***<br/>9816977<br/>Chang<br/>Method of Digital Image Correlation in combination with probe microscopy is developed for application to smaller dimensions, establishing limits on the size scale. This utilized to measure mechanical properties, including fracture-failure at submicron scale with MEMS applications. The fracture and fatigue behavior of homogeneoous solids and at interfaces in MEMS size structures contribute to the understanding of failure behavior at microscopic domains.***