The invention relates to a method of and apparatus for cooling a heat producing device in general, and specifically, to a method of and apparatus for cooling server applications using fluid-based cooling systems.
Cooling of high performance integrated circuits with high heat dissipation is presenting significant challenge in the electronics cooling arena. Conventional cooling with heat pipes and fan mounted heat sinks are not adequate for cooling chips with ever increasing wattage requirements, including those exceeding 100 W.
Electronics servers, such as blade servers and rack servers, are being used in increasing numbers due to the higher processor performance per unit volume one can achieve. However, the high density of integrated circuits also leads to high thermal density, which is beyond the capability of conventional air-cooling methods.
A particular problem with cooling integrated circuits on electronics servers is that multiple electronics servers are typically mounted in close quarters within a server chassis. In such configurations, electronics servers are separated by a limited amount of space, thereby reducing the dimensions within which to provide an adequate cooling solution. Typically, stacking of electronics servers does not provide the mounting of large fans and heat sinks for each electronics server. Often electronics server stacks within a single server chassis are cooled with one or more fans, one or more heat sinks, or a combination of both. Using this configuration, the integrated circuits on each electronics server are cooled using the heat sink and the large fan that blows air over the heat sink, or simply by blowing air directly over the electronics servers. However, considering the limited free space surrounding the stacked electronics servers within the server chassis, the amount of air available for cooling the integrated circuits is limited.
As data centers continue to increase their computer density, electronics servers are being deployed more frequently. Fully populated electronics servers significantly increase rack heat production. This requires supplemental cooling beyond what the Computer Room Air Conditioning (CRAC) units can provide. Supplemental cooling systems may include fans, pumps, and heat exchangers located outside the back end of the electronics server to decrease the air temperature exiting the electronics server. The heat exchangers in these supplemental cooling systems are supplied with pumped coolants, water, or refrigerants. While these supplemental cooling systems can take advantage of efficiency gained by economies of scale, they still require additional fans. It is desirable to take advantage of the existing fans in the electronics server.
Some supplemental cooling systems are configured as a “cooling door” that is attached to the back of a server rack. Supply and return hoses extend into the data center floor through a large opening. This large opening is required to provide clearance so that additional hose length can be pulled out of the floor as the door is opened and slid back into the floor when the door is closed. The space in the floor is usually under a positive pressure with air being supplied from CRAC units. The floor opening can cause a loss in efficiency as some amount of chilled air escapes from under the floor through this opening. Further, pulling additional hose out of and sliding the hose back into the opening is a tedious, and sometimes difficult, activity for the user opening and closing the cooling door. Still further, since the hose is connected to the cooling door as the door is opened and closed, physical strain is placed on the cooling door and hose connection, which creates wear and tear on, and possibly damage to, the connection components.
Cooling systems of the present invention are directed to a cooling door assembly including one or more heat exchangers. In some embodiments, the cooling door assembly includes a frame and a cooling door coupled to the frame. The frame is configured to mount to a server rack, cabinet, or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The cooling door and frame are mounted together to form a stand-alone cooling door assembly with input and output plumbing to the external cooling system. There is no plumbing within the server rack and therefore the cooling door assembly does not include plumbing into and out of the server cabinet. As such, there is no need to modify an existing server cabinet for plumbing when adding the cooling door assembly to the server cabinet. The cooling door assembly is configured as a retrofit assembly to the server cabinet. The frame of the cooling door assembly can be designed to mate to different sized server cabinets. The frame is coupled to the external cooling system, and the cooling door includes one or more swivel joints configured to provide one or more fluid paths between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the one or more fluid paths through each swivel joint.
The cooling door assembly does not include hoses that are pulled in and out of the floor when the cooling door is opened and closed. The cooling door assembly can be hard plumbed or virtually hard plumbed since the use of highly flexible hoses is no longer used as a connection to an external cooling system. In addition, since highly flexible hoses are no longer used, metal tubes and pipes can be used, which allows for the use of refrigerants, such as R-134. With the use of refrigerant, an increase in cooling capacity can be obtained.
In some embodiments, the frame includes mounting blocks that are coupled with external fluid interconnects for supplying and returning fluid from an external source, such as an external cooling system. The external cooling system can include a cooling tower, a chiller, or other secondary cooling loop including a heat exchanger used to cool the fluid exiting the cooling door assembly. The types of fluid that can be used include, but are not limited to, water, refrigerant, or any other coolant. In some embodiments, the fluid is a two-phase fluid. In other embodiments, the fluid is a single-phase fluid. Fluid flow rate controls can be included to optimize the fluid flow rate within the cooling door assembly. In some embodiments, the fluid flow rate controls are implemented using flow rate valves under the control of a control module.
The mounting blocks, including a supply mounting block and a return mounting black, are each configured using one of a number of various connection types, and with one or more input/output openings. For example, the supply mounting block can have 1, 2, or more input connections depending on the amount of fluid that is required. Each input connection is coupled to a separate external supply line. The same can be done on the return mounting block, where each output connection is coupled to a separate external return line. The connection types can be a flare fitting, a threaded connection, or other common types of connection. In a two-phase system, there is an extra pressure drop that occurs when a fluid is in the gas phase. In this case, the cooling door assembly can be configured to have a supply mounting block with a single input coupled to a single fluid supply line, and a return mounting block with multiple outputs coupled to multiple return lines, for example. If the connection type has too high a fluid pressure drop, then the mounting blocks can be configured with multiple supply or return connections. The frame including the mounting blocks is designed such that the mounting blocks are interchangeable so that different connection types and number of connections are readily available by simply switching mounting blocks.
In some embodiments, both the supply mounting block and the return mounting block are located at the top of the frame. In other embodiments, the mounting blocks are located at the bottom of the frame, such as when a chilled water loop is used. It is also possible to position the mounting blocks in a configuration such that one is at the top and one is at the bottom. In some configurations, one or more mounting blocks are located at the top of the frame and one or more mounting blocks are located at the bottom of the frame. This may be the case if the system is coupled to one or more different cooling loops in order to provide redundancy in case of failure. The mounting blocks are designed to add minimal pressure drop to the system.
The mounting blocks are fixed in position relative to the frame. The cooling door is rotatably coupled to the frame through the use of fluid swivel joints, also referred to as rotary unions. The swivel joint allows fluid to pass through a hinge that allows rotation to occur and also provides a fluid path between the fixed mounting block and the rotating cooling door. A swivel joint is coupled to at least one of the mounting blocks. In some embodiments, the swivel joint is configured with a single fluid path. In other embodiments, the swivel joint is configured with multiple fluid paths. Multiple load-bearing mechanical hinges can be used to attach the cooling door to the frame.
A heat exchanger system on the cooling door is configured to transfer heat from the air passing over the heat exchanger surfaces into the fluid flowing within the heat exchangers. The heat exchangers are designed with a low airflow impedance. This allows the existing air movers in the electronics enclosure to be used to provide the air flow for cooling. Optionally, a separate fan tray is attached to the cooling door to provide better air flow.
In some embodiments, the heat exchangers are made of a micro-tube construction with attached air fins or of a tube-fin type of design. The cooling door can include a single large heat exchanging panel or groups of heat exchanging panels attached in parallel or series. Separate heat exchanging panels are more manageable to construct and provide better control of fluid distribution. In some embodiments, each heat exchanging panel has its own separate flow regulator or valve for regulating the amount of fluid flow within the panel. The regulators or valves can be set so that each panel gets equal fluid flow or each panel gets a different amount of fluid. In other embodiments, a flow control regulator is positioned at any point on the fluid supply side of the heat exchanging panels, such as in a frame supply line or a cooling door supply line.
The system of heat exchanging panels can be oriented so that fluid flow is either in the horizontal orientation or the vertical orientation. Separate panels also enable one or more windows to be included in the cooling door. Heat exchangers are difficult to see through. By breaking up the cooling door into a series of panels, one or more windows can be added in between the heat exchangers so that one can see into the enclosure. This is particularly useful to see warning lights. Each window is covered with a transparent material so as to prevent airflow through the window opening.
In some embodiments, the multiple heat exchanging panels are coupled to each other either in series, in parallel, or a series-parallel combination via mounting piping to make a rigid assembly. In some embodiments, the heat exchangers are organized into groups of one or more heat exchangers. Each group is supplied with an independent source of fluid so as to provide separate and independent fluid paths through the cooling door assembly.
In order for the cooling door to properly open and close without binding, the mechanical hinges and the swivel joints optimally have all their axis of rotation co-linear. If the axis are not collinear, then some amount of flex is required to prevent binding. To accomplish this, flexible tubing is used in key areas on the cooling door. This allows for some flex and misalignment to be taken up. Flexible tubing or flexible piping generally has better bending flex than it has the ability to torsionally flex (twist) or axially flex (longer or shorter.) To overcome this, sections of flexible piping are assembled together with a non-flexible right-angle bend. The non-flexible right-angle bend allows one arm to move axially because the movement is taken up be a bend in flexible tubing coupled to the other arm. Both flexible members allow flex in three-dimensions. An alternative way of accomplishing this is by using a four-bar linkage. The four bar linkage allows for movement of the swivel joint without changing the rotational orientation of the swivel joint.
In some embodiments, the cooling door assembly is configured with a branching fluid flow path, where fluid is supplied to the branching fluid flow path by consolidating the fluid input at one or more external supply line interconnects into a common fluid supply for the cooling door. In this manner, the fluid source provided to this configuration of the cooling door assembly is conceptually considered as a “single source”, although multiple different external supply lines are coupled to the external supply line interconnects. In other embodiments, the cooling door assembly is configured with separate and independent fluid paths, where fluid is separately provided to each independent fluid path. In this manner, the fluid source provided to this configuration of the cooling door assembly is conceptually considered as a “multiple source”, where the multiple different external supply lines coupled to the external supply line interconnects are not consolidated into a single source of fluid, but instead are separately directed to each of the independent fluid paths. Different groups of heat exchangers are coupled to each independent fluid path. In the event of failure of one of the independent fluid paths, the other independent fluid path(s) remain operational.
Other features and advantages of the present invention will become apparent after reviewing the detailed description of the embodiments set forth below.
The present invention is described relative to the several views of the drawings. Where appropriate and only where identical elements are disclosed and shown in more than one drawing, the same reference numeral will be used to represent such identical elements.
Reference will now be made in detail to the embodiments of the cooling system of the invention, examples of which are illustrated in the accompanying drawings. While the invention will be described in conjunction with the embodiments below, it will be understood that they are not intended to limit the invention to these embodiments and examples. On the contrary, the invention is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the invention as defined by the appended claims. Furthermore, in the following detailed description of the present invention, numerous specific details are set forth in order to more fully illustrate the present invention. However, it will be apparent to one of ordinary skill in the prior art that the present invention may be practiced without these specific details. In other instances, well-known methods and procedures, components and processes haven not been described in detail so as not to unnecessarily obscure aspects of the present invention.
Embodiments of the present invention are directed to a cooling system that transfers heat generated by one or more electronics servers within a server rack. The cooling system described herein can be applied to any electronics sub-system that is mounted to a backplane, including but not limited to, a blade server and a rack server, herein referred to collectively as an electronics server. A server chassis is configured to house multiple electronics servers. Each electronics server is coupled to a backplane or mid-plane within the server chassis. Each electronics server includes one or more heat generating devices as is well known in the art.
One or more external supply lines 20 provide fluid from an external source, such as an external cooling system, to the cooling door assembly 10 via a supply mounting block 16 within the frame 12. As shown in
A flex assembly 38 is coupled to the swivel joint 28, and a cooling door supply line 40 is coupled to the flex assembly 38. A heat exchanging panel 8 is coupled to the cooling door supply line 40 via a panel supply line 42. The heat exchanging panel 8 is also coupled to a cooling door return line 58 via a panel return line 50. A heat exchanging panel 6 is coupled to the cooling door supply line 40 via a panel supply line 44. The heat exchanging panel 6 is also coupled to the cooling door return line 58 via a panel return line 52. A heat exchanging panel 4 is coupled to the cooling door supply line 40 via a panel supply line 46. The heat exchanging panel 4 is also coupled to the cooling door return line 58 via a panel return line 54. A heat exchanging panel 2 is coupled to the cooling door supply line 40 via a panel supply line 48. The heat exchanging panel 2 is also coupled to the cooling door return line 58 via a panel return line 56. Each heat exchanging panel includes a fluid input header and a fluid output header. The fluid input header is configured with one or more fluid input ports, and the fluid output header is configured with one or more fluid output ports. The panel supply line for each heat exchanging panel is coupled to the corresponding fluid input header, and the panel return line for each heat exchanging panel is coupled to the corresponding fluid output header. Where the fluid input header includes multiple fluid input ports, either a single common panel supply line is coupled to the multiple fluid input ports, or a separate panel supply line is coupled from the cooling door supply line to each of the fluid input ports. Where the fluid output header includes multiple fluid output ports, either a single common panel return line is coupled to the multiple fluid output ports, or a separate panel return line is coupled from each of the fluid output ports to the cooling door return line. In some embodiments, the cooling door 14 is configured such that fluid flow through each of the heat exchanging panels 2, 4, 6, 8 is from bottom to top. Such a configuration provides a more consistent and uniform fluid flow through the heat exchanging panels than a top to bottom fluid flow configuration.
The cooling door return line 58 is coupled to a flex assembly 36, and the flex assembly 36 is coupled to a swivel joint 30. The swivel joint 30 is coupled to one or more external return lines 22 via a return mounting block 18. As shown in
The cooling door assembly 10 shown in
The cooling door 14 is coupled to the frame 12 using a plurality of mechanical hinges 32, 34. The mechanical hinges 32, 34 are configured as load-bearing connection points and are also configured to enable the cooling door 14 to rotate relative to the frame 12. Although two mechanical hinges 32 and 34 are shown in
Each swivel joint 28, 30 is configured to enable the cooling door 16 to rotate relative to the frame 12, and in particular relative to the mounting block 18 and the frame supply line 26, while maintaining a sealed fluid path between the frame 12 and the cooling door 14.
In operation, fluid is provided to the supply mounting block 16 via the external supply lines 20. The fluid flows through the supply mounting block 16, through the frame supply lines 24 and 26 and to the cooling door 14 via the swivel joint 28. Fluid flows from the swivel joint 28 through the flex assembly 38 to the cooling door supply line 40. Fluid is provided to each of the heat exchanging panels 2, 4, 6, 8 from the cooling door supply line 40 via the panel supply lines 48, 46, 44, 42, respectively. Fluid flows through each of the heat exchanging panels 2, 4, 6, 8 to the panel returns lines 56, 54, 52, 50, respectively, and into the cooling door return line 58. Fluid flows from the cooling door return line 58 through the flex assembly 36 to the swivel joint 30 and into the return mounting block 18. Fluid is output from the cooling door assembly 10 to the external return lines 22 via the return mounting block 18. Air from inside the electronics enclosure 80 is directed out of the enclosure through each of the heat exchanging panels 2, 4, 6, 8 within the cooling door 14. As air passes through each of the heat exchanging panels 2, 4, 6, 8, and over the heat exchanging surfaces of the heat exchanging panels 2, 4, 6, 8, heat is transferred from the air to the fluid flowing through the heat exchanging panels 2, 4, 6, 8. The heated fluid is then output from the cooling door assembly 10 to an external cooling system via the external return lines 22, where the fluid is cooled and returned to the cooling door assembly 10 via the external supply lines 20.
The return mounting block 18 shown in
In some embodiments, each of the panel supply lines 42, 44, 46, and 48 include a flow control regulator or valve. As shown in
As shown in
The cooling door assembly shown in
The cooling door assembly 110 is also configured to operate within a two-phase cooling system. In such a system, fluid input to the cooling door assembly 110 is in a liquid phase, and the fluid output from the cooling door assembly 110 is in a gas phase or a combination of liquid and gas phase. The fluid in the cooling door assembly 110 remains in the liquid phase until it enters the heat exchanging panels 102, 104, 106, 108. In an exemplary application, the mass flow rate of the fluid through the cooling door assembly is substantially constant. Since fluid in a gas phase has a greater volume than the same fluid in a liquid phase, the return lines in the cooling door assembly 110 are configured with a greater diameter than the supply lines within the cooling door assembly 110. Accordingly, the frame supply interconnects 180 and 182 have a smaller diameter than the frame return interconnects 184 and 186. The frame supply lines 124, 126, and 190, the cooling door supply line 140, and the panel supply lines 142, 144, 146, and 148 have a smaller diameter than the frame return line 188, the cooling door return line 158, and the panel return lines 150, 152, 154, and 156. The components of the flex assembly 138 have smaller diameters than the components of the flex assembly 136. The interconnects of the swivel joint 128 and the mounting block 116 are smaller in diameter than the interconnects of the swivel joint 130 and the mounting block 118, respectively. Similarly, the external supply line interconnects (not shown) and the external supply lines (not shown) have a smaller diameter than the external return line interconnects (not shown) and the external return lines (not shown), respectively. Configuring the components in the supply path with smaller diameters than the complimentary components in the return path functions to alleviate increased pressure due to the phase change of the fluid from liquid to gas. In other embodiments, the cooling door assembly 110 is configured for single-phase cooling.
In some embodiments, a single swivel joint and a single mounting block are used, where the swivel joint and the mounting block coupled to the swivel joint are each configured with at least two independent fluid paths. One fluid path is used to supply fluid to the cooling door from the frame, and another fluid path is used to return fluid from the cooling door to the frame. In such a configuration, a flex assembly and a cooling door supply line are used to couple the single swivel joint to each of the panel supply lines.
The heat exchanging panels 208, 206, 204, 202 are also coupled to panel return lines 250, 252, 254, 246, respectively, to output fluid from the heat exchanging panels. The panel return lines 250, 252, 254, 256 are coupled to a cooling door return line 258, which is coupled to a flex assembly 236. The flex assembly 236 is coupled to the return fluid path of the swivel joint 230.
The mounting block 218 also includes two independent fluid paths, a supply fluid path and a return fluid path. The supply fluid path of the mounting block 218 is coupled to the supply fluid path of the swivel joint 230 and to one or more frame supply lines (not shown). The frame supply line(s) is coupled to frame supply interconnects 280, 282. The return fluid path of the mounting block 218 is coupled to the return fluid path of the swivel joint 230 and to one or more frame return lines (not shown). The frame return line(s) is coupled to frame return interconnects 284, 286. As shown in
The cooling door 214 is mounted to the frame 212 using a plurality of hinges, such as hinges 232 and 234. In some embodiments, the swivel joint 230 is also configured as a load-bearing hinge.
The single swivel joint configuration of the cooling door assembly 210 reduces the number of swivel joints and mounting blocks, and also reduces the amount of frame fluid lines used to direct fluid flow to and from the cooling door 214. The cooling door assembly 210 can be configured as either a single-phase cooling system or a two-phase cooling system.
The cooling door assemblies described and illustrated in relation to
In another exemplary configuration, a single input swivel joint is coupled to a common cooling door supply line and a pair of output swivel joints are coupled to the fluid output side of the heat exchanging panels. Each output swivel joint is coupled to multiple heat exchanging panels.
The inlet swivel joint 328 is coupled to an inlet mounting block 316. The mounting block 316 is fluidically coupled to the frame 312 via a frame supply line 326 (
The outlet swivel joint 330 is coupled to an outlet mounting block 318, and the outlet swivel joint 331 is coupled to an outlet mounting block 319. The mounting block 318 is fluidically coupled to the frame 312 via frame return line 323 (
Each of the swivel joints 328, 330, 331 is configured with a fluid path, which is coupled to a fluid path within the mounting blocks 316, 318, 319, respectively. The fluid path through the mounting block 316 and the inlet swivel joint 328 provides a supply fluid path to supply fluid from the frame 312 to the cooling door 314. A common cooling door supply line 338 (
The frame return line 329 is coupled to the frame return line 323 via a flexible piping 325. The flexibility of the flexible piping 325 provides independent movement of the mounting block 318/swivel joint 330 relative to the mounting block 319/swivel joint 331. If the mounting block 318/swivel joint 330 were rigidly coupled to the mounting block 319/swivel joint 331, then movement of one would cause movement of the other. However, movement of both the mounting block 318/swivel joint 330 and the mounting block 319/swivel joint 331 may not be needed for proper alignment. The flexible piping 325 provides this independent movement.
Fluid is output from the frame 312 via frame return interconnects 384, 386, which are coupled to external return lines (not shown). The frame return interconnects 384, 386 are coupled to the frame return line 323. Fluid is input to the frame 312 via frame supply interconnects 380, 382, which are coupled to external supply lines (not shown). The frame supply interconnects 380, 382 are coupled to the mounting block 316 via frame supply lines 324 and 326. In some embodiments, flexible piping is included in either the frame supply line 324 and/or the frame supply line 326, such as flexible piping 327. Use of flexible piping in the frame supply lines provides float for properly aligning the mounting block 316/swivel joint 328.
The movement provided by the grommets and flexible piping enables the swivel joints to float into proper alignment of the cooling door relative to the frame. When mounting the cooling door to the frame, the hinge axis and the swivel joint axis must be aligned. The movement provided by the grommets and/or the flexible piping enable proper alignment of the cooling door to the frame.
In some embodiments, the swivel joints 328, 330, 331 are configured as load-bearing elements and therefore also function as hinges. In other embodiments, hinges independent of the swivel joints are used, in which case the swivel joints may or may not be configured as load-bearing elements.
The cooling door assembly 310 can be configured as either a single-phase cooling system or a two-phase cooling system.
Although not shown in
Embodiments of the cooling door assemblies described above are configured with a branching fluid flow path, where fluid is supplied to the branching fluid flow path by consolidating the fluid input at the external supply line interconnects into a common fluid supply for the cooling door. In this manner, the fluid source for these configurations of the cooling door assembly is conceptually considered as a “single source”, although multiple different external supply lines are coupled to the external supply line interconnects. In this context, the fluid flow paths through the frame and cooling door are dependent on this single fluid source. For example, a single fluid flow path is provided to the cooling door 14 via the fluid supply lines 24 and 26 in
In other embodiments, the cooling door assembly is configured with separate and independent fluid paths, where fluid is separately provided to each independent fluid path. In this manner, the fluid source for this configuration of the cooling door assembly is conceptually considered as a “multiple source”, where the multiple different external supply lines coupled to the external supply line interconnects are not consolidated into a single source of fluid, but instead are separately directed to each of the independent fluid paths, which remain independent through the frame and the cooling door, and coupled independently to the external return lines. The heat exchangers within the cooling door are configured as groups, the heat exchangers within a given group are fluidically coupled. A different group of heat exchangers is coupled to each independent fluid path. In the event of failure of one of the independent fluid paths, the other independent fluid path(s) remain operational.
The supply fluid path of the swivel joint 428 is coupled to a cooling door supply line 440 via a cooling door supply line 438, which can be a flex assembly. The cooling door supply line 440 is coupled to panel supply lines 442 and 444, which are in turn coupled to heat exchanging panels 408 and 406, respectively, to receive input fluid. The supply fluid path of the swivel joint 431 is coupled to a cooling door supply line 441 via a cooling door supply line 439, which can be a flex assembly. The cooling door supply line 441 is coupled to panel supply lines 446 and 448, which are in turn coupled to heat exchanging panels 404 and 402, respectively, to receive input fluid.
The heat exchanging panels 408 and 406 are also coupled to panel return lines 450 and 452, respectively, to output fluid from the heat exchanging panels. The panel return lines 450 and 452 are coupled to a cooling door return line 459, which is coupled to a cooling door return line 457, which can be a flex assembly. The flex assembly 457 is coupled to the return fluid path of the swivel joint 431. The heat exchanging panels 404 and 402 are also coupled to panel return lines 454 and 456, respectively, to output fluid from the heat exchanging panels. The panel return lines 454 and 456 are coupled to a cooling door return line 458, which is coupled to a cooling door return line 436, which can be a flex assembly. The flex assembly 436 is coupled to the return fluid path of the swivel joint 430.
The mounting block 416 includes a supply fluid path, which is coupled to the supply fluid path of the swivel joint 428 and to a frame supply line 426. The frame supply line 426 is coupled to frame supply interconnect 480 via frame supply lines 424 and 426. The mounting block 418 includes a return fluid path, which is coupled to the return fluid path of the swivel joint 430 and to a frame return line 422. The frame return line 422 is coupled to frame return interconnect 486.
The mounting block 419 includes two independent fluid paths, a supply fluid path and a return fluid path. The supply fluid path of the mounting block 419 is coupled to the supply fluid path of the swivel joint 431 and to a frame supply line 429. The frame supply line 429 is coupled to frame supply interconnect 482 via frame supply lines 427 and 423. The return fluid path of the mounting block 419 is coupled to the return fluid path of the swivel joint 431 and to a frame return line 421. The frame return line 421 is coupled to frame return interconnect 484.
The cooling door assembly 410 includes two independent fluid paths. A first independent fluid path includes the frame supply line interconnect 480, the frame supply line 424, the frame supply line 426, the supply fluid path through the mounting block 416, the supply fluid path through the swivel joint 428, the cooling door supply line 438, the cooling door supply line 440, the panel supply lines 442 and 444, the heat exchangers 406 and 408, the panel return lines 450 and 452, the cooling door return line 459, the cooling door return line 457, the return fluid path through the swivel joint 431, the return fluid path through the mounting block 419, the frame return line 421, and the frame return line interconnect 484. A second independent fluid path includes the frame supply line interconnect 482, the frame supply line 423, the frame supply line 427, the frame supply line 429, the supply fluid path through the mounting block 419, the supply fluid path through the swivel joint 431, the cooling door supply line 439, the cooling door supply line 441, the panel supply lines 446 and 448, the heat exchangers 402 and 404, the panel return lines 454 and 456, the cooling door return line 458, the cooling door return line 436, the return fluid path through the swivel joint 430, the return fluid path through the mounting block 418, the frame return line 422, and the frame return line interconnect 486.
In the exemplary configuration of
As shown in
The cooling door 414 is mounted to the frame 412 using a plurality of hinges. In some embodiments, one or more of the swivel joints 430, 431, and 428 are also configured as a load-bearing hinges.
The cooling door assembly 510 includes two independent fluid paths. A first independent fluid path includes a frame supply line interconnect 580, a first supply fluid path through the mounting block 518, a first supply fluid path through the swivel joint 530, a cooling door supply line 538, which can be a flex assembly, a cooling door supply line 540, panel supply lines 546 and 548, heat exchangers 504 and 502, panel return lines 554 and 556, a cooling door return line 558, a cooling door return line 536, which can be a flex assembly, a first return fluid path through the swivel joint 530, a first return fluid path through the mounting block 518, and a frame return line interconnect 586. A second independent fluid path includes a frame supply line interconnect 582, a second supply fluid path through the mounting block 518, a second supply fluid path through the swivel joint 530, a cooling door supply line 539, which can be a flex assembly, panel supply lines 542 and 544, heat exchangers 506 and 508, panel return lines 550 and 552, a cooling door return line 537, which can be a flex assembly, a second return fluid path through the swivel joint 530, a second return fluid path through the mounting block 518, and a frame return line interconnect 584.
The cooling door assembly 610 includes two independent fluid paths. A first independent fluid path includes a frame supply line interconnect 680, a frame supply line 624, a frame supply line 626, a first supply fluid path through the mounting block 616, a first supply fluid path through the swivel joint 628, a cooling door supply line 637, which can be a flex assembly, a cooling door supply line 641, panel supply lines 646 and 648, heat exchangers 604 and 602, panel return lines 654 and 656, a cooling door return line 659, a cooling door return line 638, a first return fluid path through the swivel joint 630, a first return fluid path through the mounting block 618, and a frame return line interconnect 686. A second independent fluid path includes a frame supply line interconnect 682, a frame supply line 623, a frame supply line 627, a second supply fluid path through the mounting block 616, a second supply fluid path through the swivel joint 628, a cooling door supply line 639, which can be a flex assembly, a cooling door supply line 640, panel supply lines 642 and 644, heat exchangers 606 and 608, a panel return lines 650 and 652, a cooling door return line 658, a cooling door return line 636, which can be a flex assembly, a second return fluid path through the swivel joint 630, a second return fluid path through the mounting block 618, and a frame return line interconnect 684.
The cooling door assemblies 410, 510, 610 are described above as including two independent fluid paths. It is understood that a cooling door assembly can be configured with more than two independent fluid paths. The cooling door assemblies 410, 510, 610 are also described as having a one-to-one relationship between the number of external supply lines and the number of independent fluid paths. In alternative embodiments, two or more external supply lines can be consolidated as a “single source”, which is coupled to an independent fluid path. In general, each independent fluid path can be coupled to one or more external fluid lines.
The specific configurations of the cooling door assemblies described above are for exemplary purposes only. It is understood that other embodiments, including any combination of the individual components, including the use of flexible piping and flex assemblies, described in the various configurations are also contemplated.
The cooling door assemblies are described above as including a cooling door coupled to a frame, and the frame is mounted to an electronics enclosure. In this configuration, the cooling door assemblies are mounted to the electronics enclosure without having to add additional plumbing to the electronics enclosure. Alternatively, the cooling doors are configured to mount directly to the electronics enclosures. In such configurations, additional plumbing, such as frame supply lines, frame return lines, and/or mounting blocks, is added to the electronics enclosure to provide the necessary fluid connections to the external fluid supply and return lines.
In some embodiments, the cooling door is further configured to provide an amount of electro-magnetic interference (EMI) protection, such as adding a screen with opening to allow airflow to the heat exchangers. Additionally, EMI gasketing can be used where the frame attaches to the rack and around where the cooling door closes. EMI gasketing functions to seal the cooling door and restrict the air from leaving the enclosure without passing through the heat exchangers in the cooling door.
The present invention has been described in terms of specific embodiments incorporating details to facilitate the understanding of the principles of construction and operation of the invention. Such reference herein to specific embodiments and details thereof is not intended to limit the scope of the claims appended hereto. It will be apparent to those skilled in the art that modifications may be made in the embodiment chosen for illustration without departing from the spirit and scope of the invention.
This application is a continuation-in-part of U.S. patent application Ser. No. 12/291,884, filed Nov. 14, 2008, and entitled “Device and Methodology for the Removal of Heat from an Equipment Rack by Means of Heat Exchangers Mounted to a Door.” U.S. patent application Ser. No. 12/291,884 claims priority of U.S. Provisional Application, Ser. No. 61/068,891, filed Mar. 10, 2008, and entitled “Fan Tray for Supplemental Air Flow”, by these same inventors. This application incorporates U.S. patent application Ser. No. 12/291,884 and U.S. Provisional Application, Ser. No. 61/068,891 in their entirety by reference.
Number | Name | Date | Kind |
---|---|---|---|
596062 | Firey | Dec 1897 | A |
2039593 | Hubbuch et al. | May 1936 | A |
2273505 | Florian | Feb 1942 | A |
3361195 | Meyerhoff | Jan 1968 | A |
3524497 | Chu et al. | Aug 1970 | A |
3654988 | Clayton, III | Apr 1972 | A |
3771219 | Tuzi et al. | Nov 1973 | A |
3817321 | Von Cube et al. | Jun 1974 | A |
3823572 | Cochran, Jr. | Jul 1974 | A |
3852806 | Corman et al. | Dec 1974 | A |
3923426 | Theeuwes | Dec 1975 | A |
3929154 | Goodwin | Dec 1975 | A |
3946276 | Braun et al. | Mar 1976 | A |
3948316 | Souriau | Apr 1976 | A |
4109707 | Wilson et al. | Aug 1978 | A |
4194559 | Eastman | Mar 1980 | A |
4203488 | Johnson et al. | May 1980 | A |
4211208 | Lindner | Jul 1980 | A |
4235285 | Johnson et al. | Nov 1980 | A |
4248295 | Ernst et al. | Feb 1981 | A |
4312012 | Frieser et al. | Jan 1982 | A |
4345267 | Corman et al. | Aug 1982 | A |
4450472 | Tuckerman et al. | May 1984 | A |
4467861 | Kiseev et al. | Aug 1984 | A |
4485429 | Mittal | Nov 1984 | A |
4494171 | Bland et al. | Jan 1985 | A |
4516632 | Swift et al. | May 1985 | A |
4540115 | Hawrylo | Sep 1985 | A |
4561040 | Eastman et al. | Dec 1985 | A |
4567505 | Pease et al. | Jan 1986 | A |
4573067 | Tuckerman et al. | Feb 1986 | A |
4574876 | Aid | Mar 1986 | A |
4664181 | Sumberg | May 1987 | A |
4675783 | Murase | Jun 1987 | A |
4716494 | Bright et al. | Dec 1987 | A |
4866570 | Porter | Sep 1989 | A |
4868712 | Woodman | Sep 1989 | A |
4893174 | Yamada et al. | Jan 1990 | A |
4894709 | Phillips et al. | Jan 1990 | A |
4896719 | O'Neill et al. | Jan 1990 | A |
4903761 | Cima | Feb 1990 | A |
4908112 | Pace | Mar 1990 | A |
4938280 | Clark | Jul 1990 | A |
4978638 | Buller et al. | Dec 1990 | A |
5009760 | Zare et al. | Apr 1991 | A |
5016090 | Galyon et al. | May 1991 | A |
5016138 | Woodman | May 1991 | A |
5043797 | Lopes | Aug 1991 | A |
5057908 | Weber | Oct 1991 | A |
5058627 | Brannen | Oct 1991 | A |
5070040 | Pankove | Dec 1991 | A |
5083194 | Bartilson | Jan 1992 | A |
5088005 | Ciaccio | Feb 1992 | A |
5096388 | Weinberg | Mar 1992 | A |
5099311 | Bonde et al. | Mar 1992 | A |
5099910 | Walpole | Mar 1992 | A |
5125451 | Matthews | Jun 1992 | A |
5131233 | Cray et al. | Jul 1992 | A |
5145001 | Valenzuela | Sep 1992 | A |
5161089 | Chu et al. | Nov 1992 | A |
5179500 | Koubek et al. | Jan 1993 | A |
5199487 | DiFrancesco et al. | Apr 1993 | A |
5203401 | Hamburgen et al. | Apr 1993 | A |
5218515 | Bernhardt | Jun 1993 | A |
5219278 | Van Lintel | Jun 1993 | A |
5228502 | Chu et al. | Jul 1993 | A |
5232047 | Matthews | Aug 1993 | A |
5239200 | Messina et al. | Aug 1993 | A |
5239443 | Fahey et al. | Aug 1993 | A |
5263251 | Matthews | Nov 1993 | A |
5265670 | Zingher | Nov 1993 | A |
5269372 | Chu et al. | Dec 1993 | A |
5274920 | Matthews | Jan 1994 | A |
5275237 | Rolfson et al. | Jan 1994 | A |
5308429 | Bradley | May 1994 | A |
5309319 | Messina | May 1994 | A |
5310440 | Zingher | May 1994 | A |
5316077 | Reichard | May 1994 | A |
5317805 | Hoopman | Jun 1994 | A |
5325265 | Turlik et al. | Jun 1994 | A |
5336062 | Richter | Aug 1994 | A |
5346000 | Schlitt | Sep 1994 | A |
5354415 | Fushii et al. | Oct 1994 | A |
5365400 | Ashiwake et al. | Nov 1994 | A |
5380956 | Loo et al. | Jan 1995 | A |
5383340 | Larson et al. | Jan 1995 | A |
5386143 | Fitch | Jan 1995 | A |
5388635 | Gruber et al. | Feb 1995 | A |
5397919 | Tata et al. | Mar 1995 | A |
5421943 | Tam et al. | Jun 1995 | A |
5427174 | Lomolino, Sr. et al. | Jun 1995 | A |
5436793 | Sanwo et al. | Jul 1995 | A |
5459099 | Hsu | Oct 1995 | A |
5490117 | Oda et al. | Feb 1996 | A |
5508234 | Dusablon, Sr. et al. | Apr 1996 | A |
5514832 | Dusablon, Sr. et al. | May 1996 | A |
5514906 | Love et al. | May 1996 | A |
5544696 | Leland | Aug 1996 | A |
5548605 | Benett et al. | Aug 1996 | A |
5564497 | Fukuoka et al. | Oct 1996 | A |
5575929 | Yu et al. | Nov 1996 | A |
5579828 | Reed et al. | Dec 1996 | A |
5583317 | Mennucci et al. | Dec 1996 | A |
5585069 | Zanzucchi et al. | Dec 1996 | A |
5641400 | Kaltenbach et al. | Jun 1997 | A |
5646824 | Ohashi et al. | Jul 1997 | A |
5647429 | Oktay et al. | Jul 1997 | A |
5658831 | Layton et al. | Aug 1997 | A |
5675473 | McDunn et al. | Oct 1997 | A |
5692558 | Hamilton et al. | Dec 1997 | A |
5696405 | Weld | Dec 1997 | A |
5701751 | Flores | Dec 1997 | A |
5703536 | Davis et al. | Dec 1997 | A |
5704416 | Larson et al. | Jan 1998 | A |
5727618 | Mundinger et al. | Mar 1998 | A |
5740013 | Roesner et al. | Apr 1998 | A |
5759014 | Van Lintel | Jun 1998 | A |
5763951 | Hamilton et al. | Jun 1998 | A |
5768104 | Salmonson et al. | Jun 1998 | A |
5800690 | Chow et al. | Sep 1998 | A |
5801442 | Hamilton et al. | Sep 1998 | A |
5810077 | Nakaamura et al. | Sep 1998 | A |
5835345 | Staskus et al. | Nov 1998 | A |
5836750 | Cabuz | Nov 1998 | A |
5858188 | Soane et al. | Jan 1999 | A |
5863708 | Zanzucchi et al. | Jan 1999 | A |
5869004 | Parce et al. | Feb 1999 | A |
5870823 | Bezama et al. | Feb 1999 | A |
5874795 | Sakamoto | Feb 1999 | A |
5876655 | Fisher | Mar 1999 | A |
5880017 | Schwiebert et al. | Mar 1999 | A |
5880524 | Xie | Mar 1999 | A |
5886870 | Omori | Mar 1999 | A |
5901037 | Hamilton | May 1999 | A |
5918469 | Cardella | Jul 1999 | A |
5921087 | Bhatia et al. | Jul 1999 | A |
5923086 | Winer et al. | Jul 1999 | A |
5936192 | Tauchi | Aug 1999 | A |
5940270 | Puckett | Aug 1999 | A |
5942093 | Rakestraw et al. | Aug 1999 | A |
5945217 | Hanrahan | Aug 1999 | A |
5950721 | Bock et al. | Sep 1999 | A |
5960866 | Kimura et al. | Oct 1999 | A |
5964092 | Tozuka et al. | Oct 1999 | A |
5965001 | Chow et al. | Oct 1999 | A |
5965813 | Wan et al. | Oct 1999 | A |
5978220 | Frey et al. | Nov 1999 | A |
5993750 | Ghosh et al. | Nov 1999 | A |
5997713 | Beetz, Jr. et al. | Dec 1999 | A |
5998240 | Hamilton et al. | Dec 1999 | A |
6007309 | Hartley | Dec 1999 | A |
6010316 | Haller et al. | Jan 2000 | A |
6013164 | Paul et al. | Jan 2000 | A |
6014312 | Schulz-Harder et al. | Jan 2000 | A |
6019165 | Batchelder | Feb 2000 | A |
6019882 | Paul et al. | Feb 2000 | A |
6021045 | Johnson | Feb 2000 | A |
6034872 | Chrysler et al. | Mar 2000 | A |
6039114 | Becker et al. | Mar 2000 | A |
6054034 | Soane et al. | Apr 2000 | A |
6068752 | Dubrow et al. | May 2000 | A |
6090251 | Sundberg et al. | Jul 2000 | A |
6096656 | Matzke et al. | Aug 2000 | A |
6100541 | Nagle et al. | Aug 2000 | A |
6101715 | Fuesser et al. | Aug 2000 | A |
6119729 | Oberholzer et al. | Sep 2000 | A |
6126723 | Drost et al. | Oct 2000 | A |
6129145 | Yamamoto et al. | Oct 2000 | A |
6129260 | Andrus et al. | Oct 2000 | A |
6131650 | North et al. | Oct 2000 | A |
6140860 | Sandhu et al. | Oct 2000 | A |
6146103 | Lee et al. | Nov 2000 | A |
6154363 | Chang | Nov 2000 | A |
6159353 | West et al. | Dec 2000 | A |
6167948 | Thomas | Jan 2001 | B1 |
6171067 | Parce | Jan 2001 | B1 |
6174675 | Chow et al. | Jan 2001 | B1 |
6175493 | Gold | Jan 2001 | B1 |
6176962 | Soane et al. | Jan 2001 | B1 |
6182742 | Tanahashi et al. | Feb 2001 | B1 |
6186660 | Kopf-Sill et al. | Feb 2001 | B1 |
6196307 | Ozmat | Mar 2001 | B1 |
6206022 | Tsai et al. | Mar 2001 | B1 |
6210986 | Arnold et al. | Apr 2001 | B1 |
6216343 | Leland et al. | Apr 2001 | B1 |
6221226 | Kopf-Sill | Apr 2001 | B1 |
6227287 | Tanaka et al. | May 2001 | B1 |
6227809 | Forster et al. | May 2001 | B1 |
6234240 | Cheon | May 2001 | B1 |
6238538 | Parce et al. | May 2001 | B1 |
6253832 | Hallefalt | Jul 2001 | B1 |
6253835 | Chu et al. | Jul 2001 | B1 |
6257320 | Wargo | Jul 2001 | B1 |
6269864 | Kabadi | Aug 2001 | B1 |
6277257 | Paul et al. | Aug 2001 | B1 |
6287440 | Arnold et al. | Sep 2001 | B1 |
6301109 | Chu et al. | Oct 2001 | B1 |
6313992 | Hildebrandt | Nov 2001 | B1 |
6317326 | Vogel et al. | Nov 2001 | B1 |
6321791 | Chow | Nov 2001 | B1 |
6322753 | Lindberg et al. | Nov 2001 | B1 |
6324058 | Hsiao | Nov 2001 | B1 |
6330907 | Ogushi et al. | Dec 2001 | B1 |
6336497 | Lin | Jan 2002 | B1 |
6337794 | Agonafer et al. | Jan 2002 | B1 |
6347036 | Yeager et al. | Feb 2002 | B1 |
6351384 | Daikoku et al. | Feb 2002 | B1 |
6366462 | Chu et al. | Apr 2002 | B1 |
6366467 | Patel et al. | Apr 2002 | B1 |
6367544 | Calaman | Apr 2002 | B1 |
6388317 | Reese | May 2002 | B1 |
6396706 | Wohlfarth | May 2002 | B1 |
6397932 | Calaman et al. | Jun 2002 | B1 |
6400012 | Miller et al. | Jun 2002 | B1 |
6404640 | Ishimine et al. | Jun 2002 | B1 |
6406605 | Moles | Jun 2002 | B1 |
6415860 | Kelly et al. | Jul 2002 | B1 |
6416642 | Alajoki et al. | Jul 2002 | B1 |
6417060 | Tavkhelidze et al. | Jul 2002 | B2 |
6424531 | Bhatti et al. | Jul 2002 | B1 |
6431260 | Agonafer et al. | Aug 2002 | B1 |
6437981 | Newton et al. | Aug 2002 | B1 |
6438984 | Novotny et al. | Aug 2002 | B1 |
6443222 | Yun et al. | Sep 2002 | B1 |
6444461 | Knapp et al. | Sep 2002 | B1 |
6449157 | Chu | Sep 2002 | B1 |
6449162 | Corbin, Jr. et al. | Sep 2002 | B1 |
6457515 | Vafai et al. | Oct 2002 | B1 |
6459581 | Newton et al. | Oct 2002 | B1 |
6459582 | Ali et al. | Oct 2002 | B1 |
6466442 | Lin | Oct 2002 | B2 |
6477045 | Wang | Nov 2002 | B1 |
6488214 | Nicolai et al. | Dec 2002 | B1 |
6492200 | Park et al. | Dec 2002 | B1 |
6495015 | Schoeniger et al. | Dec 2002 | B1 |
6508301 | Marsala | Jan 2003 | B2 |
6519151 | Chu et al. | Feb 2003 | B2 |
6533029 | Phillips | Mar 2003 | B1 |
6536516 | Davies et al. | Mar 2003 | B2 |
6537437 | Galambos et al. | Mar 2003 | B1 |
6543521 | Sato et al. | Apr 2003 | B1 |
6553253 | Chang | Apr 2003 | B1 |
6572749 | Paul et al. | Jun 2003 | B1 |
6578626 | Calaman et al. | Jun 2003 | B1 |
6581388 | Novotny et al. | Jun 2003 | B2 |
6587343 | Novotny et al. | Jul 2003 | B2 |
6588498 | Reyzin et al. | Jul 2003 | B1 |
6591625 | Simon | Jul 2003 | B1 |
6596229 | Lin et al. | Jul 2003 | B2 |
6600220 | Barber et al. | Jul 2003 | B2 |
6601643 | Cho et al. | Aug 2003 | B2 |
6606251 | Kenny et al. | Aug 2003 | B1 |
6609560 | Cho et al. | Aug 2003 | B2 |
6632655 | Mehta et al. | Oct 2003 | B1 |
6632719 | DeBoer et al. | Oct 2003 | B1 |
6637109 | Nyqvist | Oct 2003 | B2 |
6651735 | Cho et al. | Nov 2003 | B2 |
6729383 | Cannell et al. | May 2004 | B1 |
6743664 | Liang et al. | Jun 2004 | B2 |
6757169 | Kondo et al. | Jun 2004 | B2 |
6796372 | Bear | Sep 2004 | B2 |
6826922 | Patel et al. | Dec 2004 | B2 |
6882543 | Kenny et al. | Apr 2005 | B2 |
6940298 | Gutfeldt et al. | Sep 2005 | B2 |
6942018 | Goodson et al. | Sep 2005 | B2 |
6988534 | Kenny et al. | Jan 2006 | B2 |
7021369 | Werner et al. | Apr 2006 | B2 |
7052751 | Smith et al. | May 2006 | B2 |
7104312 | Goodson et al. | Sep 2006 | B2 |
7124811 | Crocker et al. | Oct 2006 | B2 |
7143820 | Crocker et al. | Dec 2006 | B2 |
7147042 | Huang et al. | Dec 2006 | B2 |
7177931 | Athey et al. | Feb 2007 | B2 |
7178512 | Merten | Feb 2007 | B1 |
7228888 | Eckberg et al. | Jun 2007 | B2 |
7334630 | Goodson et al. | Feb 2008 | B2 |
7359197 | Stefanoski et al. | Apr 2008 | B2 |
7385810 | Chu et al. | Jun 2008 | B2 |
7450385 | Campbell et al. | Nov 2008 | B1 |
7509995 | Bhatti et al. | Mar 2009 | B2 |
7516777 | Terakado et al. | Apr 2009 | B2 |
7619887 | Koch et al. | Nov 2009 | B2 |
7660116 | Claassen et al. | Feb 2010 | B2 |
7782616 | Myers et al. | Aug 2010 | B1 |
8096348 | Takagi et al. | Jan 2012 | B2 |
8254422 | Datta et al. | Aug 2012 | B2 |
8299604 | Datta et al. | Oct 2012 | B2 |
20010024820 | Mastromatteo et al. | Sep 2001 | A1 |
20010042616 | Baer | Nov 2001 | A1 |
20080018212 | Spearing et al. | Jan 2008 | A1 |
Number | Date | Country |
---|---|---|
3927755 | Feb 1991 | DE |
19628548 | Jan 1998 | DE |
19715001 | Dec 1998 | DE |
69413012 | Mar 1999 | DE |
69511875 | Mar 2000 | DE |
10132874 | Jan 2003 | DE |
10141525 | Mar 2003 | DE |
10319367 | Nov 2004 | DE |
102004042154 | Mar 2006 | DE |
0520173 | Dec 1992 | EP |
0845728 | Jun 1998 | EP |
60046056 | Dec 1985 | JP |
1024447 | Jan 1989 | JP |
06326226 | Nov 1994 | JP |
09102568 | Apr 1997 | JP |
10099592 | Apr 1998 | JP |
2001326311 | Nov 2001 | JP |
502102 | Sep 2002 | TW |
9219027 | Oct 1992 | WO |
2005080901 | Sep 2005 | WO |
2007006590 | Jan 2007 | WO |
Number | Date | Country | |
---|---|---|---|
61068891 | Mar 2008 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 12291884 | Nov 2008 | US |
Child | 13540015 | US |