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5051868 | Leverault et al. | Sep 1991 | A |
5337464 | Steffes | Aug 1994 | A |
5347430 | Curlee et al. | Sep 1994 | A |
5438476 | Steffes | Aug 1995 | A |
5495389 | Dewitt et al. | Feb 1996 | A |
5561893 | Lee | Oct 1996 | A |
5661640 | Mills et al. | Aug 1997 | A |
5701231 | Do et al. | Dec 1997 | A |
5745342 | Jeffries et al. | Apr 1998 | A |
5941617 | Crane et al. | Aug 1999 | A |
5995363 | Wu | Nov 1999 | A |
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6373690 | Buican et al. | Apr 2002 | B1 |
Number | Date | Country |
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896272 | Feb 1999 | EP |
Entry |
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An article: “Mechanical Packaging Scheme With Considerations for Maximum ESD/EMC Protection, Efficient Cooling and Quie Office Environment”, IBM Technical Disclosure Bulletin, Feb. 1991, US; vol. 33, Issue 9; pp. 379-383). |