Dielectric mounting system

Information

  • Patent Grant
  • 6323746
  • Patent Number
    6,323,746
  • Date Filed
    Wednesday, November 17, 1999
    25 years ago
  • Date Issued
    Tuesday, November 27, 2001
    23 years ago
Abstract
A dielectric resonator system having a dielectric element and a purified alumina attachment assembly both housed within a metallic resonant casing. Attachment assembly is at least 99.5% pure alumina. Attachment assembly couples dielectric element to the casing. Dielectric element is an internally threaded ring or disk. Attachment assembly includes an externally threaded alumina support member coupled to the internally threaded dielectric element.
Description




TECHNICAL FIELD OF THE INVENTION




The present invention relates generally to dielectric devices, and more specifically to the mounting of dielectric resonators in resonant cavities.




BACKGROUND OF THE INVENTION




It is well known among electrical engineers that energy losses in dielectric resonator systems occur at contact boundaries, such as those between the dielectric and its support or between the dielectric and the cavity boundary. Energy losses both degrade the efficiency of the resonator by subtracting energy from the system and increase its temperature through resistance heating.




Dielectric resonators are used to confine electromagnetic fields mostly within their boundaries. Dielectric resonators are commonly used in electronic communication devices, such as cellular telephone systems. There is an increasing demand for smaller versions of such systems and other electronic devices. Accordingly, there is a need for smaller dielectric resonators that are capable of the same dielectric performance. Dielectric resonators may be miniaturized by using dielectric elements with higher dielectric constants. The trade-off for the decrease in size of the resonator is that the same amount of power is being drawn through a smaller device. Unless there is an increase in the efficiency of heat removal from the resonator, miniaturization results in the same heat being generated in a smaller volume and a corresponding rise in operating temperatures. It is therefore useful to develop devices exhibiting either less power loss, better thermal dissipation capabilities, or both.




As the temperature of a dielectric element increases, its dielectric constant shifts. Large increases in operating temperatures will therefore result in a shift of the resonant frequency of a dielectric resonator. Temperature differentials and thermal cycling can also contribute to mechanical creep, structural instabilities, component misalignment, debonding, and other undesirable changes in the resonator. It is therefore important to minimize excess heat generated in the resonator, efficiently drain the generated waste heat, and choose components with compatible physical characteristics for use with dielectric element.




In prior dielectric resonator systems, the resonating dielectric element has been secured within its resonant cavity by a variety of mounting media. These include a mounting stem formed as part of the resonating body, adhesives to bond the resonator to a ceramic support and the ceramic support to the casing floor, adhesives to bond the dielectric resonator directly to the casing floor, and insulators to sandwich the dielectric resonator securely within the cavity. Mounting media used in the prior art include media formed from dielectrics, quartz, and plastics. Each of these mounting materials has its own inherent disadvantages.




Adhesives introduce extrinsic energy loss into the system and thereby lower the Q-factor of the resonator. Furthermore, adhesives degrade with time, temperature cycling, and thermal and mechanical shock. Moreover, adhesives introduce assembly inefficiencies because they are cumbersome, messy, and difficult to use with reproducible accuracy. Finally, adhesives tend to be poor thermal conductors and hinder the dissipation of heat from the system.




Some dielectric resonator systems have used quartz to support dielectric element within the resonant cavity. Dielectric element is usually attached to the quartz with an adhesive having all of the disadvantages listed above. Moreover, the coefficients of thermal expansion of the dielectric and the quartz are generally substantially disparate, requiring a flexible adhesive bond to prevent delamination of the adhesive or degradation of the bond.




A mounting stem formed as part of the dielectric resonator does not suffer from the above-mentioned problems associated with adhesives, but can instead distort the electromagnetic field within the cavity. Additional energy loss can be introduced as induced current in the casing. Further, many good dielectric resonators tend to be poor thermal conductors, retarding heat dissipation from the system. Finally, the formation of a one-piece resonator with a stem increases the complexity of the manufacturing process.




Plastic support structures are typically not suitable for use in high temperature applications, as plastic tends to lose structural integrity with increasing temperature. Additionally, plastics typically are poor thermal conductors. Moreover, high-temperature plastics are generally lower-Q materials and contribute to frequency drift with temperature. High-Q plastics, such as high-density polyethylene and high-density polystyrene, quickly lose structural integrity above 100° C.




Finally, the use of sandwiching introduces variables such as stacking tolerances and positioning fluctuations within the cavity with respect to dielectric element.




Hence, there is a need for an improved method of securing the dielectric resonator within the resonant cavity. The securing method must be capable of producing a dielectric resonator system with fewer energy losses and better thermal dissipation, and improved mechanical stability at elevated temperatures. A means for satisfying this need has so far eluded those skilled in the art.




SUMMARY OF THE INVENTION




One form of the present invention contemplates an externally threaded ceramic support member removably coupled to an internally threaded dielectric ring. The ceramic support member is secured to an internal floor or wall of a cavity, and is at least about 99.5% pure alumina.




One object of the present invention is to reduce energy loss at the dielectric mount interface by providing an improved means for mounting the dielectric.




Related objects and advantages of the present invention will be apparent from the following description.











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1A

is a side view of a dielectric element supported by a first embodiment attachment assembly of the present invention.





FIG. 1B

is a cross-sectional side view of a dielectric element having a partially threaded internal recess screwed to the first embodiment attachment assembly of FIG.


1


A.





FIG. 1C

is an exploded cross-sectional side view of dielectric element of FIG.


1


B.





FIG. 1D

is a cross-sectional side view of an externally threaded dielectric element screwed to an internally threaded alternate first embodiment attachment assembly of the present invention.





FIG. 2

is a cross-sectional view of a partially internally threaded dielectric element having an upper recess and secured to a second embodiment attachment assembly of the present invention, showing a tuning element positioned within the upper recess.





FIG. 3A

is a side view of a dielectric element supported by a third embodiment attachment assembly of the present invention.





FIG. 3B

is a cross-sectional side view of a dielectric element screwed to the third embodiment attachment assembly of FIG.


3


A.





FIG. 4

is a cross-sectional view of a partially internally threaded dielectric element having an upper recess and secured to a fourth embodiment attachment assembly of the present invention, showing a tuning element positioned within the upper recess.





FIG. 5A

is a partial cross-sectional side view of a dielectric element in a housing and supported by an attachment assembly of a fifth embodiment of the present invention.





FIG. 5B

is a cross-sectional side view of a partially internally threaded dielectric element screwed to attachment assembly of FIG.


5


A.





FIG. 5C

is a cross-sectional side view of

FIG. 5A

showing attachment assembly connected to housing by a screw.





FIG. 6A

is a partial cross-sectional view of a dielectric element in a housing and supported by a sixth embodiment of the present invention.





FIG. 6B

is a cross-sectional side view of

FIG. 6A

, showing a tuning element positioned within the inner diameter of dielectric element.





FIG. 6C

is a cross-sectional side view of a first variation of FIG.


6


A.





FIG. 6D

is a cross-sectional view of a second variation of FIG.


6


C.











DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT




For the purposes of promoting an understanding of the principles of the invention, reference will now be made to the embodiment illustrated in the drawings and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended, such alterations and further modifications in the illustrated device, and such further applications of the principles of the invention as illustrated therein being contemplated as would normally occur to one skilled in the art to which the invention relates.




A dielectric is operationally defined to be any material that is not a good electrical conductor (electrical conductor defined as a material having an electrical resistivity less than about 10


4


ohm-cm.) Dielectric resonators generally comprise a dielectric element with a relatively high dielectric constant (greater than about 10) enclosed within a cavity. The casing defining the cavity is usually metallic to minimize interference from external electromagnetic radiation.




A dielectric element used in a dielectric resonator is usually formed of a ceramic material with a high dielectric constant and a high Q-factor and usually has a symmetrical geometry, such as cylindrical. The dielectric may be doped to fine-tune its dielectric and electronic properties to suit a given application, as is known in the art.




Dielectric resonators operate by the reflection of electromagnetic waves at the interface between two dielectrics with different dielectric constants. A resonator operates to absorb and reradiate energy at its resonant frequency. The resonant frequency is dependent upon the dielectric properties of the resonator, specifically the dielectric element, the size and shape of the resonant cavity, and the placement of the delectric element within the resonant cavity. The dielectric resonator may be tuned by varying the placement of the resonator within the resonant cavity. Dielectric resonators are commonly used in filters and oscillators.




A dielectric resonator with a high dielectric constant can confine a large electromagnetic field mostly within its boundaries. Consequently, the availability of dielectrics with increasingly high dielectric constants has lead to increasingly smaller resonators. While attractive for use in smaller and more convenient devices, miniaturization has resulted in the same power being drawn through smaller devices. Without a corresponding increase in efficiency, the miniaturization of the dielectric resonator can lead to the same heat being generated in a smaller volume. This can give rise to higher operating temperatures as well as smaller areas through which to dissipate the generated waste heat. It is increasingly critical to develop devices that either exhibit less power loss, have better thermal dissipation capabilities, or both.




Furthermore, as the temperature of a dielectric increases, its dielectric constant shifts. While some materials, such as ceramic perovskites, are more thermally stable with respect to their dielectric properties than most, large increases in operating temperatures will nonetheless cause even their dielectric properties, and therefore the resonant frequencies of dielectric resonators formed from them, to shift. Moreover, differential thermal expansion and thermal cycling can contribute to problems such as mechanical creep, structural instabilities, component misalignment, and debonding. It is therefore desirable to choose components with similar thermal expansion characteristics as well as to allow for fine-tuning of the dielectric resonator.




Traditionally, ceramic materials have generally been attractive for use in structural applications requiring high compressive strengths, but not in applications requiring high tensile or shear strengths. Moreover, ceramic materials are notoriously brittle. As a result, the use of ceramic materials as threadedly interlocking fasteners has been minimal. Ceramic fasteners, especially those utilizing a matably threaded ceramic-to-ceramic interface (i.e., a nut on a screw or bolt) have long been considered impractical to produce because of their inherent brittleness and frangibility.




The present invention relates generally to an improved system for mounting a dielectric body or element within a resonant cavity. More particularly, the present invention has one form wherein an internally threaded ceramic dielectric resonator element is matably coupled to an externally threaded ceramic support member that is in turn secured to a floor or wall of the resonant cavity. Where the operation of the resonator will produce significant amounts of waste heat, the support member should be formed of a material with a relatively high thermal conductivity and/or high temperature stability, such as alumina.




In addition to having high thermal conductivity, the support member should also have a coefficient of thermal expansion closely matched to that of the attached dielectric element. During normal operation, dielectric element can generate a significant amount of heat. If the support member and the threadedly attached dielectric element have substantially different coefficients of thermal expansion, the heat generated by dielectric element during operation will cause dielectric element and its support to expand at different rates, putting a mechanical strain on the threaded connection. Over time, repeated thermal cycling can degrade dielectric element and/or the support member. Brittle materials, such as ceramics, are especially sensitive to this type of mechanical degradation.




The support member should also have a relatively low dielectric loss tangent, Q, that is also relatively stable over the operating temperature range. Since the support structure is positioned within the resonant cavity, dielectric losses and the accompanying heat generation from the support structure are proportional to its dielectric loss tangent. Therefore, it is desirable that the support structure have a low dielectric loss tangent. Moreover, the dielectric properties of the support structure should be stable over the operating temperature range of the resonator to prevent unpredictable and/or catastrophic changes in the dielectric properties of the system.




Another related set of characteristics describing the support structure that helps minimize the dielectric loss of the resonator is the support structure's size and strength. The stronger the material, the smaller the support structure has to be. And the smaller the support structure, the lower the effective dielectric loss and associated heat generation from the support structure's presence in the resonant cavity. Therefore, small support members formed of mechanically strong materials are generally preferable.





FIGS. 1A-1C

illustrate a preferred embodiment of the present invention, a dielectric resonator mounting system


100


having a dielectric element


102


fastened to the interior of a housing


104


by an attachment assembly


106


. Dielectric element


102


preferably comprises a ceramic dielectric composition such as an alkaline-earth titanate, tantalate, aluminate, niobate or the like. The composition of dielectric element


102


may further include dopants such as small amounts of rare earth elements, alkaline-earth elements, or the like, but may be any convenient dielectric composition having desirable dielectric and mechanical properties.




Dielectric element


102


preferably has a coefficient of thermal expansion of about 5-10×10


−6


, and more preferably has a coefficient of thermal expansion substantially equal to or greater than that of attachment assembly


106


. Dielectric element


102


preferably includes a threaded recess


108


and is formed with a symmetrical shape. Dielectric element


102


is more preferably an internally threaded ring having an outer surface (diameter)


110


and an at least partially threaded inner surface (diameter) defining a recess


108


. Dielectric element


102


may be formed by any convenient process, such as isostatic or uniaxial pressing and green machining (such as tapping, thread milling, or lathing).




Attachment assembly


106


is preferably formed of alumina. Attachment assembly


106


is also preferably at least about 99.5% pure, and is more preferably at least about 99.9% pure. Attachment assembly


106


preferably has a dielectric loss tangent of less than about 0.0001 and preferably has a thermal conductivity of at least about 25 W/m/K at 25° C. Attachment assembly


106


preferably has a coefficient of thermal expansion of about 5×10


−6


/° C., and more preferably has a coefficient of thermal expansion substantially equal to that of dielectric element


102


. It is desirable that the coefficients of thermal expansion of dielectric element


102


and of attachment assembly


106


be matched as closely as possible, since they are to be threadedly attached. Attachment assembly


106


may likewise be formed of any convenient process, such as high or low pressure injection molding, uniaxial pressing and green machining, or isostatic pressing and green machining. Additional grinding may be required after sintering to fully form the threading. Ceramic attachment assembly


106


is preferably at least about 99.5% pure and is preferably formulated to be a good electrical insulator. Electrical insulators are defined as any material having an electrical resistivity in excess of about 10


13


ohm cm. In other embodiments, ceramic attachment assembly


106


may include electrically non-insulating components, such as semiconducting ceramics or ceramic composites, or electrically conducting ceramic composites.




Attachment assembly


106


of the preferred embodiment preferably includes a cylindrical member


107


that is at least partially externally threaded, having external threads


114


adapted to threadedly engage the threaded portion of recess


108


of dielectric element


102


. Attachment assembly


106


connects dielectric element


102


to the interior of housing


104


. Attachment assembly preferably includes fastener


150


adapted to threadedly attach cylindrical member


107


to housing


104


. Housing


104


is preferentially formed of metal and defines a resonant cavity


116


. The heat generated by operating dielectric element


102


is conducted away by attachment assembly


106


to housing


104


and then to a heat sink (not shown). By eliminating interfaces (such as from connectors or adhesives between dielectric element


102


and attachment assembly


106


and/or between attachment assembly


106


and housing


104


) from system


100


, heat retention is reduced both because heat is no longer generated at the eliminated interfaces by dielectric attenuation and because thermal conduction is not slowed at the eliminated interfaces.





FIG. 1D

illustrates one alternative embodiment of the present invention, a dielectric resonator system


100


′ wherein attachment assembly


106


′ is connected to housing


104


′ and includes an internally threaded recess


120


′ adapted to threadingly engage external threads


122


′ formed on dielectric element


102


′.





FIG. 2

illustrates another embodiment of the present invention, a dielectric resonator system


200


including a dielectric element


202


mounted to a housing


204


by an attachment assembly


206


. In this embodiment of the present invention, the above-described dielectric resonator system


100


is further modified by the inclusion of a tuning plug


222


. Dielectric element


202


is preferably a ceramic perovskite, but may be any convenient dielectric composition having desirable electrical and mechanical properties. Dielectric element


202


is preferably a ring formed having a threaded inner portion


208


adapted to threadedly engage a threads


214


formed on the (preferably at least 99.5% pure alumina) attachment assembly


206


. The top portion


224


of dielectric ring


202


includes a cylindrical tuning recess


220


adapted to at least partially receive a tuning plug


222


. Tuning plug


222


is mounted to a rod


228


that extends through a cavity


216


formed in tuning plug


222


and protrudes through an aperture (not shown) in housing


204


. In the embodiment illustrated in

FIG. 2

, rod


228


is preferably made of alumina or other suitable material and is threadedly coupled to tuning plug


222


, but may also be affixed by any known coupling means. The resonance of dielectric system


200


is fine-tuned as tuning plug


222


is advanced into or withdrawn from recess


220


. The movement of tuning plug


222


is halted when the desired resonant frequency is attained.




Dielectric element


202


and attachment assembly


206


preferably have substantially the same coefficient of thermal expansion, and more preferably have coefficients of thermal expansion of about 5-10×10


−6


/° C. Attachment assembly preferably has a loss tangent less than about 1×10


−4


and preferably has a thermal conductivity of at least about 25 W/m/K at 25° C.





FIGS. 3A and 3B

illustrate still another embodiment of the present invention, a dielectric resonator system


300


including a dielectric element


302


mounted to a casing


304


by an attachment assembly


306


. In this embodiment of the present invention, dielectric element


302


is preferably a ring having a hollow, threaded cylindrical central recess


308


extending therethrough. Dielectric element


302


is preferably a ceramic perovskite material but may be any convenient dielectric material having desirable physical properties. Attachment assembly


306


is externally threaded and includes a screw member


307


adapted to threadedly engage threaded recess


308


. Screw member


307


may therefore be rotatably advanced through dielectric element


302


. Casing


304


features an aperture


330


also threaded to mate with screw


307


. Attachment assembly


306


also includes an electrically insulating support cylinder


332


extending from casing


304


to dielectric ring


302


, preventing it from moving. Cylinder


332


is preferably formed from alumina and may be affixed to housing


304


with adhesive, such as ceramic cement. Alternatively, one or more discrete support spacers (not shown) may be used to additionally support dielectric ring


302


. The resonance of dielectric system


300


is tuned as screw member


307


is advanced into dielectric ring


302


. The advancement of screw member


307


is halted when the desired resonant frequency is attained.




Dielectric element


302


and attachment assembly


306


preferably have substantially the same coefficient of thermal expansion, and more preferably have coefficients of thermal expansion of about 5-10×10


−6


/° C. Attachment assembly preferably has a loss tangent less than about 1×10


−4


and preferably has a thermal conductivity of at least about 25 W/m/K at 25° C.





FIG. 4

illustrates yet another embodiment of the present invention, a dielectric resonator system


400


including a dielectric element


402


mounted to a housing


404


by an attachment assembly


406


. In this embodiment of the present invention, the above-described dielectric resonator system


300


is further modified by the inclusion of a tuning plug


422


. Dielectric element


402


is preferably formed from a ceramic perovskite material and is preferably a ring formed having a threaded inner portion


408


adapted to threadedly engage a threaded outer portion


414


of the (preferably at least 99.5% pure alumina) attachment assembly


406


. Dielectric ring


402


includes a top portion


424


having a cylindrical tuning recess


420


adapted to at least partially receive tuning plug


422


. Tuning plug


422


is mounted to a rod


428


that extends through a cavity


420


formed in tuning plug


422


and protrudes through an aperture


430


formed in housing


404


. Attachment assembly


406


includes screw member


407


adapted to threadedly engage aperture


430


and dielectric ring


402


. Attachment assembly


406


further includes at least one support member


432


extending between dielectric ring


402


and housing


404


.




In the embodiment illustrated in

FIG. 4

, rod


428


is preferably made of alumina or other suitable material and is threadedly coupled to tuning plug


422


, but may also be affixed by any known coupling means. The resonance of dielectric system


400


is therefore tuned by the placement of the screw


407


within dielectric ring


402


and is further fine-tuned as tuning plug


422


is advanced into tuning recess


420


. The advancement of plug


422


is halted when the desired resonant frequency is attained.




Dielectric element


402


and attachment assembly


406


preferably have substantially the same coefficient of thermal expansion, and more preferably have coefficients of thermal expansion of about 5-10×10


−6


/° C. Attachment assembly preferably has a loss tangent less than about 1×10


−4


and preferably has a thermal conductivity of at least about 25 W/m/K at 25° C.





FIGS. 5A-5C

illustrate still another embodiment of the present invention, a dielectric resonator


500


including a dielectric element


502


mounted to a housing


504


by an attachment assembly


506


. In this embodiment, dielectric element


502


is preferably a disk formed of dielectric ceramic material (more preferably from E


29


, E


36


, or E


45


) having a threaded inner recess portion


508


adapted to threadedly engage a threaded outer portion


514


of the (preferably at least 99.5% pure alumina) attachment assembly


506


. Dielectric disk


502


includes a top portion


524


that preferably is solid. Attachment assembly


506


is preferably an alumina cylinder and includes a bottom portion


540


and a threaded top portion


544


defining a shoulder


546


therebetween. Dielectric disk


502


is adapted to threadedly engage threaded top portion


544


of attachment assembly


506


and rest on or above shoulder


546


. Attachment assembly


506


is preferably hollow with a substantially solid bottom portion


540


. Attachment assembly


506


may be coupled to housing


504


by adhesives (not shown), one or more fasteners


550


(see

FIG. 5C

) penetrating bottom portion


540


and housing


504


, by mating bottom portion


540


and housing


504


either threadedly or by an interference fitting, or by any convenient coupling means. The resonance of dielectric system


500


is at least partially tuned by the placement of dielectric element


502


within cavity


516


.




Dielectric element


502


and attachment assembly


506


preferably have substantially the same coefficient of thermal expansion, and more preferably have coefficients of thermal expansion of about 5×10


−6


/° C. Attachment assembly preferably has a loss tangent less than about 1×10


−4


and preferably has a thermal conductivity of at least about 25 W/m/K at 25° C.





FIGS. 6A and B

illustrate yet another embodiment of the present invention, a dielectric resonator system


600


including a dielectric element


602


mounted within a housing


604


by an attachment assembly


606


. Dielectric element is preferably formed from a ceramic perovskite material, although it may be formed from any convenient dielectric material having desirable electrical and mechanical properties. Attachment assembly


606


is preferably formed of at least about 99.5% pure alumina and preferably has the form of a hollow support column attached. Attachment assembly


606


may be attached to housing


604


by fasteners (not shown) such as bolts or screws, by adhesives (not shown) such as alumina cement, or may be externally threaded and matably attached to an internally threaded aperture (as are the attachment assemblies of

FIGS. 3A

,


3


B and


4


) formed in housing


604


. Attachment assembly


606


has a bottom portion


640


, a central portion


642


, and a top portion


644


. Top portion


644


includes external threads


614


and has a smaller outer radius than does central portion


642


. The intersection of top portion


644


and central portion


642


defines a shoulder


646


. Attachment assembly


606


has a hollow, axially centered cylindrical core


648


of substantially constant radius.




Dielectric element


602


illustrated in

FIGS. 6A and B

has the shape of a ring, although it can have any desired shape. Dielectric ring


602


has a top portion


650


and a bottom portion


652


. Bottom portion


652


of dielectric ring


602


features a threaded circular recess


608


adapted to threadedly engage threads


614


of top portion


644


of attachment assmebly


606


.




Top portion


650


of dielectric ring


602


further includes an inner core


654


with a radius substantially equal to that of cylindrical core


648


of attachment assembly


606


. When dielectric ring


602


is threadedly engaged with attachment assembly


606


and seated on or above shoulder


646


, an extended axially centered cylindrical core


660


is defined. A substantially cylindrical dielectric tuning plug


622


adapted to slide within the extended axially centered cylindrical core


660


is used to fine-tune the dielectric resonant frequency of the system


600


. Dielectric plug


622


is mounted on a rod


628


that extends from plug


622


axially through the cylindrical core


660


and protrudes through aperture


630


in housing


604


. In one embodiment the protruding end of rod


628


is attached to a control knob


662


, which may be rotated to change the axial position of plug


622


within core


660


. Alternatively, element


662


may comprise an electromechanical actuator, such as a linear actuator.




Dielectric element


602


and attachment assembly


606


preferably have substantially the same coefficient of thermal expansion, and more preferably have coefficients of thermal expansion of about 5×10


−6


/° C. Attachment assembly preferably has a loss tangent less than about 1×10


−4


and preferably has a thermal conductivity of at least about 25 W/m/K at 25° C.




Variations on this embodiment include a dielectric resonator


600


′ including an attachment assembly


606


′ for connecting dielectric element


602


′ and having a threaded bottom portion


640


′ which is adapted to engage a threaded entry aperture


641


′ formed in housing


604


′, as illustrated in FIG.


6


C. The ceramic attachment assembly


606


′ therefore comprises a support structure having a threaded bottom portion


641


′ directly threadedly attachable to housing


604


′.




Another variation of the sixth embodiment dielectric resonator system


600


″, shown in

FIG. 6D

, includes a completely internally threaded dielectric ring


602


″ screwed to the top portion of externally threaded ceramic support member


606


″. Dielectric plug


622


″ is still provided to be variably positioned near or within dielectric ring


602


″. The positioning of dielectric plug


622


″ is controlled by knob


662


″.




Yet other variations of the third embodiment include the use of different geometries for the tuning plug, such as cubic or spherical (not shown). Still other variations of the third embodiment contemplate the use of various compositions for the tuning plug, such as glass, ceramic, plastic, or composite (not shown). Still another variation contemplates the use of a solenoid, linear actuator, or the like to automatically actuate the tuning plug into position (not shown).




While the invention has been illustrated and described in detail in the drawings and foregoing description, the same is to be considered as illustrative and not restrictive in character, it being understood that only the preferred embodiment has been shown and described and that all changes and modifications that come within the spirit of the invention are desired to be protected.



Claims
  • 1. A dielectric resonator system comprising:a housing defining a cavity; an externally threaded ceramic attachment assembly mounted within the housing; and an internally threaded dielectric element threadedly coupled to the attachment assembly; wherein the attachment assembly is at least about 99.5% pure; wherein the dielectric element and the attachment assembly have substantially the same coefficent of thermal expansion; and wherein the attachment assembly has a loss tangent less than about 0.0002.
  • 2. The system of claim 1 wherein the dielectric element comprises an internally threaded ceramic ring.
  • 3. The system of claim 2 wherein the dielectric ring is a ceramic perovskite.
  • 4. The system of claim 1 wherein attachment assembly has a thermal conductivity of at least about 25 W/M/K at 25° C.
  • 5. The system of claim 1 wherein the attachment assembly includes a substantially cylindrical alumina support member.
  • 6. The system of claim 1 wherein the attachment assembly includes an alumina support structure having an externally threaded top portion and a bottom portion defining a shoulder therebetween and wherein the dielectric element is threadedly mated to the top portion and rests on the shoulder.
  • 7. The system of claim 1 further comprising:a threaded entry aperture formed in the housing; wherein the externally threaded ceramic attachment assembly threadedly engages the entry aperture.
  • 8. The system of claim 1 wherein the attachment assembly comprises:a hollow alumina support structure having an externally threaded top portion and a central portion defining a shoulder therebetween; a bottom portion; a substantially cylindrical core formed in the hollow support structure; wherein the dielectric element is a ring threadedly coupled to the top portion of the alumina support structure; and a dielectric tuning plug adapted to slidably move within the cylindrical core and the ring.
  • 9. The system of claim 8 further comprising a rod coupled to the dielectric tuning plug and protruding through the housing.
  • 10. The system of claim 1 wherein the attachment assembly comprises:an alumina support structure having an at least partially externally threaded top portion, a central portion, and a bottom portion; a threaded entry aperture formed in the housing; and a dielectric tuning plug adapted to slidably move within the dielectric element; wherein the dielectric element is an at least partially internally threaded ring having a recess formed therein and threadedly coupled to the top portion of the alumina support structure.
  • 11. The system of claim 10 wherein the bottom portion is externally threaded and wherein the bottom portion threadedly engages the threaded entry aperture.
  • 12. The system of claim 1 wherein the attachment assembly comprises:a threaded dielectric tuning screw threadedly coupled to the dielectric element and to the housing; and a support cylinder extending from the housing to the dielectric element.
  • 13. The system of claim 12 wherein the dielectric element includes a recess and further comprising:a tuning plug; a rod connected to the tuning plug and extending through the housing; and wherein the tuning plug slidably engages the recess.
  • 14. The system of claim 1 wherein the attachment assembly includes:a substantially cylindrical hollow alumina support structure member with a thermal conductivity of at least about 25 W/M/K at 25° C. and having an externally threaded top portion and a central portion defining a shoulder therebetween; a bottom portion coupled to the housing; and a dielectric tuning plug; wherein the dielectric element includes: a partially hollow internally threaded ceramic disk; and a recess; wherein the dielectric element is a ring threadedly coupled to the top portion of the alumina support structure member; wherein the tuning plug is slidingly engaged within the recess.
  • 15. The system of claim 1 wherein the attachment assembly includes:a substantially cylindrical hollow externally threaded alumina support structure member with a thermal conductivity of at least about 25 W/M/K at 25° C.; a threaded entry aperture formed in the housing; and a dielectric tuning plug; wherein the dielectric element is an internally threaded ring; wherein the dielectric element has an upper recess; wherein the dielectric element is threadedly coupled to the top portion of the alumina support structure member; and wherein the dielectric tuning plug is adapted to slidably move within the internally threaded ring.
  • 16. The system of claim 1 wherein the dielectric element includes a tuning recess and further comprising:a tuning plug; a rod connected to the tuning plug and extending through the housing; and wherein the tuning plug slidably engages the tuning recess.
  • 17. The system of claim 16 wherein the placement of the dielectric element within the cavity tunes the resonant frequency of the system.
  • 18. The system of claim 16 wherein the placement of the dielectric element within the cavity tunes the resonant frequency of the system and wherein the placement of the tuning plug in the tuning recess fine-tunes the system.
  • 19. A dielectric resonator system comprising:a metallic casing; a threaded dielectric element housed within the metallic casing; and a threaded alumina attachment assembly connecting the metallic casing and the dielectric element; wherein the alumina attachment assembly is at least 99.5% pure.
  • 20. The system of claim 19 wherein the dielectric element is internally threaded and wherein the alumina attachment assembly further comprises an externally threaded alumina member threadedly coupled to the dielectric element.
  • 21. The system of claim 19 wherein the dielectric element is externally threaded and wherein the alumina attachment assembly further comprises an internally threaded alumina member threadedly coupled to the dielectric element.
  • 22. A dielectric resonator, comprising:a housing having an entry aperture; a ceramic support member having a threaded top end and a bottom end defining a shoulder therebetween; a dielectric disk resting on the shoulder; and wherein the ceramic support member is at least about 99.5% pure; wherein the ceramic support member has a thermal conductivity of at least about 25 W/M/K at 25° C.; wherein the ceramic support member has a coefficient of thermal expansion substantially equal to that of the dielectric disk; and wherein the bottom end is coupled to the housing.
  • 23. A dielectric resonator comprising:a casing having a threaded aperture; a dielectric element having a threaded internal diameter; and at least one threaded ceramic support member adapted to extend from the casing to the dielectric element; wherein the at least one threaded ceramic support member is at least about 99.5% pure; and wherein the at least one threaded ceramic support member has a coefficient of thermal conductivity of at least about 25 W/M/K at 25° C.
  • 24. The dielectric resonator of claim 23 wherein the dielectric element has a top portion and a bottom portion, the top portion having an inner cavity, and further comprising:a substantially cylindrical dielectric tuning plug slidably adapted to enter the cavity; and a support rod affixed to the dielectric tuning plug and protruding through the casing.
  • 25. A method of tuning a dielectric resonator comprising the steps of:a) providing a dielectric element having a tuning cavity formed therein; b) providing a resonating cavity defined by a housing; c) providing an attachment assembly formed of at least 99.5% pure alumina and connecting the dielectric element to the housing; d) providing a tuning dielectric; and e) moving the tuning dielectric within the tuning cavity.
  • 26. The method of claim 25 further comprising the steps of:providing threads on the surface of the attachment assembly; providing a threaded aperture in the housing; threadedly engaging the attachment assembly and the housing; and rotating the attachment assembly to move the tuning dielectric within the housing.
  • 27. The method of claim 25 further comprising the steps of:providing the attachment assembly as a substantially hollow attachment assembly; providing the tuning dielectric as a tuning plug adapted to slidingly move within the substantially hollow attachment assembly; and moving the tuning plug within the attachment assembly.
CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation-in-part of U.S. patent application Ser. No. 09/078,245, filed May 13, 1998 and now abandoned, and claims the benefit of U.S. Provisional Application No. 60/056,951, filed Aug. 25, 1997.

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Provisional Applications (1)
Number Date Country
60/056951 Aug 1997 US
Continuation in Parts (1)
Number Date Country
Parent 09/078245 May 1998 US
Child 09/442257 US