1. Field of the Invention
The present invention relates generally to micro-electroacoustic devices, and more particularly to a diaphragm structure for a micro-electroacoustic device.
2. Description of Related Art
Sound is one important means by which people communicate with each other, thus creating new methods for sound transference which allows greater communication between people. Electroacoustic transducers are key components in transferring sound. A typical electroacoustic transducer has a magnetic circuit in which a magnetic field generated by a magnet passes through a base member, a magnetic core and a diaphragm structure and returns to the magnet again. When an oscillating electric current is supplied to a coil wound around the magnetic core, the corresponding oscillating magnetic field generated by the coil is then superimposed onto the magnetostatic field of the magnetic circuit. The resulting oscillation generated in the diaphragm structure is then transmitted to the air as sound. The basic loudspeaker, in which electric energy is converted to acoustic energy, is a typical electroacoustic transducer. There are many different types of loudspeakers, including electrostatic loudspeakers, piezoelectric loudspeakers, and moving-coil loudspeakers.
Nowadays, mobile phones are widely used and loudspeakers are important components packaged within mobile phones. As design style for mobile phones emphasizes lightness, thinness, shortness, smallness, energy-efficiency, low cost, the space available for loudspeakers within mobile phones is therefore limited. Furthermore, as more and more mobile phones are being used to play MP3s, the rated power of the loudspeakers needs to increase. The space occupied by a loudspeaker mainly depends on the maximum deformation displacement of an oscillating diaphragm of the loudspeaker.
Therefore, it is desired to design a new diaphragm structure for micro-electroacoustic transducers which may undergo an increased power to generate louder sound while occupying a smaller amount of space.
The present invention relates, in one aspect, to a diaphragm structure for a micro-electroacoustic device. The diaphragm structure includes an oscillating diaphragm, and a strengthening member superposed on and surrounding a periphery of the oscillating diaphragm. The oscillating diaphragm includes an oscillating part and a joint part surrounding and integrally formed with the oscillating part. The strengthening member is pressed on the joint part of the oscillating diaphragm so as to increase rigidity of the diaphragm structure.
The present invention relates, in another aspect, to a method for manufacturing the diaphragm structure. The method includes the steps of: providing a piece of polymeric membrane and the strengthening member; putting the polymeric membrane and the strengthening member into a hot-press mold; heating the polymeric membrane and the strengthening member to a temperature which is higher than a softening temperature of the polymeric membrane but lower than a softening temperature of the strengthening member; heat pressing an indent in the polymeric membrane so as to form the oscillating part and the joint part of the oscillating diaphragm and heat pressing the strengthening member onto the oscillating diaphragm so as to obtain a rough diaphragm structure; cooling the rough diaphragm structure while it is in the mold so that a residual stress is obtained in the rough diaphragm; separating the mold and pushing the rough diaphragm structure out of the mold; obtaining the diaphragm structure.
Other advantages and novel features of the present invention will become more apparent from the following detailed description of preferred embodiments when taken in conjunction with the accompanying drawings, in which:
Reference will now be made to the drawing figures to describe the preferred embodiment in detail.
Referring to
Referring to
Table 1 shows the maximum deformation displacements of different diaphragm structures, i.e., diaphragm structures of
From table 1, one can conclude that if the diaphragm structures undergo the same power, the maximum deformation displacement of the diaphragm structure 10 of
In addition, the present invention also provides a method for manufacturing the diaphragm structure 10. The method includes the steps of: providing a piece of polymeric membrane and the strengthening member 13; putting the polymeric membrane and the strengthening member 13 into a hot-press mold; heating the polymeric membrane and the strengthening member 13 to a temperature which is higher than a softening temperature of the polymeric membrane but lower than a softening temperature of the strengthening member 13; pressing a plate-like indent in the polymeric membrane so as to form the oscillating part 110 and the joint part 111 of the oscillating diaphragm 11; pressing the oscillating diaphragm 11 to the strengthening member 13 so as to obtain a rough diaphragm structure 10; cooling the rough diaphragm structure 10 to a temperature which is 10 to 100° C. lower than the softening temperature of the oscillating diaphragm 11 or cooling the rough diaphragm structure 10 to room temperature whereby a residual stress is existed in the rough diaphragm structure 10; separating the mold and taking the rough diaphragm structure 10 out of the mold; obtaining the diaphragm structure 10.
During manufacturing of the diaphragm structure 10, when the oscillating diaphragm 11 and the strengthening member 13 are heated, the oscillating diaphragm 11 is expanded. The strengthening member 13 which is firmly compressed in the mold blocks the oscillating diaphragm 11 to expand outwardly. Therefore, there is residual compressive stress remained in the oscillating diaphragm 11 of the diaphragm structure 10. When the oscillating diaphragm 11 and the strengthening member 13 are cooled, the oscillating diaphragm 11 shrinks. The strengthening member 13 upholds the oscillating diaphragm 11 to prohibit it from shrinking inwardly. Therefore, there is residual tensile stress remained in the oscillating diaphragm 11 of the diaphragm structure 10. Whether there is tensile stress or compress stress left in the oscillating diaphragm 11 is decided by the duration, speed and temperature of the heating and cooling process. For the conventional diaphragm structure, there is no such residual stress or only a very small amount left therein, since once the conventional diaphragm structure is formed, the mold is opened and the conventional diaphragm is taken out from the mold and cooled in a free condition. Inventor has found that the residual stress existed in the oscillating diaphragm 11 can greatly increase the rigidity of the oscillating diaphragm 11 thereby to help improving the acoustic characteristics of the diaphragm structure 10. More explanations regarding this are given below.
In order to understand the effect of the residual stress for the diaphragm structure 10, applicant has tested the maximum deformation displacements of different diaphragm structures, i.e., diaphragm structures of
From table 2, one can conclude that when the diaphragm structures of
In other words, from table 2, one can conclude that when the diaphragm structures of
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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200710074327.3 | May 2007 | CN | national |