The present invention relates to a device for patterning an optical element, more particularly, to a device having a single shaft and multiple cutting tools in which device the cutting forces of the cutting tools applied onto the optical element can be adjusted by weight sliding blocks.
With rapid advancement of the fabrication technology of a thin film transistor liquid crystal display (TFT-LCD), the LCD is largely applied in various electronic products such as a Personal Digital Assistant (PDA) device, a notebook computer, a digital camera, a video camera, and a mobile phone due to the fact it has advantages of smaller size, lighter weight, lower power consumption and low radiation. Moreover, since the related manufacturers aggressively invest in research & development and employ large-scale fabricating equipment, the quality of the LCD is unceasingly improved and the price thereof is continuously decreased. This promptly broadens the applied fields of the LCD.
Since the LCD is not a light-emitting display apparatus, it performs a display function with the aid of a back light module. Please refer to
U.S. patent application Ser. Nos. 09/766,774 and 09/766,914 disclose two inventions relating to methods and apparatuses for patterning the bottom surface of a light guiding plate. In the disclosure, a plurality of pins of a V-cutter are inserted into the surface of the light guiding plate in a certain depth. A driver is used to drive the V-cutter in motion relative to the light guiding plate in a certain direction, so that a plurality of V-shaped grooves are formed by the pins on the surface of the light guiding plate. The pattern density of the grooves on the surface of the light guiding plate is gradually increased from one end nearer the lamp to the other end far away from the lamp, so that the uniformity of the light dispersed from the light guiding plate is increased.
However, the light guiding plate is fixed to a predetermined position in the prior art and a plurality of the V-shaped grooves are formed on the surface of the light guiding plate by driving the cutter. The pattern quality of these grooves is affected by the cutter due to vibration during the continuous scraping process. Moreover, the pins are fixed to the conventional cutter, the pattern of these grooves formed by the cutter is also fixed. The shape, density, or depth of grooves formed by the cutter are fixed. Sometimes, U-shaped grooves might be better than V-shaped grooves for some kinds of light guiding plates. In addition, the density and depth of these grooves may need to be adjusted because of different materials of the light guiding plates or non-uniform brightness of lamps. However, the conventional device for patterning light guiding plates cannot provide the above-mentioned functions, and thus affects the quality of the back light module.
In view of the above, those skilled in this art endeavor to improve the apparatus for patterning the optical elements such as a light guiding plate and an optical film, etc. so as to form patterns on the optical element with better quality, and thus to solve the problems occurred in the prior art.
The primary objective of the present invention is to provide a device for patterning an optical element, which device can adjust the cutting tools thereof and produce uniform patterns on the optical element. Therefore, a back light module of a display with such an optical element can have better optical quality.
The second objective of the present invention is to provide a device for patterning an optical element, wherein the cutting tools of the device are moveable and adjustable. Therefore, the shape, density and depth of the cutting tools can be changed to form desired patterns on the optical element.
The device disclosed in this invention includes a working platform, a linear cutting pedestal, at least a cutting tool, at least a weight sliding block and a shaft. An optical element to be patterned is carried on the working platform. The optical element can be a light guiding plate or a diffusion film. The working platform is driven to move linearly and horizontally. The linear cutting pedestal is mounted above the working platform. An upper sliding track in which the weight sliding blocks can move back and forth is disposed at the top of the linear cutting pedestal. A lower sliding track in which the cutting tools can move back and forth is disposed at the bottom of the linear cutting pedestal. Each of the weight sliding blocks disposed at a specific position on the linear cutting pedestal corresponding to each of the cutting tools has a specific weight and produces a press force in a certain extent. Hence, in the device of this invention, the shape of the cutting tools can be modified, or the density and depth thereof can be adjusted according to the desired patterns for the optical element. The shaft is positioned above the linear cutting pedestal and drives the linear cutting pedestal to move vertically.
Adjustment of the cutting tools in shape, density and depth is firstly carried out based on patterns desired for the optical element. Then, the weight sliding blocks are adjusted to appropriate positions corresponding to the cutting tools such that each of the cutting tools at the bottom of the linear cutting pedestal can provide a uniform final press force to the optical element. Afterwards, the linear cutting pedestal is driven to cut out uniform grooves on the optical element. Therefore, the back light module of the display with the optical element has enhanced optical quality.
The foregoing aspects and many of the attendant advantages of this invention will become more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:
The present invention relates to a device for patterning an optical element wherein the optical element is a light guiding plate or a diffusion film, etc. In this invention, the best mode in which a light guiding plate is used as the optical element is described below in detail.
Please refer to
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Moreover, the shape of the cutting tools 23 in this invention can be modified, and the density and depth of cutting tools 23 can also be adjusted for the light guiding plate 26. The cutting tool 23 can be a V shape or a U shape, as shown in FIG. 4. The adjustment in the density of the cutting tools 23 is related to the arrangement of the cutting tools 23 in the lower sliding track 222. After each of the cutting tools 23 is moved to an appropriate position, it is fixed with a fixer 27. The fixer 27 can be a bolt or clamp, etc. The depth of the cutting tool 23 can be adjusted with a pad 28, as shown in FIG. 5. Furthermore, the shaft 25 positioned in the middle above the linear cutting pedestal 22 can drive the linear cutting pedestal 22 to move vertically (i.e. Z direction).
First, the liner cutting pedestal 22 is moved downwardly by the shaft 25 so that the cutting tools 23 at the bottom of the linear cutting pedestal 22 can insert into the light guiding plate 26 by an appropriate depth. Then, the shaft 25 is fixed. Afterwards, the working platform 21 and the light guiding plate 26 is driven by the X driving device (or the Y driving device) to move linearly in the X direction (or in the Y direction) so that the cutting tools 23 can cut out grooves on the light guiding plate 26.
It is noted from the above-mentioned that the patterning device of this invention has the following advantages.
1. When the cutting tools cut out grooves on the light guiding plate, the linear cutting pedestal is fixed to the patterning device, and the working platform and the light guide plate are drove to move. Thus, the vibration of the cutting tool during the cutting process is smaller. In the prior art, the light guiding plate is fixed and the cutter is moved, and thus the vibration of the cutter is larger. Hence, this invention can reduce vibration during cutting and obtain patterns of better quality.
2. The fixers of the cutting tools in the lower sliding track can be adjusted according to a desired pattern density. Therefore, the patterning device of this invention can form patterns of different densities. Conversely, the pins of the cutter in the prior art are fixed and the pattern density is unchangeable.
3. The cutting tools in the linear cutting pedestal can be replaced in the invention. Therefore, the shape of the cutting tools can be changed according to the desired groove shape. In the prior art, the pins are fixed to the cutter and the groove shape is also fixed.
4. The linear cutting pedestal of this invention has the function of adjusting the depth of the cutting tools in the light guiding plate by means of adding pads such that grooves of different depths are formed on the light guiding plate. However, the depth of grooves formed in the prior art is unchangeable.
5. The press force of the linear cutting pedestal varies according the position of the weight sliding blocks, such that the cutting tools at the bottom of the linear cutting pedestal can produce uniform cutting forces to cut the light guiding plate. Therefore, the patterns of better quality can be obtained.
Further, referring to
As is understood by a person skilled in the art, the foregoing preferred embodiment of the present invention is illustrated of the present invention rather than limiting of the present invention. It is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims, the scope of which should be accorded the broadest interpretation so as to encompass all such modifications and similar structure.
Number | Date | Country | Kind |
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91137717 A | Dec 2002 | TW | national |
Number | Name | Date | Kind |
---|---|---|---|
6239851 | Hatazawa et al. | May 2001 | B1 |
6398610 | Inoue | Jun 2002 | B1 |
6619175 | Yoo | Sep 2003 | B2 |
20020056355 | Yoo | May 2002 | A1 |
20020059860 | Yoo | May 2002 | A1 |
Number | Date | Country | |
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20040149117 A1 | Aug 2004 | US |