The present invention relates to a device for converting electrical energy into thermal energy.
Devices for converting electrical energy into thermal energy are generally understood to mean so-called thermoelectrical devices (TED for short) or also electrothermal converters. These types of thermoelectrical devices may be operated in a heating or cooling mode, depending on the direction of current flow. When current flows through, a temperature difference is created on two opposite sides of the thermoelectrical device.
A number of such thermoelectrical devices are already known from the prior art. Typical thermoelectrical devices include a layer of multiple semiconductor elements. The layer of multiple semiconductor elements may be, for example, a layer of so-called thermoelectrical pellets (TE pellets for short), which are generally formed from semiconductor material in the form of p- and n-doped cubes.
The cubes made of semiconductor material are connected to one another in alternation on a top side and a bottom side by metal bridges. This respective connection results in a series connection of the semiconductor elements, as the result of which the supplied current flows through each of the cubes. Depending on the current intensity and current direction, the connection points on one side surface cool, while the connection points on the other side surface heat. Heat may thus be pumped from one side surface to the other side surface by means of the current, resulting in a temperature difference between the side surfaces.
The layer of semiconductor elements is often soldered or attached in some other way between parts, forming an enclosure, in the form of two layers of ceramic or copper plates, since in particular ceramic and copper have a high heat conductivity. The top side and bottom side parts of the enclosure may subsequently be coupled to other components, such as a fluid circuit, by means of a solder, adhesive, lubricant, or thermal film connection, for example. However, a problem with such known units is that the stated top side and bottom side parts are not designed to allow fixing or a flexible or sealing fastening of the thermoelectrical device, since in particular the parts of the enclosure made of ceramic or copper plates are very rigid, dimensionally stable parts.
Even when such a thermoelectrical device is coupled to a fluid circuit, for example, distinct disadvantages result from ceramic or copper plates as a component of the enclosure of the layer of multiple semiconductor elements. In many known devices for converting electrical energy into thermal energy, the layer of semiconductor elements is bordered between ceramic or copper plates, the semiconductor elements being attached between the ceramic or copper plates via, for example, a layer of solder material, adhesive, lubricant, thermal film, etc. The device for converting electrical energy into thermal energy may be coupled to a fluid circuit via a part of the enclosure. However, in this design it is possible that a number of thermal resistances may result for a heat flow in the direction of the fluid circuit. Thus, it has been shown that considerable heat losses occur for a heat flow of a medium. In particular for liquids or gaseous fluids, deficient or poor sealing of the device may be accompanied by undesirable fluid losses.
The object of the invention, therefore, is to provide a device for converting electrical energy into thermal energy, which at least partially eliminates the above-stated disadvantages of the prior art.
The above object is achieved by a device for converting electrical energy into thermal energy which includes the features in claim 1. Further advantageous embodiments are described by the subclaims.
A device according to the invention for converting electrical energy into thermal energy includes at least one layer of multiple semiconductor elements, and an enclosure, formed from at least two parts, between whose oppositely situated broadside surfaces the at least one layer of multiple semiconductor elements is accommodated. At least one of the two parts forming the enclosure laterally protrudes beyond the layer of multiple semiconductor elements. In addition, a portion of the respective part laterally protruding beyond the layer of multiple semiconductor elements is designed as a functional section.
In a design according to the invention of the device for converting electrical energy into thermal energy, it may also be provided that the functional section of the at least one part of the two parts forming the enclosure has an arched structure, at least in areas. For the case that the at least one part forming a functional section is situated directly adjacent to a fluid, the functional section in the area of the arched structure may cooperate with an element that encloses the fluid, as a sealing unit in order to seal off the layer of multiple semiconductor elements from the fluid. The functional section of the at least one part of the two parts forming the enclosure may thus at the same time act as a seal. A seal may be advantageous in particular when the device for converting electrical energy into thermal energy is coupled to an element that encloses a gaseous or liquid fluid, in order to prevent losses of the fluid due to unintentional leakage of the fluid from the element enclosing the fluid through gaps or cracks between the device for converting electrical energy into thermal energy, situated on the element enclosing the fluid, and the element enclosing the fluid. The functional section may be designed with depressions and/or bulges or may form depressions and/or bulges in order to provide sealing properties.
It is advantageous when the arched structure of the functional section provided for sealing extends around an area of the layer of multiple semiconductor elements, at a certain distance therefrom, and in cooperation with the element enclosing the fluid forms a sealing ring, so that the layer of multiple semiconductor elements is sealed off from the fluid.
In addition, the functional section may have greater rigidity than other areas of the part. The greater rigidity of the part may be brought about, for example, by material having a reinforced and/or stiffened design in the area of the functional section of the part. The reinforcement of the functional section of the part may be provided, for example, by an increased cross section of the part in the area of the functional section compared to other areas of the part. Furthermore, it is also conceivable to reinforce the part in the area of the functional section by adding other materials and/or reinforcing or stiffening elements. Stability of the at least one part of the two parts forming the enclosure may be improved by the reinforcement and/or stiffening. Unintended bending or bursting of solder joints, for example, between individual parts of the device for converting electrical energy into thermal energy may be prevented in this way.
The functional section may be designed, using standard methods, in such a way that the accommodation of sealants such as O-rings, sealing compounds such as silicone, or solder or adhesive is made possible or simplified. In addition, the functional surface may be designed in such a way that integral bonding (welding, for example) is providable.
In addition, the thermal conductivity between the functional section and the semiconductor elements may be meaningfully influenced, for example, via spacing, wall thickness, or ribbing or similar structures. Increasing the heat conduction may, for example, improve the heat exchange with the body that is contacted at the functional section. On the other hand, reducing the heat conductivity, for example for joining processes with high heat input (welding, soldering), may prevent overheating of the TED.
Furthermore, it is conceivable for the functional section to have a reversibly elastically deformable design, at least in areas. The functional section may have a resiliently flexible design due to its reversible elastic deformability, at least in areas. Elastic properties of the functional section possibly brought about in this way may be meaningful in several respects. For example, when the device for converting electrical energy into thermal energy cooperates with an element enclosing fluid, pressure fluctuations with regard to the fluid may occur. The pressure fluctuations of the fluid may also change a pressure that acts on the device for converting electrical energy into thermal energy, in particular the part of the enclosure that may possibly be in thermal contact with the fluid. Due to the reversible elastic deformability of the functional section, pressure fluctuations may be balanced to a certain extent, for example to avoid damage to the layer of multiple semiconductor elements, or solder joints between individual parts of the device for converting electrical energy into thermal energy. In addition, the elastic property may be utilized in a targeted manner to provide a contact force between the TED and a surface to be temperature-controlled, in that the functional surface is deflected from the unloaded normal position, in the direction of force. This may occur, for example, when the functional surface is being screwed to the surface to be temperature-controlled. In some cases it is conceivable for the at least one layer of multiple semiconductor elements to be situated at a certain distance from, and without direct contact with, the at least one second part of the enclosure formed from at least two parts. For example, due to the reversible elastic deformability of the functional section of the at least one part that includes the functional section, a deflection may be used to establish contact between the at least one layer of multiple semiconductor elements and the at least one second part of the enclosure. A targeted transmission of heat energy between the parts of the device for converting electrical energy into thermal energy may thus be provided or avoided in order to obtain a desired transmission of heat energy or avoid same.
In conceivable embodiments, the functional section may have at least one opening that is designed for receiving a fastening element. As a result of the at least one opening, the at least one part of the at least two parts forming the enclosure, which has the functional section, or the entire device for converting electrical energy into thermal energy may be easily and durably connected to an element enclosing a fluid or attached to an element enclosing a fluid, by means of fastening elements such as screws. If two of the at least two parts forming the enclosure each have openings, it is also possible to brace the components of the device for converting electrical energy into thermal energy, such as the layer of multiple semiconductor elements, between the parts forming the enclosure. In particular, it is meaningful when the openings are situated in convexly curved edge or corner areas of the part forming the functional section. Openings situated outside the arched structure of the functional section are advantageous, in particular when cooperation of the functional section having an arched structure is provided, and the element enclosing the fluid is designed as a sealing unit. As the result of fixing the device for converting electrical energy into thermal energy through the openings by means of fastening elements, a good sealing effect results by pressing the arched structure of the functional section against an element that seals off the fluid, so that escape of fluid from the element enclosing the fluid may be prevented.
Moreover, an upper broadside surface of the at least one part forming the functional section, the upper broadside surface facing away from the at least one layer of multiple semiconductor elements, may form a segment of a channel for fluid.
It is also conceivable that the at least one part that forms the functional section includes a heat exchange-promoting structure on the upper broadside surface in the area of the segment.
In addition, the at least one part that forms the functional section may include an elastic layer, at least in part, on the upper broadside surface in the area of the segment. Furthermore, a broadside surface of at least one of the at least two parts forming the enclosure, facing in the direction of the at least one layer of multiple semiconductor elements, may be provided with a heat exchange-promoting element.
Moreover, embodiments are conceivable in which the enclosure formed from at least two parts is designed for accommodating at least two spaced-apart layers of multiple semiconductor elements.
In addition, each of the at least two parts may laterally protrude beyond the at least one layer of multiple semiconductor elements. The portions of the at least two parts that laterally protrude beyond the layer of multiple semiconductor elements may be designed as a functional section.
It is evident that at least the functional section, at least at the locations contacting the other bodies or fluids, may be coated, treated, or passivated in such a way that electrical or thermal conduction may be promoted or largely prevented, or that corrosion protection is achieved. Common methods include, for example, anodizing, tin plating, coating with aluminum oxide, application of nitrile rubber, etc.
It may be advantageous for the protruding area or the functional section (or parts thereof) to have material compositions that are different from one another or from the enclosure. Targeted properties such as areas of differing elasticity or heat conductivity may be provided in this way. In addition, a wide range of different production and joining processes may be utilized to provide the properties according to the invention.
The invention further relates to a vehicle seat, a vehicle steering wheel, a battery, or a battery housing in the vehicle, a temperature-controllable beverage holder for vehicles, as well as a heat exchanger, heat store, or heat transfer unit, that includes at least one device for converting electrical energy into thermal energy according to an embodiment from the above description.
Exemplary embodiments of the invention and their advantages are explained in greater detail with reference to the appended figures. The proportions of the individual elements with respect to one another in the figures do not always correspond to the actual proportions, since some shapes are simplified, and other shapes are illustrated on a larger scale than other elements for better clarity. Identical reference numerals are used for similar or functionally equivalent elements of the invention. In addition, for the sake of clarity, only reference numerals that are necessary for describing the particular figure are illustrated in the individual figures. The illustrated embodiments merely represent examples of how the device according to the invention may be configured, and do not constitute a definitive delimitation.
The openings 36 are each situated in convexly curved edge or corner areas 38 of the functional section 32 of the part 28, since such a type of arrangement of the openings 36 allows a stable fastening option for the device 20 for converting electrical energy into thermal energy or for the part 28. In addition, in the embodiment variant in
According to the embodiment of the functional section 32 of the part 28 in
In addition, the functional section 32 of the part 28 includes a first arched structure 40′ having a reversibly elastically deformable design, at least in areas. Furthermore, the functional section 32 includes a second arched structure 40″ which in cooperation with an element 58 that encloses a fluid forms a sealing unit. The first arched structure 40′ and the second arched structure 40″ surround the layer 6 of multiple semiconductor elements 4 or its region 6′″ at a certain distance therefrom. The sectional illustration D-D depicts once again the first and second arched structures 40′ and 40″ of the functional section 32 of the part 28.
In the embodiment variant of the device 20 for converting electrical energy into thermal energy according to
The functional sections 32′ and 32″ each have a first arched structure 40′ and a second arched structure 40″. The first arched structure 40′ is situated in the area of the layer 6 and 6″ of multiple semiconductor elements 4′. The functional sections 32′ and 32″ have a reversibly elastically deformable design in the area of the arched structure 40′ and 40″, respectively, thus allowing resiliency of the part 28. This reversible elastic deformability of the functional sections 32′ and 32″ is advantageous when the part 26 has a nonflat or nonlinear cross section, since a stable, secure arrangement of the layers 6′ and 6″ of multiple semiconductor elements 4 is thus made possible by the reversible elastic deformability. The functional sections 32′ and 32″ cooperate with the wall 58 of the channel for fluid 48 or the partition wall 54 in the area of the second arched structure 40″, thus forming a sealing unit in each case. The layers 6′ and 6″ of multiple semiconductor elements 4 are thus sealed off from the fluid. The arched structures 40″ of the first and second functional section 32′ and 32″ may be designed as a shared arched structure 40″ in the area of the partition wall 54.
Reversible elastic deformability of the part 28 in the area of the arched structure 40 is also indicated in
The invention has been described with reference to one preferred embodiment. However, it is conceivable for those skilled in the art to make use of modifications or changes to the invention without departing from the scope of protection of the claims set forth below.
Number | Date | Country | Kind |
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10 2016 006 063.8 | May 2016 | DE | national |
Filing Document | Filing Date | Country | Kind |
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PCT/DE2017/000119 | 5/2/2017 | WO | 00 |