BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a diamond saw blade for milling. More particularly, the present invention improves the cutting edge of the saw blade for the diamond milling.
2. Description of the Related Art
Conventionally, the diamond saw blade uses the softer and circular metal material under a mechanical rolling or a mechanical rolling through high temperature to bond the diamond grain and the rim of the annular copper body for its formation. The structure in the present invention has a well cutting performance. However, since the diamond saw blade is made of copper or other softer metal, the copper has less strength only for slow cutting. Therefore, it is easy to get deformed and damaged under high-speed cutting. Please refer to FIGS. 1 and 1A. Figures are 3-D diagrams of the prior arts showing the diamond saw blade and the diamond drill bit used by the electroplated method to bond diamond grains. The cutting edge (10a and 11a) uses circular or tubular metal material with electroplated method implemented. Moreover, the electroplated layer is increased, and the diamond grains bond to the cutting edge (10a and 11a) for forming a diamond saw blade and a diamond drill bit. The cutting edge portion is only covered with a layer of diamond grains through electroplating for milling and cutting. This, therefore, is easy to get damaged and decreases the lifecycle for milling.
FIG. 2 is another 3-D diagram of the prior art showing the diamond saw blade used by the rolling method to bond diamond grains. The rim of the circular metal plate has multiple inclined trenches (12a) for positioning diamond grains. Further, one stacks with the other for rolling the rim by the roller (13). The inclined trench (12a) is pressed and closely bonded with diamond grains for forming a diamond saw blade (12). The diamond saw blade based on the above structure was already used on precious gems before 1970. However, it does not have a long lifecycle for cutting. In order to overcome the above shortcomings, the industry developed (as shown in FIG. 3) a diamond saw blade (14) used by metal sintering. Different metal powders and diamond grains are mixed together, and then positioned on a specified jig under high temperature (650° C.˜1500° C.) and high pressure for forming a diamond grinding wheel (14a). Further, each diamond grinding wheel (14a) is welded to the rim of the circular steel (14b) with a shaft for forming a diamond saw blade (14). However, the above diamond saw blade (14) by metal sintering requires high-cost diamond grains and different kinds of metal powders for the manufacture. Besides, the manufacture of the mixture between diamond grains and metal powders will cause skin lesions to the operator. Further, the external accessories for the manufacture are extremely expensive Moreover, it requires more electrical energy thereto causing air pollution. Sometimes, the cost for manufacturing the diamond saw blade is several times more than the one used by mechanical rolling or general electroplating. Therefore, it can not meet the low cost for different industries. Further, the diamond saw blade (14) used by metal sintering (as shown in FIG. 3) has some advantages, such as no deformation on the body. However, its cutting performance is worse than the copper diamond saw blade which is used by mechanical rolling. From the above descriptions, the advantages of the mechanical rolling method and electroplated method are low manufacture cost, high cutting performance, and easy manufacture. However, the strength is insufficient as its disadvantage. The diamond saw blade (14) with metal sintering uses steel as its main body, and has better strength so it does not get deformed. However, the disadvantages are poor cutting performance, and high manufacture cost.
According to the mentioned descriptions, the above manufacture methods should be improved. The present invention, therefore, is proposed to overcome the mentioned shortcomings, such as decreasing the cost, simplifying the manufacture, and increasing the sharpness without scarifying the merits of each manufacture.
Further, the invention has a better structure, and the performance is also improved. The structure in the present invention, therefore, possesses a high cutting performance and a long lifecycle. The structure, purpose, method and spirit of the invention can refer to the following detailed description of the preferred embodiments taken in conjunction with the accompanying drawings.
SUMMARY OF THE INVENTION
The present invention relates to a saw blade for diamond milling. Please refer to FIG. 4 and FIG. 5. The rim of the circular metal (20) with a shaft or the front end of the tubular body (30) or an edge of strip metal has multiple equidistant openings (20a and 30a) for positioning the diamond grains (40). The width of the opening (20a and 30a) is slightly wider or equal to the diameter of the diamond grain (40). After the diamond grains are positioned in each opening (20a and 30a), the metal surface on both sides of each opening is pressed by the jig in two directions. As seen in FIG. 6 and FIG. 8, the metal surface on both sides of the opening is deformed by the pressure from the jig, and extrudes along the direction (as shown in FIG. 6A) of each opening (20a and 30a) for bonding diamond grains (40). Please refer to FIGS. 6, 8, and 6A. The surface forms a rugged cutting edge (201 and 301). Moreover, a diamond layer (401) with diamond grains is electroplated on the surface of the cutting edge (201 and 301) for forming a cutting edge (201 and 301) with long lifecycle and high cutting performance but no deformation, please refer to FIGS. 7, 7A and 9. Further, the electroplated diamond layer (401) of the cutting edge (201 and 301) and the bonding diamond grains (40) of each opening (20a and 30a) form the diamond saw blade (2) and the diamond drill bit (3) with a long lifecycle and high-speed cutting performance.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a 3-D diagram of the prior art showing the diamond saw blade used by the electroplated method to bond diamond grains;
FIG. 1A is a 3-D diagram of the prior art showing the diamond drill bit used by the electroplated method to bond diamond grains;
FIG. 2 is a 3-D diagram of the prior art showing the diamond saw blade used by the rolling method to bond diamond grains;
FIG. 3 is a 3-D diagram of the prior art showing the diamond saw blade used by metal sintering;
FIG. 4 is a schematic view of the present invention showing the rim of the circular metal having multiple equidistant openings for positioning diamond grains;
FIG. 5 is a schematic view of the present invention showing the front end of the tubular metal body having multiple equidistant openings for positioning diamond grains;
FIG. 6 is a 3-D diagram of the present invention showing the circular metal opening having diamond grains with bonding through jig pressure for forming a rugged cutting edge;
FIG. 6A is a partially cross-sectional view showing the circular metal opening having diamond grains with bonding through jig pressure for forming a rugged cutting edge;
FIG. 7 is a 3-D diagram of the present invention showing the diamond saw blade;
FIG. 7A is a partially cross-sectional view of the present invention showing the cutting edge of the diamond saw blade;
FIG. 8 is a 3-D diagram of the present invention showing the tubular metal opening having diamond grains with bonding through jig pressure for forming a rugged cutting edge; and
FIG. 9 is a 3-D diagram of the present invention showing the diamond drill bit.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to FIGS. 4˜9, the thickness of the electroplated diamond layer (401) in the cutting edge (201 and 301) can vary according to different purposes. Further, the electroplated metal of the electroplated layer can fill into the opening (20a and 30a) as well as load into the gap of the diamond grains. Moreover, it can increase the bonding of the diamond grains (40).
As can be seen from the present invention, it can increase the lifecycle and sharpness. The structure of the present invention is simple, and has not been published. All descriptions meet the requirements of patentability, such as utility, and novelty. The applicant follows the legal rules to apply the patent, and sincerely expects the examiner can exam the invention promptly and grants the patent right for the present application.
While the invention has been described by way of example and in terms of a preferred embodiment, it is intended to cover various modifications and similar arrangements and procedures. The scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Patent Grant
7178517
