Developing apparatus and developing method

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a substrate processing apparatus and method for supplying a developer, a rinsing liquid and the like to substrates such as semiconductor wafers and glass substrates for liquid crystal display panels and for plasma display panels. And it relates especially to a developing apparatus and developing method for developing a thin resist film formed on those substrates and having a predetermined pattern exposed.

2. Description of the Background Art

Conventionally, developing apparatuses of this type comprise a developer supply nozzle having a slit developer discharge unit formed with an opening width equal to or greater than the width of a substrate, and a rinsing liquid supply nozzle having a slit rinsing liquid discharge unit formed with an opening width equal to or greater than the width of a substrate (refer to, for example, U.S. Pat. No. 6,092,937 and Japanese Patent Application Laid-open No. 10-340836).

Such developing apparatuses move the developer supply nozzle from one end of a substrate to the other to supply a developer to the entire upper surface of the substrate (this developer supply method is also called a slit scan developing method), and after the expiration of a predetermined time interval, move the rinsing liquid supply nozzle from one end of the substrate to the other with the same travel speed as the developer supply nozzle to supply a rinsing liquid to the entire upper surface of the substrate and thereby to stop development on the upper surface of the substrate.

In this case, making equal the travel speeds of the developer supply nozzle and the rinsing liquid supply nozzle carries the advantages that development time is approximately the same at each point on the upper surface of the substrate, thereby preventing unevenness in development, and that uniformity in the line width of a resist pattern after development can be improved.

However, in the above developing apparatuses, for reasons such as adhesion of undesirable matter to the discharge units and any possible defects resulting therefrom, the supply of a rinsing liquid from the slit discharge unit may not be uniform (for example, in amount and in velocity) along a discharge width of the discharge unit. The same can be said of the supply of a developer, but since especially a rinsing liquid needs to be passed over a layer of developer, the spacing between the rinsing liquid supply nozzle and the substrate becomes greater and, as a result, there is a greater likelihood that the supply of a rinsing liquid is not uniform.

In this case, since the rinsing liquid supply nozzle and the like are moved linearly from one end of the substrate to the other, a streak of area to which processing liquids were not supplied may remain along a direction of nozzle movement on the substrate, and therefore, the supply of a rinsing liquid and the like to the substrate may become nonuniform along the width of the substrate.

SUMMARY OF THE INVENTION

The present invention is directed to an apparatus and method for supplying a developer and a rinsing liquid to a substrate.

According to the present invention, a substrate held by a substrate holder is rotated in a first rotational direction, and a rinsing liquid supply nozzle is rotated in the first rotational direction to pass over a developer layer formed on the major surface of the substrate being rotated and to discharge a rinsing liquid from its discharge unit. In response to rotation of the rinsing liquid supply nozzle, the rotation axis of the rinsing liquid supply nozzle is moved in a predetermined direction of movement closer to or away from the rotation axis of the substrate held by the substrate holder, so that a center-to-center distance between the rotation axes of the rinsing liquid supply nozzle and the substrate at least either when the rinsing liquid supply nozzle starts passing over the substrate or when it has finished passing over the substrate is greater than that when the rinsing liquid supply nozzle is passing over the rotation axis of the substrate.

Since, with the rotation of the substrate, the rinsing liquid supply nozzle is rotated to pass over the substrate and to supply a rinsing liquid to the major surface of the substrate, the rinsing liquid supply nozzle moves generally along an arc in the form of strip relative to the substrate. This improves uniformity in the supply of a rinsing liquid.

Further, since the rotation axis of the rinsing liquid supply nozzle is relatively far away from the rotation axis of the substrate at least either when the rinsing liquid supply nozzle starts passing over the substrate or when it has finished passing over the substrate, it is possible to reduce the amount of projection of the tip portion of the rinsing liquid supply nozzle from the outer periphery of the substrate. This prevents an increase in the size of a tray for receiving a rinsing liquid.

Thus, an object of the present invention is to improve uniformity in the supply of a rinsing liquid.

Another object of the present invention is to prevent an increase in the size of a tray for receiving a rinsing liquid.

These and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view showing a developing apparatus according to a first preferred embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view taken along the line II—II of FIG. 1;

FIG. 3A is a cross-sectional view of a developer supply nozzle;

FIG. 3B is a bottom view of the developer supply nozzle;

FIG. 4 is an explanatory diagram showing an initial state of the developing apparatus according to the first preferred embodiment;

FIG. 5 is an explanatory diagram showing the developing apparatus according to the first preferred embodiment when supplying a developer;

FIG. 6 is an explanatory diagram showing the developing apparatus according to the first preferred embodiment after the supply of a developer;

FIG. 7 is an explanatory diagram showing the developing apparatus according to the first preferred embodiment when supplying a rinsing liquid;

FIG. 8 is an explanatory diagram showing the developing apparatus according to the first preferred embodiment after the supply of a rinsing liquid;

FIG. 9 is an explanatory diagram showing how the developing apparatus according to the first preferred embodiment supplies a rinsing liquid;

FIG. 10 is an explanatory diagram showing how the developing apparatus according to the first preferred embodiment supplies a rinsing liquid in time sequence;

FIG. 11 is a schematic plan view showing a developing apparatus according to a second preferred embodiment of the present invention;

FIG. 12 is an explanatory diagram showing an initial state of the developing apparatus according to the second preferred embodiment;

FIG. 13 is an explanatory diagram showing the developing apparatus according to the second preferred embodiment when supplying a developer;

FIG. 14 is an explanatory diagram showing the developing apparatus according to the second preferred embodiment when supplying a rinsing liquid;

FIG. 15 is an explanatory diagram showing the developing apparatus according to the second preferred embodiment after the supply of a rinsing liquid;

FIG. 16 is an explanatory diagram showing the path of movement of a developer supply nozzle with respect to a substrate;

FIG. 17 is an explanatory diagram showing the path of movement of a rinsing liquid supply nozzle with respect to a substrate;

FIG. 18 is a diagram showing the relationship between travel distances and relative velocities of the developer supply nozzle and the rinsing liquid supply nozzle with respect to a substrate;

FIG. 19 is an explanatory diagram showing a modification in the location of a rotation axis of the rinsing liquid supply nozzle;

FIG. 20 is an explanatory diagram showing how a rinsing liquid discharged from the rinsing liquid supply nozzle drops onto a substrate;

FIG. 21 is a plan view showing a schematic configuration of a developing apparatus;

FIG. 22 is a side view showing a schematic configuration of the developing apparatus;

FIG. 23 is a cross-sectional view taken along the line XXIII—XXIII of FIG. 21;

FIGS. 24 and 25 are enlarged views showing major parts of a developer supply nozzle and a rinsing liquid supply nozzle;

FIG. 26 is a piping diagram showing a developer supply system;

FIG. 27 is a piping diagram showing a rinsing liquid supply system;

FIG. 28 is a block diagram showing an electrical structure of the developing apparatus;

FIG. 29 is a flow chart illustrating a sequence of development processing by the developing apparatus;

FIG. 30 is an explanatory diagram for explaining the movement of the developer supply nozzle;

FIG. 31 is an explanatory diagram for explaining the movement of the rinsing liquid supply nozzle;

FIG. 32 is a diagram showing the relative positions of a semiconductor wafer and the developer supply nozzle;

FIG. 33 is a diagram showing the relative positions of the semiconductor wafer and the rinsing liquid supply nozzle;

FIG. 34 is a diagram showing the relationship between the semiconductor wafer and the rinsing liquid supply nozzle in the XY plane;

FIG. 35 is a diagram showing the relationship between the polar coordinates of the rinsing liquid supply nozzle and a rotation angle;

FIG. 36 is a diagram showing the path of movement of the rinsing liquid supply nozzle with respect to the semiconductor wafer;

FIG. 37 is a diagram showing the travel distance of the rinsing liquid supply nozzle in a virtual scanning direction of the semiconductor wafer;

FIG. 38 is a diagram showing the area that the rinsing liquid supply nozzle will pass through per unit time;

FIG. 39 is a diagram showing the variation in the relative velocity component of the rinsing liquid supply nozzle in the virtual scanning direction of the semiconductor wafer;

FIG. 40 is a diagram showing the relationship between the time elapsed since the start of rotation and the rotation angle;

FIGS. 41 to 44 are diagrams showing the locus of the rinsing liquid supply nozzle passing over the semiconductor wafer;

FIG. 45 is a schematic plan view showing a developing apparatus according to a fourth preferred embodiment of the present invention;

FIG. 46 is a schematic side view showing the developing apparatus according to the fourth preferred embodiment;

FIG. 47 is an enlarged plan view showing a major part of a rinsing liquid supply nozzle rotation supporting mechanism in the developing apparatus according to the fourth preferred embodiment;

FIG. 48 is an explanatory diagram showing an initial state of the developing apparatus according to the fourth preferred embodiment;

FIG. 49 is an explanatory diagram showing the developing apparatus according to the fourth preferred embodiment when supplying a developer;

FIG. 50 is an explanatory diagram showing the developing apparatus according to the fourth preferred embodiment after the supply of a developer;

FIG. 51 is an explanatory diagram showing the developing apparatus according to the fourth preferred embodiment before the supply of a rinsing liquid;

FIG. 52 is an explanatory diagram showing the developing apparatus according to the fourth preferred embodiment when supplying a rinsing liquid;

FIG. 53 is an explanatory diagram showing the developing apparatus according to the fourth preferred embodiment after the supply of a rinsing liquid;

FIG. 54 is an explanatory diagram showing the developing apparatus according to the fourth preferred embodiment after development processing;

FIG. 55 is an explanatory diagram showing the path of movement of the rinsing liquid supply nozzle relative to a semiconductor wafer;

FIG. 56 is an explanatory diagram showing the path of movement of the rinsing liquid supply nozzle relative to a tray;

FIG. 57 is an explanatory diagram showing the path of movement of the rinsing liquid supply nozzle relative to the tray in a comparative example;

FIG. 58 is a diagram for explaining the position of a rotary shaft of a drive arm relative to a direction of movement of the axis of the rinsing liquid supply nozzle;

FIG. 59 is a schematic plan view showing a developing apparatus according to a fifth preferred embodiment of the present invention;

FIG. 60 is an explanatory diagram showing an initial state of the developing apparatus according to the fifth preferred embodiment;

FIG. 61 is an explanatory diagram showing the developing apparatus according to the fifth preferred embodiment when supplying a developer;

FIG. 62 is an explanatory diagram showing the developing apparatus according to the fifth preferred embodiment when supplying a rinsing liquid;

FIG. 63 is an explanatory diagram showing the path of movement of the developer supply nozzle relative to a substrate;

FIG. 64 is an explanatory diagram showing the path of movement of the rinsing liquid supply nozzle relative to a substrate;

FIG. 65 is a schematic longitudinal sectional view showing a developing apparatus according to a sixth preferred embodiment of the present invention;

FIG. 66 is a schematic plan sectional view showing the developing apparatus according to the sixth preferred embodiment;

FIG. 67 is a schematic plan view showing a developing apparatus according to a seventh preferred embodiment of the present invention;

FIG. 68 is a bottom view showing a modification of a discharge unit of a nozzle;

FIG. 69 is a main side view showing a modification by provision of a liquid sensor; and

FIG. 70 is a main side view showing a modification by provision of a light sensor.

DESCRIPTION OF THE PREFERRED EMBODIMENTS
First Preferred Embodiment

In this first preferred embodiment, a developing apparatus is described which, while holding a substrate at rest, moves a developer supply nozzle and a rinsing liquid supply nozzle along a line running diagonally relative to a virtual scanning direction of the substrate.

FIG. 1 is a plan view showing a schematic configuration of the developing apparatus according to the first preferred embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line II—II of FIG. 1. In FIG. 2, a developer supply nozzle 20 or a rinsing liquid supply nozzle 40 moving over a substrate W is illustrated by the dash-double dot lines.

This developing apparatus is configured to supply a developer and a rinsing liquid as processing liquids to the substrate W after being exposed for development processing. It comprises a substrate holder 10 for holding the substrate W, the developer supply nozzle 20, a first nozzle movement mechanism 30 for moving the developer supply nozzle 20, the rinsing liquid supply nozzle 40, a second nozzle movement mechanism 50 for moving the rinsing liquid supply nozzle 40, and a controller 60 for controlling the operation of the entire apparatus.

The substrate holder 10 holds the substrate W in an approximately horizontal position.

More specifically, the substrate holder 10 comprises a support shaft 11 located in an approximately vertical position near the center of an apparatus body 5, and a support base 12 fixedly mounted on the upper end of the support shaft 11. The support base 12 is configured to be capable of holding the substrate W in an approximately horizontal position by suction. Here, it is to be noted that the support base 12 is not limited to the configuration of holding the substrate W by suction, but it may be configured to, for example, grasp the peripheral portion of the substrate W. In the present example, a thin resist film having a predetermined pattern exposed is formed on the major surface of the substrate W.

Around the substrate holder 10, a circular inner cup 6 is provided to surround the substrate W and a generally square outer cup 7 is provided around the outer periphery of the inner cup 6. Also, standby pots 8 are provided on both sides of the outer cup 7.

The developer supply nozzle 20, as shown in FIGS. 1, 2, 3A and 3B, has a discharge unit 22 for discharging a processing liquid with a discharge width substantially equal to or greater than the width of the substrate W.

In this preferred embodiment, the slit discharge unit 22 is formed in the lower end portion of a transversely elongated nozzle body 21. The discharge unit 22 extends along the length of the nozzle body 21 and its longitudinal dimension is substantially equal to or greater than the width of the substrate W.

Here, the width of the substrate W is the dimension of the substrate W in a direction orthogonal to a virtual scanning direction La from a supply start point on one end of the substrate W to a supply end point on the other end. In this preferred embodiment, the substrate W is of substantially a generally circular disk shape, wherein the supply start point and the supply end point are respectively on one and the other ends of the substrate W having a predetermined diameter and the virtual scanning direction La is a direction from the supply start point to the supply end point. The supply start point and the supply end point are located at diametrically opposed positions on the outer periphery of the generally circular disk substrate W, to sandwich the center of the substrate. Since the substrate W is of substantially a generally circular disk shape, the width of the substrate W indicates the diameter of a circle defining a plan configuration of the substrate W.

The ideal condition is when the discharge unit 22 discharges a developer along the whole discharge width in the form of a curtain, i.e., with a constant velocity and a constant amount along the whole discharge width.

The discharge unit 22 of the developer supply nozzle 20 is inclined at a predetermined angle with respect to a direction opposite to a direction of movement of the developer supply nozzle 20 (see FIG. 3A). Thus, a developer discharged from the discharge unit 22 flows in the direction opposite to the direction of movement of the developer supply nozzle 20. This prevents a developer from flowing ahead of the movement of the developer supply nozzle 20.

The developer supply nozzle 20 is coupled to a developer supply system 26.

The developer supply system 26 comprises a developer supply source for storing a developer and an on-off valve (both not shown), and is configured to supply a developer from the developer supply source to the developer supply nozzle 20 in a predetermined timed relationship with the opening and closing of the on-off valve.

The first nozzle movement mechanism 30, while keeping the direction of extension (discharge width) of the discharge unit 22 substantially perpendicular to the virtual scanning direction La of the substrate W held by the substrate holder 10, moves the developer supply nozzle 20 along a line Lb running diagonally relative to the virtual scanning direction La. In the following description, for convenience of reference to the drawings, it will be assumed that the directions of extension of the developer supply nozzle 20 and the discharge unit 22 are approximately the same, but this is not an absolute necessity.

More specifically, the first nozzle movement mechanism 30 comprises a guide rail 31, a horizontal driver 34 which is movable along the guide rail 31, and a support arm 36.

The guide rail 31 is laid in an approximately horizontal position on the side of the substrate holder 10 and on the upper surface of the apparatus body 5. The guide rail 31 extends along the diagonal line Lb. The horizontal driver 34 is configured to be reciprocally movable along the guide rail 31 by an actuator such as an air cylinder or a motor. The support arm 36 is supported in a cantilever manner by the horizontal driver 34 to extend toward the substrate holder 10. On a free end of the support arm 36, the developer supply nozzle 20 is supported in an approximately horizontal position so that the direction of extension of the discharge unit 22, i.e., the direction of extension of the developer supply nozzle 20, is substantially orthogonal to the virtual scanning direction La. The developer supply nozzle 20, while maintaining this position, passes over the substrate W.

Driven by the horizontal driver 34, the developer supply nozzle 20 is moved from one end of the substrate W to the other to pass over the major surface of the substrate W. At this time, since the guide rail 31 is diagonal to the virtual scanning direction La, the discharge unit 22 is moved while also being shifted in a direction orthogonal to the virtual scanning direction La.

The rinsing liquid supply nozzle 40 has a discharge unit 42 for discharging a rinsing liquid with a discharge width substantially equal to or greater than the width of the substrate W.

More specifically, the rinsing liquid supply nozzle 40 is identical in configuration to the developer supply nozzle 20. That is, the rinsing liquid supply nozzle 40 is configured such that the discharge unit 42 which is identical in configuration to the discharge unit 22 is formed in the lower end portion of a nozzle body 41 which is identical in configuration to the nozzle body 21.

As in the case of the developer supply nozzle 20, the ideal condition is when the discharge unit 42 discharges a rinsing liquid uniformly along the whole discharge width in the form of a curtain so that a rinsing liquid is supplied along the whole width of the substrate W.

The discharge unit 42 of the rinsing liquid supply nozzle 40 is also inclined at a predetermined angle with respect to a direction opposite to the direction of movement of the rinsing liquid supply nozzle 40 (see FIG. 3A). Thus, a rinsing liquid discharged from the discharge unit 42 flows in the direction opposite to the direction of movement of the rinsing liquid supply nozzle 40. This prevents a rinsing liquid from flowing ahead of the movement of the rinsing liquid supply nozzle 40 and also prevents a rinsing liquid from sweeping a developer on the substrate W ahead of the movement of the rinsing liquid supply nozzle 40.

The rinsing liquid supply nozzle 40 is coupled to a rinsing liquid supply system 46. The rinsing liquid supply system 46 comprises a rinsing liquid supply source for storing a rinsing liquid and an on-off valve (both not shown) and is configured to supply a rinsing liquid from the rinsing liquid supply source to the rinsing liquid supply nozzle 40 in a predetermined timed relationship with the opening and closing of the on-off valve.

The second nozzle movement mechanism 50, while keeping the direction of extension (discharge width) of the discharge unit 42, i.e., the direction of extension of the rinsing liquid supply nozzle 40, substantially perpendicular to the virtual scanning direction La of the substrate W held by the substrate holder 10, moves the rinsing liquid supply nozzle 40 along the line Lb running diagonally relative to the virtual scanning direction La.

More specifically, the second nozzle movement mechanism 50 is identical in configuration to the first nozzle movement mechanism 30 and more specifically, comprises the guide rail 31, a horizontal driver 54 corresponding to the horizontal driver 34, and a support arm 56 corresponding to the support arm 36. The guide rail 31 is shared by the first nozzle movement mechanism 30 and the second nozzle movement mechanism 50.

Driven by the horizontal driver 54, the rinsing liquid supply nozzle 40 is moved from one end of the substrate W to the other to pass over the major surface of the substrate W. At this time, since the guide rail 31 is diagonal to the virtual scanning direction La, the discharge unit 42 is moved while also being shifted in a direction orthogonal to the virtual scanning direction La.

The controller 60 is for controlling the entire apparatus. It comprises a CPU, a ROM, a RAM and the like, and is configured of a general microcomputer which performs predetermined computations by executing a previously stored software program.

This controller 60 controls a sequence of operations next to be described and performs at least an act of supplying a developer and then supplying a rinsing liquid to the substrate W.

Now, the basic operation of this developing apparatus will be described with reference to FIGS. 4 to 8.

First, in an initial standby state, as shown in FIG. 4, the developer supply nozzle 20 and the rinsing liquid supply nozzle 40 are positioned on one end of the substrate W (upstream of the virtual scanning direction La). During the following operation, the substrate W is supported at rest in a horizontal position.

After the initiation of processing, as shown in FIG. 5, the developer supply nozzle 20 moves from a supply start point on one end of the substrate W to a supply end point on the other end over the major surface of the substrate W. In passing over the major surface of the substrate W, the developer supply nozzle 20 discharges a developer so that a developer is supplied to the entire major surface of the substrate W. Thereby a layer of developer (developer layer DL) (see FIG. 3A) is formed on the major surface of the substrate W.

At this time, since the developer supply nozzle 20 moves along the diagonal line Lb, the discharge unit 22 is shifted in a direction substantially perpendicular to the virtual scanning direction La.

After the developer supply nozzle 20 passed over the major surface of the substrate W as shown in FIG. 6 and after the elapse of a predetermined time required for development reactions on the substrate W, as shown in FIG. 7, the rinsing liquid supply nozzle 40 moves from the supply start point of the substrate W to the supply end point over the major surface of the substrate W (i.e., over the developer layer DL formed on the major surface of the substrate W). In passing over the major surface of the substrate W, the rinsing liquid supply nozzle 40 discharges a rinsing liquid toward the developer layer DL on the major surface of the substrate W so that a rinsing liquid is supplied to the entire major surface of the substrate W.

At this time, since the rinsing liquid supply nozzle 40 moves along the diagonal line Lb, the discharge unit 42 is shifted in a direction substantially perpendicular to the virtual scanning direction La. In other words, the discharge unit 42 is shifted along the width of the substrate W.

The supply of a rinsing liquid to the major surface of the substrate W stops development on the substrate W.

In this process, a rinsing liquid is supplied to the major surface of the substrate W in a similar manner to a developer (i.e., in the same direction and with the same velocity). Thus, development time is approximately the same at each point on the entire major surface of the substrate W.

Next described is an operation where, for reasons such as adhesion of undesirable matter to the discharge units 22, 42 and any possible defects resulting therefrom, a developer or a rinsing liquid is supplied nonuniformly (e.g., with different amounts and velocities) along the discharge width from the discharge unit 22 or 42.

FIGS. 9 and 10 show how a rinsing liquid is supplied to the substrate W if the rinsing liquid supply nozzle 40 has, in a certain part along its direction of extension, a non-supplying part P1 from which a rinsing liquid is not supplied. In FIGS. 9 and 10, an area of oblique lines which extend upwardly to the right indicates an area where a rinsing liquid was supplied at the time of FIG. 9. In FIG. 10, an area of oblique lines which extend upwardly to the left indicates an area where a rinsing liquid was supplied at the time of FIG. 10.

As shown in FIG. 9, assuming that the rinsing liquid supply nozzle 40 has moved halfway along the virtual scanning direction La of the substrate W, a streak of non-supply area E1 where a rinsing liquid was not supplied will remain on a rearward extension of the non-supplying point P1 on the substrate W.

Then, as shown in FIG. 10, the rinsing liquid supply nozzle 40 moves a distance M along the diagonal line Lb. That is, the rinsing liquid supply nozzle 40 moves a distance M_xalong the virtual scanning direction La and a distance M_yalong a direction substantially orthogonal to the virtual scanning direction La. Thus, the non-supplying part P1 of the discharge unit 42 is also moved to a position which deviates by the distance M_yfrom the position shown in FIG. 9 along the direction substantially orthogonal to the virtual scanning direction La, and accordingly, other part of the discharge unit 42 which is capable of supplying a rinsing liquid (i.e., any part other than the non-supplying part P1) is located in a position corresponding to the non-supply area E1. In the state shown in FIG. 10, a rinsing liquid discharged from that part of the discharge unit 42 which is capable of supplying a rinsing liquid is supplied to the non-supply area E1.

These operations are performed successively with the movement of the rinsing liquid supply nozzle 40, which eliminates non-supply areas where a rinsing liquid is not supplied on the substrate W.

In a similar manner as above described, the discharge unit 22 of the developer supply nozzle 20 supplies a developer to the substrate W.

In the developing apparatus of the aforementioned configuration, when a developer and a rinsing liquid are supplied from the developer supply nozzle 20 and the rinsing liquid supply nozzle 40, the discharge units 22 and 42 are shifted in a direction substantially perpendicular to the virtual scanning direction La. This improves uniformity in the supply of processing liquids.

While in this preferred embodiment, both the developer supply nozzle 20 and the rinsing liquid supply nozzle 40 are shifted in a direction substantially perpendicular to the virtual scanning direction La, only one of them may be shifted in the direction substantially perpendicular to the virtual scanning direction La.

Second Preferred Embodiment

<A. Description of Developing Apparatus>

In this second preferred embodiment, a developing apparatus is described which, while rotating a substrate, rotates a processing liquid supply nozzle so that the nozzle passes over the substrate.

FIG. 11 is a plan view showing a schematic configuration of the developing apparatus according to the second preferred embodiment of the present invention.

The developing apparatus is configured to supply a developer and a rinsing liquid as processing liquids to the substrate W after being exposed for development processing. It comprises a substrate holder 110 for holding the substrate W, a developer supply nozzle 120, a first nozzle movement mechanism 130 for moving the developer supply nozzle 120, a rinsing liquid supply nozzle 140, a second nozzle movement mechanism 150 which is a rinsing liquid supply nozzle rotating section for rotating the rinsing liquid supply nozzle 140, and a controller 160 for controlling the operation of the entire apparatus.

The substrate holder 110 holds the substrate W in an approximately horizontal position.

More specifically, the substrate holder 110 comprises a support shaft 111 located in an approximately vertical position near the center of an apparatus body 105, and a support base 112 fixedly mounted on the upper end of the support shaft 111. The support base 112 is configured to be capable of holding the substrate W in an approximately horizontal position by suction. Here, it is to be noted that the support base 112 is not limited to the configuration of holding the substrate W by suction, but may be configured to, for example, grasp the peripheral portion of the substrate W.

The lower end of the support shaft 111 is coupled to a spinning motor 113 which is a substrate rotating section for rotating the substrate W. Rotation of this spinning motor 113 is transmitted through the support shaft 111 to the support base 112. Thereby, the substrate W can be rotated in a horizontal plane on a vertical axis as a rotation axis. The rotational speed of the substrate W with this spinning motor 113 is variably controllable by the controller 160 later to be described.

Around the substrate holder 110, as in the first preferred embodiment, circular cups are provided to surround the substrate W and also standby pots are provided in positions corresponding to stand-by positions of the developer supply nozzle 120 and the rinsing liquid supply nozzle 140. Those cups and pots are not shown herein.

The developer supply nozzle 120 has a discharge unit for discharging a processing liquid with a discharge width substantially equal to or greater than the width of the substrate W.

The developer supply nozzle 120 herein has the same configuration as the developer supply nozzle 20 of the aforementioned first preferred embodiment.

Also, the developer supply nozzle 120 is connected to a developer supply system 126 which is identical in configuration to the developer supply system 26 of the aforementioned first preferred embodiment, whereby a developer is supplied to the developer supply nozzle 120 in predetermined timed relation.

The first nozzle movement mechanism 130 moves the developer supply nozzle 120 along a developer scanning direction Lc from one end of the apparatus body 105 to the other.

This first nozzle movement mechanism 130 comprises a guide rail 131, a horizontal driver 134 which is movable along the guide rail 131, and a support arm 136.

The guide rail 131 is laid in an approximately horizontal position from one end of the apparatus body 105 to the other, on the upper surface of the apparatus body 105 and on the side of the substrate holder 110. The horizontal driver 134, like the horizontal driver 34 of the aforementioned first preferred embodiment, is configured to be reciprocally movable along the guide rail 131. The support arm 136 supports the developer supply nozzle 120 in an approximately horizontal position so that a direction of extension of the developer supply nozzle 120 is substantially orthogonal to the developer scanning direction Lc.

Driven by the horizontal driver 134, the developer supply nozzle 120 is moved along the developer scanning direction Lc to pass over the major surface of the substrate W. In passing over the substrate W, the developer supply nozzle 120 discharges a developer from its discharge unit so that a developer is supplied onto the major surface of the substrate W.

The rinsing liquid supply nozzle 140 has a discharge unit for discharging a processing liquid with a discharge width substantially equal to or greater than the width of the substrate W.

The rinsing liquid supply nozzle 140 herein is identical in configuration to the rinsing liquid supply nozzle 40 of the aforementioned first preferred embodiment.

Also, the rinsing liquid supply nozzle 140 is connected to a rinsing liquid supply system 146 which is identical in configuration to the rinsing liquid supply system 46 of the aforementioned first preferred embodiment, whereby a rinsing liquid is supplied to the rinsing liquid supply nozzle 140 in predetermined timed relation.

The second nozzle movement mechanism 150 rotatably supports one end of the rinsing liquid supply nozzle 140 and rotates the rinsing liquid supply nozzle 140 so that the nozzle 140 passes over the substrate W.

More specifically, the second nozzle movement mechanism 150 comprises a nozzle rotary driver 152, a rotary shaft 154, and a support arm 156.

The rotary shaft 154 is freely rotatable on one vertex of a virtual square S which circumscribes the substrate W held by the substrate holder 110.

The nozzle rotary driver 152 is configured of an actuator such as a spinning motor, and the rotary shaft 154 is driven to rotate by this nozzle rotary driver 152. The rotational speed of the nozzle rotary driver 152 is variably controllable by the controller 160.

The support arm 156 is fixedly coupled at its one end to the rotary shaft 154 and is supported in a cantilever manner above the apparatus body 105. On a free end of the support arm 156, the rinsing liquid supply nozzle 140 is supported in an approximately horizontal position.

Driven by the nozzle rotary driver 152, the rinsing liquid supply nozzle 140 is rotated on a rotation axis of the rotary shaft 154 over the substrate W. In passing over the substrate W, the rinsing liquid supply nozzle 140 discharges a rinsing liquid from its discharge unit so that a rinsing liquid is supplied onto the major surface of the substrate W.

The developer supply nozzle 120 and the rinsing liquid supply nozzle 140 can be moved without interfering each other, for example by being placed at different levels.

The controller 160 is for controlling the entire apparatus and, like the controller 60, is configured of a general microcomputer.

The controller 160 controls a sequence of operations next to be described and performs at least an act of rotating the substrate W and the rinsing liquid supply nozzle 140 so that the virtual scanning direction La from the supply start point on one end of the substrate W to the supply end point on the other end is substantially perpendicular to a direction of extension of the rinsing liquid supply nozzle 140.

Now, the operation of this developing apparatus will be described with reference to FIGS. 12 to 15.

First, in an initial standby state, as shown in FIG. 12, the substrate W is supported at rest in a horizontal position by the substrate holder 110. On one and the other ends of the substrate W, respectively, are the supply start point and the supply end point, and the virtual scanning direction La is a direction which is virtually set from the supply start point of the substrate W to the supply end point. In FIGS. 12 to 15, the supply start point is shown with a closed circle and the supply end point with a closed triangle, and the virtual scanning direction La is indicated by a dash-double dot line. In this initial state, the supply start point of the substrate W is on one end of the apparatus body 105 (on the right side of FIG. 12).

The developer supply nozzle 120 and the rinsing liquid supply nozzle 140 are located on one end of the apparatus body 105 (upstream of the developer scanning direction Lc). That is, in the initial state, the developer supply nozzle 120 and the rinsing liquid supply nozzle 140 face the supply start point of the initial-state substrate W.

After the initiation of processing, as shown in FIG. 13, the developer supply nozzle 120 moves along the developer scanning direction Lc over the major surface of the substrate W. At this time, the substrate W is not rotating. Thus, the developer supply nozzle 120 moves along the virtual scanning direction La over the major surface of the substrate W.

In passing over the major surface of the substrate W, the developer supply nozzle 120 discharges a developer so that a developer is supplied sequentially along the virtual scanning direction La onto the entire major surface of the substrate W.

After passing over the major surface of the substrate W, the developer supply nozzle 120 is brought to its standby state on the other end of the apparatus body 105 (downstream of the developer scanning direction Lc).

After the supply of a developer to the major surface of the substrate W and after the elapse of a predetermined time required for development reactions on the substrate W, as shown in FIG. 14, a rinsing liquid is supplied.

More specifically, the rinsing liquid supply nozzle 140 rotates on its rotation axis in a first rotational direction over the substrate W (i.e., over a developer layer (see FIG. 3A) on the major surface of the substrate W).

In response to the rotation of the rinsing liquid supply nozzle 140, the substrate W rotates in the first rotational direction. The rotation of the substrate W is made such that its virtual scanning direction La is substantially orthogonal to a direction of extension of the rinsing liquid supply nozzle 140. Thus, the rinsing liquid supply nozzle 140 moves along an arc in the form of a strip relative to the substrate W.

To make the virtual scanning direction La of the substrate W substantially orthogonal to the direction of extension of the rinsing liquid supply nozzle 140, the rotational speeds of the substrate W and the rinsing liquid supply nozzle 140 should be made substantially equal.

In passing over the substrate W, the rinsing liquid supply nozzle 140 discharges a rinsing liquid so that a rinsing liquid is supplied to the major surface of the substrate W. At this time, since the direction of extension of the rinsing liquid supply nozzle 140 and the virtual scanning direction La of the substrate W are substantially orthogonal to each other, the timing of the supply of a rinsing liquid is approximately the same at each point along a direction substantially perpendicular to the virtual scanning direction La.

After the rinsing liquid supply nozzle 140 passed over the substrate W as shown in FIG. 15, the rinsing liquid supply nozzle 140 and the substrate W stop their rotation. In the present example, the substrate W and the rinsing liquid supply nozzle 140 stop rotating after rotation of π/2 radians.

The supply of a rinsing liquid to the major surface of the substrate W in this way stops development on the substrate W.

Accordingly, a rinsing liquid is supplied in the same direction as a developer to the major surface of the substrate W, which allows the development time to be the same as precisely as possible at each point on the entire major surface of the substrate W.

Now, the movements of the developer supply nozzle 120 and the rinsing liquid supply nozzle 140 with respect to the substrate W will be described.

FIG. 16 is an explanatory diagram showing the path of movement of the developer supply nozzle 120 relative to the substrate W, and FIG. 17 is an explanatory diagram showing the path of movement of the rinsing liquid supply nozzle 140 relative to the substrate W when the substrate W and the rinsing liquid supply nozzle 140 are rotated such that the direction of extension of the rinsing liquid supply nozzle 140 is substantially orthogonal to the virtual scanning direction La of the substrate W.

As shown in FIG. 16, the developer supply nozzle 120 moves linearly along the virtual scanning direction La of the substrate W, which is approximately the same as the developer scanning direction Lc at this time. On the other hand, the rinsing liquid supply nozzle 140 describes a different path of movement from the developer supply nozzle 120. As shown in FIG. 17, the rinsing liquid supply nozzle 140 moves nonlinearly along the virtual scanning direction La of the substrate W, i.e., moves along an arc.

FIG. 18 is a diagram showing the relationship between travel distances and relative travel speeds of the developer supply nozzle 120 and the rinsing liquid supply nozzle 140 with respect to the substrate W, in which the straight line L indicates the relative travel speed of the developer supply nozzle 120 and the curve M indicates the relative travel speed of the rinsing liquid supply nozzle 140. The vertical axis of FIG. 18 indicates a relative velocity component with respect to the substrate W in the virtual scanning direction La of the substrate W. The relative travel speed of the rinsing liquid supply nozzle 140 shows variation when the substrate W and the rinsing liquid supply nozzle 140 are rotated with substantially the same constant rotational speed. In FIG. 18, values r and 2r represent a radius and a diameter of the substrate W, respectively.

As shown in this drawing, the developer supply nozzle 120 moves in the virtual scanning direction La of the substrate W to describe a constant velocity pattern. On the other hand, the rinsing liquid supply nozzle 140 moves in a different velocity pattern from that of the developer supply nozzle 120. More specifically, the rinsing liquid supply nozzle 140 moves in such a velocity pattern that its relative velocity with respect to the substrate W is gradually increased until the center of the substrate W is reached and thereafter reduced gradually; that is, the rinsing liquid supply nozzle 140 moves in a velocity pattern to describe an arc.

In the developing apparatus of the above configuration, since the rinsing liquid supply nozzle 140 rotates on a rotation axis located on its one end to pass over the substrate W, its discharge unit is moved along an arc in the form of a strip relative to the substrate W while also being shifted in a direction orthogonal to the virtual scanning direction La. This improves uniformity in the supply of a rinsing liquid.

Since the direction of extension of the rinsing liquid supply nozzle 140 is substantially perpendicular to the virtual scanning direction La, the timing of the supply of a rinsing liquid can be made approximately the same at each point along a direction substantially perpendicular to the virtual scanning direction La.

Further, the second nozzle movement mechanism 150 for rotating the rinsing liquid supply nozzle 140 is a rotary drive mechanism, which is more compact in size than a horizontal drive mechanism. This also contributes to a reduction in the size of the whole apparatus.

Furthermore, rotating the substrate W during the supply of a rinsing liquid can also achieve the effect of, by centrifugal force, conducting undesirable matter (e.g., particles) produced by development reactions to the outside of the substrate W with efficiency.

The rotation axis of the rinsing liquid supply nozzle 140 does not necessarily have to be located at one vertex of a virtual square S circumscribing the substrate W.

For example, as shown in FIG. 19, the rotation axis of a rinsing liquid supply nozzle 140B may be located outside the virtual square S.

In this case, a support arm 156B (corresponding to the support arm 156) should be elongated so that the rinsing liquid supply nozzle 140B (corresponding to the rinsing liquid supply nozzle 140) can pass over the substrate W.

Or, the rotation axes of the rinsing liquid supply nozzles 140 and 140B may be located inside the virtual square S.

In a word, the rotation axes of the rinsing liquid supply nozzles 140 and 140B only need to be located outside the substrate W.

To make the timing of termination of the development approximately the same at each point in the plane of the substrate W, it is preferable that a developer supply time during which the developer supply nozzle 120 discharges a developer from the supply start point of the substrate W to the supply end point be substantially equal to a rinsing liquid supply time during which the rinsing liquid supply nozzle 140 discharges a rinsing liquid from the supply start point of the substrate W to the supply end point.

Also, in order to equate the amount of the supply of a rinsing liquid at each point along the virtual scanning direction La of the substrate W, it is preferable that, out of relative velocity components of the rinsing liquid supply nozzle 140 with respect to the substrate W, a relative velocity component in the virtual scanning direction La be made constant. For this, for example in a rotating coordinate system based on the substrate W being rotated, the relations between the relative velocity of the rinsing liquid supply nozzle 140 and the rotational speeds of the rinsing liquid supply nozzle 140 and the substrate W should be obtained, and then, the rotational speeds of the rinsing liquid supply nozzle 140 and the substrate W should be controlled so as to make constant the above relative velocity component in the virtual scanning direction La.

This makes the discharge of a rinsing liquid along the virtual scanning direction La as uniform as possible.

The above-described relationships between the respective rotational speeds and between the developer supply time and the rinsing liquid supply time are also applicable to each of the other preferred embodiments later to be described.

<B. Discharge of Rinsing Liquid>

A description will now be made of a preferred form of the discharge of a rinsing liquid in the developing apparatus according to the second preferred embodiment.

FIG. 20 is an explanatory diagram showing how a rinsing liquid discharged from the discharge unit of the rinsing liquid supply nozzle 140 drops onto a developer layer DL formed on the substrate W. A rinsing liquid is discharged from the discharge unit of the rinsing liquid supply nozzle 140 in a direction opposite to the direction of movement of the rinsing liquid supply nozzle 140 relative to the substrate W.

First of all, let V₀be the initial velocity of a rinsing liquid discharged from the discharge unit of the rinsing liquid supply nozzle 140, θ be the angle of discharge of a rinsing liquid with respect to the plane of the substrate W (0≦θ<π/4), and h be the height from the major (upper) surface of the substrate W to the discharge unit of the rinsing liquid supply nozzle 140.

Of relative velocity components of the rinsing liquid supply nozzle 140 when moving relative to the substrate W, a relative velocity component along the direction of discharge of a rinsing liquid is defined as (−V_n), where the direction of discharge of a rinsing liquid is assumed to be a positive direction, i.e., V_n>0. In the second preferred embodiment, the rinsing liquid supply nozzle 140, while moving along an arc in the form of a strip relative to the substrate W, discharges a rinsing liquid in a direction opposite to the virtual scanning direction La. Thus, out of the relative velocity components of the rinsing liquid supply nozzle 140 when moving relative to the substrate W, a relative velocity component in a direction opposite to the direction of movement of the nozzle 140 along the virtual scanning direction La of the substrate W corresponds to the above relative velocity component (−V_n). Since, in this second preferred embodiment, the substrate W is also rotated, the relative velocity component (−V_n) of the rinsing liquid supply nozzle 140 when moving relative to the substrate W is calculated based on the rotational speeds of the substrate W and the nozzle 140.

At the time when a rinsing liquid discharged from the discharge unit of the rinsing liquid supply nozzle 140 drops onto the developer layer DL on the substrate W, relative velocity components of a rinsing liquid with respect to the substrate W include a relative velocity component V_xin the direction of discharge of a rinsing liquid along a direction of the plane of the substrate W. In this second preferred embodiment, the direction of the relative velocity component V_xis opposite from the virtual scanning direction La of the substrate W. A relative velocity component of a rinsing liquid in a vertically downward direction with respect to the substrate W is defined as V_z.

In this case, the relative velocity components V_xand V_zcan be expressed as:

V_x=V₀·cos θ−V_n
V_z=V₀·sin θ+g·t

where g is the gravitational acceleration, t is the time interval from when a rinsing liquid is discharged from the discharge unit of the rinsing liquid supply nozzle 140 to when the rinsing liquid drops onto the developer layer DL on the substrate W, and

h=V₀·t·sin θ+1/2·g·t².

For the discharge of a rinsing liquid, it is preferable that, at the time when a rinsing liquid drops onto the developer layer DL, out of the relative velocity components of a rinsing liquid with respect to the substrate W, the relative velocity component V_xin the direction of discharge of a rinsing liquid with respect to the plane of the substrate W be set to be greater than 0. That is, it is preferable to satisfy V_x=V₀·cos θ−V_n>0.

This prevents the occurrence of such situations that a rinsing liquid is swept in front of the rinsing liquid supply nozzle 140 and also resolves a difference in development time at each point on the substrate W with great precision. Thereby, after development, uniformity in the line width of a resist pattern at each point on the substrate W can be improved.

More preferably, at the time when a rinsing liquid drops onto the developer layer DL, out of the relative velocity components of a rinsing liquid with respect to the substrate W, the relative velocity component V_xin the direction of discharge of a rinsing liquid with respect to the plane of the substrate W is set to be substantially equal to or greater than the relative velocity component V_zin the vertically downward direction with respect to the substrate W. That is, V_x≧V_z.

This prevents the occurrence of such situations that a rinsing liquid is swept in front of the rinsing liquid supply nozzle 140, with more reliably and also resolves a difference in development time at each point on the substrate W with greater precision.

The setting of those relative velocity components V_xand V_zcan be made, for example by adjusting and setting, for example, the initial velocity V of a rinsing liquid, the relative velocity component (−V_n) of the rinsing liquid supply nozzle 140 (i.e., the rotational speeds of the nozzle 140 and the substrate W), the height h of the rinsing liquid supply nozzle 140, and the angle θ of discharge of a rinsing liquid.

Even if the values are within the above prescribed range, the dimensions of, for example, a resist pattern at each point on the substrate W may vary depending on the type of the resist, the scanning speed of the nozzle 140, the flow rate, and the like. Thus, it is preferable to previously obtain optimum set values by experiment or the like. In the second preferred embodiment, the height of the major surface of the substrate W and the height of the surface of the developer layer DL are shown to be approximately the same. More specifically, in consideration of the thickness of the developer layer DL, defining the height from the major surface of the substrate W to the discharge unit of the rinsing liquid supply nozzle 140 as the height h, the relative velocity component of the rinsing liquid may be determined at the position higher than the major surface of the substrate W by the thickness of the developer layer DL.

The discharge of a rinsing liquid in this form is applicable not only to the second preferred embodiment but also in a similar manner to the aforementioned first preferred embodiment and each of the other preferred embodiments later to be described.

Third Preferred Embodiment

<A. Description of Developing Apparatus>

A description will now be made of a developing apparatus according to a third preferred embodiment of the present invention.

FIGS. 21 and 22, respectively, are plan and side views showing a schematic configuration of the developing apparatus, and FIG. 23 is a cross-sectional view taken along the line XXIII—XXIII of FIG. 21. In FIG. 23, a portion where a substrate is held is also shown in cross section.

This developing apparatus is configured to develop a thin resist film which is formed on the surface of a semiconductor wafer SW as a substrate. Prior to development processing by this apparatus, a predetermined pattern is exposed onto the thin resist film by an exposure apparatus.

More specifically, this developing apparatus may, for example, be disposed as a development unit in a substrate processing apparatus disclosed in U.S. Pat. No. 6,051,101. It is, however, to be understood that the form of installation of the developing apparatus of this preferred embodiment in another developing apparatus is not limited to the particular form disclosed in the above U.S. patent. In fact, it is, for example, possible that, by replacing a coating unit in the substrate processing apparatus of the above U.S. patent with the developing apparatus of this preferred embodiment, the substrate processing apparatus of the U.S. patent may be configured as a developing apparatus for performing only development processing.

A semiconductor wafer SW to be processed is formed in substantially a circular disk shape. The diameter of the semiconductor wafer SW is, for example, 200 or 300 mm. The semiconductor wafer SW has a notch NC or an orientation flat formed in part of its outer peripheral edge.

This developing apparatus comprises a wafer holding and rotation mechanism 710, a developer supply nozzle 720, a developer supply system (see FIG. 26), a developer supply nozzle scan mechanism 730, a developer supply nozzle up-and-down mechanism 739, a rinsing liquid supply nozzle 740, a rinsing liquid supply system (see FIG. 27), a rinsing liquid supply nozzle rotation mechanism 750, a rinsing liquid supply nozzle up-and-down mechanism 756, and a final rinsing liquid supply nozzle 770.

The wafer holding and rotation mechanism 710 is a mechanism for holding and rotating the semiconductor wafer SW and comprises a support shaft 711, a spin chuck 712 provided on the upper end of the support shaft 711, and a spinning motor 713 having a rotation axis coupled to the lower end of the support shaft 711.

The spin chuck 712 is configured to hold the semiconductor wafer SW in an approximately horizontal position and consists of a vacuum chuck for holding the semiconductor wafer SW by suction. Alternatively, a mechanical chuck for grasping and holding the outer peripheral edge of the semiconductor wafer SW may be used as the spin shuck 712.

The spinning motor 713 consists of, for example, a servo motor and is configured to be capable of variably controlling the rotational speed and the amount of rotation in response to a signal (such as a pulse signal) given from a controller 760 later to be described. Rotation of this spinning motor 713 is transmitted through the support shaft 711 to the spin shuck 712. Rotatably driven by this spinning motor 713, the semiconductor wafer SW can be rotated in a horizontal plane on a vertical axis as a rotation axis.

Around the spin chuck 712, an inner cup 716 of a generally circular shape in plan view is provided to surround the semiconductor wafer SW held by the spin chuck 712. The inner cup 716 becomes narrower toward its upper end to form an upper opening. By an up-and-down mechanism (not shown) such as an air cylinder, the inner cup 716 is vertically movable between its upward position at which its upper opening edge is positioned to surround the outer periphery of the semiconductor wafer SW, and its downward position which is at a lower level than the upward position.

Also, an outer cup 717 of a generally square shape in plan view is provided to surround the inner cup 716. When the developer supply nozzle 720 or the rinsing liquid supply nozzle 740 discharges a developer or a rinsing liquid onto the semiconductor wafer SW, a developer or a rinsing liquid which is supplied and falls off the edge of the semiconductor wafer SW is conducted along the outer surface of the inner cup 716 or along a path between the inner cup 716 and the outer cup 717 to the bottom of the outer cup 717.

A standby pot 718 is provided in a position corresponding to a stand-by position of the developer supply nozzle 720, on one side of and outside the outer cup 717. The standby pot 718 is formed in the shape of a casing having an upper opening in which the developer supply nozzle 720 can be accommodated from above.

The developer supply nozzle 720 has a discharge unit 722 for discharging a developer with a discharge width substantially equal to or greater than the width (diameter) of the semiconductor wafer SW.

In the present example, the developer supply nozzle 720 has the slit discharge unit 722 formed on one end side of a long length of nozzle body 721. The discharge unit 722 extends along the length of the nozzle body 721. This discharge unit 722 is configured to discharge a developer in the form of a uniform curtain along the whole discharge width so that a developer can be supplied along the whole width of the semiconductor wafer SW.

The developer supply nozzle 720 is coupled to the developer supply system which will be described later.

The developer supply nozzle scan mechanism 730 is a mechanism for moving the developer supply nozzle 720 along a horizontal direction so that the nozzle 720 passes over the semiconductor wafer SW. It comprises a pair of support side plates 731a and 731b which are horizontally movably supported by guides, and a horizontal driver 735 for horizontally reciprocating the support side plate 731a on one side.

The support side plate 731a on one side is formed in the shape of a long plate. With an upper portion of the support side plate 731a extending beyond the support 705, a lower portion of the support side plate 731a is horizontally movably supported by two linear guides 732 provided on one outer sidewall surface of the support 705.

The horizontal driver 735 comprises a drive pulley 736 and an idler pulley 737 which are provided on both sides of one sidewall surface of the support 705, a developer supply nozzle scanning motor 736a for rotating the drive pulley 736, and a belt 738 stretched between the pulleys 736 and 737. The lower end of the support side plate 731a is secured above an upper portion of the belt 738 running around the pulleys 736 and 737. By driving and rotating the drive pulley 736 with the developer supply nozzle scanning motor 736a, the belt 738 is rotated, in response to which the support side plate 731a is horizontally reciprocated on one side of the support 705. The developer supply nozzle scanning motor 736a consists of, for example, a stepping motor and is configured to be capable of controlling the amount of rotation and the rotational speed in both forward and backward directions in response to a signal (such as a pulse signal) given from the controller 760.

On one outer sidewall surface of the support 705, a plurality of position sensors 734a, 734b, 734c and 734d are provided to detect the position of the moving developer supply nozzle 720 by detecting the position of the moving support side plate 731a. In order from the right side of FIG. 22, there are the position sensor 734a for detecting a rinsing liquid supply position U1, the position sensor 734b for detecting a stand-by position U2, the position sensor 734c for detecting a developer discharge start position U3, and the position sensor 734d for detecting a developer discharge stop position U4. A sector 731e provided with the support side plate 731a is inserted into each of the sensors 734a, 734b, 734c and 734d, by which each of the positions U1, U2, U3 and U4 can be detected.

The support side plate 731b on the other side is formed in the shape of a long plate. A guide rail 733 is secured to a support other than the support 705. With an upper portion of the support side plate 731b extending beyond the support 705, a lower end portion of the support side plate 731b is supported so as to be reciprocally movable in a horizontal direction through a cam follower 733a along the guide rail 733. With the developer supply nozzle 720 in its upward position, the cam follower 733a and the guide rail 733 are spaced apart from each other.

The developer supply nozzle 720 is fixedly supported to bridge a gap between the upper end portions of both the support side plates 731a and 731b. The developer supply nozzle 720 is held in an approximately horizontal position with its discharge unit 722 facing in a downward direction, i.e., in a position to discharge a developer almost directly downward. Also a lateral rod 731c for reinforcement is provided on one side of the developer supply nozzle 720 to bridge a gap between the upper end portions of both the support side plates 731a and 731b. Preferably, those support side plates 731a, 731b and the lateral rod 731c are integrally formed by, for example, cast molding. Driven by the developer supply nozzle scanning mechanism 730, the developer supply nozzle 720 can pass over the semiconductor wafer SW. In passing over the semiconductor wafer SW, the developer supply nozzle 720 discharges a developer from its discharge unit 722 so that a developer is supplied to the major surface of the semiconductor wafer SW.

Alternatively, the configuration may be such that the developer supply nozzle 720 is supported in a cantilever manner without provision of the support side plate 731b on the other side and the guide rail 733 for supporting the side plate 731b.

The developer supply nozzle up-and-down mechanism 739 is a mechanism for vertically moving the developer supply nozzle 720 between a position where the developer supply nozzle 720 can pass over the semiconductor wafer SW and a position which is at a lower level than the above position and at which the developer supply nozzle 720 can be housed in the standby pot 718. The developer supply nozzle up-and-down mechanism 739 comprises an air cylinder 739a and developer supply nozzle up-and-down guides 739b.

The developer supply nozzle up-and-down guides 739b vertically movably guide the support 705, and the air cylinder 739a vertically moves the support 705. Vertical movement of the support 705 results in vertical movement of the respective components attached to the support 705, namely the developer supply nozzle 720, the developer supply nozzle scanning mechanism 730, the rinsing liquid supply nozzle 740 and the rinsing liquid supply nozzle rotation mechanism 750. Here, the wafer holding and rotation mechanism 710, the inner cup 716, the outer cup 717 and the standby pot 718 are supported by the support other than the support 705. Thus, the developer supply nozzle 720 and the rinsing liquid supply nozzle 740, which move vertically together with the support 705, move up and down relative to the semiconductor wafer SW held by the wafer holding and rotation mechanism 710.

Instead of the air cylinder 739a, a servo motor and a ball screw mechanism may be used. This has the advantage that the height of the developer supply nozzle 720 can be set to any value.

The developer supply nozzle scanning mechanism 730 and the developer supply nozzle up-and-down mechanism 739 constitute a mechanism for moving the developer supply nozzle 720.

The rinsing liquid supply nozzle 740 has a discharge unit 742 for discharging a rinsing liquid with a discharge width substantially equal to or greater than the width (diameter) of the semiconductor wafer SW.

In the present example, the rinsing liquid supply nozzle 740 has the slit discharge unit 742 formed on one side of a long length of nozzle body 742. The discharge unit 742 extends along the length of the nozzle body 741. This discharge unit 742 is configured to discharge a rinsing liquid in the form of a uniform curtain along the whole discharge width so that a rinsing liquid can be supplied along the whole width of the semiconductor wafer SW.

The rinsing liquid supply nozzle 740 is coupled to the rinsing liquid supply system for supplying a rinsing liquid, which will be described later.

The rinsing liquid supply nozzle rotation mechanism 750 is a mechanism for rotating the rinsing liquid supply nozzle 740 so that the nozzle 740 passes over the semiconductor wafer SW. It comprises a rinsing liquid supply nozzle rotating motor 752 and a rotary shaft 754.

The rinsing liquid supply nozzle rotating motor 752 consists of, for example, a stepping motor and is mounted in a position close to one end of the developer supply nozzle 720, with a bracket 751 and the rinsing liquid supply nozzle up-and-down mechanism 756 in between. The rotational speed and the amount of rotation of this motor 752 is variably controllable in response to a signal (such as a pulse signal) given from the controller 760.

The rotary shaft 754 is coupled to a motor shaft of the rinsing liquid supply nozzle rotating motor 752 and is disposed vertically from under the lower surface of the bracket 751. With the developer supply nozzle 720 in the rinsing liquid supply position U1, the rotary shaft 754 is freely rotatable on one vertex of a virtual square S circumscribing the semiconductor wafer SW held by the wafer holding and rotation mechanism 710.

The rinsing liquid supply nozzle 740 is fixedly coupled at its one end to the lower end of the rotary shaft 754, whereby the rinsing liquid supply nozzle 740 is supported in a cantilever manner in an approximately horizontal position above the support 705. The discharge unit 742 of the rinsing liquid supply nozzle 740 is arranged inclined at an angle in the range of 15 to 60 degrees to a horizontal plane toward a direction opposite to the direction of rotation of the rinsing liquid supply nozzle 740 during discharge. Inclining the discharge unit 742 in this way in the direction opposite to the direction of rotation of the rinsing liquid supply nozzle 740 is in order to prevent a rinsing liquid from flowing ahead of the movement of the rinsing liquid supply nozzle 740 (see FIG. 20). By driving and rotating the rotary shaft 754 with the rinsing liquid supply nozzle rotating motor 752, the rinsing liquid supply nozzle 740 is rotated to pass over the semiconductor wafer SW. In passing over the semiconductor wafer SW, the rinsing liquid supply nozzle 740 discharges a rinsing liquid from its discharge unit 742 so that a rinsing liquid is supplied to the major surface of the semiconductor wafer SW.

The rinsing liquid supply nozzle 740 is attached to the above lateral rod 731c via the bracket 751, the rinsing liquid supply nozzle rotating motor 752, the rinsing liquid supply nozzle up-and-down mechanism 756 and a cylinder mounting bracket 731d later to be described.

The bracket 751 is provided with a sensor 755b for detecting an original position of the rinsing liquid supply nozzle 740, with a sensor bracket 755a in between. On the other hand, a sector 741a (FIG. 24) to be sensed is secured to the nozzle body 741 of the rinsing liquid supply nozzle 740. With the rinsing liquid supply nozzle 740 in its original position (i.e., in a position substantially parallel to the developer supply nozzle 720), the sector 741a is inserted into the sensor 755b. Thereby the sensor 755b detects whether the rinsing liquid supply nozzle 740 is in its original position.

FIGS. 24 and 25 are enlarged views showing major parts of the developer supply nozzle 720 and the rinsing liquid supply nozzle 740. FIG. 24 shows the rinsing liquid supply nozzle 740 being in its upward position, and FIG. 25 shows the rinsing liquid supply nozzle 740 being in its downward position.

The rinsing liquid supply nozzle up-and-down mechanism 756 comprises a block piece 756a fixedly secured to the bracket 751 with the rode 756c in between, and a block piece 756b fixedly secured to the lateral rod 731c with the cylinder mounting bracket 731d in between. Those block pieces 756a and 756b are vertically slidably coupled. The block piece 756a is, for example, air driven to slide relative to the other block piece 756b. Thereby the bracket 751 is moved up and down and the rinsing liquid supply nozzle 740, together with the rinsing liquid supply nozzle rotating motor 752 and the like, is moved vertically relative to the developer supply nozzle 720.

While in this preferred embodiment, the rinsing liquid supply nozzle 740 is integrally mounted on the developer supply nozzle 720, they may, of course, be provided separately and independently as in the aforementioned second preferred embodiment.

Two final rinsing liquid supply nozzles 770 are mounted on the tip of a nozzle support arm 771 and in a position on the arm 771 slightly away from the tip. Each of the final rinsing liquid supply nozzles 770 is supplied with a rinsing liquid through piping 772. The final rinsing liquid supply nozzle 770 on the tip is for supplying a rinsing liquid to the central portion of the semiconductor wafer SW, while the other final rinsing liquid supply nozzle 770 is for supplying a rinsing liquid to the outer peripheral portion of the semiconductor wafer SW. One end of the nozzle support arm 771 is rotatably mounted in a position outside the semiconductor wafer SW, more specifically, in a position outside the rinsing liquid supply position U1. During the supply of a developer or a rinsing liquid to the semiconductor wafer SW, the nozzle support arm 771 is located in its stand-by position and spaced laterally from the semiconductor wafer SW (see FIG. 21). After the supply of a rinsing liquid to the semiconductor wafer SW for termination of development reactions, in order to clean the upper surface of the semiconductor wafer SW, the nozzle support arm 771 is, for example, motor driven to rotate so that the final rinsing liquid supply nozzle 770 on the tip is located above the semiconductor wafer SW and discharges a rinsing liquid to the central portion of the semiconductor wafer SW and a portion closer to the outer periphery.

FIG. 26 is a piping diagram showing the developer supply system.

The developer supply system comprises a pressure developer tank 780, first developer piping 781 connecting between the developer tank 780 and another developer reservoir tank or a plant utility which is a predetermined developer supply source installed in a plant, second developer piping 782 connecting between a predetermined N2 gas supply source and the developer tank 780, and third developer piping 783 connecting between the developer tank 780 and the developer supply nozzle 720. The first developer piping 781 has an air operation valve 781a interposed therein. The air operation valve is a valve opened or closed by air flow responsive to the opening and closing of a solenoid valve. The second developer piping 782 has interposed therein a regulator 782a for controlling the rate of N2 gas flow and an air operation valve 782b. The third developer piping 783 has interposed therein an air operation valve 783a, a flowmeter 783b having a mechanism for measuring and adjusting the rate of developer flow toward the developer supply nozzle 720, and a filter 783c for removing undesirable matter contained in a developer. One ends of the first developer piping 781 and the second developer piping 782 on the side of the developer tank 780 are opened to an upper space of the developer tank 780 where a developer is not stored, while one end of the third developer piping 783 on the side of the developer tank 780 is led to the bottom of the developer tank 780 and opened to be immersed in a developer stored. The on-off control of the respective air operation valves 781a, 782b and 783a is exercised by controlling the rate of gas flow such as N2 gas, and the rate of gas flow for use in the above on-off control is controlled by the on-off control of a solenoid valve through the controller 760.

Prior to the supply of a developer to the developer supply nozzle 720, a developer is supplied into the developer tank 780. During the supply of a developer into the developing tank 780, with the air operation valves 782b and 783a in their closed positions, the air operation valve 781a is opened to supply a developer through the first developer piping 781 into the developer tank 780. After a sufficient amount of a developer is stored in the developer tank 780 and then when a developer is supplied to the developer supply nozzle 720, the air operation valves 782b and 783a are opened with the air operation valve 781a in its closed position. Accordingly, N2 gas is introduced through the second developer piping 782 into the developer tank 780 and thereby an internal pressure in the developer tank 780 is increased. This increased internal pressure pushes the developer tank 780, whereby a developer is supplied through the third developer piping 783 to the developer supply nozzle 720. The rate of flow of a developer supplied to the developer supply nozzle 720 through the third developer piping 783 is controlled by the flowmeter 783b.

FIG. 27 is a piping diagram showing a rinsing liquid supply system.

The rinsing liquid supply system comprises a pressure rinsing liquid tank 785, first rinsing liquid piping 786 connecting between the rinsing liquid tank 785 and another rinsing liquid reservoir tank or a plant utility which is a predetermined rinsing liquid supply source installed in a plant, second rinsing liquid piping 787 connecting between a predetermined N2 gas supply source and the rinsing liquid tank 785, and third rinsing liquid piping 788 connecting between the rinsing liquid tank 785 and the rinsing liquid supply nozzle 740. The first rinsing liquid piping 786 has an air operation valve 786a interposed therein. The second rinsing liquid piping 787 has interposed therein a regulator 787a for controlling the rate of N2 gas flow and an air operation valve 787b. The third rinsing liquid piping 788 has interposed therein an air operation valve 788a, a filter 788c for removing undesirable matter contained in a rinsing liquid, and a flowmeter 788b having a mechanism for measuring and adjusting the rate of rinsing liquid flow toward the rinsing liquid supply nozzle 740.

Except that the locations of the filter 788c and the flowmeter 788b are reversed in the third rinsing liquid piping 788, the rinsing liquid supply system is identical in configuration to the aforementioned developer supply system and, based on the same principle and in the same manner, supplies a rinsing liquid to the rinsing liquid supply nozzle 740.

FIG. 28 is a block diagram showing an electrical structure of the developing apparatus of this preferred embodiment.

The controller 760 controls a sequence of operations later to be described and comprises a CPU, a ROM, a RAM and the like. It consists of a general microcomputer which performs predetermined arithmetic and logical operations by executing a previously stored software program.

The controller 760 is connected to the position sensors 734a, 734b, 734c and 734d for detecting the position of the moving developer supply nozzle 720 and the sensor 755b for detecting an original position of the rinsing liquid supply nozzle 740, so that each detection signal is fed to the controller 760. The controller 760 is also connected to a control panel 762, through which a predetermined operator command is given to the controller 760.

Also, the spinning motor 713 consisting of, for example, a servo motor is connected to the controller 760. The controller 760 receives a detection signal outputted from, for example, a mechanism for detecting the amount of rotation such as a rotary encoder on the side of the spinning motor 713 and, based on the detection signal, exercises feedback control over the amount of rotation of the spinning motor 713.

The controller 760 is also connected to the developer supply nozzle scanning motor 736a, the air cylinder 739a for vertically moving the developer supply nozzle 720, the rinsing liquid supply nozzle rotating motor 752, the rinsing liquid supply nozzle up-and-down mechanism (air cylinder) 756, and solenoid valves for use with the respective air operation valves 781a, 782b, 783a, 786a, 787b and 788a in the aforementioned developer and rinsing liquid supply systems, all of whose operations are controlled by the controller 760.

Now, a sequence of development processing steps performed on the semiconductor wafer SW by this developing apparatus will be described.

FIG. 29 is a flow chart showing a sequence of development processing steps by the developing apparatus, FIG. 30 is an explanatory diagram for explaining the movement of the developer supply nozzle 720, and FIG. 31 is an explanatory diagram for explaining the movement of the rinsing liquid supply nozzle 740.

After the initiation of processing, in step S1, the semiconductor wafer SW is transferred by a transfer robot onto the spin chuck 712 in the wafer holding and rotation mechanism 710. In the initial state, the inner cup 716 is in its downward position.

In step S2, a developer is supplied to the semiconductor wafer SW.

More specifically, as shown in FIG. 30, in the initial state, the developer supply nozzle 720 is located at the stand-by position U2 and in its downward position within the standby pot 718. After the initiation of processing of step S2, the developer supply nozzle 720, as indicated by the arrow (i), moves upward away from the standby pot 718 at the stand-by position U2. Then, as indicated by the arrow (ii), the developer supply nozzle 720 horizontally moves with a constant velocity toward the developer discharge start position U3 on one end of the semiconductor wafer SW. After that, as indicated by the arrow (iii), the developer supply nozzle 720 moves downward at the developer discharge start position U3 and starts to discharge a developer. Then, as indicated by the arrow (iv), the developer supply nozzle 720 horizontally moves with a constant velocity from the developer discharge start position U3 to the developer discharge stop position U4 on the other end of the semiconductor wafer SW and at the same time, supplies a developer to the semiconductor wafer SW at a constant flow rate. Thereby, a developer is formed in a puddle on the semiconductor wafer SW.

Here, the travel speed of the developer supply nozzle 720 when moving from the stand-by position U2 to the developer discharge start position U3 may be equal to that of the developer supply nozzle 720 when moving from the developer discharge start position U3 to the developer discharge stop position U4, or the former may be higher than the latter. The latter can be set to any value in the range of 30 to 70 mm/sec. A developer discharged is an aqueous alkaline solution or a predetermined solvent. The rate of flow of a developer to be supplied at this time can be set to any value in the range of 0.7 to 1.8 liters per minute. The set value for the flow rate is fixed after an optimum value is obtained by, for example, experiment under predetermined development processing conditions and a corresponding adjustment of the flowmeter 783b is made.

As shown in FIG. 32, when the developer supply nozzle 720 moves over the semiconductor wafer SW, it is preferable that a spacing Dd between the upper surface of the semiconductor wafer SW and the lower end of the developer supply nozzle 720 be approximately 1.5 mm.

Then, as indicated by the arrow (v), the developer supply nozzle 720 moves upward at the developer discharge stop position U4.

In this step S2, the rinsing liquid supply nozzle 740 is in its upward position and moves together with the developer supply nozzle 720. The semiconductor wafer SW is at rest.

Next, static development processing is performed in step S3.

More specifically, with the semiconductor wafer SW being at rest, development processing is performed on the semiconductor wafer SW after being exposed. The static development time depends on a dissolution rate of a resist, throughput of the apparatus and the like, and is set within the range of 3 to 120 seconds.

After completion of the static development processing, as indicated by the arrow (vi) in FIG. 30, the developer supply nozzle 720 returns once to the stand-by position U2 and descends into the standby pot 718. In the configuration where the rinsing liquid supply nozzle 740 and the developing 720 are provided separately (as in the aforementioned second preferred embodiment), the developer supply nozzle 720 may return to the stand-by position U2 after completion of a substrate drive-away step (step S7) later to be described, i.e., after the semiconductor wafer SW is taken out.

In step S4, a rinsing liquid is supplied to the semiconductor wafer SW.

First, as indicated by the arrow (vii) in FIG. 30, the developer supply nozzle 720 moves upward and toward the rinsing liquid supply position U1 away from the semiconductor wafer SW. The developer supply nozzle 720 then comes to a stop in its upward position. At this time, the rinsing liquid supply nozzle 740 is located above one end of the semiconductor wafer SW. This position is slightly different from the position where the developer supply nozzle 720 starts the discharge of a developer and is slightly closer to the semiconductor wafer SW.

In this condition, as indicated by the arrow a in FIG. 31, the rinsing liquid supply nozzle 740 moves downward relative to the developer supply nozzle 720. The rinsing liquid supply nozzle 740 then starts the discharge of a rinsing liquid. At the start of the discharge of a rinsing liquid, the rinsing liquid supply nozzle 740 starts to rotate and at the same time, the semiconductor wafer SW starts to rotate. Along the circumferential direction of the semiconductor wafer SW, a position to supply a rinsing liquid and a position to supply a developer are substantially the same. The rinsing liquid supply nozzle 740 is rotated by π/2 radians (90 degrees) (as indicated by the arrow b in FIG. 31) and similarly, the semiconductor wafer SW is rotated by π/2 radians (90 degrees).

The angular velocities of the rinsing liquid supply nozzle 740 and the semiconductor wafer SW during rotation can be set to any value in the range of π/24 to π/4 in radians per second. In the present example, both the angular velocities are assumed to be constant and equal to each other.

With such constant angular velocities, even if the time required for the developer supply nozzle 720 to scan the semiconductor wafer SW is equal to the time required for the rinsing liquid supply nozzle 740 to scan the semiconductor wafer SW (e.g., 4 seconds), a velocity component of the rinsing liquid supply nozzle 740 in a direction parallel to a scanning direction of the developer supply nozzle 720 with respect to the semiconductor wafer SW is not constant and not equal to a scanning velocity of the developer supply nozzle 720.

Also, when both the above angular velocities are set to be constant, the timing of termination of the development is not the same at each point on the semiconductor wafer SW. However, by controlling each of the above angular velocities and thereby equating the velocity of the developer supply nozzle 720 and the velocity component of the rinsing liquid supply nozzle 740 in the scanning direction of the developer supply nozzle 720 with respect to the semiconductor SW, the timing of termination of the development can be made approximately the same at each point on the semiconductor wafer SW.

The relationship between the angular velocities of the rinsing liquid supply nozzle 740 and the semiconductor wafer SW and a preferable form or the like will later be described in detail.

In the above example, the rinsing liquid is pure water, alcohol, a hydrogen peroxide solution, or a predetermine solvent. The rate of flow of a rinsing liquid to be supplied is set to any value in the range of 2.5 to 3.5 litters per minute. The set value for the flow rate is fixed after an optimum value is obtained by, for example, experiment under predetermined development processing conditions and a corresponding adjustment of the flowmeter 788b is made.

As shown in FIG. 33, when the rinsing liquid supply nozzle 740 passes over the semiconductor wafer SW, it is preferable that a spacing Dr between the upper surface of the semiconductor wafer SW and the lower end of the rinsing liquid supply nozzle 740 be approximately 8 mm differently from the aforementioned spacing Dd for the developer supply nozzle 720. This is in order to prevent the rinsing liquid supply nozzle 740 from interfering with an approximately 3-mm thick developer formed in a puddle on the semiconductor wafer SW.

The supply of a rinsing liquid onto the semiconductor wafer SW in this way stops development reactions on the semiconductor wafer SW.

After being rotated over the semiconductor wafer SW, the rinsing liquid supply nozzle 740 moves upward relative to the developer supply nozzle 720 as indicated by the arrow c in FIG. 31 and then moves backward to return to its original position as indicated by the arrow d. Then, as indicated by the arrows (viii) and (ix) in FIG. 30, the developer supply nozzle 720 moves to the stand-by position U2 and descends into the standby pot 718.

Next, in step S5, a final supply of a rinsing liquid is provided to the semiconductor wafer SW.

More specifically, the inner cup 716 is moved upward and, with the semiconductor wafer SW being rotated, a rinsing liquid (pure water) is supplied from the final rinsing liquid supply nozzles 770 to the central portion of the semiconductor wafer SW thereby to clean and remove undesirable matter (e.g., particles) produced by development reactions.

The rate of rotation of the semiconductor wafer SW at this time is in the range of 500 to 1000 rpm.

Then, in step S6, the semiconductor wafer SW is rotated with a high velocity to spin off a rinsing liquid on the semiconductor wafer SW and to dry the semiconductor wafer SW.

The rate of rotation of the semiconductor wafer SW at this time is in the range of 1500 to 3000 rpm.

Finally, in step S7, the inner cup 716 is moved downward, and the semiconductor wafer SW, after being released from adsorption and holding by the spin chuck 712, is transferred to the outside by the transfer robot.

In the developing apparatus of the aforementioned configuration, with the semiconductor wafer SW being rotated, the rinsing liquid supply nozzle 740 is rotated to pass over the semiconductor wafer SW and at the same time to supply a rinsing liquid. Thus, the discharge unit 742 is shifted in the direction of discharge of a rinsing liquid, which improves uniformity in the supply of a rinsing liquid to the semiconductor wafer SW.

Besides, the development time can be made approximately the same at each point on the entire surface of the semiconductor wafer SW, which results in uniform development processing.

Further, since the semiconductor wafer SW is rotated during the supply of a rinsing liquid in step S4, undesirable matter (e.g., particles) produced by development reactions can efficiently be led to the outside of the semiconductor wafer SW by centrifugal force.

<B. Relative Positions of Semiconductor Wafer and Nozzle>

<B1. Nozzle Position Relative to Semiconductor Wafer>

Now, the relative positions of the semiconductor wafer SW and the rinsing liquid supply nozzle 740 will be described in more detail.

FIG. 34 is a diagram showing the relative positions of the semiconductor wafer SW and the rinsing liquid supply nozzle 740 in the XY plane. The XY plane is assumed to have an origin point O which is the rotation axis of the semiconductor wafer SW, an x axis extending along the virtual scanning direction La of the semiconductor wafer SW, and a y axis orthogonal to the x axis. The virtual scanning direction La herein is identical to that described in the second preferred embodiment.

In this drawing, a center of rotation of the generally disc-shaped semiconductor wafer SW is at the origin point O (0, 0) and the wafer SW has a radius of r. During the supply of a rinsing liquid, the semiconductor wafer SW rotates counterclockwise (in a direction indicated by the arrow P) on the origin point O.

The rinsing liquid supply nozzle 740 rotates counterclockwise (in a direction indicated by the arrow Q) over the semiconductor wafer SW on one vertex of a square S circumscribing the semiconductor wafer SW as a center of rotation O′ (x₀, y₀). Let r′ be the distance between the center of rotation O′ (x₀, y₀) and an arbitrary point along the direction of extension of the rinsing liquid supply nozzle 740.

Assuming that the semiconductor wafer SW is at rest, an arbitrary point (x′, y′) of the rinsing liquid supply nozzle 740 over the semiconductor wafer SW, t seconds after the start of rotation of the rinsing liquid supply nozzle 740, can be expressed by the following equation:
$\begin{matrix} {\begin{matrix} x^{'} = r^{'} \cos (θ^{'} + \frac{π}{2}) + r \\ y^{'} = r^{'} \sin (θ^{'} + \frac{π}{2}) - r \end{matrix} & (1) \end{matrix}$

where θ′ is the rotation angle of the rinsing liquid supply nozzle 740, t seconds after the start of rotation of the rinsing liquid supply nozzle 740.

Next, consider the case where the semiconductor wafer SW rotates in response to the rotation of the rinsing liquid supply nozzle 740. Let θ be the rotation angle of the semiconductor wafer SW, t seconds after the start of rotation of the semiconductor wafer SW.

In this case, the point (x′, y′) can be assumed to be rotated at θ degrees and shifted to a point (x, y).

The point (x′, y′), represented in a polar coordinate system, is as shown in FIG. 35 and can be expressed as:
$\begin{matrix} {\begin{matrix} x^{'} = r \cos θ^{'} \\ y^{'} = r \sin θ^{'} \end{matrix} & (2) \end{matrix}$

When the semiconductor wafer SW rotates counterclockwise by θ degrees, the above point (x′, y′) can be assumed to be rotated clockwise by θ degrees. Where θ is the rotation angle of the semiconductor wafer SW, t seconds after the start of rotation of the semiconductor wafer SW. In a rotating coordinate system in which the x axis is the virtual scanning direction La of the semiconductor wafer SW, the y axis is a coordinate axis orthogonal to the x axis and the origin point is at the center of rotation of the semiconductor wafer SW, the coordinates (x, y) of an arbitrary point of the rinsing liquid supply nozzle 740 relative to the semiconductor wafer W can be expressed as:
$\begin{matrix} {\begin{matrix} x = r \cos (θ^{'} - θ) \\ y = r \sin (θ^{'} - θ) \end{matrix} & (3) \end{matrix}$

According to the laws of cosines and sines, the equation (3) can be rewritten as:
$\begin{matrix} {\begin{matrix} x = r (\cos θ^{'} \cdot \cos θ + \sin θ^{'} \cdot \sin θ) \\ y = r (\sin θ^{'} \cdot \cos θ - \cos θ^{'} \cdot \sin θ) \end{matrix} & (4) \end{matrix}$

From the equations (2) and (4), the coordinates (x, y) of an arbitrary point of the rinsing liquid supply nozzle 740 relative to the semiconductor wafer SW after t seconds can be expressed by the following equation:
$\begin{matrix} {\begin{matrix} x = x^{'} \cos θ + y^{'} \sin θ \\ y = y^{'} \cos θ - x^{'} \sin θ \end{matrix} & (5) \\ where \\ {\begin{matrix} x^{'} = r^{'} \cos (θ^{'} + \frac{π}{2}) + r \\ y^{'} = r^{'} \sin (θ^{'} + \frac{π}{2}) - r \end{matrix} \end{matrix}$

By varying the value r′ in the equation (5), the coordinates of each point of the rinsing liquid supply nozzle 740 relative to the semiconductor wafer SW after t seconds can be obtained.

When the rinsing liquid supply nozzle 740 rotates with a constant velocity at a rotational frequency of T′ and the semiconductor wafer SW rotates with a constant velocity at a rotational frequency of T, the rotation angles θ and θ′ can be expressed by the following equations:
$\begin{matrix} {\begin{matrix} θ = \frac{2 π}{T} t \\ θ^{'} = \frac{2 π}{T^{'}} t \end{matrix} & (6) \end{matrix}$

<B2. Relationship Between Angular Velocities of Semiconductor Wafer and Nozzle>

On the basis of the above equation (5), the relationship between the angular velocities of the semiconductor wafer SW and the rinsing liquid supply nozzle 740 will be described.

Where the angular velocities of both the semiconductor wafer SW and the rinsing liquid supply nozzle 740 are equal (including the case where both the angular velocities vary in synchronization with each other), the rotation angle θ of the semiconductor wafer SW and the rotation angle θ′ of the rinsing liquid supply nozzle 740, after t seconds, are equal, i.e., θ=θ′. Thus, the equation (5) can be expressed as:
$\begin{matrix} {\begin{matrix} x = r (\cos θ - \sin θ) \\ y = r^{'} - r (\cos θ + \sin θ) \end{matrix} & (7) \end{matrix}$

If, in the equation (7), the rinsing liquid supply nozzle 740 and the semiconductor wafer SW rotates with a constant velocity at the same rotational frequency of T, the following equation is true:
$\begin{matrix} θ = \frac{2 π}{T} t & (8) \end{matrix}$

In the equation (7), it can be seen that the equation for x is a function of only the radius r and the rotation angle θ of the semiconductor wafer SW, not containing the term r′. This indicates that the value x is independent of a distance from the center of rotation of the rinsing liquid supply nozzle 740 and that the direction of extension of the rinsing liquid supply nozzle 740 is always parallel to the virtual scanning direction La of the semiconductor wafer SW.

On the basis of the equation (7), a path that the rinsing liquid supply nozzle 740 describes on the semiconductor wafer SW is shown in FIG. 36. FIG. 36 illustrates a coordinate system in which the horizontal axis is the virtual scanning direction La of the rotating semiconductor wafer SW and the longitudinal axis is a direction orthogonal to the horizontal axis. In the present example, the semiconductor wafer has a diameter of 200 mm.

As can be seen from this drawing, the rinsing liquid supply nozzle 740 moves along an arc in the form of a strip of a predetermined width over the semiconductor wafer SW. The direction of extension of the rinsing liquid supply nozzle 740 is always approximately perpendicular to the virtual scanning direction La of the semiconductor wafer SW; thus, it can be expected that the amount of a rinsing liquid discharged on the semiconductor wafer SW will be uniform at any point along a direction orthogonal to the virtual scanning direction La (in the longitudinal axial direction of FIG. 36).

That is, in order to make the amount of a rinsing liquid discharged on the semiconductor wafer SW as uniform as possible at each point along a direction orthogonal to the virtual scanning direction La, it is necessary to always equate the rotation angles θ and θ′, i.e., angular velocities, of the semiconductor wafer SW and the rinsing liquid supply nozzle 740 after t seconds.

The same conclusion can be reached even if the coordinates of the rotation axis of the rinsing liquid supply nozzle 740 is set to any coordinates outside the semiconductor wafer SW.

<B3. Relative Velocity of Nozzle along Virtual Scanning Direction>

Based on the equation (7), we will now consider the amount of discharge of a rinsing liquid from the rinsing liquid supply nozzle 740 along the virtual scanning direction La of the semiconductor wafer SW.

Closed circles on the semiconductor wafer SW shown in FIG. 37 indicate the positions of the rinsing liquid supply nozzle 740, respectively after 0, 1, 2, 3 and 4 seconds, when both the semiconductor wafer SW and the rinsing liquid supply nozzle 740, rotate with a constant velocity and make a quarter of rotation in 4 seconds, i.e., where T=16 sec.

At this time, the travel distance in the virtual scanning direction La for the first one second is 45.9 mm, that for the second one second is 54.1 mm, that for the third one second is 54.1 mm, and that for the fourth one second is 45.9 mm. That is, the travel distance of the rinsing liquid supply nozzle 740 per unit time varies.

FIG. 38 shows an area that the rinsing liquid supply nozzle 740 passes through per unit time.

F1 represents an area that the nozzle 740 passes through for the first one second, and F2 represents an area that the nozzle 740 passes through for the second one second. Letting L be the length of the nozzle 740, F1 and F2 can be expressed as:

F1≈45.9×L(mm²)
F2≈54.1×L(mm²)

For example if 100 cc of a rinsing liquid is discharged in one second, it is apparent that F1 has a larger amount of a rinsing liquid per unit area than F2.

Substituting the equation (8) into the equation (7) on condition that the equations (7) and (8) are true and differentiating the value x with respect to the time t, we obtain the relative velocity component of the rinsing liquid supply nozzle 740, which can be expressed by the following equation:
$\begin{matrix} \begin{matrix} \frac{ⅆ x}{ⅆ t} = \frac{ⅆ x}{ⅆ θ} \cdot \frac{ⅆ θ}{ⅆ t} \\ = - \frac{2 π r}{T} (\cos θ + \sin θ) \end{matrix} & (10) \end{matrix}$

By taking on the absolute value of the calculated value of the equation (10), the relative velocity component of the nozzle 740 in the virtual scanning direction La of the wafer SW can be obtained.

FIG. 39 is a diagram showing the relative velocity of the nozzle 740 with respect to the wafer SW where T=16 sec.

As shown in this drawing, two seconds after the start of rotation, i.e., when the nozzle 740 is rotated by π/4 radians, the speed becomes maximum, 55.5 mm/sec. On the other hand, at the start and the end of rotation of the nozzle 740 and the wafer SW, the speed becomes minimum, 39.3 mm/sec. With this difference in speed, the amount of a rinsing liquid discharged on the wafer SW along the virtual scanning direction La is the smallest at the central portion of the wafer SW and the largest at the supply start and end points. To avoid such nonuniformity, the relative velocity component of the nozzle 740 with respect to the wafer SW along the virtual scanning direction La needs to be constant. The conditions required therefor are as follows:

In the present case, the nozzle 740 should be moved with a constant velocity during the time when it passes over the wafer SW from end to end.

Where the nozzle 740 and the wafer SW are rotated with the same angular velocity (θ=θ′) and let T″ be the time required for the nozzle 740 and the wafer SW to make one rotation, the time required for the nozzle 740 to pass over the wafer SW can be expressed as T″/4. That is, the nozzle 740 should be moved a distance 2r corresponding to the diameter of the wafer SW, within the time T″/4 with a constant velocity.

The relative velocity component v_xof the nozzle 740 with respect to the wafer SW along the virtual scanning direction La can be expressed by the following equation:
$\begin{matrix} v_{x} = \frac{2 r}{T^{″} / 4} = \frac{8 r}{T^{″}} & (11) \end{matrix}$

When the nozzle 740 is moved with the velocity component v_x, the position of the nozzle 740 after t seconds can be expressed as:
$\begin{matrix} x = r - \frac{8 r}{T^{″}} t & (12) \end{matrix}$

Since the value x in the equation (12) and the value x in the equation (7) should be equal, from the equations (7) and (12), the following equation is true:
$\begin{matrix} \begin{matrix} r (\cos θ - \sin θ) = r - \frac{8 r}{T^{″}} t \\ ∴ \cos θ - \sin θ = 1 - \frac{8}{T^{″}} t \end{matrix} & (13) \end{matrix}$

The use of a formula of the trigonometric function for the left side of the equation (13) gives:
$\begin{matrix} \sqrt{2} \cos (θ + \frac{π}{4}) = 1 - \frac{8}{T^{″}} t & (14) \end{matrix}$

From the equation (14), the angle θ can be expressed as:
$\begin{matrix} θ = - \frac{π}{4} + \cos^{- 1} (\frac{1 - \frac{8}{T^{″}} t}{\sqrt{2}}) & (15) \end{matrix}$

FIG. 40 shows the relationship between the time t and the rotation angle θ where T″=16 sec. In the drawing, the dotted line indicates the relationship in the case of a constant angular velocity, and the solid line indicates the relationship in the case where the angular velocity is controlled according to the equation (15).

When the angular velocity is controlled so as to satisfy the equation (15), the relative velocity component v_xof the nozzle 740 with respect to the wafer SW in the virtual scanning direction La of the wafer SW becomes constant.

Especially, if the relative velocity component of the aforementioned rinsing liquid supply nozzle 140 in the virtual scanning direction La and the velocity of the developer supply nozzle 120 when moving over the substrate W (for example in the following preferred embodiment, the relative velocity component of the developer supply nozzle 220 in the virtual scanning direction La) have substantially the same constant velocity pattern, the timing of termination of the development can be made the same at each point in the plane of the substrate W and also the amount of the supply of a rinsing liquid can be made approximately uniform.

<B4. Relative Positions of Center of Rotation of Rinsing Liquid Supply Nozzle and Semiconductor Wafer>

We will now consider the relative positions of the center of rotation of the rinsing liquid supply nozzle 740 and the semiconductor wafer SW.

In FIGS. 41, 42, 43 and 44, in a coordinate system in which the horizontal axis is the virtual scanning direction La of the rotating semiconductor wafer SW and the longitudinal axis is a direction orthogonal to the x axis, the wafer SW having a diameter of 200 mm is located such that its center of rotation coincides with the origin point (0, 0).

First, the case where the center of rotation of the rinsing liquid supply nozzle 740 is located outside the square S circumscribing the semiconductor wafer SW is shown below.

More specifically, the case where, as shown in FIG. 41, the center of rotation of the nozzle 740 has the coordinates (110, −130) is shown below.

In this case, the nozzle 740 moves along an arc in the form of a strip over the wafer SW and when the wafer SW and the nozzle 740 are rotated approximately 80 degrees, the nozzle 740 can pass over the whole surface of the wafer SW. The arc-shaped curves in FIG. 41 represent the locus of the nozzle 740 when the wafer SW and the nozzle 740 are both rotated 90 degrees.

From this, it can be said that, when the center of rotation of the rinsing liquid supply nozzle 740 is located outside the square S circumscribing the semiconductor wafer SW, the rinsing liquid supply nozzle 740 can pass over the whole surface of the semiconductor wafer SW.

Next, the case where the center of rotation of the rinsing liquid supply nozzle 740 is located inside the square S circumscribing the semiconductor wafer SW and outside the semiconductor wafer SW is shown below.

More specifically, the case where, as shown in FIGS. 42 and 43, the center of rotation of the rinsing liquid supply nozzle 740 has the coordinates (90, −80) is shown below.

FIG. 42 shows the locus of the nozzle 740 when the wafer SW and the nozzle 740 are both rotated 90 degrees, and FIG. 43 shows the locus of the nozzle 740 when the wafer SW and the nozzle 740 are both rotated 113 degrees.

As shown in these drawings, only 90 degrees of rotation of the wafer SW and the nozzle 740 does not allow the nozzle 740 to pass over the whole surface of the wafer SW, and the nozzle 740 is stopped on the way. To allow the nozzle 740 to pass over the whole surface of the wafer SW, it is necessary to rotate both the wafer SW and the nozzle 740 at 113 degrees.

Next, the case where the center of rotation of the rinsing liquid supply nozzle 740 is located inside the semiconductor wafer SW is shown below.

More specifically, the case where, as shown in FIG. 44, the center of rotation of the nozzle 740 has the coordinates (30, −40) is shown below.

The arc-shaped curves in this drawing represent the locus of the nozzle 740 when the wafer SW and the nozzle 740 are both rotated 90 degrees. In this case, it can be found that the nozzle 740 cannot pass over the whole surface of the wafer SW.

When the center of rotation of the nozzle 740 is located inside the wafer SW, however long the nozzle 740 and however great the rotation angle thereof, it is impossible in principle for the nozzle 740 to pass over the whole surface of the wafer SW as long as the wafer SW and the nozzle 740 are rotated with the same rotational speed.

An explanation therefor is given below.

If the center of rotation of the nozzle 740 has the coordinates (x₁, y₁) and the angular velocities of the nozzle 740 and the wafer SW are equal, i.e., θ=θ′, the equation (5) can be rewritten as follows:
$\begin{matrix} {\begin{matrix} x = x_{1} \cos θ - y_{1} \sin θ \\ y = r^{'} - x_{1} \cos θ - y_{1} \sin θ \end{matrix} where θ = \frac{2 π}{T} t & (16) \end{matrix}$

The use of a composite formula of the trigonometric function for the value x in the equation (16) gives:

x=√{square root over (x₁²+y₁²)}·sin(θ+φ) (17)

where

tan φ=y₁/x₁

Where the radius of the wafer SW is 100 mm and when the nozzle 740 scans the wafer SW from the outside, the value x should be equal to or greater than 100. That is, the following equation has to be true:

√{square root over (x₁²+y₁²)}≧100 (18)

From the equation (18), it is found that the center of rotation of the nozzle 740 should be located outside a circle having a radius of 100 mm.

<B5. General-Formulation of Relative Velocities of Nozzles in Virtual Scanning Direction>

The above equation (15) shows that the relative velocity component of the nozzle 740 with respect to the semiconductor wafer SW in the virtual scanning direction La of the wafer SW is constant on condition that the rotation axis of the nozzle 740 be located at one vertex of the square S circumscribing the wafer SW.

However, as shown in the equation (18), it is found that, if the center of rotation of the nozzle 740 is located outside the wafer SW, the nozzle 740 can pass over the entire surface of the wafer SW.

In the following, on condition that the rotation axis of the nozzle 740 be located outside the wafer SW, the equation which gives a constant relative velocity component of the nozzle 740 with respect to the semiconductor wafer SW in the virtual scanning direction La of the wafer SW is further formulated.

Specifically, if the center of rotation of the nozzle 740 is located at an arbitrary point having coordinates (x₀, y₀) outside the wafer SW, the equation (5) that shows the coordinates (x, y) of an arbitrary point of the nozzle 740 relative to the wafer SW, t seconds after the start of rotation, can be rewritten as follows:
$\begin{matrix} {\begin{matrix} x = x^{'} \cos θ + y^{'} \sin θ \\ y = y^{'} \cos θ - x^{'} \sin θ \end{matrix} where {\begin{matrix} x^{'} = r^{'} \cos [θ^{'} + \frac{π}{2}] + x_{0} \\ y^{'} = r^{'} \sin [θ^{'} + \frac{π}{2}] + y_{0} \end{matrix}} & (19) \end{matrix}$

Where the angular velocities of the semiconductor wafer SW and the nozzle 740 are equal (including the case where both the angular velocities vary in synchronization with each other), θ=θ′. In this case, the value x in the equation (19) can be expressed as:

x=x₀cos θ+y₀sin θ (20)

The point (x₀,y₀), when represented in a polar coordinate system, is as follows:

$\begin{matrix} {\begin{matrix} x_{0} = L \cos ϕ \\ y_{0} = L \sin ϕ \end{matrix} & (21) \end{matrix}$
where L=√{square root over (x₀²+y₀²)}

Accordingly, the value x can be expressed as:

x=L cos φ cos θ+L sin φ sin θ=L cos(θ−φ) (22)

If the nozzle 740 moves over the wafer SW with a constant velocity along the x axis which extends along the virtual scanning direction La, the following equation (23) is true:

x=r−vt
$\begin{matrix} where v = \frac{2 r}{T_{0}} & (23) \end{matrix}$

Where T₀is the time required for the nozzle 740 to move from the start point of the wafer SW to the end point, i.e., the time required for the nozzle 740 to pass over the wafer SW.

From the equations (22) and (23), the following equations (24) and (25) are derived:

L cos(θ−φ)=r−vt
$\begin{matrix} θ = ϕ + \cos^{- 1} [\frac{r - v t}{L}] & (24) \\ θ = ϕ + \cos^{- 1} [\frac{r - \frac{2 r}{T_{0}} t}{\sqrt{x_{0}^{2} + y_{0}^{2}}}] & (25) \end{matrix}$

- where tan φ−y₀/x₀

Thus, in order to make constant the relative velocity component of the nozzle 740 relative to the wafer SW along the virtual scanning direction La (x axis) of the wafer SW on condition that the rotation axis of the nozzle 740 be located outside the wafer SW, the angular velocities of the nozzle 740 and the wafer SW should be controlled so as to satisfy the above equation (25).

<B6. Summary>

In summary, in order to allow the rinsing liquid supply nozzle 740 to pass over the whole surface of the wafer SW and to supply a rinsing liquid discharged from the rinsing liquid supply nozzle 740 as uniformly as possible onto the semiconductor wafer SW, the following three points should preferably be satisfied:

Firstly, the semiconductor wafer SW and the rinsing liquid supply nozzle 740 should be rotated simultaneously and with the same angular velocity.

Secondly, the respective angular velocities of the semiconductor wafer SW and the rinsing liquid supply nozzle 740 should be controlled. For example, when the rotation axis of the rinsing liquid supply nozzle 740 is located at one vertex of the square S circumscribing the semiconductor wafer SW, the angular velocities should be controlled so as to satisfy the above equation (15). Also, when the rotation axis of the rinsing liquid supply nozzle 740 is located outside the semiconductor wafer SW, the angular velocities should be controlled so as to satisfy the above equation (25).

Thirdly, the center of rotation of the rinsing liquid supply nozzle 740 should be located outside the semiconductor wafer SW.

The contents described for the relative positions of the semiconductor wafer and the nozzle is also applicable to the aforementioned second preferred embodiment and each of the other preferred embodiments described below. Of course, they are also applicable to the case where the developer supply nozzle is rotated.

Fourth Preferred Embodiment

Now, a description is made of a developing apparatus according to a fourth preferred embodiment of the present invention.

FIGS. 45 and 46 respectively are plan and side views showing a schematic configuration of the developing apparatus.

This developing apparatus is configured to develop a thin resist film formed on the surface of a semiconductor wafer SW as a substrate.

The semiconductor wafer SW to be processed is formed in substantially a circular disk shape. The diameter of the semiconductor wafer SW is, for example, 200 or 300 mm. The semiconductor wafer SW has a notch NC or an orientation flat formed in part of its outer peripheral edge. Prior to development processing by this apparatus, a predetermined pattern is exposed onto the thin resist film.

This developing apparatus comprises a wafer holding and rotation mechanism 810, a developer supply nozzle 820, a developer supply system 826, a nozzle scan mechanism 830, a nozzle up-and-down mechanism 890, a rinsing liquid supply nozzle 840, a rinsing liquid supply system 846, a rinsing liquid supply nozzle rotation supporting mechanism 850, and a controller 860.

The wafer holding and rotation mechanism 810 is a mechanism for holding and rotating the semiconductor wafer SW and comprises a support shaft 811, a spin chuck 812 provided on the upper end of the support shaft 811, and a spinning motor 813 having a rotary shaft coupled to the lower end of the support shaft 811.

The spin chuck 812 is configured to hold the semiconductor wafer SW in an approximately horizontal position and consists of a vacuum chuck for holding the semiconductor wafer SW by suction. Alternatively, a mechanical chuck for grasping and holding the outer peripheral edge of the semiconductor wafer SW may be used as the spin shuck 812.

The spinning motor 813 consists of, for example, a servo motor and is configured to be capable of variably controlling the rotational speed and the amount of rotation in response to a signal (such as a pulse signal) given from the controller 860 later to be described. Rotation of this spinning motor 813 is transmitted through the support shaft 811 to the spin shuck 812. Rotatably driven by this spinning motor 813, the semiconductor wafer SW is rotatable on a vertical axis as a rotation axis in a horizontal plane.

Around the spin chuck 812, a cup 816 of a generally circular shape in plan view is provided to surround the semiconductor wafer SW held by the spin chuck 812. The cup 816 becomes narrower toward its upper end to form an upper opening. By an up-and-down mechanism such as an air cylinder, the cup 816 is vertically movable between its upward position at which its upper opening edge is positioned to surround the outer periphery of the semiconductor wafer SW, and its downward position which is at a lower level than the upward position.

Also, a tray 817 is provided to surround the cup 816. The size of this tray 817 is determined in accordance with the path of strip linear movement of a discharge unit 822 of the developer supply nozzle 820 which is later described in detail. In this preferred embodiment, the tray 817 has a generally square shape in plan view that is one size larger than the above path of strip linear movement. The discharge unit 822 of the developer supply nozzle 820 moves over the tray 817, at which time a developer discharged from the discharge unit 822 is conducted along the outer surface of the cup 816 or along a path between the cup 816 and the tray 817 to the bottom of the tray 817. The rinsing liquid supply nozzle 840 also rotates and moves over the tray 817, at which time, in similar fashion, a rinsing liquid discharged from a discharge unit 842 of the rinsing liquid supply nozzle 840 is conducted to the bottom of the tray 817.

A standby pot 818 is provided in a position corresponding to a stand-by position of the developer supply nozzle 820, on one side of and outside the cup 816. The standby pot 818 is formed in the shape of a casing having an upper opening in which the developer supply nozzle 820 can be accommodated from above.

The developer supply nozzle 820 has the discharge unit 822 for discharging a developer with a discharge width substantially equal to or greater than the width (diameter) of the semiconductor wafer SW.

In the present example, the developer supply nozzle 820 has the slit discharge unit 822 formed on one side of a long length of nozzle body 821. The discharge unit 822 extends along the length of the nozzle body 821. This discharge unit 822 is configured to discharge a developer in the form of a uniform curtain along its whole width so that a developer can be supplied along the whole width of the semiconductor wafer SW.

The developer supply nozzle 820 is coupled to the developer supply system 826. This developer supply system 826 is identical in configuration to that described in the third preferred embodiment with reference to FIG. 26.

The nozzle scan mechanism 830 is a nozzle movement mechanism for linearly moving the developer supply nozzle 820 along a horizontal direction so that the nozzle 820 passes over the semiconductor wafer SW. It comprises a support side plate 831 which is horizontally movably supported by a guide on one side of a support 805, and a horizontal driver 835 for horizontally reciprocating the support side plate 831.

The support side plate 831 is formed in the shape of a long plate. With an upper portion of the support side plate 831 projecting above the support 805, a lower portion of the support side plate 831 is horizontally movably supported by two linear guides 832 provided on one outer sidewall surface of the support 805.

The horizontal driver 835 comprises a drive pulley 836 and an idler pulley 837 which are provided on both ends of one sidewall surface of the support 805, a nozzle scanning motor 836a for rotating the drive pulley 836, and a belt 838 stretched between the pulleys 836 and 837. The lower end of the support side plate 831 is secured to an upper portion of the belt 838 running around the pulleys 836 and 837. By driving and rotating the drive pulley 836 with the nozzle scanning motor 836a, the belt 838 is rotated, in response to which the support side plate 831 is horizontally reciprocated on one side of the support 805.

The nozzle scanning motor 836a consists of, for example, a stepping motor and is configured to be capable of controlling the amount of rotation and the rotational speed in both forward and backward directions in response to a signal (such as a pulse signal) given from the controller 860.

On one outer sidewall surface of the support 805, a plurality of position sensors 834a, 834b, 834c and 834d are provided to detect the position of the moving developer supply nozzle 820 by detecting the position of the moving support side plate 831. The outputs from those position sensors are given to the controller 860.

The nozzle up-and-down mechanism 890 is provided in the upper projecting portion of the support side plate 831.

The nozzle up-and-down mechanism 890 has a so-called ball screw structure; more specifically, it comprises a ball screw shaft 891 having a screw groove on the outer peripheral surface, a ball nut 892 having a screw groove on the inner peripheral surface, and a rotary driver such as a stepping motor for rotating the ball screw shaft 891.

The ball screw shaft 891 is supported in an approximately vertical position in the upper projecting portion of the support side plate 831. This ball screw shaft 891 is coupled to a rotary shaft of the rotary driver 893 which is controlled by the controller 860 upon receipt of a control signal, and it is configured to be capable of rotating in both forward and backward directions by receiving a rotary drive from the rotary driver 893.

The ball nut 892 is in threaded engagement with the ball screw shaft 891 with balls interposed between itself and the outer peripheral surface of the ball screw shaft 891. The ball nut 892 is configured to move vertically along the axial direction of the ball screw shaft 891 in response to rotation of the ball screw shaft 891 in both forward and reverse directions.

This ball nut 892 fixedly supports the developer supply nozzle 820 in a cantilever manner via a first bracket 896. The developer supply nozzle 820 is held in an approximately horizontal position that is generally perpendicular to a direction of movement of the support side plate 831, so that it can pass over the semiconductor wafer SW. The discharge unit 822 of the developer supply nozzle 820 faces in a downward direction.

Driven by the nozzle scan mechanism 830, the developer supply nozzle 820 can linearly pass over the semiconductor wafer SW. In passing over the semiconductor wafer SW, the developer supply nozzle 820 discharges a developer from its discharge unit 822 so that a developer is supplied to the major surface of the semiconductor wafer SW.

Also driven by the nozzle up-and-down mechanism 890, the developer supply nozzle 820 vertically moves between a position where the developer supply nozzle 820 can pass over the semiconductor wafer SW and a position which is at a lower level than the above position and at which the developer supply nozzle 820 is housed in the standby pot 818. Alternatively, an air cylinder or the like may be employed to vertically move the developer supply nozzle 820.

The rinsing liquid supply nozzle 840 has the slit discharge unit 842 formed on one side of a long length of nozzle body 841. The discharge unit 842 extends along the length of the nozzle body 841. This discharge unit 842 discharges a rinsing liquid in the form of a uniform curtain along its whole width.

The rinsing liquid supply nozzle 840 is coupled to the rinsing liquid supply system 846 for supplying a rinsing liquid. This rinsing liquid supply system 846 is identical in configuration to that described in the third preferred embodiment with reference to FIG. 27.

FIG. 47 is an enlarged plan view showing a major part of the rinsing liquid supply nozzle rotation supporting mechanism 850.

As shown in FIGS. 45 to 47, the rinsing liquid supply nozzle rotation supporting mechanism 850 is a mechanism for rotatably supporting and driving the rinsing liquid supply nozzle 840. In this preferred embodiment, the rinsing liquid supply nozzle rotation supporting mechanism 850 is supported by the ball nut 892 via a second bracket 898, so that it moves vertically and horizontally together with the developer supply nozzle 820. Alternatively, the rinsing liquid supply nozzle rotation supporting mechanism 850 may be provided in a fixed position independently of the developer supply nozzle 820.

The rinsing liquid supply nozzle rotation supporting mechanism 850 comprises a nozzle support 851 which supports the rinsing liquid supply nozzle 840 so that the rinsing liquid supply nozzle 840 is freely rotatable and is freely movable along a predetermined direction M of movement, a nozzle rotary driver 854 which provides a predetermined rotary drive, and a drive arm 856 which transmits a rotary drive from the nozzle rotary driver 854 to the rinsing liquid supply nozzle 840.

The nozzle support 851 adopts a sort of linear guide structure. The nozzle support 851 herein comprises a slide support body 852 having a slide groove 852a, and a slider 853 slidably mounted in the slide groove 852a. The slide groove 852a is provided on one side of the path of strip linear movement of the discharge unit 822 of the developer supply nozzle 820 and extends in a direction that is angled relative to a scanning direction Ld of the developer supply nozzle 820. This direction of extension of the slide groove 852a defines the above predetermined direction M of movement. The slide groove 852a (the direction M of movement) should extend in a direction that is not parallel to the scanning direction Ld of the developer supply nozzle 820; for example, it may extend along a direction generally orthogonal to the scanning direction Ld or it may extend along a curve. Alternatively, the nozzle support 851 may adopt a sort of cam-groove structure in which a shaft on the side of the rinsing liquid supply nozzle 840 is movably and rotatably supported in a groove.

The slider 853 rotatably supports a support arm 848 which extends on one end side of the rinsing liquid supply nozzle 840, via a shaft 848a. The rinsing liquid supply nozzle 840 can pass over the semiconductor wafer SW by rotating on the shaft 848a from a first angular position (see FIG. 51) to a second angular position (see FIG. 53; in this preferred embodiment, a position that is approximately parallel to the developer supply nozzle 820). The first angular position, as compared with the second angular position, forms a relatively small angle with the scanning direction Ld of the developer supply nozzle 820. The second angular position, as compared with the first angular position, forms a relatively small angle with a direction orthogonal to the scanning direction Ld of the developer supply nozzle 820. At this time, the slider 853 slides in the slide groove 852a, whereby the rotation axis of the rinsing liquid supply nozzle 840 is freely movable in a direction closer to or away from the rotation axis of the semiconductor wafer SW (in this preferred embodiment, the rotation axis of the semiconductor wafer SW coincides with the center thereof); more specifically, the rotation axis of the rinsing liquid supply nozzle 840 is freely movable along the direction M of movement that is angled relative to the scanning direction Ld of the developer supply nozzle 820, on one side of the path of strip linear movement of the discharge unit 822.

While in this preferred embodiment, the rinsing liquid supply nozzle 840 supplies a rinsing liquid when rotating from the first angular position to the second angular position, it may supply a rinsing liquid when rotating from the second angular position to the first angular position. The advantage of adopting the former configuration will be described later.

The nozzle rotary driver 854 is located beside the nozzle support 851 and mounted on a third bracket 899 which is mounted on the second bracket 898. In this preferred embodiment, the nozzle rotary driver 854 is located outside the path of strip linear movement of the discharge unit 822 of the developer supply nozzle 820, more specifically, outside one side of the tray 817. The nozzle rotary driver 854 consists of, for example, a stepping motor and has a rotary shaft 854a which is rotatably driven. The rotary shaft 854a is located off the predetermined direction M of movement. The amount of rotation and the rotational speed of the nozzle rotary driver 854 are variably controllable in response to a signal given from the controller 860.

The drive arm 856 has a long length and has its one end secured in a locked position to the rotary shaft 854a and its other end rotatably coupled to the rinsing liquid supply nozzle 840. In this preferred embodiment, the other end of the drive arm 856 is coupled to a portion of the rinsing liquid supply nozzle 840 which is closer to the root end of the nozzle 840 rather than a longitudinal center thereof.

By a rotary drive of the rotary shaft 854a, the drive arm 856 is rotated on the rotary shaft 854a. This rotation causes the rinsing liquid supply nozzle 840 to rotate on the shaft 848a to pass over the semiconductor wafer SW. At the same time, the slider 853 slides in the slide groove 852a, whereby the rinsing liquid supply nozzle 840 moves along the predetermined direction M of movement. Accordingly, a center-to-center distance between the rotation axes of the rinsing liquid supply nozzle 840 and the semiconductor wafer SW when the rinsing liquid supply nozzle 840 has finished passing over the semiconductor wafer SW (i.e., it is located in the second angular position) is greater than that when the rinsing liquid supply nozzle 840 is passing over the rotation axis of the semiconductor wafer SW.

The position of the rotary shaft 854a of the drive arm 856 relative to the direction M of movement of the axis of the rinsing liquid supply nozzle 840, which is required to rotate the rinsing liquid supply nozzle 840 and to slide the slider 853, is described later.

While in this preferred embodiment, the rinsing liquid supply nozzle rotation supporting mechanism 850 and the rinsing liquid supply nozzle 840 make horizontal and vertical movements together with the developer supply nozzle 820, the rinsing liquid supply nozzle 840 and the developer supply nozzle 820 may be moved independently by different movement mechanisms.

Outside the tray 817, two final rinsing liquid supply nozzles 870 are provided on the tip of a nozzle support arm 871 and in a position on the arm 871 slightly away from the tip. Each of the final rinsing liquid supply nozzles 870 is supplied with a rinsing liquid through piping. The final rinsing liquid supply nozzle 870 on the tip is for supplying a rinsing liquid to the central portion of the semiconductor wafer SW, while the other final rinsing liquid supply nozzle 870 is for supplying a rinsing liquid to the outer peripheral portion of the semiconductor wafer SW. One end of the nozzle support arm 871 is rotatably mounted on an apparatus case 802. During the supply of a developer or a rinsing liquid to the semiconductor wafer SW, the nozzle support arm 871 is located in its stand-by position spaced laterally from the semiconductor wafer SW. After the supply of a rinsing liquid to the semiconductor wafer SW for stopping development reactions, in order to clean the upper surface of the semiconductor wafer SW, the nozzle support arm 871 is, for example, motor driven to rotate so that the final rinsing liquid supply nozzle 870 on the tip is located above the semiconductor wafer SW and discharges a rinsing liquid to the central portion of the semiconductor wafer SW and to a portion closer to the outer periphery.

The controller 860 controls the entire apparatus and comprises a CPU, a ROM, a RAM and the like. It consists of a general microcomputer which performs predetermined arithmetic and logical operations by executing a previously stored software program.

The controller 860 controls a sequence of operations next to be described and performs at least an act of supplying a developer and then a rinsing liquid to the semiconductor wafer SW. Especially, for the supply of a rinsing liquid, the controller 860 causes the semiconductor wafer SW to rotate in a predetermined first rotational direction and causes the rinsing liquid supply nozzle 840 to rotate in the first rotational direction thereby to pass over a developer layer on the semiconductor wafer SW and to discharge a rinsing liquid from its discharge unit 842.

Now, the operation of this developing apparatus is described with reference to FIGS. 48 to 54.

First, the semiconductor wafer SW is transferred by a transfer robot onto the spin chuck 812 of the wafer holding and rotation mechanism 810. Thereby, the semiconductor wafer SW is held at rest in a horizontal position by the wafer holding and rotation mechanism 810. In this initial state, the cup 816 is in its downward position.

Then, the developer supply nozzle 820 moves upward away from the standby pot 818. After the upward movement, the developer supply nozzle 820 moves in the scanning direction Ld. When reaching one end of the semiconductor wafer SW being at rest, the developer supply nozzle 820 starts the discharge of a developer. As shown in FIG. 49, the developer supply nozzle 820 discharges a developer toward the semiconductor wafer SW at a constant flow rate, while horizontally moving from one end of the semiconductor wafer SW to the other in the scanning direction Ld with a constant velocity. Thereby, a developer is formed in a puddle on the semiconductor wafer SW. The developer discharged is an aqueous alkaline solution or a predetermined solvent.

The discharge of a developer is stopped when the developer supply nozzle 820 has passed over the other end of the semiconductor wafer SW. As shown in FIG. 50, the movement of the developer supply nozzle 820 is also stopped when the developer supply nozzle 820 has passed over the other end of the semiconductor wafer SW to a position (rinsing liquid supply position) outside the other end of the semiconductor wafer SW. At this time, the rinsing liquid supply nozzle 840 is located in the aforementioned second angular position.

Then, as shown in FIG. 51, the rinsing liquid supply nozzle 840 is rotated in a predetermined direction of rotation (in FIG. 51, counterclockwise) to pass over the semiconductor wafer SW and once to move to a position (first angular position) in contact with the outer periphery of the semiconductor wafer SW. At the same time, the semiconductor wafer SW is rotated so that one end (developer supply start position) of the outer periphery of the semiconductor wafer SW faces the rinsing liquid supply nozzle 840.

After the elapse of a predetermined time required for development processing, the supply of a rinsing liquid to the semiconductor wafer SW starts. Here, the development time depends on a dissolution rate of a resist, throughput of the apparatus and the like, and it is set within the range of 3 to 120 seconds.

More specifically, after the elapse of a predetermined time required for development processing, as shown in FIG. 52, the rinsing liquid supply nozzle 840 is rotated in a predetermined first rotational direction (in FIG. 52, clockwise) and at the same time, starts to discharge a rinsing liquid from its discharge unit 842. Thus, the rinsing liquid supply nozzle 840 supplies a rinsing liquid while passing over a developer layer formed on the major surface of the semiconductor wafer SW, thereby to stop development reactions. At this time, with the rotation of the rinsing liquid supply nozzle 840 especially after passing over the rotation axis of the semiconductor wafer SW, the rotation axis of the rinsing liquid supply nozzle 840 moves in a direction away from the rotation axis of the semiconductor wafer SW. In this preferred embodiment, the rotation axis of the rinsing liquid supply nozzle 840 moves in the direction M of movement that is angled relative to the scanning direction Ld of the developer supply nozzle 820 and away from the rotation axis of the semiconductor wafer SW. That is, the center-to-center distance between the rotation axes of the rinsing liquid supply nozzle 840 and the semiconductor wafer SW when the rinsing liquid supply nozzle 840 has finished passing over the semiconductor wafer SW is greater than that when the rinsing liquid supply nozzle 840 is passing over the rotation axis (center) of the semiconductor wafer SW.

By so doing, the tip portion of the rinsing liquid supply nozzle 840 rotates inwardly of the path of strip movement of the developer supply nozzle 820, so that the rinsing liquid supply nozzle 840 can move without going out of an area above the tray 817. In response to rotation of the rinsing liquid supply nozzle 840, the semiconductor wafer SW is rotated in the first rotational direction. At this time, the rotational speeds of the rinsing liquid supply nozzle 840 and the semiconductor wafer SW should preferably be controlled such that the virtual scanning direction La connecting the developer supply start point and end point of the semiconductor wafer SW is substantially orthogonal to the rinsing liquid supply nozzle 840 and that a velocity component of the rinsing liquid supply nozzle 840 along the virtual scanning direction La is made as constant as possible. The rinsing liquid is, for example, pure water, alcohol, a hydrogen peroxide solution, or a predetermine solvent.

Then, as shown in FIG. 53, the movement of the rinsing liquid supply nozzle 840 is stopped when the rinsing liquid supply nozzle 840 has passed over the semiconductor wafer SW and arrives at a position (second angular position) approximately parallel to the developer supply nozzle 820. It is preferable that a spacing between the semiconductor wafer SW and the rinsing liquid supply nozzle 840 when passing over the semiconductor wafer SW be set greater than a spacing between the semiconductor wafer SW and the developer supply nozzle 820 when passing over the semiconductor wafer SW. This is to keep the rinsing liquid supply nozzle 840 from contact with the developer layer on the semiconductor wafer SW. The same applies to the other preferred embodiments.

Thereafter, the cup 816 moves upward and the final rinsing liquid supply nozzles 870 move to above the semiconductor wafer SW. With the semiconductor wafer SW being rotated, the final supply of a rinsing liquid is provided from the final rinsing liquid supply nozzles 870.

After the final supply of a rinsing liquid, the semiconductor wafer SW is rotated with a high velocity so that a rinsing liquid on the semiconductor wafer SW is spun off and the semiconductor wafer SW is dried.

In this process of spinning-off and drying, the cup 816 is gradually moved downward. During the time when the cup 816 is moving downward, the developer supply nozzle 820 starts to move to its stand-by position. Specifically, the developer supply nozzle 820 and the rinsing liquid supply nozzle 840 are moved upward in a direction opposite the scanning direction Ld to pass over the semiconductor wafer SW.

Thereby, as shown in FIG. 54, the developer supply nozzle 820 and the rinsing liquid supply nozzle 840 return to their stand-by positions outside one end side of the semiconductor wafer SW. The developer supply nozzle 820 and the rinsing liquid supply nozzle 840 are then moved downward to be placed in the standby pot 818.

Finally, the semiconductor wafer SW, after being released from holding by the spin chuck 812, is transferred to the outside by the transfer robot.

While in this preferred embodiment, the rinsing liquid supply nozzle 840 is once rotated to the first angular position shown in FIG. 51 and then rotated in the first rotational direction toward the second angular position to supply a rinsing liquid, it may be rotated in the reverse direction to supply a rinsing liquid.

However, rotating the rinsing liquid supply nozzle 840 in the manner as described in this preferred embodiment brings the following advantages.

The first advantage is a speedup in substrate processing. Specifically, since in this preferred embodiment, the rinsing liquid supply nozzle 840 is rotated during developer processing, the rinsing liquid supply nozzle 840 after the supply of a rinsing liquid is placed in a position approximately parallel to the developer supply nozzle 820. Thus, after the supply of a rinsing liquid, the rinsing liquid supply nozzle 840 can immediately return to its predetermined stand-by position by making horizontal movement with the developer supply nozzle 820. This results in speedy substrate processing. On the other hand, in the case when the rinsing liquid supply nozzle 840 supplies a rinsing liquid while being rotated from the second angular position to the first angular position, it is necessary to return the rinsing liquid supply nozzle 840 to the second angular position by rotation after the supply of a rinsing liquid. This makes it impossible to return the developer supply nozzle 820 to its predetermined stand-by position immediately after the supply of a rinsing liquid, thereby impairing the speediness of substrate processing.

The second advantage is that the developer supply nozzle 820 is prevented from being soiled. In the supply of a rinsing liquid, with a view to, for example, preventing a rinsing liquid from flowing ahead of the movement of the rinsing liquid supply nozzle 840, the rinsing liquid supply nozzle 840 should preferably discharge a rinsing liquid in a direction opposite the direction of its movement. In this case, in order to start the discharge of a rinsing liquid from the second angular position shown in FIG. 50, it is necessary to discharge a rinsing liquid toward the side of the developer supply nozzle 820, which, however, may cause a rinsing liquid discharged from the rinsing liquid supply nozzle 840 to spatter on and soil the developer supply nozzle 820. On the other hand, when a rinsing liquid is discharged from the first angular position shown in FIG. 51, the occurrence of such situations can be prevented because the rinsing liquid is supplied toward the side opposite the developer supply nozzle 820. This preferred embodiment can, therefore, prevent soiling of the developer supply nozzle 820.

Now, the movement of the rinsing liquid supply nozzle 840 relative to the semiconductor wafer SW is described.

FIG. 55 is an explanatory diagram showing the path of movement of the rinsing liquid supply nozzle 840 relative to the semiconductor wafer SW.

As shown in the drawing, the rinsing liquid supply nozzle 840 moves nonlinearly along the virtual scanning direction La. More specifically, the rinsing liquid supply nozzle 840 moves along an arc having a relatively small radius of curvature until it reaches the rotation axis of the semiconductor wafer SW, and after passing over the rotation axis of the semiconductor wafer SW, it moves along an arc having a relatively large radius of curvature. Here, if the velocity component of the rinsing liquid supply nozzle 840 in the virtual scanning direction La is controlled so as to be constant, the rinsing liquid supply nozzle 840, when being located between one end and the center of the semiconductor wafer SW and between the center and the other end of the semiconductor wafer SW, is slightly inclined relative to the virtual scanning direction La. This inclination is slightly exaggerated in the illustration of FIG. 55.

Next, the movement of the rinsing liquid supply nozzle 840 relative to the tray 817 is described.

FIG. 56 is a diagram showing the path of movement of the rinsing liquid supply nozzle 840. As shown in the drawing, the rinsing liquid supply nozzle 840 in the first angular position in its initial state is largely inclined relative to the scanning direction Ld, and its tip portion largely projects out of the semiconductor wafer SW. The rinsing liquid supply nozzle 840, when being rotated closer to the rotation axis of the semiconductor wafer SW, is located on a predetermined diameter of the semiconductor wafer SW. After the rinsing liquid supply nozzle 840 has passed over the rotation axis of the semiconductor wafer SW, the rotation axis of the rinsing liquid supply nozzle 840 moves along the predetermined direction M of movement, away from the rotation axis of the semiconductor wafer SW. By this movement, the tip portion of the rinsing liquid supply nozzle 840 retracts toward the semiconductor wafer SW in a direction that is angled relative to the scanning direction Ld, which reduces the amount of projection of the rinsing liquid supply nozzle 840 from the semiconductor wafer SW.

FIG. 57 is a diagram showing the path of movement of a rinsing liquid supply nozzle 840B in a comparative example where the rotation axis of the rinsing liquid supply nozzle 840B is fixed.

In this case, the path of movement of the rinsing liquid supply nozzle 840B describes an arc with the fixed rotation axis for its center. Thus, especially when the rinsing liquid supply nozzle 840B has finished passing over the semiconductor wafer SW, the tip portion of the rinsing liquid supply nozzle 840B largely projects out of the semiconductor wafer SW. Accordingly, a tray 817B with a relatively great width is necessary.

FIG. 58 is a diagram for explaining the position of the rotary shaft 854a of the drive arm 856 relative to the direction M of movement of the rinsing liquid supply nozzle 840, which is required to reduce the amount of projection of the rinsing liquid supply nozzle 840 along a direction that is generally orthogonal to the scanning direction Ld.

As shown in the drawing, in order to reduce the amount of projection of the rinsing liquid supply nozzle 840 along a direction generally orthogonal to the scanning direction Ld, it is first necessary to set the direction M of movement of the rotation axis of the rinsing liquid supply nozzle 840 not to be parallel to the scanning direction Ld, i.e., set to be diagonal to the scanning direction Ld.

In order to move the rotation axis of the rinsing liquid supply nozzle 840 along the direction M of movement in response to rotation of the drive arm 856, a portion of the drive arm 856 which is connected to the rinsing liquid supply nozzle 840 must move with a velocity component in the direction of a tangent to the path of arc movement of the rinsing liquid supply nozzle 840 and a velocity component in the direction M of movement.

More specifically, consider based on a path Q of movement of a portion of the rinsing liquid supply nozzle 840 which is connected to the drive arm 856, in condition that the rotation axis of the rinsing liquid supply nozzle 840 is brought closest to the semiconductor wafer SW. In this case, after the rinsing liquid supply nozzle 840 has passed over the rotation axis of the semiconductor wafer SW, if a path R of movement of the portion of the drive arm 856 which is connected to the rinsing liquid supply nozzle 840 describes an arc inwardly so as to be gradually away from the path Q of movement (i.e., toward the rotation axis of the rinsing liquid supply nozzle 840), the rotation axis of the rinsing liquid supply nozzle 840 can be moved along the direction M of movement away from the semiconductor wafer SW.

In the developing apparatus of the aforementioned configuration, with the rotation of the semiconductor wafer SW, the rinsing liquid supply nozzle 840 is rotated to pass over the semiconductor wafer SW and to supply a rising liquid to the major surface of the semiconductor wafer SW. Thus, the rinsing liquid supply nozzle 840 moves generally along an arc in the form of a strip relative to the semiconductor wafer SW. This improves uniformity in the supply of a rinsing liquid.

Further, since the center-to-center distance between the rotation axes of the rinsing liquid supply nozzle 840 and the semiconductor wafer SW when the rinsing liquid supply nozzle 840 has finished passing over the semiconductor wafer SW is greater than that when the rinsing liquid supply nozzle 840 is passing over the rotation axis of the semiconductor wafer SW, it is possible to reduce the amount of projection of the tip portion of the rinsing liquid supply nozzle 840 from the outer periphery of the semiconductor wafer SW when the rinsing liquid supply nozzle 840 has finished passing over the semiconductor wafer SW. This prevents an increase in the size of the tray 817 for receiving a rinsing liquid.

In the case where the above center-to-center distance when the rinsing liquid supply nozzle 840 starts passing over the semiconductor wafer SW is greater than that when the rinsing liquid supply nozzle 840 is passing over the rotation axis of the semiconductor wafer SW, the same effect as described above can be achieved because the amount of projection of the tip portion of the rinsing liquid supply nozzle 840 can be reduced when the rinsing liquid supply nozzle 840 starts passing over the semiconductor wafer SW.

In summary, by moving the rotation axis of the rinsing liquid supply nozzle 840 so that the above center-to-center distance at least either when the rinsing liquid supply nozzle 840 starts passing over the semiconductor wafer SW or when the rinsing liquid supply nozzle 840 has finished passing over the semiconductor wafer SW is greater than that when the rinsing liquid supply nozzle 840 is passing over the rotation axis of the semiconductor wafer SW, it is possible to reduce the amount of projection of the tip portion of the discharge unit 842 and to prevent an increase in the size of the tray 817.

Of course, the same effect can also be achieved when the rinsing liquid supply nozzle 840 is rotated in the reverse direction to supply a rinsing liquid.

Particularly, in this preferred embodiment, the rotation axis of the rinsing liquid supply nozzle 840 is movable along a direction that is angled relative to the scanning direction Ld of the developer supply nozzle 820, on one side of the path of strip linear movement of the discharge unit 822 of the developer supply nozzle 820. Also, the center-to-center distance between the rotation axes of the rinsing liquid supply nozzle 840 and the semiconductor wafer SW is made greater when the rinsing liquid supply nozzle 840 is located in the second angular position that forms a relatively small angle with a direction orthogonal to the scanning direction Ld of the developer supply nozzle 820. Consequently, it is possible to reduce the amount of projection of the tip portion of the rinsing liquid supply nozzle 840 from the path of strip linear movement of the discharge unit 822. Here, the tray 817 is supposed to be provided over an area corresponding to the path of strip linear movement of the discharge unit 822; thus, a further increase in the size of the tray 817 can be prevented by bringing the path of movement of the rinsing liquid supply nozzle 840 within the confines of the tray 817.

Further, since the nozzle rotary driver 854 is located outside the path of strip linear movement of the discharge unit 822 of the developer supply nozzle 820, more specifically, outside one side of the tray 817, it is possible to prevent spattering of liquids from the side of the semiconductor wafer SW toward the side of the nozzle rotary driver 854 and to prevent scattering of contaminants such as oil from the nozzle rotary driver 854 toward the side of the semiconductor wafer SW.

Still further, the nozzle support 851 supports one end of the rinsing liquid supply nozzle 840 to be rotatable and to be movable in the predetermined direction M of movement, and the drive arm 856 transmits a rotary drive from the nozzle rotary driver 854 to the rinsing liquid supply nozzle 840 as a force for rotating the rinsing liquid supply nozzle 840 and as a force for moving the rotation axis of the rinsing liquid supply nozzle 840 in the direction M of movement. This simplifies the configuration of the developing apparatus.

Alternatively, it is also possible to provide, aside from the rotary drive such as a motor for rotating the rinsing liquid supply nozzle 840, another drive mechanism utilizing a motor or the like for moving the rotation axis of the rinsing liquid supply nozzle 840 and to drive both of them in response to each other.

Fifth Preferred Embodiment

In this fifth preferred embodiment, a developing apparatus will be described which is configured to rotate both the developer supply nozzle and the rinsing liquid supply nozzle.

FIG. 59 is a plan view showing a schematic configuration of the developing apparatus according to the fifth preferred embodiment of the present invention.

The parts, which are identical to those of the developing apparatus shown in the second preferred embodiment, are referred to by the same reference numerals and not described herein.

This developing apparatus comprises the substrate holder 110, a developer supply nozzle 220, a first nozzle movement mechanism 230 which is a developer supply nozzle rotating section for rotating the developer supply nozzle 220, the rinsing liquid supply nozzle 140, the second nozzle movement mechanism 150 for rotating the rinsing liquid supply nozzle 140, and a controller 260 for controlling the operation of the entire apparatus.

The developer supply nozzle 220 has a discharge unit for discharging a processing liquid with a discharge width substantially equal to or greater than the width of the substrate W.

In the present example, the developer supply nozzle 220 is identical in configuration to the rinsing liquid supply nozzle 40 described in the first preferred embodiment.

The developer supply nozzle 220 is coupled to the developer supply system 26 which comprises a developer supply source for storing a developer and an on-off valve (both not shown), whereby a developer from the developer supply source is supplied to the developer supply nozzle 220 in a predetermined timed relationship with the opening and closing of the on-off valve.

The first nozzle movement mechanism 230 rotatably supports one end of the developer supply nozzle 220 and rotates the developer supply nozzle 220 so that the nozzle 220 passes over the substrate W.

More specifically, the first nozzle movement mechanism 230 comprises a nozzle rotary driver 232, a rotary shaft 234, and a support arm 236.

The rotary shaft 234 is freely rotatable on one vertex of the virtual square S circumscribing the substrate W, the vertex being diagonally opposed to the rotary shaft of the second nozzle movement mechanism 150.

The nozzle rotary driver 232 consists of an actuator such as a spinning motor. Driven by this nozzle rotary driver 232, the rotary shaft 234 is rotated.

The support arm 236 is fixedly coupled at its one end to the rotary shaft 234 and is supported in a cantilever manner above an apparatus body 205. On a free end of the support arm 236, the developer supply nozzle 220 is supported in an approximately horizontal position.

Driven by the nozzle rotary driver 232, the developer supply nozzle 220 is rotated on a rotation axis of the rotary shaft 234 over the substrate W. In passing over the substrate W, the developer supply nozzle 220 discharges a developer from its discharge unit so that a developer is supplied onto the major surface of the substrate W.

The controller 260, like the controller 60, consists of a general microcomputer and controls a sequence of operations next to be described. It performs at least an act of rotating the substrate W, the developer supply nozzle 220 and the rinsing liquid supply nozzle 140 so that the virtual scanning direction La from the supply start point on one end of the substrate W to the supply end point on the other end is substantially perpendicular to directions of extension of the discharge units of the developer supply nozzle 220 and the rinsing liquid supply nozzle 140.

Now, the operation of this developing apparatus will be described with reference to FIGS. 60 to 62.

First, in an initial state, as shown in FIG. 60, the substrate W is supported at rest in a horizontal position by the substrate holder 110. In FIGS. 60 to 62, the supply start point on one end of the substrate W is shown with a closed circle and the supply end point on the other end with a closed triangle, and the virtual scanning direction La from the supply start point to the supply end point is indicated by a dash-double dot line. In the initial state, the substrate W is supported such that its supply start point is on one end of the apparatus body 205 (on the bottom side of FIG. 60).

The developer supply nozzle 220 is on standby in a position to circumscribe the substrate W and to face the supply start point. The rinsing liquid supply nozzle 140 is on standby in a position to circumscribe the substrate W and to be orthogonal to the developer supply nozzle 220. This position of the rinsing liquid supply nozzle 140 is a position to face the supply start point of the substrate W after the supply of a developer as will later be described.

After the initiation of processing, as shown in FIG. 61, the developer supply nozzle 220 is rotated in a second rotational direction to pass over the major surface of the substrate W. In response to this, the substrate W is rotated in the second rotational direction so that its virtual scanning direction La is orthogonal to a direction of extension of the developer supply nozzle 220. That is, the substrate W and the developer supply nozzle 220 are rotated with substantially the same rotational speeds.

In passing over the major surface of the substrate W, the developer supply nozzle 220 discharges a developer so that a developer is supplied sequentially onto the entire major surface of the substrate W along the virtual scanning direction La. At this time, the path of movement of the developer supply nozzle 220 with respect to the substrate W is described as an arc. Thereby a developer layer is formed on the major surface of the substrate W.

After counterclockwise rotation of π/2 radians over the major surface of the substrate W, the developer supply nozzle 220 is brought to its standby state on the other end of the apparatus body 205.

Since, in this condition, the substrate W and the developer supply nozzle 220 rotate with substantially the same rotational speeds, the substrate W is also rotated counterclockwise by π/2 radians. Thus, the supply start point of the substrate W is shifted to one end of the apparatus body 205 (on the right side of FIG. 61) to face the rinsing liquid supply nozzle 140.

After the supply of a developer to the substrate W and after the elapse of a predetermined time required for development reactions on the substrate W, as shown in FIG. 62, the rinsing liquid supply nozzle 140 is rotated in a first rotational direction to pass over the major surface of the substrate W (i.e., over the developer layer formed on the major surface of the substrate W). In response to this, the substrate W is rotated in the first rotational direction so that its virtual scanning direction La is orthogonal to a direction of extension of the rinsing liquid supply nozzle 140. That is, the substrate W and the rinsing liquid supply nozzle 140 are rotated with substantially the same rotational speed.

In passing over the substrate W, the rinsing liquid supply nozzle 140 discharges a rinsing liquid so that a rinsing liquid is supplied sequentially to the entire major surface of the substrate W along the virtual scanning direction La. At this time, the path of movement of the rinsing liquid supply nozzle 140 with respect to the substrate W is described as an arc.

After clockwise rotation of π/2 radians over the major surface of the substrate W, the rinsing liquid supply nozzle 140 is brought to its standby state on the other end of the substrate W. Since the substrate W rotates with the same rotational speed as the rinsing liquid supply nozzle 140, the substrate W is also rotated clockwise by π/2 radians.

In this way, a sequence of operations of the developing apparatus is completed.

Now, the movement of the developer supply nozzle 220 and the rinsing liquid supply nozzle 140 relative to the substrate W will be described.

FIG. 63 is an explanatory diagram showing the path of movement of the developer supply nozzle 220 relative to the substrate W, and FIG. 64 is an explanatory diagram showing the path of movement of the rinsing liquid supply nozzle 140 relative to the substrate W. Both the drawings show the paths of movement in the case where the substrate W, the developer supply nozzle 220 and the rinsing liquid supply nozzle 140 are rotated such that directions of extension of the developer supply nozzle 220 and the rinsing liquid supply nozzle 140 are substantially orthogonal to the virtual scanning direction La of the substrate W.

As shown in the drawings, both the developer supply nozzle 220 and the rinsing liquid supply nozzle 140 are moved nonlinearly but their paths of movement are different from each other.

That is, as shown in FIG. 63, the developer supply nozzle 220 moves in the virtual scanning direction La of the substrate W along an arc that is curved toward one side of the virtual scanning direction La (upwardly of the virtual scanning direction La). On the other hand, the rinsing liquid supply nozzle 140 moves in the virtual scanning direction along an arc that is curved toward the other side of the virtual scanning direction La (downwardly of the virtual scanning direction La).

The developing apparatus of the above configuration can give an effect similar to that described in the second preferred embodiment on the supply of a developer and a rinsing liquid.

Besides, since the rinsing liquid supply nozzle 140 after the supply of a developer is located in a position to face the supply start point of the substrate W, the supply of a rinsing liquid can be started immediately after the supply of a developer without rotation of the substrate W. This smoothes the development processing.

It is to be noted that the locations and initial positions of the rotation axes of the developer supply nozzle 220 and the rinsing liquid supply nozzle 140 are not limited to what has been particularly shown and described hereinabove.

In summary, after rotational movement of the developer supply nozzle 220, the rinsing liquid supply nozzle 140 should be disposed in face-to-face relationship with the supply start point of the substrate W.

In viewing such relative positions from a different view point, since the virtual scanning direction La is a direction from the supply start point of the substrate W to the supply end point, the developer supply nozzle 220 and the rinsing liquid supply nozzle 140 after the supply of a developer should be opposed to each other with the substrate W in between, and also, their respective directions of extension should be substantially parallel to each other.

While, in this preferred embodiment, the second rotational direction in which the substrate W and the developer supply nozzle 220 rotate for the supply of a developer is opposite from the first rotational direction in which the substrate W and the rinsing liquid supply nozzle 140 rotates for the supply of a rinsing liquid, the first and second rotational directions may be the same direction. For this, the original positions of the developer supply nozzle 220 and the rinsing liquid supply nozzle 140 should be changed.

Also in this preferred embodiment, in order to make the timing of termination of the development approximately the same at each point in the plane of the substrate W, it is preferable that the developer supply time during which the developer supply nozzle 220 discharges a developer from the supply start point of the substrate W to the supply end point be substantially equal to the rinsing liquid supply time during which the rinsing liquid supply nozzle 140 discharges a rinsing liquid from the supply start point of the substrate W to the supply end point. Also, if the relative velocity component of the developer supply nozzle 220 in the virtual scanning direction La and the relative velocity component of the rinsing liquid supply nozzle 140 in the virtual scanning direction La have substantially the same constant velocity pattern, the timing of termination of the development can be made the same at each point in the plane of the substrate W and also the amounts of the supply of a developer and a rinsing liquid can be made approximately uniform.

Sixth Preferred Embodiment

In this sixth preferred embodiment, a developing apparatus will be described which is configured to supply processing liquids to substrates W arranged vertically at multiple levels.

FIG. 65 is a longitudinal cross-sectional view showing a schematic configuration of the developing apparatus according to the sixth preferred embodiment of the present invention, and FIG. 66 is a plan sectional view showing a schematic configuration of the developing apparatus.

In this developing apparatus, a plurality of substrate holders 310 are arranged vertically at multiple levels. Each of the substrate holders 310 is identical in configuration to the substrate holder 110 described in the second preferred embodiment.

A substrate W held in an approximately horizontal position by each of the substrate holders 310 is rotated by a spinning motor 313 which is a substrate rotating section. Around the substrate W, a cup 316 is provided to prevent splattering of processing liquids.

The substrate holders 310, each of which is housed in a box-type apparatus case 302, are arranged vertically at multiple levels and partitioned with partition plates 302a which correspond respectively to the bottoms of the apparatus cases 302.

In the lowermost apparatus case 302, a processing liquid supply nozzle 320 is located on the side of the substrate W held by the substrate holder 310.

The processing liquid supply nozzle 320 has a discharge unit for discharging a rinsing liquid or a developer with a discharge width substantially equal to or greater than the width of the substrate W, and is identical in configuration to the rinsing liquid supply nozzle 140 of the aforementioned second preferred embodiment.

The processing liquid supply nozzle 320 is supported by a rotation mechanism 330 to be rotatable on a rotation axis on its one end. The rotation mechanism 330 is identical in configuration to the second nozzle movement mechanism 150 of the aforementioned second preferred embodiment. Thus, the processing liquid supply nozzle 320 can be rotated to pass over the substrate W.

This developing apparatus comprises a vertical movement mechanism 390 for vertically moving the processing liquid supply nozzle 320 to each position where the nozzle 320 can pass over each of the substrates W held by the substrate holders 310.

The vertical movement mechanism 390 can be implemented by, for example, a telescoping extension. It is, however, to be noted that the configuration is not limited thereto but the processing liquid supply nozzle 320 may, for example, be configured to move vertically along a vertically extending rail.

Each of the partition plates 302a has a through hole 302h through which the processing liquid supply nozzle 320 can pass.

Driven by the vertical movement mechanism 390, the processing liquid supply nozzle 320 is moved vertically through the through holes 302h and located in each position where the nozzle 320 can pass over each of the substrates W.

The developing apparatus according to this preferred embodiment operates as follows under the control of a controller not shown.

In this developing apparatus, driven by the vertical movement mechanism 390, the processing liquid supply nozzle 320 is moved vertically and, in each of the apparatus cases 302, makes a temporary stop in each position where the nozzle 320 can pass over each substrate W.

In this condition, the processing liquid supply nozzle 320 is rotated by the rotation mechanism 330 to pass over the substrate W at a corresponding level. At this time, a processing liquid is supplied in the same manner as the rinsing liquid supply nozzle 140 of the second preferred embodiment.

Then, the processing liquid supply nozzle 320 returns to its original position by rotation and again moves vertically through each of the through holes 302h to a position where it can pass over another substrate W, and then makes a temporary stop at that position. In this stopped position, the processing liquid supply nozzle 320 again rotates to pass over the substrate W at a corresponding level and to supply a processing liquid in the same manner as above described.

Hereafter, the processing liquid supply nozzle 320, while moving vertically, performs the above operation on the substrates W at the respective levels.

This developing apparatus, therefore, can supply a processing liquid to a plurality of substrates W with only a single processing liquid supply nozzle 320. This achieves the effect of, for example, reducing the manufacturing cost.

An actual developing apparatus usually supplies both a developer and a rinsing liquid. To address this, a single processing liquid supply nozzle 320 may supply both a developer and a rinsing liquid by switching. Or, two sets of the processing liquid supply nozzles 320, the rotation mechanism 330 and the vertical movement mechanism 390 may be provided so that they respectively supply a rinsing liquid and a developer.

Seventh Preferred Embodiment

In this seventh preferred embodiment, a developing apparatus will be described which is configured to supply a processing liquid to a plurality of substrates W arranged around a rotation axis of a processing liquid supply nozzle.

FIG. 67 is a plan view showing a schematic configuration of the developing apparatus according to the seventh preferred embodiment of the present invention.

This developing apparatus comprises a processing liquid supply nozzle 420 and a plurality of substrate holders 410.

The processing liquid supply nozzle 420 has a discharge unit for discharging a rinsing liquid or a developer with a discharge width substantially equal to or greater than the width of the substrate W and is identical in configuration to the rinsing liquid supply nozzle 140 of the aforementioned second preferred embodiment.

The processing liquid supply nozzle 420 is supported by a rotation mechanism 430 to be rotatable on a rotation axis on its one end. This rotation mechanism 430 is identical in configuration to the second nozzle movement mechanism 150 of the aforementioned second preferred embodiment and its rotation axis is located near the center of an apparatus body 405. The processing liquid supply nozzle 420 is capable of rotating through such an angle that it can successively pass over the substrates W. In the present example, the processing liquid supply nozzle 420 can be rotated by 2π radian.

The plurality of substrate holders 410 are arranged around the rotation axis of the processing liquid supply nozzle 420. In this preferred embodiment, four substrate holders 410 are spaced at intervals of π/2 radians around the rotation axis of the processing liquid supply nozzle 420. However, the number of substrate holders 410 is not limited to four but may be two, three, five, or more. In a word, the substrate holders 410 should be located nearly equidistant from the rotation axis of the processing liquid supply nozzle 420.

Each of the substrate holders 410 is individually rotated by a spinning motor 413 which is a substrate rotating section; thus, the substrates W held by the substrate holders 410 are also rotated individually.

Driven by the rotation mechanism 430, the processing liquid supply nozzle 420 is rotated to sequentially pass over the substrates W.

The developing apparatus according to this preferred embodiment operates as follows under the control of a controller not shown.

In this developing apparatus, driven by the rotation mechanism 430, the processing liquid supply nozzle 420 is rotated. When the processing liquid supply nozzle 420 rotates clockwise from its original position (a position indicating a downward direction in FIG. 67) to above one end of a first substrate W (the lower left substrate W of FIG. 67), the first substrate W starts to rotate. At this time, the rotational speeds of the substrate W and the processing liquid supply nozzle 420 are controlled so that the virtual scanning direction La of the substrate W is substantially orthogonal to a direction of extension of the processing liquid supply nozzle 420.

In passing over the substrate W, the processing liquid supply nozzle 420 discharges a processing liquid so that a processing liquid is supplied to the substrate W.

After the processing liquid supply nozzle 420 has passed over the first substrate W, rotation of the first substrate W stops.

When the processing liquid supply nozzle 420 reaches above one end of the next substrate W (the upper left substrate W of FIG. 67), this substrate W starts to rotate.

Hereafter, in a similar manner, the processing liquid supply nozzle 420 sequentially passes over the respective substrates W to supply a processing liquid to the substrates W.

This developing apparatus, therefore, can supply a processing liquid to a plurality of substrates W with only a single processing liquid supply nozzle 420. This achieves the effect of, for example, reducing the manufacturing cost.

To supply both a developer and a rinsing liquid by this developing apparatus, a single processing liquid supply nozzle 420 may supply both a developer and a rinsing liquid by switching. Or, in order to avoid interference, two sets of the processing liquid supply nozzle 420 and the rotation mechanism 430 as above described may be provided so that they respectively supply a rinsing liquid and a developer.

In the present invention, by shifting the nozzles 20, 220, 320, 420, 40, 140, 140B, 840, etc. in a direction orthogonal to the virtual scanning direction La, the supply of processing liquids such as a developer and a rinsing liquid is made as uniform as possible along the orthogonal direction. Thus, each of the above nozzles 20, 220, 320, 420, 40, 140, 140B, 840, etc. is not necessarily formed with a slit discharge unit.

For example, like a nozzle 520 shown in FIG. 68, a discharge unit 522 may be formed with a plurality of supply holes 522h which are intermittently formed along the discharge width. Also in this case, the nozzle 520 is moved while also being shifted in a direction orthogonal to the virtual scanning direction La of the substrate W; therefore, processing liquids such as a developer and a rinsing liquid can be supplied to the entire major surface of the substrate W.

In this case, the consumption of a processing liquid can be reduced as compared to the case where a processing liquid is supplied from a slit discharge unit.

In the aforementioned second to seventh preferred embodiments, especially when the stand-by positions of the nozzles 220, 320, 420, 140, 140B, 840, etc. are located outside the substrate(s) W, it is preferable that the time when the nozzles 220, 320, 420, 140, 140B, 840, etc. reach the supply start point of the substrate W from the outside of the substrate W should be synchronized as exactly as possible with the time when the substrate(s) W start(s) to rotate.

For this, as in modifications shown in FIGS. 69 and 70, a detecting unit 630 or 640 should be provided for detecting whether a nozzle 620 (corresponding to the nozzles 220, 320, 420, 140 and 140B, 840, etc.) reaches the supply start point of the substrate W. And, when the detecting unit 630 or 640 detects that the nozzle 620 has reached the supply start point of the substrate W, rotation of the substrate W should be started.

In the modification shown in FIG. 69, a liquid sensor 630 is provided as a detecting unit under the supply start point of the initial-state substrate W.

When the nozzle 620 moves toward the supply start point of the substrate W while discharging a processing liquid such as a developer or a rinsing liquid and when the nozzle 620 reaches above the supply start point, a processing liquid is discharged almost simultaneously to the supply start point and to the liquid sensor 630. Upon detection of a processing liquid in the liquid sensor 630, with the detection signal as a trigger, the spinning motor or rotary drivers 113, 313 and 413 start rotation of the substrate W.

In the modification shown in FIG. 70, the nozzle 620 is provided with a light-reflective light sensor 640. This light sensor 640 emits light downwardly of the nozzle 620 and detects the presence or absence of the substrate W under the nozzle 620 by the presence or absence of reflected light. When the nozzle 620 moves toward the supply start point of the substrate W from the outside of the substrate W and when it reaches above the supply start point, the light sensor 640 detects reflected light and determines that the nozzle 620 has reached above the supply start point of the substrate W. With this detection signal as a trigger, the spinning motor or rotary drivers 113, 313 and 413 start rotation of the substrate W.

In those modifications shown in FIGS. 69 and 70, the timing of the movement of the nozzle 620 and the timing of the rotation of the substrate W can be exactly synchronized with each other. This allows relatively accurate control over the relative positions of the nozzle 620 and the substrate W.

While the invention has been shown and described in detail, the foregoing description is in all aspects illustrative and not restrictive. It is therefore understood that numerous modifications and variations can be devised without departing from the scope of the invention.

Number	Date	Country	Kind
P2002-091346	Mar 2002	JP	national
P2002-303322	Oct 2002	JP	national
P2003-056801	Mar 2003	JP	national

Number	Name	Date	Kind
6051101	Ohtani et al.	Apr 2000	A
6092937	Snodgrass et al.	Jul 2000	A
6183810	Ota	Feb 2001	B1
6270579	Subramanian et al.	Aug 2001	B1

Number	Date	Country
10-020508	Jan 1998	JP
10-340836	Dec 1998	JP
11-267573	Oct 1999	JP
3352417	Sep 2002	JP

	Number	Date	Country
Parent	10305911	Nov 2002	US
Child	10637774		US

Developing apparatus and developing method

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CPC

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