Patent Application
20180191046
The present invention relates generally to the field of radio-frequency circuits, and more particularly, but not exclusively, to methods and apparatus for implementing a dielectric-loaded cavity resonator.
This section introduces aspects that may be helpful to facilitate a better understanding of the inventions. Accordingly, the statements of this section are to be read in this light and are not to be understood as admissions about what is in the prior art or what is not in the prior art. Any techniques or schemes described herein as existing or possible are presented as background for the present disclosure, but no admission is made thereby that these techniques and schemes were heretofore commercialized, or known to others besides the inventors.
Cavity resonators typically include a cavity enclosed by metal walls that confine electromagnetic fields, e.g. in the microwave region of the spectrum. The cavity may include a center electrode, sometimes referred to as a post. At a resonant frequency determined in part by the dimensions of the cavity, electromagnetic waves may resonate, forming standing waves in the cavity. Thus the cavity may act as a bandpass filter, allowing microwaves of a particular frequency to pass while blocking microwaves at other frequencies.
The inventors disclose various apparatus and methods that may be beneficially applied to, e.g., optical communication systems such as metro and/or regional communications networks. While such embodiments may be expected to provide improvements in performance and/or security of such apparatus and methods, no particular result is a requirement of the present invention unless explicitly recited in a particular claim.
One embodiment provides an apparatus, e.g. a cavity resonator, that includes a floor and a cover. A conductive cylindrical post located between the floor and the cover includes a void oriented along a longitudinal axis, and a dielectric rod located within the void. A dielectric spacer is located between the cover and the cylindrical post. A resilient dielectric is located within the void between the dielectric spacer and the floor, and in some embodiments may be compressed between the floor and the cover to provide a restoring force that holds the dielectric spacer in place.
In some embodiments the dielectric rod includes a low-k dielectric such as poly(tetrafluoroethylene) (PTFE). In some embodiments the resilient dielectric is located between the floor and the dielectric rod. In some embodiments the resilient dielectric is an O-ring comprising an elastomeric material. In some embodiments the resilient dielectric includes a porous foam. Some embodiments further include an air gap between the dielectric rod and the floor. In some embodiments the resilient dielectric is located between the dielectric rod and the floor. In some embodiments the dielectric spacer comprises a ceramic material.
Another embodiment provides a method, e.g. of forming a cavity resonator. A cavity is provided that includes a floor, walls, and a conductive cylindrical post on the floor, the cylindrical post including a void oriented along a longitudinal axis of the post. The post includes a dielectric rod and a resilient dielectric within the void. The method further includes compressing the resilient dielectric by attaching a cover of the cavity to the walls, thereby applying a force on the dielectric rod.
Additional embodiments include methods, e.g. of forming a cavity resonator according to any of the apparatus described above.
Additional aspects of the invention will be set forth, in part, in the detailed description, figures and any claims which follow, and in part will be derived from the detailed description, or can be learned by practice of the invention. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as disclosed.
A more complete understanding of the present invention may be obtained by reference to the following detailed description when taken in conjunction with the accompanying drawings wherein:
Various embodiments are now described with reference to the drawings, wherein like reference numbers are used to refer to like elements throughout. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details.
In some implementations of a cavity resonator a dielectric spacer, or resonator, is placed between a central conductive rod and a wall of the cavity, e.g. a cover plate, to provide capacitive coupling between the rod and the wall. The relative permittivity, ϵr, of the resonator material, and a thickness of the resonator, may be selected to result in a desired value of capacitive coupling. Often, the dielectric spacer is designed with a large relative permittivity, e.g. 30-40, to provide strong coupling.
It is typically desirable to place the dielectric spacer in direct contact with both the central rod and the wall, i.e. to eliminate air gaps. When this is done, it may be desirable or necessary to secure the dielectric spacer to the central rod or to the cover plate during assembly so that the
Referring to
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The resilient dielectric is 160 compressed between the dielectric rod 150 and the floor 110. The compressed resilient dielectric 160 holds the dielectric rod 150 away from the floor 110, resulting in a gap 165 between the floor 110 and the dielectric rod 150. The compression of the resilient dielectric 160 gives rise to a restoring force directed along the longitudinal axis of the dielectric rod 150, thereby holding the dielectric rod 150 in compression against the dielectric spacer 170. The dielectric spacer 170 is thereby held in compression between the between the cover 130 and the dielectric rod 150, effectively immobilizing the dielectric spacer 170.
The resilient dielectric 160 may be, for example, an O-ring as illustrated, but is not limited thereto. More generally, the resilient dielectric 160 is a compressible non-conductive material that when compressed by a compressive force provides an opposite restoring force. In the case of an O-ring, the resilient dielectric 160 may be formed from an elastomeric material such as, for example and without limitation, butyl rubber, fluoropolymer elastomer (e.g. Viton®), acrylonitrile butadiene rubber (e.g. Buna N®), and silicone rubber, such as molded liquid silicone rubber (LSR). While the O-ring in the illustrated embodiment is shown having a circular sectional profile when uncompressed, this is not a requirement. Thus the O-ring may have an uncompressed sectional profile that is, e.g. oval, square or rectangular. The resilient dielectric 160 may be other than an O-ring, e.g. an elastomeric foam.
In the case of a resilient dielectric 160 that does not fill the space between the floor 110 and the dielectric rod 150, e.g. an O-ring, an air gap is present between the floor 110 and the resilient dielectric 160. In the case that the resilient dielectric 160 comprises an elastomeric foam, a portion of the volume between the floor 110 and the resilient dielectric 160 comprises open space, e.g. air space. Common to all embodiments consistent with the disclosure is that the volume between the floor 110 and the resilient dielectric 160 comprises a non-zero fraction of an elastomeric material and a non-zero fraction of open space, e.g. air space. The open space provides space into which the elastomeric material may deform when compressed by the compressive force imposed by the dielectric rod 150.
The dielectric rod 150 may comprise, and in some embodiments does comprise, a low-k dielectric material. In this context, “low-k” means the material has a relative dielectric permittivity of about 3 or less. Such materials may include, e.g., porous dielectrics and/or materials with inherently low relative dielectric permittivity, e.g. poly(tetrafluoroethylene) (PTFE).
The dielectric spacer 170 may comprise, and in some embodiments does comprise, a high-k dielectric material. In this context, “high-k” means the material has a relative dielectric permittivity of about 15 or more. Such materials may include, e.g., porous dielectrics and/or ceramic materials with inherently high relative dielectric permittivity, e.g. various compositions available from Trans-Tech, Inc., Woburn Mass., USA. The characteristics of the spacer 170, e.g. thickness and relative dielectric permittivity, are typically selected by the designer to result in a desired electrical characteristic of the cavity resonator 100. Such selection criteria are well known to those skilled in the pertinent art, and may include, e.g. cavity size, resonator quality, frequency sensitivity, material cost, and material manufacturability.
As described earlier, when the cover 130 is fastened to the walls 120, the resilient dielectric 160, e.g. O-ring or foam, is compressed, leaving an air gap in the form of an open space (e.g. in the case of the O-ring) or distributed pores (e.g. in the case of the foam). Without limitations, the primary purpose of the air gap is to provide space into which the resilient dielectric 160 can deform under compression. Because the air gap is located within the cylindrical post 140, its presence is not expected to effect the electrical characteristics of the resonator 100. The compressive force between the dielectric spacer 170 and the cover 130, and between the dielectric spacer 170 and the cover dielectric rod 150, may be determined in part by the thickness and material type of the resilient dielectric 160. It is noted that it is the force of the dielectric rod 150 against the dielectric spacer 170 that holds the dielectric spacer 170 against the cover 130. However, in various embodiments it may be preferred that the characteristics of the resilient dielectric, e.g. thickness and material type, be selected such that the gap 185 is eliminated when the cover 130 is attached to the walls 120. This selection typically cannot be determined a priori for all embodiments, as the material requirements are expected to be influenced by other design factors, such as the diameter of the void within the cylindrical post 140. It is further noted that while it may be preferred that the gap 185 be eliminated, this is not a requirement of any embodiment unless specifically claimed. Finally, it is not a requirement that the gap 180 between the cover 130 and the walls 120 be eliminated unless specifically recited in the claims. Thus embodiments within the scope of the description include the cavity resonator 100 prior to attachment of the cover 130 to the walls 120.
Herein and in the claims, the term “provide” with respect to an optical transmission system encompasses designing or fabricating the system, causing the system to be designed or fabricated, and/or obtaining the system by purchase, lease, rental or other contractual arrangement.
Unless explicitly stated otherwise, each numerical value and range should be interpreted as being approximate as if the word “about” or “approximately” preceded the value of the value or range.
It will be further understood that various changes in the details, materials, and arrangements of the parts which have been described and illustrated in order to explain the nature of this invention may be made by those skilled in the art without departing from the scope of the invention as expressed in the following claims.
The use of figure numbers and/or figure reference labels in the claims is intended to identify one or more possible embodiments of the claimed subject matter in order to facilitate the interpretation of the claims. Such use is not to be construed as necessarily limiting the scope of those claims to the embodiments shown in the corresponding figures.
Although the elements in the following method claims, if any, are recited in a particular sequence with corresponding labeling, unless the claim recitations otherwise imply a particular sequence for implementing some or all of those elements, those elements are not necessarily intended to be limited to being implemented in that particular sequence.
Reference herein to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments necessarily mutually exclusive of other embodiments. The same applies to the term “implementation.”
Also for purposes of this description, the terms “couple,” “coupling,” “coupled,” “connect,” “connecting,” or “connected” refer to any manner known in the art or later developed in which energy is allowed to be transferred between two or more elements, and the interposition of one or more additional elements is contemplated, although not required. Conversely, the terms “directly coupled,” “directly connected,” etc., imply the absence of such additional elements.
The embodiments covered by the claims in this application are limited to embodiments that (1) are enabled by this specification and (2) correspond to statutory subject matter. Non-enabled embodiments and embodiments that correspond to non-statutory subject matter are explicitly disclaimed even if they formally fall within the scope of the claims.
The description and drawings merely illustrate the principles of the invention. It will thus be appreciated that those of ordinary skill in the art will be able to devise various arrangements that, although not explicitly described or shown herein, embody the principles of the invention and are included within its spirit and scope. Furthermore, all examples recited herein are principally intended expressly to be only for pedagogical purposes to aid the reader in understanding the principles of the invention and the concepts contributed by the inventor(s) to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions. Moreover, all statements herein reciting principles, aspects, and embodiments of the invention, as well as specific examples thereof, are intended to encompass equivalents thereof.
Although multiple embodiments of the present invention have been illustrated in the accompanying Drawings and described in the foregoing Detailed Description, it should be understood that the present invention is not limited to the disclosed embodiments, but is capable of numerous rearrangements, modifications and substitutions without departing from the invention as set forth and defined by the following claims.
