the spirit or scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.