Dielectric waveguide filter with trap resonator

Information

  • Patent Grant
  • 11437691
  • Patent Number
    11,437,691
  • Date Filed
    Tuesday, June 23, 2020
    4 years ago
  • Date Issued
    Tuesday, September 6, 2022
    2 years ago
Abstract
A dielectric waveguide filter with a first solid block of dielectric material covered with a layer of conductive material and defining a plurality of resonators. A first RF signal input/output through-hole is defined in a first end resonator of the plurality of resonators of the first block of dielectric material. A second solid block of dielectric material is coupled to the first solid block of dielectric material. The second block of dielectric material is covered with a layer of conductive material and defines a plurality of resonators including first and second adjacent end resonators separated by an RF signal isolator for preventing the transmission of an RF signal between the first and second end resonators. An RF signal coupling window provides a coupling between the first end resonator of the plurality of resonators of the first block of dielectric material and the first end resonator of the second block of dielectric material whereby the first end resonator of the second block of dielectric material defines a trap resonator.
Description
FIELD OF THE INVENTION

The invention relates generally to dielectric waveguide filters and, more specifically, to a dielectric waveguide filter with a trap resonator.


BACKGROUND OF THE INVENTION

This invention is related to a dielectric waveguide filter of the type disclosed in U.S. Pat. No. 5,926,079 to Heine et al. in which a plurality of resonators are spaced longitudinally along the length of a monoblock and in which a plurality of slots/notches are spaced longitudinally along the length of the monoblock and define a plurality of bridges between the plurality of resonators which provide a direct inductive/capacitive coupling between the plurality of resonators.


The attenuation characteristics of a waveguide filter of the type disclosed in U.S. Pat. No. 5,926,079 to Heine et al. can be increased through the incorporation of zeros in the form of additional resonators located at one or both ends of the waveguide filter. A disadvantage associated with the incorporation of additional resonators, however, is that it also increases the length of the filter which, in some applications, may not be desirable or possible due to, for example, space limitations on a customer's motherboard.


The attenuation characteristics of a filter can also be increased by both direct and cross-coupling the resonators as disclosed in, for example, U.S. Pat. No. 7,714,680 to Vangala et al. which discloses a monoblock filter with both inductive direct coupling and quadruplet cross-coupling of resonators created in part by respective metallization patterns which are defined on the top surface of the filter and extend between selected ones of the resonator through-holes to provide the disclosed direct and cross-coupling of the resonators.


Direct and cross-coupling of the type disclosed in U.S. Pat. No. 7,714,680 to Vangala et al. and comprised of top surface of metallization patterns is not applicable in waveguide filters of the type disclosed in U.S. Pat. No. 5,926,079 to Heine et al. which includes only slots and no top surface metallization patterns.


The present invention is thus directed to a dielectric waveguide filter with a trap resonator.


SUMMARY OF THE INVENTION

The present invention is generally directed to a dielectric waveguide filter comprising a first solid block of dielectric material covered with a layer of conductive material and defining a plurality of resonators, a second solid block of dielectric material coupled to the first solid block of dielectric material, the second block of dielectric material covered with a layer of conductive material and defining a plurality of resonators including first and second adjacent resonators separated by an RF signal isolator for preventing the transmission of an RF signal between the first and second resonators, and an RF signal coupling window providing a coupling between a first one of the plurality of resonators of the first block of dielectric material and the first resonator of the second block of dielectric material whereby the first resonator of the second block of dielectric material defines a trap resonator.


In one embodiment, the first RF signal input/output is defined on an end one of the plurality of resonators of the first solid block of dielectric material and the first and second adjacent resonators of the second solid block of dielectric material comprised end ones of the resonators of the second solid block of dielectric material.


In one embodiment, the RF signal isolator comprises a plurality of spaced apart through-holes positioned between the first and second adjacent resonators.


In one embodiment, the RF signal coupling window is defined by a region on the first and second solid blocks of dielectric material that is devoid of conductive material.


In one embodiment, a first RF signal input/output through-hole is defined in the first one of the plurality of resonators of the first block of dielectric material.


In one embodiment, a third solid block of dielectric material is covered with a layer of conductive material and defines the trap resonator, the third solid block of dielectric material being coupled to the first and second solid blocks of dielectric material in a relationship abutting an end region of the first solid block of dielectric material and adjacent an end of the second block of dielectric material.


In one embodiment, an elongate slot is defined between the second and third solid blocks of dielectric material, the elongate slot defining the RF signal isolator for preventing the transmission of the RF signal between the second and third solid blocks of dielectric material.


In one embodiment, the RF signal coupling window is defined by a capacitive coupling isolated pad of conductive material on the first and third solid blocks of dielectric material.


The present invention is also directed to a dielectric waveguide filter comprising a first solid block of dielectric material covered with a layer of conductive material and defining a plurality of resonators, a first RF signal input/output through-hole defined in a first end resonator of the plurality of resonators of the first block of dielectric material, a second solid block of dielectric material coupled to the first solid block of dielectric material, the second block of dielectric material covered with a layer of conductive material and defining a plurality of resonators including first and second adjacent end resonators separated by an RF signal isolator for preventing the transmission of an RF signal between the first and second end resonators, and an RF signal coupling window for providing a coupling between the first end resonator of the plurality of resonators of the first block of dielectric material and the first end resonator of the second block of dielectric material whereby the first end resonator of the second block of dielectric material defines a trap resonator.


In one embodiment, the RF signal isolator comprises a plurality of spaced apart through-holes positioned between the first and second adjacent resonators.


In one embodiment, the RF signal coupling window is defined by a region on the first and second solid blocks of dielectric material that is devoid of conductive material.


In one embodiment, a first RF signal input/output is defined on the first one of the plurality of resonators of the first block of dielectric material.


In one embodiment, a third solid block of dielectric material is covered with a layer of conductive material and defines the trap resonator, the third solid block of dielectric material being coupled to the first and second solid blocks of dielectric material in a relationship abutting the end resonator of the first solid block of dielectric material and adjacent an end of the second block of dielectric material.


In one embodiment, an elongate slot is defined between the second and third solid blocks of dielectric material, the elongate slot defining the RF signal isolator for preventing the transmission of the RF signal between the second and third solid blocks of dielectric material.


In one embodiment, the RF signal coupling window is defined by a capacitive coupling isolated pad of conductive material on the first and third solid blocks of dielectric material.


The present invention is further directed to a dielectric waveguide filter comprising a first solid block of dielectric material covered with a layer of conductive material and defining a plurality of resonators, a second solid block of dielectric material coupled to the first solid block of dielectric material, the second block of dielectric material covered with a layer of conductive material and defining a plurality of resonators including a first end resonator, a third solid block of dielectric material coupled to the first solid block of dielectric material and positioned adjacent an end of the second solid block of dielectric material and defining a resonator, a slot between the second and third solid blocks of dielectric material and defining an RF signal isolator for preventing the transmission of an RF signal between the first end resonator of the second solid block of dielectric material and the resonator of the third solid block of dielectric material, and an RF signal coupling window providing a coupling between a first one of the plurality of resonators of the first block of dielectric material and the resonator of the third block of dielectric material whereby the resonator of the third block of dielectric material defines a trap resonator.


Other advantages and features of the present invention will be more readily apparent from the following detailed description of the preferred embodiment of the invention, the accompanying drawings, and the appended claims.





BRIEF DESCRIPTION OF THE DRAWINGS

These and other features of the invention can best be understood by the following description of the accompanying FIGS. as follows:



FIG. 1 is a top perspective view of a dielectric waveguide filter according to the present invention;



FIG. 2 is a bottom perspective view of the dielectric waveguide filter shown in FIG. 1;



FIG. 3 is an exploded perspective view of the dielectric waveguide filter shown in FIG. 1;



FIG. 4 is a bottom perspective view of the top block of the dielectric waveguide filter shown in FIG. 1;



FIG. 5 is a part phantom perspective view of the dielectric waveguide filter shown in FIG. 1;



FIG. 6 is a part phantom vertical cross-sectional view of the dielectric waveguide filter shown in FIG. 1 and depicting the internal RF signal direct and indirect transmission and coupling paths;



FIG. 7 is a schematic diagram of the electrical circuit of the dielectric waveguide filter shown in FIG. 1;



FIG. 8 is a top perspective view of another embodiment of a dielectric waveguide filter in accordance with the present invention;



FIG. 9 is an exploded perspective view of the dielectric waveguide filter shown in FIG. 8;



FIG. 10 is a bottom perspective view of the top block of the dielectric waveguide filter shown in FIG. 7;



FIG. 11 is bottom perspective view of the bottom block of the dielectric waveguide filter shown in FIG. 7;



FIG. 12 is a part phantom perspective view of the dielectric waveguide filter shown in FIG. 7;



FIG. 13 is a part phantom vertical cross-sectional view of the dielectric waveguide filter shown in FIG. 7 and depicting the internal RF signal transmission and coupling paths;



FIG. 14 is a schematic diagram of the electrical circuit of the dielectric waveguide filter shown in FIG. 7; and



FIG. 15 is a graph depicting the performance of the dielectric waveguide filters shown in the FIGS.





DETAILED DESCRIPTION OF THE EMBODIMENTS


FIGS. 1 through 7 depict a waveguide filter 100 in accordance with the present invention.


In the embodiment shown, the waveguide filter 100 is made from a pair of separate generally parallelepiped-shaped monoblocks or solid blocks of dielectric material 101 and 103 which have been coupled and abutted together in a stacked relationship to form the waveguide filter 100.


The monoblock 101 is comprised of a suitable solid block or core of dielectric material, such as for example ceramic, and includes opposed longitudinal horizontal exterior surfaces 102a and 104a, opposed longitudinal side vertical exterior surfaces 106a and 108a that are disposed in a relationship normal to and extend between the horizontal exterior surfaces 102a and 104a, and opposed transverse end side vertical exterior end surfaces 110a and 112a that are disposed in a relationship generally normal to and extend between the longitudinal horizontal exterior surfaces 102a and 104a and the longitudinal vertical exterior surfaces 102a and 102b.


Thus, in the embodiment shown, each of the surfaces 102a, 104a, 106a, and 108a extends in the same direction as the longitudinal axis of the monoblock 101 and each of the end surfaces 110a and 112a extends in a direction transverse or normal to the direction of the longitudinal axis of the monoblock 101.


The monoblock 103 is also comprised of a suitable solid block or core of dielectric material, such as for example ceramic, and includes opposed longitudinal horizontal exterior surfaces 102b and 104b, opposed longitudinal side vertical exterior surfaces 106b and 108b disposed in a relationship normal to and extending between the horizontal exterior surfaces 102b and 104b, and opposed transverse end side vertical exterior surfaces 110b and 112b disposed in a relationship normal to and extending between the horizontal exterior surfaces 102b and 104b and the longitudinal side vertical exterior surfaces 106b and 108b.


Thus, in the embodiment shown, each of the surfaces 102b, 104b, 106b, and 108b extends in the same direction as the longitudinal axis of the monoblock 103 and each of the surfaces 110b and 112b extends in a direction transverse or normal to the direction of the longitudinal axis of the monoblock 103.


The monoblocks 101 and 103 include and define respective first and second pluralities of resonant sections (also referred to as cavities or cells or resonators) R1, R4, R5, R8, and R9 on monoblock 101 and R2, R3, R6, R7, and R10 on monoblock 103 which are spaced longitudinally along the length of and extend co-linearly with and in the same direction as the longitudinal axis of the respective monoblocks 101 and 103. In the embodiment shown, each of the monoblocks 101 and 103 includes and defines five resonators although it is understood that the monoblocks 101 and 103 can include less or more than five resonators depending upon the application.


The resonators in each of the monoblocks 101 and 103 are separated from each other by respective sets or groups of two or four spaced-apart and co-linear RF signal isolation through-holes 140 that extend between and terminate in respective openings in the upper and lower longitudinal exterior surfaces of the respective monoblocks 101 and 103. The number of through-holes 140 located between respective adjacent resonators is dependent upon the desired direct RF signal coupling (D2, D4, D6, and D8) or indirect or cross RF signal coupling (C1 and C2) or no coupling between respective ones of the resonators as shown in FIGS. 6 and 7.


In the embodiment of FIGS. 1-7, the number and location of the through-holes 140 in spaced-apart and co-linear relationship between the respective resonators in the monoblock 101 is as follows: two through-holes 140 located between the resonators R1 and R4 to provide an inductive cross-coupling C1 between the resonators R1 and R4; two through-holes 140 located between the resonators R4 and R5 to provide an inductive direct coupling D4 between the resonators R4 and R5; two through-holes 140 located between the resonators R5 and R8 to provide an inductive cross-coupling between the resonators R5 and R8; and two through-holes 140 located between the resonators R8 and R9 to provide an inductive direct coupling D8 between the resonators R8 and R9.


In the embodiment of FIGS. 1-7, the number and location of the through-holes 140 in spaced-apart and co-linear relationship between the respective resonators in the monoblock 103 is as follows: two through-holes 140 located between the resonators R2 and R3 to provide an inductive direct coupling D2 between the resonators R2 and R3; four through-holes 140 located between the resonators R3 and R6 to eliminate any coupling between the resonators R3 and R6; two through-holes 140 located between the resonators R6 and R7 to provide an inductive direct coupling D6 between the resonators R6 and R7; and four through-holes 140 located between the resonators R7 and R9 to eliminate any coupling between the resonators R7 and R9.


Each of the monoblocks 101 and 103 further includes and defines a plurality of (namely ten in the embodiment shown) circular recesses or counter-bores or grooves 150 extending inwardly into the interior of the respective monoblocks 101 and 103 from the respective monoblock longitudinal surfaces or faces 102a and 102b. In the embodiment shown, the recesses 150 are positioned and located in the center of each of the respective resonators of the respective monoblocks 101 and 103.


Each of the monoblocks 101 and 103 further includes and defines a plurality of RF signal transmission windows 160a and 160b positioned and located on the respective longitudinal exterior surfaces 104a and 104b of the respective monoblocks 101 and 103. A window 160a or 160b is located and positioned on each of the respective resonators defined on each of the respective monoblocks 101 and 103.


In the embodiment shown, and as described in more detail below, the windows 160a define inductive RF signal transmission means and are generally rectangular and comprise regions on the exterior longitudinal surfaces 104a and 104b of the respective monoblocks 101 and 103 which are devoid of conductive material (i.e., isolated regions of dielectric material).


Moreover, in the embodiment shown, the windows 160b define capacitive RF signal transmission means and are generally circular in shape and comprise isolated regions of conductive material on the exterior longitudinal surfaces 104a and 104b of the respective monoblocks 101 and 103 which are surrounded by regions devoid of conductive material (i.e., regions of dielectric material) which in turn are surrounded by regions of conductive material.


In the embodiment of FIGS. 1-7, the RF signal transmission windows 160a and 160b are located and defined on the monoblock 101 as follows: a window 160a is located and defined on each of the resonators R1 and R5; and a window 160b is located and defined on each of the resonators R4 and R8.


In the embodiment of FIGS. 1-7, the RF signal transmission windows 160a and 160b are located and defined on the monoblock 103 as follows: a window 160a is located and defined on each of the resonators R2 and R6; and a window 160b is located and defined on each of the resonators R3 and R7.


The monoblock 101 still further comprises respective interior RF signal input/output through-holes 170 extending through the body of the monoblock 101 between the respective upper and lower longitudinal surfaces 102a and 104a thereof and terminating in respective openings in the respective upper and lower longitudinal surfaces 102a and 104a. In the embodiment shown, the through-holes 170 are located and positioned and extend through the interior of the respective end resonators R1 and R9 of the monoblock 101.


All of the external surfaces 102a, 104a, 106a, 108a, 110a, and 112a of the monoblock 101, the interior surfaces of the respective recesses 150, the interior surfaces of the respective RF signal coupling through-holes 140, the interior surfaces of the respective RF signal input/output through-holes 170, and the exterior surfaces of the respective RF signal coupling windows 160b are covered with a suitable conductive material, such as for example silver.


Similarly, all of the exterior surfaces 102b, 104b, 106b, 110b, and 112b of the monoblock 103, the interior surfaces of the respective recesses 150, the interior surfaces of the respective RF signal coupling through-holes 140, the interior surfaces of the respective RF signal input/output through-holes 170, and the exterior surfaces of the respective RF signal coupling windows 160b are covered with a suitable conductive material, such as for example silver.


The separate monoblocks 101 and 103 are coupled to and stacked on each other in an abutting side-by-side relationship to define and form the waveguide filter 100 in a manner in which the separate monoblocks 101 and 103, and more specifically the respective resonators thereof, are arranged in an abutting and stacked/side-by-side relationship as described in more detail below.


Specifically, the monoblocks 101 and 103 are coupled to each other in a relationship wherein the longitudinal horizontal exterior surface 102b of the monoblock 103 is abutted against the longitudinal horizontal exterior surface 104a of the monoblock 101.


Still more specifically, the monoblocks 101 and 103 are stacked/coupled to each other in a side-by-side relationship wherein the surface 104a of the monoblock 101 is abutted against the surface 102b of the monoblock 103; a central interior layer 200 of conductive material which extends the length and width of the interior of the waveguide filter 100 is sandwiched between the surface 104a of the monoblock 101 and the surface 102b of the monoblock 103, and is defined by the layer of conductive material covering the length and width of the external surfaces 104a and 102b of the respective monoblocks 101 and 103; the longitudinal side vertical exterior surface 106a of the monoblock 101 is co-planarly aligned with the longitudinal side vertical exterior surface 106b of the monoblock 103; the respective through-holes 140 in the monoblock 101 are co-linearly aligned with respective through-holes 140 in the monoblock 103; the respective recesses 150 in the monoblock 101 are co-linearly aligned with the respective recesses 150 in the monoblock 103; the respective RF signal coupling windows 160a on the monoblock 101 are co-linearly aligned with and abutted against the respective RF signal coupling windows 160a on the monoblock 103; the respective RF signal coupling windows 160b on the monoblock 101 are co-linearly aligned and abutted against the respective RF signal coupling windows 160b on the monoblock 101; the opposed longitudinal side vertical exterior surface 108a of the monoblock 101 is co-planarly aligned with the longitudinal side vertical exterior surface 108b of the monoblock 103; the transverse end side vertical exterior surface 110a of the monoblock 101 is co-planarly aligned with the transverse side vertical exterior surface 110b of the monoblock 103; and the opposed transverse end side vertical exterior surface 112a of the monoblock 101 is co-planarly aligned with the opposed transverse end side vertical exterior surface 112b of the monoblock 103.


Thus, with the monoblocks 101 and 103 abutted against each other, the resonators in the respective monoblocks 101 and 103 are abutted and stacked on each other as follows: R1 and R2; R3 and R4; R5 and R6; R7 and R8; and R9 and R10.


In accordance with the embodiment of FIGS. 1-7, the abutting relationship of the respective RF signal coupling windows 160a and 160b with the two monoblocks 101 and 103 stacked against each other provides the following RF signal couplings as shown in FIGS. 6 and 7: the abutting windows 160a between the resonators R1 and R2 provide a direct inductive coupling between the resonator R1 in monoblock 101 and the resonator R2 in monoblock 103; the abutting windows 160b between the resonators R3 and R4 provide a direct capacitive coupling between the resonator R3 in the monoblock 103 and the resonator R4 in the monoblock 101; the abutting windows 160a between the resonators R5 and R6 provide a direct inductive coupling between the resonator R5 in the monoblock 101 and the resonator R6 in the monoblock 103; and the abutting windows 160b between the resonators R7 and R8 provide a direct capacitive coupling between the resonator R7 in the monoblock 103 and the resonator R8 in the monoblock 101.


In accordance with the invention, the waveguide filter 100 defines a first combination inductive and capacitive generally serpentine shaped direct coupling RF signal transmission path generally designated by the lines D1 through D8 as shown in FIGS. 6 and 7 and described in more detail below.


Initially, the RF signal is inputted/transmitted into the RF signal input/output through-hole 170 and into the end resonator R1 of the monoblock 101 via the coupling Cin the embodiment where the through-hole 170 in the resonator R1 of monoblock 101 defines the RF signal input through-hole 170.


Thereafter, the RF signal is transmitted in a direction normal to the monoblock longitudinal axis from the end resonator R1 in the monoblock 101 into the resonator R2 in the monoblock 103 via the RF signal transmission window 160a that is located between the resonators R1 and R2; the RF signal then travels in the direction of the monoblock longitudinal axis into the adjacent resonator R3 in monoblock 103 via and through and around the isolation through-holes 140 located between the resonators R2 and R3; then in a direction normal to the monoblock longitudinal axis from the resonator R3 in the monoblock 103 and into the resonator R4 in the monoblock 101 via the RF signal transmission window 160b located between the resonators R3 and R4; then in the same direction as the monoblock longitudinal axis from the resonator R4 in the monoblock 101 and into the adjacent resonator R5 in the monoblock 101 via and through and around the isolation through-holes 140 located between the resonators R4 and R5; then in a direction normal to the monoblock longitudinal axis from the resonator R5 in the monoblock 101 and into the resonator R6 of the monoblock 103 via and through the RF signal transmission window 160a located between the resonators R5 and R6; then in the same direction as the monoblock longitudinal axis from the resonator R6 in the monoblock 103 and into the resonator R7 in the monoblock 103 via and through and around the isolation through-holes 140 located between the adjacent resonators R6 and R7; then in a direction normal to the monoblock longitudinal axis from the resonator R7 in the monoblock 103 and into the resonator R8 in the monoblock 101 via and through the RF signal transmission window 160b located between the resonators R7 and R8; then in the same direction as the monoblock longitudinal axis from the resonator R8 in the monoblock 101 and into the resonator R9 in the monoblock 101 via and through and around the isolation through-holes 140 located between the resonators R8 and R9; and then from the end resonator R9 in the monoblock 101 via coupling Cout and into and through the RF signal input/output through-hole 170 in the embodiment where the RF signal input/output through-hole 170 comprises the output for the RF signal.


The waveguide filter 100 also defines and provides an alternate or indirect- or cross-coupling RF signal transmission path for RF signals generally designated by the lines C1 and C2 as shown in FIGS. 6 and 7.


Specifically, a first cross-coupling or indirect inductive RF signal transmission path C1 is defined and created in the same direction as the monoblock longitudinal axis between the resonators R1 and R4 in the monoblock 101 and a second cross-coupling or indirect inductive RF signal transmission path C2 is defined and created in the same direction as the monoblock longitudinal axis between the resonators R5 and R8 in the monoblock 101.


Moreover, and as shown in FIGS. 6 and 7, the combination of the respective recesses 150 in the respective end resonators R9 and R10 of the respective monoblocks 101 and 103; the abutting RF signal transmission windows 160a located between the end resonators R9 and R10; and the RF signal input/output through-hole 170 in the end resonator R9 of the monoblock 101 define a trap resonator R10 in the monoblock 103 that defines and forms the notch 200 in the graph of FIG. 15.


More specifically, and although the resonator R7 in the monoblock 103 is located adjacent and in a side-by-side relationship with the end resonator R10 in the monoblock 103, there is no direct RF signal coupling between the resonator R7 and the end resonator R10 in the direction of the monoblock longitudinal axis due to the presence of the four RF signal isolation through-holes 140 positioned between the resonators R7 and R10. Instead, there is an inductive trap coupling Ctrap defined between the resonators R9 and R10 in the respective monoblocks 101 and 103, i.e., the resonator R10 in the monoblock 103 is coupled to the resonator R9 in the monoblock 101 through the RF signal coupling window 160a located between the resonators R10 and R9 to function as an external or isolated trap resonator R10.



FIGS. 8 through 14 depict another embodiment of a dielectric waveguide filter 1100 which is similar in structure to the dielectric waveguide 100, and thus the earlier description of the elements, structure and function of the dielectric waveguide filter 100 is incorporated herein by reference in connection with the description of the elements, structure, and function of the dielectric waveguide filter 1100, except that in the waveguide filter 1100 the resonator R10 is in the form of a separate third solid block of dielectric material 105; the RF coupling window 160a between the resonator R9 on the first solid block of dielectric material 101 and the third solid block of dielectric material 105 has been substituted with a capacitive RF signal coupling window 160b comprising an isolated pad of conductive material on the respective exterior surfaces of the first and third blocks of dielectric material 101 and 105 respectively that is surrounded by a region or ring of dielectric material; and the RF signal isolator between the resonators R7 and R10 comprises an elongate slot 107 defined between the adjacent end faces or surfaces of the respective monoblocks 103 and 105 that prevents the transmission of the RF signal between the end resonator R7 in the block 103 and the resonator R10 in the block 105.


Specifically, the third solid block of dielectric material 105, like the blocks 101 and 103, is a generally parallelepiped-shaped monoblock with a solid core of dielectric material and including opposed top and bottom exterior longitudinal horizontal surfaces or faces 105a and 105b, opposed longitudinal side vertical exterior surfaces or faces 105c and 105d that are disposed in a relationship normal to and extend between the horizontal exterior surfaces 105a and 105b, and opposed transverse end side vertical surfaces or faces 105e and 105f that are disposed in a relationship generally normal to and extend between the longitudinal horizontal exterior surfaces 105a and 105b and the longitudinal vertical exterior surfaces 105c and 105d.


The monoblock or block 105 includes and defines a circular recess or counter-bore 150 extending inwardly into the interior of the monoblock 105 from the top exterior surface or face 105a. In the embodiment shown, the recess 150 is centrally located on the monoblock 105.


All of the exterior surfaces 105a, 105b, 105c, 105d, 105e, and 105f of the monoblock 105 including the exterior surfaces of the recess 150 defined therein are covered with a suitable conductive material, such as for example silver.


The monoblock 105 also includes and defines the capacitive RF signal coupling window 160b in the form of an isolated pad of conductive material on the bottom exterior surface or face 105b of the monoblock 105 that is surrounded by a region or ring of dielectric material which in turn in surrounded by a region of conductive material.


Although not shown in the FIGS, it is understood that in the waveguide filter embodiment 1100 as shown in FIGS. 8-14, the inductive RF coupling window 160a formed in the region of the resonator R9 of the monoblock 101 in the filter embodiment of FIGS. 1-7 has been substituted with a capacitive RF signal coupling window 160b in the form of an isolated pad of conductive material on the top exterior surface 104a of the monoblock 101.


Further, in the embodiment of FIG. 14, the second block of dielectric material 103 is shorter than the first block of dielectric material 101 to allow mounting and abutting of the third block of dielectric material 105 against the first block 101 and adjacent the second block 103 in the region of the end resonator R9 of the block 101 in a relationship wherein the end face 105e of the block 105 is positioned in a relationship spaced, adjacent and parallel to the end face 112b of the block 103; the end face 105f of the block 105 is positioned in a relationship co-planar with the end face 112a of the block 101; the bottom exterior face 105a of the block 105 is abutted against the top exterior face 104a of the block 101; and the RF signal coupling window 160b on the bottom exterior face 105a of the block 105 is abutted against the RF signal coupling window 160b on the top exterior face 104a of the block 101.


In accordance with the embodiment of FIGS. 8 through 13, the space between the respective adjacent end faces 112b of the block 103 and the end face 105e of the block 105 defines and forms an elongate slot 107 between the blocks 103 and 105 defining a RF signal isolator.


More specifically, and although the resonator R7 in the monoblock 103 is located adjacent and in a side-by-side relationship with the end resonator R10 defined by the block 105, there is no direct RF signal coupling between the resonator R7 and the end resonator R10 in the direction of the monoblock longitudinal axis due to the presence of the elongate slot 107 between the resonators R7 and R10. Instead, there is a capacitive trap coupling Ctrap defined between the resonators R9 and R10 in the respective monoblocks 101 and 105, i.e., the resonator R10 in the monoblock 105 is coupled to the resonator R9 in the monoblock 101 through the capacitive RF signal coupling window 160a located between the resonators R10 and R9 to function as an external or isolated trap resonator R10.


While the invention has been taught with specific reference to the embodiments shown, it is understood that a person of ordinary skill in the art will recognize that changes can be made in form and detail without departing from the spirit and the scope of the invention. The described embodiments are to be considered in all respects only as illustrative and not restrictive.


For example, it is understood that the configuration, size, shape, and location of several of the elements of the waveguide filter including, but not limited to, the resonators, windows, and through-holes may be adjusted or varied depending upon the particular application or desired performance characteristics of the waveguide filter.

Claims
  • 1. A dielectric waveguide filter comprising: a first solid block of dielectric material covered with a layer of conductive material and defining a plurality of resonators;a second solid block of dielectric material coupled to the first solid block of dielectric material, the second block of dielectric material covered with a layer of conductive material and defining a plurality of resonators including first and second adjacent resonators separated by an RF signal isolator for preventing the transmission of an RF signal between the first and second resonators; andan RF signal coupling window providing a coupling between a first one of the plurality of resonators of the first block of dielectric material and the first resonator of the second block of dielectric material whereby the first resonator of the second block of dielectric material defines a trap resonator.
  • 2. The dielectric waveguide filter of claim 1 wherein a first RF signal input/output is defined on an end one of the plurality of resonators of the first solid block of dielectric material and the first and second adjacent resonators of the second solid block of dielectric material comprised end ones of the resonators of the second solid block of dielectric material.
  • 3. The dielectric waveguide filter of claim 1 wherein the RF signal isolator comprises a plurality of spaced apart through-holes positioned between the first and second adjacent resonators.
  • 4. The dielectric waveguide filter of claim 1 wherein the RF signal coupling window is defined by a region on the first and second solid blocks of dielectric material that is devoid of conductive material.
  • 5. The dielectric waveguide filter of claim 1 further comprising a first RF signal input/output on the first one of the plurality of resonators of the first block of dielectric material.
  • 6. A dielectric waveguide filter comprising: a first solid block of dielectric material covered with a layer of conductive material and defining a plurality of resonators;a first RF signal input/output on a first end resonator of the plurality of resonators of the first block of dielectric material;a second solid block of dielectric material coupled to the first solid block of dielectric material, the second block of dielectric material covered with a layer of conductive material and defining a plurality of resonators including first and second adjacent end resonators separated by an RF signal isolator for preventing the transmission of an RF signal between the first and second end resonators; andan RF signal coupling window for providing a coupling between the first end resonator of the plurality of resonators of the first block of dielectric material and the first end resonator of the second block of dielectric material whereby the first end resonator of the second block of dielectric material defines a trap resonator.
  • 7. The dielectric waveguide filter of claim 6 wherein the RF signal isolator comprises a plurality of spaced apart through-holes positioned between the first and second adjacent resonators.
  • 8. The dielectric waveguide filter of claim 6 wherein the RF signal coupling window is defined by a region on the first and second solid blocks of dielectric material that is devoid of conductive material.
  • 9. A dielectric waveguide filter comprising: a first solid block of dielectric material covered with a layer of conductive material and defining a plurality of resonators;a second solid block of dielectric material coupled to the first solid block of dielectric material, the second block of dielectric material covered with a layer of conductive material and defining a plurality of resonators including a first end resonator;a third solid block of dielectric material coupled to the first solid block of dielectric material and positioned adjacent an end of the second solid block of dielectric material and defining a resonator; a slot between the second and third solid blocks of dielectric material and defining an RF signal isolator for preventing the transmission of an RF signal between the first end resonator of the second solid block of dielectric material and the resonator of the third solid block of dielectric material; andan RF signal coupling window providing a coupling between a first one of the plurality of resonators of the first block of dielectric material and the resonator of the third block of dielectric material whereby the resonator of the third block of dielectric material defines a trap resonator.
  • 10. The dielectric waveguide filter of claim 9 wherein the third solid block of dielectric material that is coupled to the first and second solid blocks of dielectric material is abutting an end region of the first solid block of dielectric material.
  • 11. The dielectric waveguide filter of claim 9 wherein the slot is an elongate slot.
  • 12. The dielectric waveguide filter of claim 9 wherein the RF signal coupling window is defined by a capacitive coupling isolated pad of conductive material on the first and third solid blocks of dielectric material.
CROSS-REFERENCE TO RELATED AND CO-PENDING APPLICATIONS

This application claims the benefit of the filing date and disclosure of U.S. Provisional Application Ser. No. 62/866,867 filed on Jun. 26, 2019, the contents of which are entirely incorporated herein by reference as are all of references cited therein.

US Referenced Citations (142)
Number Name Date Kind
3882434 Levy May 1975 A
3955161 MacTurk May 1976 A
4396896 Williams Aug 1983 A
4431977 Sokola et al. Feb 1984 A
4609892 Higgins, Jr. Sep 1986 A
4692726 Green et al. Sep 1987 A
4706051 Dieleman et al. Nov 1987 A
4773208 Ishikawa et al. Mar 1988 A
4742562 Kommrusch May 1988 A
4800348 Rosar et al. Jan 1989 A
4806889 Nakano et al. Feb 1989 A
4837535 Konishi et al. Jun 1989 A
4940955 Higgins, Jr. Jul 1990 A
4963844 Konishi et al. Oct 1990 A
4996506 Ishikawa et al. Feb 1991 A
5004992 Grieco et al. Apr 1991 A
5023944 Bradley Jun 1991 A
5130682 Agahi-Kesheh Jul 1992 A
5130683 Agahi-Kesheh et al. Jul 1992 A
5208565 Sogo et al. May 1993 A
5243309 L'Ecuyer Sep 1993 A
5288351 Hoang et al. Feb 1994 A
5285570 Fulinara May 1994 A
5365203 Nakamura et al. Nov 1994 A
5382931 Piloto et al. Jan 1995 A
5416454 McVetty May 1995 A
5525946 Tsujiguchi et al. Jun 1996 A
5528204 Hoang et al. Jun 1996 A
5528207 Ito Jun 1996 A
5537082 Tada et al. Jul 1996 A
5572175 Tada et al. Nov 1996 A
5602518 Clifford, Jr. et al. Feb 1997 A
5719539 Ishizaki et al. Feb 1998 A
5731751 Vangala Mar 1998 A
5821836 Katehi et al. Oct 1998 A
5850168 McVetty et al. Dec 1998 A
5926078 Hino et al. Jul 1999 A
5926079 Heine et al. Jul 1999 A
5929726 Ito et al. Jul 1999 A
5999070 Endo Dec 1999 A
6002306 Arakawa et al. Dec 1999 A
6016091 Hidaka et al. Jan 2000 A
6023207 Ito et al. Feb 2000 A
6026281 Yorita Feb 2000 A
6104261 Sonoda et al. Aug 2000 A
6137383 De Lillo Oct 2000 A
6154106 De Lillo Nov 2000 A
6160463 Arakawa et al. Dec 2000 A
6181225 Bettner Jan 2001 B1
6255921 Arakawa et al. Jul 2001 B1
6281764 Arakawa et al. Aug 2001 B1
6329890 Brooks et al. Dec 2001 B1
6351198 Tsukamoto et al. Feb 2002 B1
6437655 Andoh et al. Aug 2002 B1
6504446 Ishihara et al. Jan 2003 B1
6507252 Ho et al. Jan 2003 B1
6535083 Hageman et al. Mar 2003 B1
6549095 Tsukamoto et al. Apr 2003 B2
6556106 Sano et al. Apr 2003 B1
6559740 Schulz et al. May 2003 B1
6568067 Takeda May 2003 B2
6570467 Walker et al. May 2003 B2
6594425 Tapalian et al. Jul 2003 B2
6650202 Rogozine et al. Nov 2003 B2
6677837 Kojima et al. Jan 2004 B2
6757963 Meier et al. Jul 2004 B2
6791403 Tayrani et al. Sep 2004 B1
6801106 Ono et al. Oct 2004 B2
6834429 Blair et al. Dec 2004 B2
6844861 Peterson Jan 2005 B2
6888973 Kolodziejski et al. May 2005 B2
6900150 Jacquin et al. May 2005 B2
6909339 Yonekura et al. Jun 2005 B2
6909345 Salmela et al. Jun 2005 B1
6927653 Uchimura et al. Aug 2005 B2
6977560 Iroh et al. Dec 2005 B2
6977566 Fukunaga Dec 2005 B2
7009470 Yatabe et al. Mar 2006 B2
7068127 Wilber et al. Jun 2006 B2
7075388 Rogozine et al. Jul 2006 B2
7132905 Sano Nov 2006 B2
7142074 Kim et al. Nov 2006 B2
7170373 Ito et al. Jan 2007 B2
7271686 Koshikawa et al. Sep 2007 B2
7321278 Vangala Jan 2008 B2
7323954 Lee et al. Jan 2008 B2
7449979 Koh et al. Nov 2008 B2
7545235 Mansour et al. Jun 2009 B2
7659799 Jun et al. Feb 2010 B2
7714680 Vangala et al. May 2010 B2
7877855 Chuang et al. Feb 2011 B2
8008993 Milson et al. Aug 2011 B2
8072294 Tanpo et al. Dec 2011 B2
8171617 Vangala May 2012 B2
8284000 Fukunaga Oct 2012 B2
8314667 Uhm et al. Nov 2012 B2
8823470 Vangala Sep 2014 B2
8860532 Gong et al. Oct 2014 B2
9030278 Vangala May 2015 B2
9030279 Vangala May 2015 B2
9077062 Brady Jul 2015 B2
9130255 Rogozine et al. Sep 2015 B2
9130256 Rogozine et al. Sep 2015 B2
9130257 Vangala Sep 2015 B2
9130258 Vangala et al. Sep 2015 B2
9431690 Rogozine et al. Aug 2016 B2
9437908 Vangala Sep 2016 B2
9437909 Vangala et al. Sep 2016 B2
9466864 Rogozine et al. Oct 2016 B2
9666921 Rogozine et al. May 2017 B2
10050321 Rogozine et al. Aug 2018 B2
10116028 Vangala Oct 2018 B2
20010024147 Arkawa et al. Sep 2001 A1
20020024410 Guglielmi et al. Feb 2002 A1
20030006865 Kim et al. Jan 2003 A1
20040000968 White et al. Jan 2004 A1
20040056737 Carpintero et al. Mar 2004 A1
20040129958 Kho et al. Jul 2004 A1
20040257194 Casey et al. Dec 2004 A1
20050057402 Ohno et al. Mar 2005 A1
20070120628 Jun et al. May 2007 A1
20090015352 Goebel et al. Jan 2009 A1
20090102582 Van Der Heijden et al. Apr 2009 A1
20090146761 Nummerdor Jun 2009 A1
20090201106 Iio et al. Aug 2009 A1
20090231064 Bates et al. Sep 2009 A1
20100024973 Vangala Feb 2010 A1
20100253450 Kim et al. Oct 2010 A1
20110032050 Kouki et al. Feb 2011 A1
20110279200 Vangala Nov 2011 A1
20120049983 Uhm et al. Mar 2012 A1
20120229233 Ito Sep 2012 A1
20120286901 Vangala Nov 2012 A1
20130214878 Gorisee et al. Aug 2013 A1
20140077900 Rogozine et al. Mar 2014 A1
20140152403 Park Jun 2014 A1
20140266514 Rogozine et al. Sep 2014 A1
20150084720 Vangala et al. Mar 2015 A1
20150295294 Rogozine et al. Oct 2015 A1
20160308264 Vangala Oct 2016 A1
20180301781 Peng et al. Oct 2018 A1
20190067773 Vangala Feb 2019 A1
Foreign Referenced Citations (65)
Number Date Country
1398014 Feb 2003 CN
1507109 Jun 2004 CN
201898182 Jul 2011 CN
102361113 Feb 2012 CN
203218423 Sep 2013 CN
102361113 Aug 2014 CN
109449557 Mar 2019 CN
109509945 Mar 2019 CN
208806343 Apr 2019 CN
2056528 May 1972 DE
102008017967 Oct 2009 DE
0322993 Jul 1989 EP
0322993 Apr 1990 EP
0444948 Mar 1991 EP
0757401 Feb 1997 EP
0859423 Aug 1998 EP
1024548 Feb 2000 EP
0997964 May 2000 EP
0997964 Sep 2001 EP
1278264 Jan 2003 EP
1439599 Jul 2004 EP
2318512 Feb 1977 FR
62038601 Feb 1987 JP
02-090801 Mar 1990 JP
6-177607 Jun 1994 JP
6177607 Jun 1994 JP
10173407 Jun 1998 JP
2000286606 Oct 2000 JP
2001-339204 Dec 2001 JP
3405783 Mar 2003 JP
2003298313 Oct 2003 JP
2005-269012 Sep 2005 JP
2006157486 Jun 2006 JP
2006340141 Dec 2006 JP
2010028381 Feb 2010 JP
2010-130663 Jun 2010 JP
2011244451 Dec 2011 JP
2003-0007057 Jan 2003 KR
10-0399041 Sep 2003 KR
10-0522726 Oct 2005 KR
10-0586502 May 2006 KR
10-0852487 Aug 2008 KR
10-0866978 Nov 2008 KR
10-0906215 Jul 2009 KR
10-0932705 Dec 2009 KR
10-2010-0030862 Mar 2010 KR
10-0954801 Apr 2010 KR
10-0995758 Nov 2010 KR
10-1001935 Dec 2010 KR
10-1081419 Nov 2011 KR
10-1126183 Mar 2012 KR
20130020632 Feb 2013 KR
10-1431005 Aug 2014 KR
10-1442220 Sep 2014 KR
10-1581687 Dec 2015 KR
10-1616768 Apr 2016 KR
1020170048753 May 2017 KR
10-1919456 Feb 2019 KR
199509451 Apr 1995 WO
2000024080 Apr 2000 WO
0038270 Jun 2000 WO
02078119 Oct 2002 WO
2005091427 Sep 2005 WO
2013012438 Jan 2013 WO
2015090107 Jun 2015 WO
Non-Patent Literature Citations (19)
Entry
Ruiz-Cruz J et al.: “Rectangular Waveguide Elliptic Filters with Capacitive and Inductive Irises and Integrated Coaxial Excitation”, 2005 IEEE MTT-S International Microwave Symposium, Piscataway, NJ, USA, IEEE, (Jun. 12, 2005) pp. 269-272, EP010844740, DOI: 10.1109/MWSYM.2005.1516577, ISBN: 978-0-7803-8846-8 p. 269; figures 1,3.
Paul Wade: “Rectangular Waveguide to Coax Transition Design”, QEX, Nov./Dec. 2006, pp. 10-17, published by American Radio Relay League, Newington, Connecticut, US.
Yoji Isota, Moriyasu Miyazaki, Osami Ishida, Fumio Takeda, Mitsubishi Electric Corporation. “A Grooved Monoblock Comb-Line Filter Suppressing the Third Harmonics”, IEEE 1987 MTT-S Digest, pp. 383-386, published by IEEE, New York, New York, US.
C. Choi, Fig 2.13, Monolithic Plated Ceramic Waveguide Filters, Mar. 31, 1986, Motorola, Inc., Schaumburg, Illinois, U.S.
Kocbach J. et al.: “Design Procedure for Waveguide Filters with Cross-Couplings”, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No. 02CH37278) IEEE Piscataway, NJ, USA; IEEE MTT-S International Microwave Symposium, IEEE, Jun. 2, 2002, pp. 1449-1452, XP001113877, DOI: 10.1109/WMSYM.2002.1012128 ISBN: 978-0-8703-7239-9 abstract; figure 1.
N. Marcuvilz, Waveguide Handbook, McGraw-Hill Book Co., New York City, Ch. 5, 1951.
Y. Konishi, “Novel dielectric waveguide components-microwave applications of new ceramic materials,” Proc. IEEE, vo. 79, pp. 726-740, Jun. 1991.
K. Sano, “Dielectric waveguide filter with low profile and low insertion loss,” IEEE Trans. on Microwave Theory & Tech., vol. 47, pp. 2299-2303, Dec. 1999.
K. Sano and T. Yoneyama, “A transition from Microstrip to Dielectric Filled Rectangular Waveguide in Surface Mounting,” IEEE MTT-S Int. Microwave Symp. Digest, pp. 813-816, 2002.
I. Awai, A.C. Kundu, and T. Yamashita, “Equivalent circuit representation and explanation of attenuation poles of a dual-mode dielectric resonator bandpass filter,” IEEE Trans. Microwave Theory & Tech., vol. 46, pp. 2159-2163, Dec. 1998.
A.D. Lapidus and C. Rossiter, “Cross-coupling in microwave bandpass filters,” Microwave Journal, pp. 22-46, Nov. 2004.
Tze-min Shen; Chi-Feng Chen' Huang, Ting-Yi; Wu, Ruey-Beei, “Design of Vertically Stacked Waveguide Filters in LTCC,” Microwave Theory and Techniques, IEEE Transactions on, vol. 55, No. 8, pp. 1771, 1779, Aug. 2007.
Hung-Yi Chien; Tze-Min Shen; Huang; Ting-Yi; Wei-Hsin Wang; Wu, Ruey-Beei, “Miniaturized Bandpass Filters with Double-Folded Substrate Integrated Resonators in LTCC,” Microwave Theory and Techniques, IEEE Transactions on vol. 57, No. 7, pp. 1774, 1782, Jul. 2009.
Bo-Jiun Chen; Tze-Min Shen; Wu, Ruey-Beei, “Dual-Band Vertically Stacked Laminated Waveguide Filter Design in LTCC Technology,” Microwave Theory and Techniques, IEEE Transactions on, vol. 57, No. 6, pp. 1554, 1562, Jun. 2009.
Wolfram Wersing, Microwave ceramics for resonators and filters, Current Opinion in Solid State and Materials Science, vol. 1, Issue 5, Oct. 1996, pp. 715-731, ISSN 1359-0286.
Shen T et al., Full-Wave Design of Canonical Waveguide Filters by Optimization, 2001 IEEE MTT-S International Microwave Symposium Digest. (IMS 2001) Phoenix, AZ, May 20-25, 2001, pp. 1487-1490.
John David Rhodes, The Generalized Direct-Coupled Cavity Linear Phase Filter, IEEE Transactions on Microwave Theory and Techniques, vol. MTT-18, No. 6, Jun. 1, 1970 (Jun. 1, 1970), pp. 308-313, XP001401320, abstract.
Y. Cassivi et al., Low-Cost and High-Q Millimeter-Wave Resonator Using Substrate Integrated Waveguide Technique, Microwave Conference, 2002 32nd European, pp. 1-4.
Emilio Amieri et al., Coaxially Fed Substrate Integrated Radiating Waveguides, Antennas and Propogation Society International Symposium, 2007 IEEE, pp. 2718-2721.
Related Publications (1)
Number Date Country
20200411935 A1 Dec 2020 US
Provisional Applications (1)
Number Date Country
62866867 Jun 2019 US