1. Field of the Invention
The invention relates to a device and a method for removing residue, and more particularly, to a device and a method for effectively removing residue from contact surfaces and enhancing dispensing quality.
2. Description of the Related Art
Inkjet systems have been researched and developed for decades, and improvement of inkjet quality has been topics of research and development. One factor influencing inkjet quality is the cleaning of nozzle plates. The four major cleaning methods are using a scraper or wiping the inkjet head directly, utilizing a control circuit to continuously dispense liquid to clean the front of the nozzle plates, vacuum ink pumping and high-frequency oscillation.
Inkjet systems have been used extensively in different industrial applications, such as LCD fabrication, biomedical science, and material science. The four types of cleaning methods, however, are not suitable for cleaning nozzle plates in all field of application. In biomedical field, for example, using a scraper contaminates biomedical materials; continuous dispensing and vacuum ink pumping waste expensive biomedical materials. Thus, methods for cleaning nozzle plates of all inkjet systems regardless of application are desirable.
The invention provides a residue removal device and a method by utilizing cohesion of the solution for removing residue to maintain nozzle plate cleanliness in inkjet systems.
Accordingly, a residue removal device is provided. The residue removal device comprises an object, a sink, and a conveying device. The object comprises a contact surface. There are residues on the contact surface. The solution is contained in the sink corresponding to of the contact surface. The conveying device drives the relative motion between the object and the sink to remove residue from the contact surface by the solution.
Furthermore, a residue removal method is provided. The residue removal method comprises the following steps. Firstly, a solution, a sink, an object, and a conveying device are provided. The object comprises a contact surface, and there are residues on the contact surface. The solution is contained in the sink. The position of the sink is adjusted so that the solution is in contact with the contact surface. The conveying device drives the relative motion between the sink and the contact surface utilizing the cohesion of the solution to remove residue.
A detailed description is given in the following embodiments with reference to the accompanying drawings.
The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
The following description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims.
Referring to
The experimental results of applying the residue removal device are shown in the table of
The residue removal device 1 can also be applied to inkjet platforms, as shown in
Note that the conveying device 4 can be disposed on the object 2 as shown in
A residue removal method of the residue removal device 1 is provided. The solution 31 is disposed in the sink 3. The sink 3 is then adjusted so that the solution 31 contacts the contact surface 21. The solution 31 simultaneously contacts the residues 22 of the object 2, as shown in
The residue removal device provides a method for cleaning nozzles of an inkjet system by removing residue. Removing residue raises dispensing quality, prevents pollutant accumulation and reduces material consumption.
While the invention has been described by way of example and in terms of the preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
| Number | Date | Country | Kind |
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| 95148764 A | Dec 2006 | TW | national |
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| Number | Date | Country | |
|---|---|---|---|
| 20080149143 A1 | Jun 2008 | US |