Claims
- 1. A dielectric material which comprises approximately 50% to 95% per weight of atomized metal particles commonly used in sintering powder metallurgy, said particles having a mesh ranging from 2 to 150 microns in a thermosetting resin matrix cured to hardness, wherein said metal particles are selected from a group consisting of particles of copper, zinc, aluminum, silver, steel, lead, tungsten, molybdenum, cobalt, and composites and alloys thereof.
- 2. The material of claim 1, wherein said resin comprises an isophthalic, acid-based polyester.
- 3. The material of claim 1, wherein said metal particles consist of particles of bronze.
- 4. The material of claim 1, wherein said metal particles consist of particles of brass.
- 5. The material of claim 1, wherein said particles consist of particles of stainless steel.
- 6. The material of claim 1, wherein said particles consist of particles of lead.
- 7. A process for manufacturing a dielectric material which comprises:
- mixing at room temperature up to 95% per weight of atomized metal particles commonly used in sintering powder metallurgy, said particles having a mesh ranging from approximately 2 to 150 microns and a volume of thermosetting resin;
- curing said mixture to hardness at ambient temperatures up to 150.degree. C.; and
- finishing said applied and hardened mixture.
- 8. The process of claim 7, wherein said resin is selected from a group consisting of epoxy resins and polyester resins.
- 9. The process of claim 8, wherein said catalyst compirses two percent of said volume of a ketonic catalyst.
- 10. The process of claim 9, wherein said ketonic catalyst is a methyl ethyl keton peroxide.
PRIOR APPLICATION
This application is a continuation of application Ser. No. 08/786,701 filed Jan. 1, 1997 now U.S. Pat. No. 5,789,064, a continuation-in-part of abandoned application Ser. No. 08/394,616 filed Feb. 27, 1995 a continuation-in-part of Ser. No. 08/160,428 filed Nov. 30, 1993, now U.S. Pat. No. 5,393,568, a continuation of Ser. No. 08/060,162 filed May 7, 1993 now abandoned, a continuation-in-part of Ser. No. 07/843,951 filed Feb. 28, 1992 now abandoned.
US Referenced Citations (3)
Continuations (2)
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Number |
Date |
Country |
Parent |
786701 |
Jan 1997 |
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Parent |
060162 |
May 1993 |
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