The present invention relates generally to electronic devices, such as medical devices, and more particularly to reducing crosstalk in such devices.
This section is intended to introduce the reader to various aspects of art that may be related to various aspects of the present invention, which are described and/or claimed below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present invention. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.
Medical devices such as those used for monitoring a patient's vital sign or other physiologic variable, are commonly comprised of a patient-contacting signal transducer and a monitor that connects to the transducer, processes the signals, and provides information to the caregiver. Typically, the transducer is connected to the monitor with and interface cable that includes wires for conducting electrical signals.
An ideal cable and connector assembly for use in such medical devices would be immune to noise interference from external sources as well as crosstalk between wires within the cable and connector assembly. In reality, however, the manufacturing process of a cable and connector assembly includes steps that make the wires within a cable and connector assembly vulnerable to noise, such as capacitive and inductive crosstalk, wherein electrical signals in one wire or pair of wires may interfere or create noise on a nearby wire. The crosstalk may be detrimental to the operation of a medical device. For example, in pulse oximetry, the crosstalk can result in inaccurate readings of SpO2 values.
Cables are generally manufactured to limit the amount of external noise and inductive and capacitive crosstalk that can occur between wires. For example, the cables are bundled together with an electrically insulating protective coating and a conductive shield mesh to protect against environmental noise sources. Additionally, the cables may be made up of twisted wire pairs, commonly referred to as twisted pairs. As their name suggests, the twisted pairs are a pair of wires twisted together in a manner that results in each wire becoming exposed to the same or similar amounts noise elements such that the noise can be nearly or completely canceled out. A twisted pair may be surrounded by an electrically grounded conductive mesh shield to help eliminate noise interference from other wires within the cable bundle. Twisted pairs having the conductive mesh shield are referred to as shielded twisted pairs, while twisted pairs without the conductive mesh are referred to as unshielded twisted pairs. The cables used in medical devices such as pulse oximetry systems are commonly constructed with one or both types of twisted pairs, where multiple sets of wires are combined into a cable bundle. Electrical crosstalk can occur when signal wires electrically contact one another (a “short”), or come into close proximity to adjacent conductors.
In order to connect the wires to connector pins, the cable bundle must be stripped and the wires untwisted. Thus, in this section of the cables, the wires are unprotected and vulnerable to crosstalk interference. Furthermore, after the wires have been connected to connector pins and the pins are placed in a connector housing, even if the wires are initially pushed apart and spatially separated, additional handling and processing may push the wires together and increase the likelihood of crosstalk.
Certain aspects commensurate in scope with the originally claimed invention are set forth below. It should be understood that these aspects are presented merely to provide the reader with a brief summary of certain forms the invention might take and that these aspects are not intended to limit the scope of the invention. Indeed, the invention may encompass a variety of aspects that may not be set forth below.
In accordance with one aspect of the present invention, there is provided a medical device cable. In the examples used herein, the medical device is a pulse oximeter. The pulse oximeter cable comprises a first pair of wires, a second pair of wires and an insulative piece configured to maintain spatial separation between the first and second pairs of wires. Additionally, the cable comprises a connector housing formed over the insulative piece.
In accordance with another aspect of the present invention, there is provided a method of manufacturing an electrical cable comprising spatially separating a first set of wires from a second set of wires and disposing a device relative to the first and second sets of wires to maintain the spatial separation and coupling pins to the first and second sets of wires. Additionally, the method comprises covering the device with a connector housing.
Certain exemplary embodiments are described in the following detailed description and in reference to the drawings in which:
One or more specific embodiments of the present invention will be described below. In an effort to provide a concise description of these embodiments, not all features of an actual implementation are described in the specification. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another. Moreover, it should be appreciated that such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure.
Turning initially to
A more detailed illustration of the cable 18 is shown in
The cable 18, as shown in
The emitter wires 26 may comprise an unshielded twisted pair and the detector wires 28 may comprise a shielded twisted pair. As can be seen in
During the manufacturing process, the outer jacket 22 is stripped from the cable 18, and the coating 30 of the detector wires 28 is stripped from the detector wires 28. The emitter wires 26 and detector wires 28 are then untwisted to facilitate connection of the emitter wires 26 and detector wires 28 to their respective pins 34. The detector wires 28, however, become vulnerable to a variety of noise-inducing influences, including inductive and capacitive crosstalk from the emitter wires 26 when they are unshielded and untwisted.
Initially, during the manufacturing process, the emitter wires 26 and the detector wires 28 are separated. The wires may be pulled apart by a worker or a machine may push a tool in between the pairs of wires to separate them. Unfortunately, after this initial separation, little may be done to maintain the separation of the wires.
Although workers may understand their specific role in the manufacturing process, they may not fully appreciate the importance of maintaining the separation between the wires and may fail to take precautions to maintain the separation of the wires. As such, the cables may be tossed into bins for transportation to different workstations, and the cables may be handled and manipulated by multiple workers and machines before the cables are fully assembled and ready for operation. In the bins, the cables may be compacted together or get tangled together. While being handled and manipulated by workers and machines, the wires may be pushed together. Therefore, at the end of the manufacturing process, there is a risk that the wires will no longer be separated, resulting in an increased susceptibility to crosstalk in the fully assembled cables.
To address this concern, an insulative material 36, as illustrated in
After the emitter wires 26 and detector wires 28 have been positioned in the apertures 38, the insulative material 36 and a portion of the pins 34 and the wires 26 and 28 are encapsulated by the connector housing 20. An over-molding process (such as insert, injection, or transfer molding), or other means, may be implemented to form the connector housing 20. The connector housing 20 is formed over the insulative piece 36 so that the insulative piece 36 can continue to prevent the emitter and detector wires from moving closer to each other during the encapsulation process. By preserving the spatial separation, the insulative piece 36 helps the detector wires 28 to be less susceptible to crosstalk interference from the emitter wires 26.
In another embodiment, as illustrated in
Alternatively, as illustrated in
Turning to
Alternatively, an insulative material 70, such as epoxy resin or silicone, for example, may be used to maintain spatial separation of the detector wires 28 and the emitter wires 26, as illustrated in
A cross-sectional view of the material 70 is illustrated in
In another embodiment, a printed circuit board (PCB) 72 may also be used to maintain spatial separation between the emitter wires 26 and detector wires 28, as shown in
An alternative embodiment using a PCB to prevent crosstalk is shown in
Turning to
After the wires are stripped, the wires are spatially separated from each other, as indicated at block 104. Specifically, sets of twisted pairs are separated from each other. The spatial separation of the wires may be done by a person or by a machine. Because the twisting of the wires is a noise cancellation technique, effort should be made to keep the pairs of wires twisted, insofar as it is practicable.
The spatial separation between the sets of wires is maintained by coupling or inserting a device between the sets of wires, as indicated at block 106. Specifically, the spatial separation may be maintained by implementing one of the embodiments described above, such as using a PCB to physically separate the emitter wires 26 from the detector wires 28, for example, or inserting an insulative object between the pairs of wires. The use of one of the above mentioned exemplary embodiments, or other device, precludes the pushing of the separated wires into closer proximity of each other during the over-molding process or other processing and handling that may occur during manufacture.
Connector pins are electrically coupled to the wires, as indicated by block 108. The connector pins may be connected to the wires either directly by soldering the wires to the pins or indirectly via traces on a PCB, as described above, depending on the particular embodiment being implemented. By physically separating the wires and preserving that separation, crosstalk between wires is greatly reduced, or eliminated. The elimination of crosstalk may increase the accuracy of the medical devices.
The techniques described herein for maintaining spatial separation of the signal wires during the cable termination process to reduce cross-talk have applicability in patient monitoring applications beyond pulse oximetry. With respect to devices that utilize photo-emitters and photo-detectors as described herein, such techniques can be utilized in devices intended to monitor other blood constituents such as carboxyhemoglobin, methemoglobin, total hemoglobin content, glucose, pH, water content and others. Reducing signal cross-talk is also of importance in bio-impedance measurements for evaluating physiologic variables such as tissue hydration, cardiac output or blood pressure.
The step of creating a cabling connector may not be restricted to over-molding processes. Pre-molded connector housing components may be assembled to contain the pins and cable. During assembly, wires may come into close proximity that results in cross-talk (noise). The techniques described above may be used to reduce the likelihood of this occurring by ensuring proper spatial separation during the assembly process.
Additionally, it should be understood, that although the figures and the associated discussion describe embodiments wherein the cable 18 comprises twisted pair wires, the techniques disclosed herein may be applicable to any type of cable. Indeed, the techniques disclosed herein may be implemented with a coaxial cable, for example.
While the invention may be susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and have been described in detail herein. However, it should be understood that the invention is not intended to be limited to the particular forms disclosed. Rather, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the following appended claims.
This application is a divisional of U.S. application Ser. No. 11/540,376, filed on Sep. 29, 2006, and issued as U.S. Pat. No. 7,476,131 on Jan. 13, 2009.
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