This application claims the benefit of Japanese Patent Application No. 2002-160054 filed May 31, 2002, incorporated herein by reference.
The present invention is concerned with a mechanism for changing dies used in an apparatus for joining workpieces and is more particularly concerned with a self-piercing rivet setting apparatus.
In order to comply with the demand for weight reduction in transport apparatuses or the like, aluminum alloy components have been increasingly employed. Generally, a welding process is not suitable for aluminum panels of automobiles or the like, and such panels are typically fastened together using self-piercing rivets. Particularly in a body assembling operation for automobiles or the like (more particularly in an assembling operation of an aluminum body), self-piercing rivets are used to fasten two or more sheet members (or a sheet member and another component) together.
One example of a self-piercing rivet setting apparatus is disclosed in Japanese Patent Laid-Open Publication No. H 08-505087. A self-piercing rivet may comprise a large diameter head (hereinafter, “large head”) and a hollow leg extending downward from the head. When the self-piercing rivet is driven into a pair of workpieces, the front end of the leg is expandingly deformed while piercing the workpieces, and the workpieces are finally fastened together by the deformed leg and the large head.
The self-piercing rivet may be driven into workpieces to penetrate through a punch-side workpiece but to stay in a die-side workpiece adjacent to a die without penetrating therethrough. Thus, after the rivet setting operation, no opening is formed in the surface of the die-side workpiece. This provides an advantage of preventing deterioration in sealing performance of a workpiece while maintaining good appearance thereof.
The size or dimensions of the rivet may vary depending on the thickness and/or material of workpieces to be fastened. A die to be used in a rivet setting operation for fastening workpieces may need to be changed depending on the thickness and/or material of the workpieces and/or the dimensions of the rivet. When a different die is used, the rivet setting condition for obtaining an optimal undercut may be changed.
Heretofore, in a rivet setting operation for different workpieces, one rivet setting apparatus has been exchanged with another rivet setting apparatus having a different die mounted thereon, or one rivet setting apparatus has been used by substituting one die with another suitable die.
When different rivet setting apparatuses are used, it is necessary to provide a plurality of rivet setting apparatuses suitable for different rivet setting conditions and to transfer workpieces to the respective locations of these apparatuses. As a result, the use of a plurality of rivet setting apparatuses leads to increased equipment cost, expanded installation space and extended time for rivet setting operations. When die substitution is used, it is necessary to change dies in the apparatus frequently, which increases the time needed for riveting operations.
In view of the above problems, it is an object of the present invention to provide a rivet setting apparatus capable of changing dies for rivet setting operations, thereby enhancing productivity, for example in an assembly line for automobile bodies or the like.
Another object of the present invention is to provide an improved mechanism for changing dies used in an apparatus for joining workpieces.
A self-piercing rivet setting apparatus in accordance with one embodiment of the invention comprises a die assembly including a movable table and a plurality of dies, and a driving device for moving the die assembly in a first direction transverse to the axis of a punch and in a second direction axially of the punch and perpendicular to the table.
Movement of the die assembly in the direction transverse to the axis of the punch allows one of the plurality of dies to be moved to a position axially aligned with the punch. Movement of the die assembly axially of the punch is in a range between a lifted position and a lowered position of the die assembly. In the lifted position, a driving device is allowed to move the die assembly in the direction transverse to the axis of the punch. In the lowered position, the driving device is prevented from moving the die assembly in the direction transverse to the axis of the punch, and the selected die is fixed in axial alignment with the punch. In the lowered position of the die assembly, the punch is operable to drive a rivet into workpieces and fasten them together.
The die assembly includes a plurality of dies, e.g., three or more dies. The movable table may be a rotary table having a disk shape, with the plurality of dies mounted in a circular array along the periphery of the movable table, and the driving device may be operable to rotate the die assembly so as to move the dies in the direction transverse to the axis of the punch. The driving device may include a rotary motor. Alternatively, the plurality of dies may be mounted on a reciprocating table in a linear array. In this case, the driving device may be operable to move the die assembly linearly so as to displace the dies in the direction transverse to the axis of the punch. The driving device may include a linear motor.
The self-piercing rivet setting apparatus may be adapted to select one of the dies to be used according to a rivet setting condition. The self-piercing rivet setting apparatus may include a device for detecting the position of the movable table, and the driving device may be controlled automatically or manually.
The invention will be further described in conjunction with the accompanying drawings, which illustrate preferred (best mode) embodiments, and in which:
FIG: 6 is an enlarged view of the region fastened by the rivet in
A self-piercing rivet setting apparatus according to one embodiment of the present invention is shown in
A setting mechanism 13 of the self-piercing rivet setting apparatus is attached to one end of the upper horizontal arm portion. A punch 14 is attached to the lower portion of the setting mechanism 13, the punch being movable vertically in the form shown. A receiver unit 15 for holding a self-piercing rivet is provided at the lower side of the punch 14.
A spindle driving unit 17 is provided on the upper side of the punch 14. The spindle driving unit 17 may comprise an electric driving motor 19, a reduction gear mechanism 21 for transmitting a rotational force of the motor, a gear mechanism 22, and a spindle 23 which is driven by the gear mechanism and adapted to move vertically while rotating. The setting mechanism 13 is adapted to push the punch 14 downward to allow the self-piercing rivet held by the receiver unit 15 located on the lower side of the punch to be driven into workpieces held on a die assembly 18 attached at one end of the lower horizontal arm portion of the C-shaped frame 11.
In one embodiment of the present invention, the die assembly 18 includes a movable table 31, a plurality of dies on the movable table 31, and a shaft 33 attached at the center of the movable table. The movable table 31 is formed as a disk-shaped flat plate, and is controllably rotated around the axis of the center shaft. In the embodiment illustrated in
Upon activation of the electric driving motor 19, the spindle 23 is vertically moved, and the punch 14 is moved by the spindle to push a self-piercing rivet held by the receiver unit 15 toward the die 26, for example. A plurality of workpieces (e.g. the workpieces 2, 3 in
A driving device 32 provided in the C-shaped frame 11 is operable to move the shaft 33 vertically (in the axial direction of the punch) for allowing the die assembly 18 to be moved vertically (in a direction perpendicular to the table 31). The driving device 32 includes a lifting mechanism for vertically moving the die assembly. The lifting mechanism includes an electromagnet or solenoid, for example, and is operable to energize the electromagnet in a direction to move the movable table 31 upward to the lifted position. The electromagnet may be energized in an opposite direction to move the movable table 31 downward to the lowered position, or the electromagnet may be de-energized to allow the table 31 to be moved downward to the lowered position by a return spring, for example.
In the lifted position of the die assembly 18 as shown in
In one embodiment of the present invention, the self-piercing rivet setting apparatus is adapted to automatically select a desired die according to a rivet setting condition, which may determine a control signal to the driving device 32 instructing the driving device to move a particular die into alignment with the axis of the punch. The relationship between the respective dies and corresponding rivet setting conditions, such as the thickness and/or material of workpieces to be fastened, can be determined in advance and stored to control the selection of particular dies automatically. Alternatively, an operator may control the driving device manually to select a desired die.
As shown in
The die 26 includes a cavity 25 having a bottom surface formed with a protrusion 43 at the center thereof. Other dies may have similar protrusions. The leg of the rivet is expanded in a radially outward direction by the protrusion 43. The cavity of each die may be formed as an approximately flat surface, for example. The shape of the cavity of the die in
As shown in
In advance of the rivet setting operation, the driving device 32 rotates the die assembly 18 in the lifted position to allow a desired die to be rotated to the position below the punch 14. Then, the driving device 32 moves the die assembly downward to the lowered position to insert the shank of the die into the die mounting hole 41 so that the die is fixed to the C-shaped frame 11.
While the movable table in the above embodiment is a disk shaped table that is rotated, the movable table of the present invention is not so limited. For example, the movable table may be a reciprocating table formed in a rectangular shape. In this case, a plurality of dies are mounted on the movable table in a linear array, and a die may be placed below the punch by moving the movable table linearly.
While preferred embodiments of the invention have been shown and described, it will be apparent that changes can be made without departing from the principles and spirit of the invention, the scope of which is defined in the accompanying claims. For example, one or more of the dies may be configured to cooperate with a punch for joining workpieces by clinching instead of riveting.
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2002-160054 | May 2002 | JP | national |
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WO 9414554 | Jul 1994 | WO |
Number | Date | Country | |
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20040060958 A1 | Apr 2004 | US |