This application is a U.S. National Phase Application of International Patent Application No. PCT/JP2019/017446, which was filed on Apr. 24, 2019, and which claims the benefit of, and priority to, Japanese Patent Application No. 2018-131031, which was filed on Jul. 10, 2018. The contents of each application are incorporated herein by reference in their entirety.
The present invention relates to a die molding surface treatment device.
Technologies that clean a molding surface of a die by air-blowing, technologies that apply a parting agent to a molding surface of a die, and suchlike are known (for example, see Japanese Patent Application Publication (JP-B) No. H8-018123).
However, with these technologies, a device floor surface is soiled by waste matter that falls during air-blowing, during mold release agent application or the like. Accordingly, the device must be paused and the device floor surface must be cleaned by a separate process.
In consideration of the circumstances described above, an object of the present disclosure is to provide a die molding surface treatment device that, when waste matter falls onto a device floor surface while the device is being operated, may automatically perform cleaning while the device is operating.
A die molding surface treatment device according to a first aspect includes: a moving body including a portion that is disposed between a pair of dies that are arrayed in a horizontal direction, with molding surfaces of the dies opposing one another; a driving mechanism that reciprocatingly moves the moving body in a direction that is orthogonal to an opposing direction of the pair of dies in a device plan view; a treatment function portion provided at the moving body, the treatment function portion performing at least one of a treatment of air-blowing the molding surfaces of the pair of dies or a treatment of applying a parting agent to the molding surfaces of the pair of dies; and a cleaning implement attached to a lower portion of the moving body, the cleaning implement reciprocatingly moving together with the moving body and sweeping a device floor surface.
According to the die molding surface treatment device according to the first aspect, the moving body is structured with the portion that is disposed between the pair of dies, which are arranged in the horizontal direction with the molding surfaces opposing one another. The moving body is reciprocatingly moved by the driving mechanism in the direction that is orthogonal to the opposing direction of the pair of dies in the device plan view. The treatment function portion provided at the moving body performs one or both of the treatment of air-blowing the molding surfaces of the pair of dies and the treatment of applying a parting agent to the molding surfaces of the pair of dies. The cleaning implement is mounted at the lower portion of the moving body. The cleaning implement moves reciprocatingly together with the moving body and sweeps the device floor surface. Thus, when waste matter falls onto the device floor surface while the moving body is being reciprocatingly moved and the treatment function portion is treating the molding surfaces of the dies, the device floor surface is automatically cleaned by the cleaning implement.
In a die molding surface treatment device according to a second aspect, in the die molding surface treatment device according to the first aspect, the device floor surface is constituted from an ultra-high molecular weight polyethylene.
According to the die molding surface treatment device according to the second aspect, because the device floor surface is constituted from the ultra-high molecular weight polyethylene, waste matter is unlikely to stick to the device floor surface when the waste matter falls onto the device floor surface while the moving body is being moved reciprocatingly and the treatment function portion is treating the molding surfaces of the dies. Therefore, the waste matter may be excellently removed by the cleaning implement.
In a die molding surface treatment device according to a third aspect, in the die molding surface treatment device according to the first aspect or the second aspect, recovering means is provided in correspondence with positions at both ends of a reciprocating movement range of the cleaning implement, the recovering means recovering waste matter swept by the cleaning implement.
According to the die molding surface treatment device according to the third aspect, the waste matter swept by the cleaning implement is automatically recovered by the recovering means at both end sides of the reciprocating movement range of the cleaning implement. Therefore, waste matter swept by the cleaning implement may be recovered directly, and the waste matter does not remain on the device floor surface even though the waste matter is not recovered by a separate process.
In a die molding surface treatment device according to a fourth aspect, the die molding surface treatment device according to the third aspect further includes: a waste collector that serves as the recovering means; a level sensor provided at the waste collector, the level sensor detecting an accumulated height of waste matter recovered and accumulated at the waste collector; and a reporting means that, in a case in which a detection value of the level sensor is at least a pre-specified criterion value, reports that at least a predetermined amount of the waste matter has been accumulated.
According to the die molding surface treatment device according to the fourth aspect, the level sensor provided at the waste collector that serves as the recovering means detects an accumulated height of waste matter recovered and accumulated in the waste collector. When a value detected by the level sensor is at least the pre-specified criterion value, the reporting means reports that the waste matter has been accumulated to at least the predetermined amount.
In a die molding surface treatment device according to a fifth aspect, the die molding surface treatment device according to any one of the first to fourth aspects further includes a cleaning brush attached to an upper portion of the moving body, the cleaning brush reciprocatingly moving together with the moving body and sweeping an upward-facing surface of the dies.
According to the die molding surface treatment device according to the fifth aspect, when the moving body reciprocatingly moves, the cleaning brush sweeps the upward-facing surface of the die. Thus, the upward-facing surface of the die is cleaned. Waste matter that falls onto the device floor surface when the cleaning brush sweeps the upward-facing surface of the die is then swept by the cleaning implement.
In a die molding surface treatment device according to a sixth aspect, the die molding surface treatment device according to any one of the first to fifth aspects further includes shielding brushes provided at the moving body, base end sides of the shielding brushes being attached at both flank sides of the treatment function portion at sides of the treatment function portion that oppose the dies, and distal end sides of the shielding brushes being disposed spaced apart from but close to the dies in a state in which the shielding brushes oppose the dies, the shielding brushes suppressing scattering of flying matter that is produced during a treatment by the treatment function portion. The meaning of the term “both of flank sides” recited in the present aspect is intended to include sides at both flanks of the treatment function portion when a side of the treatment function portion that opposes the dies is seen in an elevation view.
According to the die molding surface treatment device according to the sixth aspect, the shielding brushes provided at the moving body are specified such that the base end sides of the shielding brushes are attached to the both flank sides of the treatment function portion that oppose the dies. In states in which the shielding brushes oppose the dies, the distal end sides of the shielding brushes are disposed proximate to the dies with space therebetween. Scattering of flying matter that is produced during a treatment by the treatment function portion is suppressed by these shielding brushes.
As described above, according to the die molding surface treatment device according to the present disclosure, an excellent effect is provided in that, when waste matter falls onto a device floor surface while the device is being operated, the waste matter may be automatically cleaned up while the device is operating.
A parting agent application device that serves as a die molding surface treatment device according to an exemplary embodiment of the present disclosure is described using
Structure of the Exemplary Embodiment
As shown in
The device floor surface 12, which is shown in
The mold release agent application device 10 is provided with a moving body 16 that includes a portion disposed between the pair of dies 50 in the state described above. The mold release agent application device 10 is also provided with a driving mechanism 18 that reciprocatingly moves the moving body 16 in a direction (see the direction of arrow X) that is orthogonal to the opposing direction of the pair of dies 50 in the device plan view shown in
As shown in
As shown in
Head portions of a treatment function portion 20 are provided at vertical direction middle portions of the moving body 16. As shown in
The cleaning blowing function portion 22 is provided with plural blowing nozzles 22A. The blowing nozzles 22A are disposed at both sides in the device left-and-right direction of the linking tube member 16D at the rear side. A plural number of the blowing nozzles 22A (for example, three at each side in the present exemplary embodiment) spaced apart in the vertical direction are disposed at positions corresponding with vertical direction middle portions of the dies 50. Distal ends of the blowing nozzles 22A are oriented to opposite sides thereof from the linking tube member 16D. The blowing nozzles 22A are connected to a compressed air supply mechanism, which is not shown in the drawings, via hoses or the like that are not shown in the drawings. When the compressed air supply mechanism operates, air may be jetted out from the blowing nozzles 22A. Thus, the cleaning blowing function portion 22 performs an air-blowing treatment on the molding surfaces 50A of the pair of dies 50.
As shown in
As shown in
As shown in
Cleaning brushes 32 that serve as a cleaning implement are attached to the floor wall portion 16A, at a lower portion of the moving body 16, via linking portions 30 at both the left and right sides of the lower face side of the floor wall portion 16A. The cleaning brushes 32 are for cleaning the device floor surface 12. The cleaning brushes 32 are specified such that distal ends of the cleaning brushes 32 are oriented downward and touch the device floor surface 12. Thus, the cleaning brushes 32 are specified so as to reciprocatingly move together with the moving body 16 and sweep the device floor surface 12. The pair of cleaning brushes 32 are disposed at both the left and right sides sandwiching the driving mechanism 18. An end portion of each cleaning brush 32 at the side thereof at which the driving mechanism 18 is disposed is specified to be at a position close to the driving mechanism 18, and an end portion of the cleaning brush 32 at the opposite side from the side at which the driving mechanism 18 is disposed is specified to be further to a device width direction outer side than the corresponding die 50.
As shown in
As shown in
Action, Operation and Effects of the Mold Release Agent Application Device
Now, while the action of the mold release agent application device 10 is described, operation and effects of the present exemplary embodiment are described.
When the molding surfaces 50A of the pair of dies 50 are to be cleaned by air-blowing, while the moving body 16 shown in
In the present exemplary embodiment, because the device floor surface 12 is formed of an ultra-high molecular weight polyethylene, even when waste matter falls onto the device floor surface 12 while the moving body 16 is being reciprocatingly moved and the treatment function portion 20 is operating, the waste matter is unlikely to stick to the device floor surface 12. Hence, the waste matter can be excellently removed by the cleaning brushes 32. Therefore, incidences of, for example, mixed sand that constitutes the waste matter fixing and becoming troublesome to clean off may be avoided or effectively suppressed.
In the present exemplary embodiment, the waste collectors 34 that recover the waste matter swept by the cleaning brushes 32 are provided in correspondence with positions at both ends of the reciprocating movement range A of the cleaning brushes 32. Therefore, waste matter swept by the cleaning brushes 32 is automatically recovered (collected) into the waste collectors 34 at both end sides of the reciprocating movement range A of the cleaning brushes 32. Thus, the waste matter swept by the cleaning brushes 32 may be recovered directly, and the waste matter does not remain on the device floor surface 12 even when the waste matter is not recovered by a separate process.
In the present exemplary embodiment, the level sensor 36 provided at each waste collector 34 detects an accumulated height of the waste matter recovered and accumulated in the waste collector 34. When a detection value of the level sensor 36 is at least the pre-specified criterion value, the report display device 38 shown in
In the present exemplary embodiment, when the moving body 16 reciprocatingly moves, the cleaning brushes 28 provided at the upper portion of the moving body 16 sweep the upward-facing surfaces 50C of the dies 50. Thus, the upward-facing surfaces 50C of the dies 50 are cleaned. To add to this description, when mixed sand collects on the upward-facing surfaces 50C of the dies 50, for example, in periphery portions of the upper ends of the gate portions 50D shown in
In the present exemplary embodiment as shown in
As described above, according to the mold release agent application device 10 according to the present exemplary embodiment, when waste matter falls onto the device floor surface 12 while the device is being operated, the waste matter may be automatically cleaned up while the device is operating.
Supplementary Descriptions of the Exemplary Embodiment
In the exemplary embodiment described above, the treatment function portion 20 is structured to be capable of two treatments, the treatment of air-blowing the molding surfaces 50A of the pair of dies 50 and the treatment of applying a parting agent to the molding surfaces 50A of the pair of dies 50. However, a die molding surface treatment device may be structured with a treatment function portion that performs only one treatment: the treatment of air-blowing molding surfaces (50A) of a pair of dies (50) or the treatment of applying a parting agent to the molding surfaces (50A) of a pair of dies (50).
In the exemplary embodiment described above, the cleaning brushes 32 that serve as the cleaning implement are attached to the lower portion of the moving body 16. However, a cleaning implement attached to a lower portion of the moving body 16 may be a cleaning implement other than cleaning brushes such as, for example, a sponge-form member, a member fabricated of rubber in a long, narrow, thin plate shape, or the like.
In the exemplary embodiment described above, the device floor surface 12 is formed of an ultra-high molecular weight polyethylene. Although this is a preferable constitution, a device floor surface may be formed of an alternative material.
As a variant example of the exemplary embodiment described above, a structure may be employed in which the waste collectors 34 that serve as the recovering means of the exemplary embodiment described above are not provided. In this variant example, waste matter swept by the cleaning brushes 32 (the cleaning implement) is recovered by a separate process.
In the exemplary embodiment described above, the waste collectors 34 are provided as the recovering means. However, recovering means other than waste collectors may be formed such as, for example: a suction device that is capable of sucking waste matter, with suction apertures disposed in correspondence with positions at both ends of the reciprocal movement range (A) of a cleaning implement such as a cleaning brush (32) or the like; holes that are formed penetrating through the device floor portion in correspondence with positions at both ends of the reciprocal movement range (A) of a cleaning implement such as a cleaning brush (32) or the like, and a recovery container that is connected to the holes via recovery hoppers below the holes; or the like. When a main body portion of this suction device is outside a treatment chamber of the die molding surface treatment device, when a structure provided with the holes, the recovery hoppers and the recovery container is provided, or the like, the waste matter swept by the cleaning implement is automatically recovered to outside the treatment chamber of the die molding surface treatment device. Therefore, there is no need to recover waste matter to outside the treatment chamber of the die molding surface treatment device by a separate process.
In the exemplary embodiment described above, each level sensor 36 shown in
As an alternative variant example of the exemplary embodiment described above, a structure may be employed in which the cleaning brushes 28 are not provided for cleaning the upward-facing surfaces 50C of the dies 50. In the exemplary embodiment described above, the shielding brushes 26 and 27 are provided at the moving body 16 of the mold release agent application device 10 in which the treatment function portion 20 shown in
Structural portions for performing the treatment of applying a parting agent to the molding surfaces (50A) of a pair of dies (50) may be, for example, structural portions that do not include spraying nozzles (24A) but include alternative applying means such as application rollers or the like.
The exemplary embodiment described above and the variant examples mentioned above may be embodied in suitable combinations.
Hereabove, examples of the present disclosure have been described. The present disclosure is not limited by these descriptions and it will be clear that numerous modifications beyond these descriptions may be embodied within a technical scope not departing from the gist of the invention.
The disclosures of Japanese Patent Application No. 2018-131031 filed Jul. 10, 2018 are incorporated into the present specification by reference in their entirety.
Number | Date | Country | Kind |
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2018-131031 | Jul 2018 | JP | national |
Filing Document | Filing Date | Country | Kind |
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PCT/JP2019/017446 | 4/24/2019 | WO |
Publishing Document | Publishing Date | Country | Kind |
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WO2020/012758 | 1/16/2020 | WO | A |
Number | Name | Date | Kind |
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20080289141 | Oh | Nov 2008 | A1 |
20190116729 | Skoog | Apr 2019 | A1 |
Number | Date | Country |
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205868973 | Jan 2017 | CN |
205868973 | Jan 2017 | CN |
0340845 | Nov 1989 | EP |
1439004 | Jul 2004 | EP |
H7136599 | May 1995 | JP |
H0818123 | Feb 1996 | JP |
H08192258 | Jul 1996 | JP |
2010184279 | Aug 2010 | JP |
860001628 | Mar 1986 | KR |
WO8601442 | Jul 2004 | WO |
Entry |
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English Translation WO8-8601442A1 (Year: 1985). |
English Abstract CN205868973U (Year: 2017). |
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Chinese Second Office Action, The State Intellectual Property Office of People's Republic of China, Chinese Application No. 201980040562.X, dated Jul. 22, 2022, 6 pages. |
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Written Opinion of the International Searching Authority, Japan Patent Office, International Application No. PCT/JP2019/017446, dated Jul. 16, 2019, 3 pages. |
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Number | Date | Country | |
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20210268572 A1 | Sep 2021 | US |