The invention relates to a device for positioning a tool in relation to a workpiece.
U.S. Pat. No. 4,187,051 shows a device for positioning a tool in relation to a workpiece with three drives for positioning the tool relative to the workpiece along at least three spatial axes. The position of the workpiece is determined with the aid of two cameras which are each oriented along a spatial axis, the two spatial axes being perpendicular to each other. The cameras react to light/dark contrasts and thus detect the position and orientation of the workpiece. One of the cameras determines a coarse position image while the other detects a high-resolution image for precision positioning. Drives move both cameras and the tool, a gripping arm in this case. The position detection is effected in that the cameras are moved until the image picked up corresponds with a stored image. The tool coupled with drives is thus then correctly oriented relative to the workpiece.
U.S. Pat. No. 5,501,388 describes a bonding device which has a single camera for detection of a workpiece. Used for bonding is a capillary which supplies pieces of material to the workpiece.
EP 0 859 681 B1 shows a device for relative positioning of a capillary as a tool and of a workpiece by means of drives which enable a relative motion along three cartesian spatial axes.
It is customary with machine tools to control the drives for the individual spatial axes through stepping motors, the increments of the stepping motors then being counted which is a measure for the position. For precise machining, however, extremely accurate clamping of the workpiece is also necessary then.
An important field of application for the invention is the application of pieces of material to a workpiece.
For the purposes of the invention, pieces of material can be pieces of any material in solid or liquid form. It can be a solderable material such as gold, copper, tin, glass or a plastic which are, in particular, micro-size pieces of material in the form of solder pellets, glass globules or plastic globules. It can also be pieces of ceramic or components such as miniature circuits, surface mounted devices or the like. Generally speaking, any material can be applied with the invention.
The application of pieces of material such as solder pellets in the form of so-called bumpers also requires a maximum of precision in the positioning of the workpiece such as a capillary which feeds the solder pellets. Accordingly, clamping of the workpieces is quite costly because it directly determines the accuracy of the work. A maximum of tool positioning accuracy is often also required in other operations such as the assembly of components on printed boards, the removal of soldered joints from boards, etc.
It is thus the object of the invention to improve the device so as to reduce the amount of work needed for clamping the workpieces while still maintaining the required accuracy of positioning.
This object is achieved by the features indicated in patent claim 1. Advantageous developments of the invention can be seen in the sub-claims.
The basic principle of the invention consists in the control of the relative positioning through cameras. The accuracy of the workpiece clamping then has no influence on the operating accuracy since the positioning of the tool is controlled through cameras which orient themselves on the workpiece itself, particularly on its edges.
The invention is explained in more detail below by means of example embodiments in connection with the drawing in which:
The same reference symbols in the individual figures designate the same or functionally equivalent parts.
Although the example embodiments in
Reference is first made to
The solder is fed to the workpiece at the tip 5 of the capillary 1 and melted there in a conventional way by a laser impulse. Here, the workpiece 6 has two surfaces 7 and 8 which are vertical with respect to each other, the workpiece being clamped so that the intersection line of the two surfaces 7 and 8 are in precisely one axis, here the y-axis. The surfaces 7 and 8 are thus each at an angle of 45 degrees to the x-y plane.
The drives 2, 3 and 4 arc now to be controlled so that the tip 5 of the capillary is positioned at preset points 9 of the workpiece 6 so that a solder pellet is applied there and a “bumper” is soldered on. To control the drives, two cameras 10 and 11 are provided, the images of which are analyzed by a control unit resulting in control commands for the drives 2, 3 and 4.
One camera, here camera 10, is oriented essentially on the y-axis. It is thus used to detect the relative position between the tip 5 of the capillary 1 and the workpiece 6 with respect to the x-z plane. The processing of the images of the camera is effected through edge recognition. The camera 10 thus essentially detects an image of the two edges 13 and 14 of surfaces 7 and 8 facing it as well as the tip 5 of the capillary 1.
The second camera 11 is positioned so that it is oriented vertically with respect to a surface 8 of the workpiece. It is thus used to monitor the relative position between the capillary and workpiece relative to the y-axis and to control the drive 3 for this axis. The image analyzer can analyze the edge 14 of the surface 8 here or also the contour of the place 9 where the solder is to be applied.
In the example embodiment shown in
The camera 11 is again oriented in the same way as in the example embodiment of
In the example embodiment of
The camera 11 is again positioned vertical to the plane 8 of the workpiece 6.
Number | Date | Country | Kind |
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100 49 584 | Oct 2000 | DE | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/EP01/11422 | 10/2/2001 | WO | 00 | 6/20/2003 |
Publishing Document | Publishing Date | Country | Kind |
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WO02/28590 | 4/11/2002 | WO | A |
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Number | Date | Country |
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0 859 681 | Aug 1998 | EP |
1 014 438 | Jun 2000 | EP |
Number | Date | Country | |
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20040129756 A1 | Jul 2004 | US |