This patent application is based on and claims priority pursuant to 35 U.S.C. § 119(a) to Japanese Patent Application Nos. 2021-112421, filed on Jul. 6, 2021, and 2022-086916, filed on May 27, 2022, in the Japan Patent Office, the entire disclosure of which is hereby incorporated by reference herein.
Embodiments of the present disclosure relate to a diagnostic system, a diagnostic method, and a recording medium.
For grasping a machining state of a machine tool or detecting a cutting abnormality in machining on a workpiece by the machine tool or the like, there is proposed a method of sensing vibration or the like of the machine tool.
For determining such an abnormality or the like in a machining state, there is known an apparatus that discriminates processing steps, groups the same type of processing steps, and determines a machining abnormality for each group.
In one aspect, a diagnostic system includes a tool to perform machining on a workpiece, a test piece to be subjected to test machining by the tool for abnormal detection, a sensor to generate sensor data representing a physical quantity generated in the test machining, and circuitry. The test piece is different from the workpiece. The circuitry controls the tool to perform the test machining in each cycle of machining on the workpiece and calculates a degree of abnormality from the sensor data of the test machining. The test machining is performed on the test piece under a test machining condition corresponding to a machining condition of the machining on the workpiece.
In another aspect, a diagnostic method includes performing, with a tool, test machining on a test piece for abnormal detection in each machining cycle on a workpiece subjected to machining by the tool; receiving, from a sensor, sensor data representing a physical quantity generated in the test machining on the test piece; and calculating a degree of abnormality from the sensor data of the test machining on the test piece. The test piece is different from the workpiece, the test machining being performed on the test piece under a test machining condition corresponding to a machining condition of the machining on the workpiece.
In another aspect, a non-transitory recording medium stores a plurality of program codes which, when executed by one or more processors, causes the processors to perform the method described above.
A more complete appreciation of the disclosure and many of the attendant advantages and features thereof can be readily obtained and understood from the following detailed description with reference to the accompanying drawings, wherein:
The accompanying drawings are intended to depict embodiments of the present invention and should not be interpreted to limit the scope thereof. The accompanying drawings are not to be considered as drawn to scale unless explicitly noted. Also, identical or similar reference numerals designate identical or similar components throughout the several views.
In describing embodiments illustrated in the drawings, specific terminology is employed for the sake of clarity. However, the disclosure of this specification is not intended to be limited to the specific terminology so selected and it is to be understood that each specific element includes all technical equivalents that have a similar function, operate in a similar manner, and achieve a similar result.
Referring now to the drawings, embodiments of the present disclosure are described below. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Descriptions are given below in detail of a diagnostic system and a diagnostic method according to embodiments of the present disclosure, with reference to the drawings. The present disclosure, however, is not limited to the following one or more embodiments, and elements of the following one or more embodiments include elements that may be easily conceived by those skilled in the art, those being substantially the same ones, and those being within equivalent ranges. Furthermore, various omissions, substitutions, changes, and combinations of the constituent elements may be made without departing from the gist of the following one or more embodiments.
Overview of Configuration of Diagnostic System
As illustrated in
The state monitoring apparatus 100 is an apparatus that is connected to the machine 200 to communicate with each other and monitors the state of the operation of the machine 200.
The machine 200 is a machine tool that uses a tool 500 to perform machining such as cutting, grinding, or polishing on an object (workpiece) to be machined. The machine 200 is an example of a machine to be monitored by the state monitoring apparatus 100. The subject of monitoring is not limited to a machine tool and may be any machine to be monitored, such as assembling machine, a measuring machine, an inspection machine, or a cleaning machine. Hereinafter, the machine 200 will be described as an example of the subject of monitoring.
The machine 200 includes the tool 500, a sensor 201 installed in the machine 200, and a controller 202 that controls the machine 200.
The tool 500 is a drill, an end mill, a cutting tool tip, a grindstone, or the like. The tool 500 performs various types of machining on a workpiece described later.
The sensor 201 detects a physical quantity and outputs the detected physical quantity information as a detection result (sensor data) to the state monitoring apparatus 100. The physical quantity detected is vibration, sound, or the like generated when the tool 500 (such as a drill, end mill, cutting tool tip, or grindstone) installed in the machine 200 contacts the workpiece to be machined during the processing, or vibration, sound, or the like generated by the tool 500 or the machine 200 itself. The sensor 201 is, for example, a microphone, a vibration sensor, an accelerometer, or an acoustic emission (AE) sensor and is installed adjacent to the tool 500 or adjacent to a motor of the machine 2003, so as to detect the vibration, the sound, or the like. The sensor 201 outputs waveform data as measurement data to the state monitoring apparatus 100.
The controller 202 outputs, to the state monitoring apparatus 100, as operation information of the machine 200, information such as a spindle rotation speed, a feed speed, a spindle coordinate value, and a current value of the spindle at the time of machining. The controller 202 further outputs, to the state monitoring apparatus 100, a type of the tool 500, a manufacturer of the tool 500, and a diameter of the tool 500 when the user has inputted such information.
The machine 200 and the state monitoring apparatus 100 may be connected in any connection form. For example, the machine 200 and the state monitoring apparatus 100 may be connected by a dedicated connection line, a wired network such as a wired local area network (LAN), a wireless network, or the like.
Note that any number of sensors 201 may be used. The machine 200 may be provided with a plurality of sensors 201 of the same type to detect the same physical quantity or a plurality of sensors 201 of different types to detect different physical quantities.
The sensor 201 and the controller 202 may be incorporated in advance in the machine 200 or may be attached to the machine 200 being a finished product.
Hardware Configuration of Machine Tool
As illustrated in
The sensor 201 is connected to the state monitoring apparatus 100 to communicate with each other.
The CPU 51 is a processor that controls the entire operation of the machine 200. The CPU 51 executes a program stored in the ROM 52 or the like using, for example, the RAM 53 as a work area, to control the entire operation of the machine 200 and implement machining functions.
The communication I/F 54 is an interface for communicating with external devices such as the state monitoring apparatus 100. The drive control circuit 55 is a circuit that controls the drive of the motor 56. The motor 56 drives the tool 500 used in machining. Examples of the tool 500 includes a drill, an end mill, a cutting tool tip, a grindstone, and a table that supports an object to be machined and moves corresponding to the machining. The sensor 201 is as described above.
Hardware Configuration of State Monitoring Apparatus
As illustrated in
The CPU 61 is a processor that controls the entire operation of the state monitoring apparatus 100. The CPU 61 executes a program stored in the ROM 62 or the like using, for example, the RAM 63 as a work area, to control the entire operation of the state monitoring apparatus 100 and implement various state monitoring functions.
The communication I/F 64 is an interface for communication with an external apparatus such as the machine 200. The communication I/F 64 is, for example, a network interface card (NIC) in compliance with transmission control protocol/internet protocol (TCP/IP).
The sensor I/F 65 is an interface for receiving a detection result from the sensor 201 installed in the machine 200.
The auxiliary memory 66 is a non-volatile memory such as a hard disk drive (HDD), a solid state drive (SSD), or an electrically erasable programmable read-only memory (EEPROM). The auxiliary memory 66 stores various data such as setting information of the state monitoring apparatus 100, detection results and context information received from the machine 200, an operating system (OS), and an application program. The auxiliary memory 66 is a memory of the state monitoring apparatus 100 but is not limited thereto. For example, the auxiliary memory 66 may be a storage device outside the state monitoring apparatus 100 or a storage device included in a server that performs data communication with the state monitoring apparatus 100.
The input device 67 is, for example, a mouse or keyboard for inputting characters and numbers, selecting an instruction, and moving a cursor.
The display 68 is, for example, a cathode ray tube (CRT) display, a liquid crystal display (LCD), or an organic electro luminescence (EL) display that displays characters, numbers, various screens, operation icons, and the like.
Note that the hardware configuration illustrated in
Configuration and Operation of Functional Blocks of State Monitoring Apparatus and Machine
As illustrated in
As illustrated in
The collection unit 101 receives operation information from the controller 202 and information such as measured waveform from the sensor 201. The collection unit 101 associates e.g., the waveform measured by the sensor 201 with the operation information of the machine 200 based on the received information. As one example, the collection unit 101 stores in an auxiliary memory the measured waveform and the time at which the operation information of the machine 200 (such as the tool number, the sequence number, or the spindle rotation speed) is received and synchronizes the waveform with the respective times, in order to associate the waveform with the operation information. The collection unit 101 transmits the associated data to the signal processing unit 102.
The signal processing unit 102 performs predetermined pre-processing. The signal processing unit 102 transmits the pre-processed measurement data and operation information to the feature value calculation unit 103.
The feature value calculation unit 103 calculates a feature value of machining, to be used in determination by the determination unit 104, from the pre-processed measurement data and the operation information. The feature value calculation unit 103 transmits the feature value of machining to the determination unit 104. The feature value of machining may be any information that indicates a feature of the information (e.g., detection result) from the sensor 201. For example, when the detection result from the sensor 201 is acoustic data collected by a microphone, the feature value calculation unit 103 may calculate, as a feature value of machining, energy, a frequency spectrum, or mel-frequency cepstrum coefficients (MFCC).
The determination unit 104 calculates a degree of abnormality based on the feature value of machining. The degree of abnormality is calculated in accordance with the subject for abnormality detection (such as the workpiece, the tool 500, the motor of the machine 200, and the spindle of the machine 200). Specifically, the determination unit 104 calculates the degree of abnormality using, for example, thresholding or machine learning based on the feature value of machining Examples of machine learning include support vector machine (SVM) and neural network. Note that the method for determining the degree of abnormality is not limited thereto and may be any method for calculating the degree of abnormality from the feature value. For example, instead of directly comparing the degree of abnormality with a threshold value, a value indicating fluctuations in the abnormality degree may be compared with a threshold value. The determination unit 104 transmits the degree of abnormality to the machine operation determination unit 105 and the storing unit 106.
The storing unit 106 stores, in a memory, the degree of abnormality calculated by the determination unit 104 in association with the operation information of the machine 200.
Alternatively, the operation unit 107 may receive the degree of abnormality, instead of acquiring the degree of abnormality from the determination unit 104. The operation unit 107 receives an abnormality degree input from the input device 67 such as a keyboard or a touch panel, and the storing unit 106 stores the abnormality degree in association with operation information of the machine 200.
The machine operation determination unit 105, which is an operation determination unit, determines the action for the machine 200 (tool 500) to be performed, in accordance with the degree of abnormality calculated by the determination unit 104 or the degree of abnormality stored in the storing unit 106. For example, when the degree of abnormality indicates a significant difference from the degrees of abnormality in similar machining processes performed so far, the machine operation determination unit 105 determines the action for the machine 200 (tool 500) such as immediately stopping the machining and sending a command to the controller 202 of the machine 200.
Next, a machining program for general cutting machining will be described.
Next, a description is given of a case in which machining is different for each cycle in single-article machining.
Therefore, in the present embodiment, the machine 200 is provided with a test piece (test workpiece) for abnormality diagnostic measurement, separately from the workpiece to be machined.
The test piece 400 may include a built-in sensor 201, or the sensor 201 may be attached to the test piece 400. The sensor 201 provided to the test piece 400 transmits the sensed physical quantity to the state monitoring apparatus 100. Use of the test piece 400 in this manner enables reliable executing of the same machining for each machining cycle even in single-article machining and enables abnormality diagnosis of the tool 500. Details will be described later.
The machining on the test piece 400 is designed to be physically the same as the machining performed on the workpiece 300 (to become a product) in the machine 200. With this configuration, the abnormality detection method for, such as, a factory line in which the same machining is repeatedly performed is also applicable to small quantity machining such as die machining and to machining of various kinds of small-quantity articles. Desirably, for comparison, the machining on the test piece 400 and the machining on the workpiece 300 are performed under the same machining conditions. However, the machining of the test piece 400 may be simplified depending on the complexity of the machining process and the state of the workpiece 300. However, regarding the machining process repeatedly performed on the test piece 400 by the same tool 500, the tool 500 repeatedly performs the machining process on the test piece 400 under the same machining conditions.
Types of machining on the test piece 400 will be described.
Note that, depending on the type or diameter of the tool 500 to be used, the physical quantity to be sensed may significantly differ due to a difference in the machining position such as the side face and the central portion of the test piece 400. Then, abnormality may not be properly determined. As illustrated in
Next, replacement of the test piece 400 will be described.
As described above, the test piece 400 does not need to be replaced each of test machining on the test piece 400, and the machine operation determination unit 105 of the state monitoring apparatus 100 may issue the replacement command as appropriate.
Next, a description is given of an abnormality diagnosis using the test piece 400, performed by the state monitoring apparatus 100.
As illustrated in
The order of machining on the test piece 400 is not limited to the head of the machining process but may be any timing such as during or after the machining process performed by the same tool 500.
The sensor 201 of the test piece 400 transmits the sensed time-series data to the state monitoring apparatus 100. The collection unit 101 collects machining information of each test machining process on the test piece 400 and associates the machining information with the sensor data. As a result, grouped time-series data of the same machining information is obtained from the data of test machining processes.
A description is given of an example of calculation of the degree of abnormality by the determination unit 104 of the state monitoring apparatus 100.
The waveform score Ga represents waveform data detected by the sensor 201.
The machining section Gb is data indicating a section during which the machine 200 performs a predetermined operation (for example, corresponds to a time during which the machine 200 actually cuts a workpiece). Note that, relative to the machining section Gb, a time x in
The abnormal machining score Gc is data indicating the degree of abnormality calculated by the determination unit 104. The abnormal machining score Gc in
In the present embodiment, when the degree of abnormality calculated by the determination unit 104 exceeds the threshold value t, the error alert E for abnormality notification is displayed on the GUI screen. However, abnormality notification is not limited thereto, and a text or an icon indicating abnormal or normal may be displayed on the GUI screen.
Further, the abnormality notification is not limited to the display of the error alert E on the GUI screen. In one example, the determination unit 104 of the state monitoring apparatus 100 has a function of outputting a notification to the controller 202 of the machine 200. Then, the determination unit 104 of the state monitoring apparatus 100 transmits an abnormality notification to the controller 202 of the machine 200 when the degree of abnormality calculated by the determination unit 104 exceeds the threshold value t. For example, the controller 202 of the machine 200 receives the abnormality notification and stops the machining or turns on a rotary beacon light of the machine 200 according to a program.
Next, an example of operation using an abnormality detection result based on a machined portion of the test piece 400 will be described.
As described above, the machine operation determination unit 105 of the state monitoring apparatus 100 has the function of sending, to the machine 200, a command based on the degree of abnormality of the machined portion of the test piece 400.
As illustrated in
The determination unit 104 of the state monitoring apparatus 100 uses, as an index, for example, determination of wear, breakage, or chipping of the tool 500, or a degree of change from the previous degree of abnormality in the determination of the degree of abnormality of the machined portion of the test piece 400.
As illustrated in
Next, descriptions are given of the movement of the tool 500 in the machine 200 that performs a test machining process on the test piece 400 and an actual machining process on the workpiece 300.
In
As described above, in the present embodiment, in the case of machining of various kinds of small-quantity articles, a test workpiece (test piece) for tool abnormality detection is prepared in addition to a workpiece to be actually machined, and the test piece is machined at a timing desired for abnormality detection, to acquire vibration (and other sensing signals) for abnormality detection regardless of the actual workpiece. Then, abnormality determination is performed using the data of test piece machining. As a result, abnormality detection is efficiently performed even in machining of various kinds of small-quantity articles.
The program executed in the state monitoring apparatus 100 and the machine 200 according to the embodiment described above may be provided by being loaded in a ROM or the like in advance.
Alternatively, the program executed by the state monitoring apparatus 100 and the machine 200 according to the embodiment described above may be provided as a computer program product stored in a computer-readable recording medium, such as a compact disc read only memory (CD-ROM), a flexible disk (FD), a compact disc recordable (CD-R), and a digital versatile disk (DVD) in a file format installable or executable.
Further, the program executed by the state monitoring apparatus 100 and the machine 200 according to the embodiment described above may be stored on a computer connected to a network such as the Internet, to be downloaded via the network. Further, the computer program executed by the state monitoring apparatus 100 and the machine 200 according to the embodiment described above may be provided or distributed via a network such as the Internet.
The program executed by the state monitoring apparatus 100 and the machine 200 according to the embodiment described above is in a modular configuration including the above-described functional units. As hardware, as the CPU (a processor) reads the program from the above-mentioned ROM and executes the program, the above-described functional units are loaded and implemented (generated) in a main memory.
Aspects of the present disclosure are, for example, as follows.
Aspect 1
A diagnostic system includes a test piece to be machined by a tool for abnormal detection, a machining unit, a sensor, and a determination unit. The test piece is different from workpieces subjected to machining by the tool.
The machining unit controls the tool to perform test machining on the test piece in accordance with the machining performed on the workpiece in a given timing in each cycle of machining on the workpiece.
The sensor generates sensor data representing a physical quantity generated in the test machining on the test piece.
The determination unit calculates a degree of abnormality from the sensor data of the test machining on the test piece.
Aspect 2
The diagnostic system of aspect 1 further includes an operation determination unit that determines an action for the tool based on the degree of abnormality calculated by the determination unit and outputs a command indicating the action for the tool.
Aspect 3
In the diagnostic system according to aspect 1 or 2, the machining unit controls the tool to perform the test machining on the test piece and the machining on the workpiece in succession.
Aspect 4
In the diagnostic system according to any one of aspects 1 to 3, the determination unit calculates the degree of abnormality using learning means based on a feature value of the sensor data of the test machining on the test piece.
Aspect 5
In the diagnostic system according to any one of aspects 1 to 4, the test piece includes a material to be machined by the tool.
Aspect 6
In the diagnostic system according to any one of aspects 1 to 4, the tool is one of a plurality of tools different from each other, and the diagnostic system includes a plurality of test pieces respectively corresponding to the plurality of tools.
Aspect 7
In the diagnostic system according to any one of aspects 1 to 6, the test piece includes the sensor.
Aspect 8
The diagnostic system according to any one of aspects 1 to 7 further includes a collection unit, a signal processing unit, and a feature value calculation unit.
The collection unit collects operation information of the tool and the sensor data and associates the operation information with the sensor data. The signal processing unit performs pre-processing of the sensor data. The feature value calculation unit calculates the feature value of the pre-processed sensor data.
The determination unit calculates the degree of abnormality from the feature value calculated by the feature value calculation unit.
Aspect 9
A diagnostic method includes performing, with a tool, test machining on a test piece for abnormal detection in a given timing in each cycle of machining on a workpiece subjected to machining by the tool; receiving, from a sensor, sensor data representing a physical quantity generated in the test machining on the test piece; and calculating a degree of abnormality from the sensor data of the test machining on the test piece. The test piece is different from workpieces subjected to machining by the tool. The test machining is performed in accordance with the machining performed on the workpiece.
In another aspect, a diagnostic method includes:
collecting operation information of test machining performed on a test piece by a tool in each machining cycle on a workpiece subjected to machining by the tool, the test piece being different from the workpiece, the test machining being performed under a test machining condition corresponding to a machining condition of the machining on the workpiece;
collecting sensor data representing a physical quantity generated in the test machining;
associating the operation information of each test machining with the sensor data, to obtain a grouped time-series data of same operation information; and
calculating a degree of abnormality of the sensor data of the test machining with reference to the grouped time-series data.
The above-described embodiments are illustrative and do not limit the present invention. Thus, numerous additional modifications and variations are possible in light of the above teachings. For example, elements and/or features of different illustrative embodiments may be combined with each other and/or substituted for each other within the scope of the present invention. Any one of the above-described operations may be performed in various other ways, for example, in an order different from the one described above.
The functionality of the elements disclosed herein may be implemented using circuitry or processing circuitry which includes general purpose processors, special purpose processors, integrated circuits, application specific integrated circuits (ASICs), digital signal processors (DSPs), field programmable gate arrays (FPGAs), conventional circuitry and/or combinations thereof which are configured or programmed to perform the disclosed functionality. Processors are considered processing circuitry or circuitry as they include transistors and other circuitry therein. In the disclosure, the circuitry, units, or means are hardware that carry out or are programmed to perform the recited functionality. The hardware may be any hardware disclosed herein or otherwise known which is programmed or configured to carry out the recited functionality. When the hardware is a processor which may be considered a type of circuitry, the circuitry, means, or units are a combination of hardware and software, the software being used to configure the hardware and/or processor.
Number | Date | Country | Kind |
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2021-112421 | Jul 2021 | JP | national |
2022-086916 | May 2022 | JP | national |