1. Field of the Invention
The present invention generally relates to the art of microphones and, more particularly, to a diaphragm of a microphone manufactured by MEMS technology.
2. Description of Related Art
Silicon based condenser microphones, known as acoustic transducers, have been researched and developed for more than 20 years. Because of potential advantages in miniaturization, performance, reliability, environmental endurance, low cost, and mass production capability, silicon based microphones are widely recognized to be the next generation product to replace electret condenser microphones (ECM) that has been widely used in communication devices, multimedia players, and hearing aids.
A related silicon based condenser microphone comprises a backplate having a planar plate with a plurality of perforations therein, and a diaphragm parallel and opposed to the backplate for forming a capacitor. The diaphragm can be activated to move along a direction perpendicularly to the planar plate of the backplate.
The diaphragm is very important to the silicon based condenser microphone. In general, the diaphragm is supported by some fixing members distributing at the periphery of the diaphragm symmetrically. But it is difficult to release stress of the diaphragm of such structure, which will influence the sensitivity and coherence of the microphone. The present invention is provided to solve the problems mentioned above.
Reference will now be made to describe the exemplary embodiment of the present invention in detail.
Electronic devices, especially portable devices, such as mobile phones generally use condenser microphones for receiving sound waves and then converting the sound waves to electrical signals. Referring to
Referring to
Along a direction perpendicularly to the vibrating member 11, the first groove 14 has an opening in the first surface 121 and the second surface 122, respectively. The second groove 15 may also has an opening in the first surface 121 and the second surface 122, respectively.
Alternatively, the first groove 14 may have an opening in the first surface or in the second surface and a bottom between the first surface and the second surface, and the second groove 15 may has an opening in the first surface or in the second surface and a bottom between the first surface and the second surface. It is preferable that a depth of the first groove 14 or the second groove 15 is half a distance from the first surface 121 to the second surface 122.
In fact, the diaphragm 10 may be described in another manner, as follows. Referring to
Because of the structure of the diaphragm mentioned above, it can free a stress by minishing a stress grads which other structure layers acting to the diaphragm and improve a sensitivity by minishing a rigidity of the diaphragm. It also improves a rigidity of a flexuosity in order to improve a reliability and a ratio of the finished product in such structure. Such structure of the diaphragm mentioned above also optimize a damp of the diaphragm to enhance accacoustic performance.
While the present invention has been described with reference to the specific embodiment, the description of the invention is illustrative and is not to be construed as limiting the invention. Various of modifications to the present invention can be made to the embodiment by those skilled in the art without departing from the true spirit and scope of the invention as defined by the appended claims.
Number | Date | Country | Kind |
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201010153569.3 | Apr 2010 | CN | national |