| Number | Date | Country | Kind |
|---|---|---|---|
| 100 50 371 | Oct 2000 | DE |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/DE01/03730 | WO | 00 |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO02/31949 | 4/18/2002 | WO | A |
| Number | Name | Date | Kind |
|---|---|---|---|
| 4336441 | Godai et al. | Jun 1982 | A |
| 4687525 | Biniasz et al. | Aug 1987 | A |
| 5030863 | Yoshimura et al. | Jul 1991 | A |
| 5407331 | Atsumi | Apr 1995 | A |
| 5710469 | Ries | Jan 1998 | A |
| 5777420 | Gamble et al. | Jul 1998 | A |
| 6255005 | Yokoyama et al. | Jul 2001 | B1 |
| Number | Date | Country |
|---|---|---|
| U 94 03 202.5 | May 1995 | DE |
| 198 13 211 | Oct 1999 | DE |
| 380805 | Sep 1932 | GB |
| 2-254962 | Oct 1990 | JP |
| WO 9608830 | Mar 1996 | WO |
| Entry |
|---|
| Reed, R., “Materials at Low Temperatures”, American Society for Metals, 1983, pp. 259, 388-389, month unknown. |
| Japanese Patent Abstract 02-254962, Oct. 1990. |
| Reed, R., “Materials at Low Temperatures”, American Society for Metals, 1983, pp. 259, 388-389. |