1. Field of the Invention
The present invention relates generally to network communication, and in particular, to a method, apparatus, system, and article of manufacture for splitting dielectric waveguides and enabling bidirectional communication across a dielectric waveguide in a millimeter wavelength communication system.
2. Description of the Related Art
(Note: This application references a number of different publications as indicated throughout the specification by reference numbers enclosed in brackets, e.g., [x]. A list of these different publications ordered according to these reference numbers can be found below in the section entitled “References.” Each of these publications is incorporated by reference herein.)
Advances in the mobile, desktop, and server backplane/data center markets have motivated new approaches to Gbps (gigabytes per second) interconnects that seek to reduce power consumption, increase data-reach (operating distance), and reduce overall package pin count. More specifically, millimeter-wave (mm-wave) communications have gained attention in recent years, primarily since the high fractional bandwidth potentially offers multi-Gb/s wireless data-links [1-3].
One recent Gbps solution proposed by wide-screen LCD (liquid crystal display) manufacturers are dielectric waveguides operating at mm-wave. These interconnects have been proposed as an alternative to conventional LVDS (low voltage differential signaling) or optical interconnects for transfer of HD (high definition) display data from the DVR (digital video recorder) or set-top box to the display processor. A dielectric waveguide is a long solid piece of dielectric that confines an electromagnetic wave and offers low insertion loss compared with copper solutions for LVDS (TP [twisted pair], CPW [coplanar waveguide], or uStrip).
Further, recently demonstrated mm-wave transceivers offer impressively high data-rates, however, their range is typically limited to only a few meters [2], and so non-free space mm-wave communication approaches such as the dielectric ribbon link demonstrated in [4] have been developed to operate over longer distances of up to 10 meters. Dielectric ribbons allow direct coupling from a transceiver with either an on-chip probe or antenna structure placed nearby the ribbon's end. The simplicity of coupling makes them attractive for aircraft and spacecraft applications as transmission through a dielectric ribbon does not rely on an electrical contact, only a coupled wave. Additionally dielectric ribbons can be much lighter weight than copper interconnects, reducing overall payload weight.
In view of the above, while dielectric waveguide interconnects themselves already exist, the necessary infrastructure (especially signal splitters and signal combiners) required to build modern network technologies have not yet been demonstrated. Accordingly, it is desirable to have a very simple, versatile, and flexible, transmission medium at relatively low costs, that offers mechanical interfacing similar to fiber optic, and channel bandwidths comparable to LVDS.
Embodiments of the invention provide a dielectric waveguide based power splitter (e.g., a dielectric ribbon system) that enables multi-cast operation (transmitting a signal from one-node to many nodes) and multi-listen (one-node receiving signals from many nodes). Such a splitter allows modern network topologies (star, ring, etc.) to be implemented and enables the dielectric waveguide to enter the network infrastructure market. Further, while the commercial market is driven by high data-rates, embodiments of the invention may be more modest, operating at data rates of 10 Mb/s which is comparable with the typical signaling interfaces found in aircraft or spacecraft systems.
Additional embodiments of the invention provide a hybrid/isolator component that allows for simultaneous bidirectional communication on a single dielectric waveguide cable (ribbon or tube) by preventing self-transmission (transmitting to the same-node receiver) through geometric manipulation of the signal.
Referring now to the drawings in which like reference numbers represent corresponding parts throughout:
In the following description, reference is made to the accompanying drawings which form a part hereof, and which is shown, by way of illustration, several embodiments of the present invention. It is understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the present invention.
Dielectric Waveguides Splitter
A dielectric waveguide entirely made of plastic (or other dielectric material) can be used to transfer data or power with low insertion loss. However, to split the power from one (1) port to two (2) ports, a dielectric waveguide power divider is required.
In one or more embodiments of the invention, the dielectric waveguide Y-junction power divider 100 is made entirely of plastic (or other dielectric material) with no metallization. The dielectric waveguide is not restricted to plastic substrate but may be any type of substrate (e.g. conventional substrate, polymer, fabric, dielectric foam, etc.). In this regard, various properties/characteristics of the dielectric waveguide power divider 100 enables the splitter/divider to function properly. More specifically, the angle A and sizing (e.g., width W) of the divider 100 may enable the power divider 100 to function as desired. In an electrical cable (e.g., a coaxial cable), if the size of the conductors is changed, nothing happens to the propagation. However, if the dimensions of a plastic/dielectric cable are changed, it may not function properly. In the dielectric waveguide Y-junction power divider 100, the angle A may be required to be less than 90°. Such an angle A permits the a mm (millimeter) wave signal to propagate from input port 1 to output ports 2 and 3 as desired.
An example of an optimized dielectric waveguide splitter is shown in
Such figures illustrates that it is possible to achieve an efficient power divider with low loss. Insertion losses in a dielectric waveguide are related to its size and dielectric properties. Therefore, embodiments of the invention use a substrate with low dielectric losses (i.e. low loss tangent).
Exemplary Dielectric Ribbon
For air and space applications, an exemplary dielectric waveguide power divider 100 may utilize HDPE (high-density polyethylene) as the material for the dielectric ribbon, both for its lightweight properties as well as its relatively high melting temperature, which is necessary in more extreme environments (deep space). Additionally HDPE is 3D printing compatible which enables low-cost and large volume manufacturing. To characterize the proposed dielectric ribbon, dimensions may be optimized using any full 3D EM solver (HFSS, CST [computer simulation technology, etc.) and then several straight ribbon sections may be fabricated to characterize the insertion losses as well as coupling losses. Final dimensions selected may be 3 mm (E-plane)×1.5 mm (H-plane). Two measurements of the same dielectric ribbon with different lengths (115 mm and 185 mm) directly coupled through open WR-10 rectangular waveguide may be performed using a vector network analyzer (VNA) (HP8510). By de-embedding the length difference between the two measurements, the loss per unit length, and the coupling losses of the ribbon can be extracted from test sections.
One additional concern that needs to be addressed, especially for aerospace applications, is interference caused by any mm-wave signal emitted from the ribbon as it may interfere with other equipment on-board, especially scientific instruments which operate in the same frequency range (radiometers or spectrometers).
To quantify any possible interference, an open ended waveguide with the flange removed may be positioned across the dielectric ribbon (as illustrated at 500 in
In order to obtain multi-casting operation where one transmitter can simultaneously broadcast to multiple receivers, it is necessary to incorporate a power splitter which can evenly distribute the power between multiple branches. In order to accomplish this, embodiments of the invention provide the power splitter ribbon geometry (Y junction) shown in
To demonstrate the proposed dielectric ribbon multi-casting link, one may use an existing 94 GHz silicon MMICs (monolithic microwave integrated circuit) that are a lower frequency variant of those presented in [5]. The Si (silicon) MMICs are wirebonded onto PCB (printed circuit board) and contain an internal on-chip folded-dipole antenna (with total radiation efficiency ˜7% [5]). For a dielectric ribbon assembly, the MMIC itself may first be encapsulated in a thin layer of epoxy to protect the widebonding as shown on the left of
To implement the complete prototype multi-casting link, one may construct the arrangement shown in
Accordingly, the losses associated with a 94 GHz dielectric ribbon data-link may be characterized using HDPE material. The proposed data-link is compatible with 3D printing processes and offers a low-cost approach to mm-wave interconnects. Further, field confinement can be shown as the propagating field is suppressed more than 30 dB at distances beyond a few cm from the ribbon. Additionally a simple Y-junction with optimized dimensions can provide balanced power splitting and enable multi-casting operation for larger network topologies. Embodiments of the invention operate reliably at 10 Mb/s with a bit error rate better than 10−12. Furthermore, a dielectric ribbon data-link does not rely on electrical contact providing higher reliability for aerospace applications.
Hybrid/Isolator for Bidirectional Link
Classically, if multiple transmitters (TXs) and a receivers (RXs) are connected on the same wire, leakage/feedback results.
To overcome such prior art problems, embodiments of the invention configure the dielectric waveguides Y-splitter 100 in a unique manner. More specifically, the splitter/divider 100 can be further generalized into a hybrid structure like the one shown in
As illustrated in
System Overview
As described above, embodiments of the invention provide a dielectric waveguide based power splitter that enables multi-cast operation and multi-listen. Further, a hybrid/isolator component allows for simultaneous bidirectional communication on a single dielectric waveguide cable.
A dielectric waveguide splitter is provided/fabricated. More specifically, a dielectric substrate is fabricated into a first Y-junction waveguide with a first port splitting into a first branch leading to a second port and a second branch leading to a third port. An angle between the first branch and the second branch is below ninety degrees (90°). Such a configuration enables millimeter-wave (mmWave) transmission between the first port and the second port while reducing feedback of the mmWave between the second and third port. In particular, a dimension of the waveguide splitter (e.g., including the angle) enables the splitter to reduce the feedback to below a desired threshold range (e.g., below 1% or 20 dB). An additional dimension that enables the functionality of the device is the sizing of the waveguide. In particular, a cross section of the Y-junction waveguide is larger than λ/4 in both height and width.
While the dielectric substrate may comprise any type of substrate with low dielectric losses (e.g., in the range of 2.0 to 3.0), in one or more embodiments of the invention, the dielectric substrate consists essentially of a plastic substrate.
Multicasting may be performed where the first port multi-casts a signal to both the second port and to the third port. Further, simultaneous bidirectional communication in opposite directions at a single frequency between the first port and the second port and third ports may be enabled.
A dielectric waveguide bidirectional link may also be fabricated. In such an embodiment, a dielectric substrate may be fabricated into a first Y-junction waveguide and a second Y-junction waveguide that share a bidirectional waveguide section. A first port on the first Y-junction waveguide leads to a first branch that leads to the bidirectional waveguide section. A second port on the second Y-junction waveguide leads to a second branch that leads to the bidirectional waveguide section. A third port on the second Y-junction leads to a third branch that leads to the bidirectional waveguide section. An angle between the second branch and the third branch is below ninety degrees (90°). Further, the above described configuration (including use of particular angles/sizing) enables simultaneous bidirectional mmWave transmission at a single frequency between the first port and the second port, and between the first port and the third port while reducing feedback of the mmWave between the second and third port.
Similar to the waveguide splitter, in the dielectric waveguide bidirectional the dielectric substrate may be any type of substrate with low dielectric losses and may consist essentially of a plastic substrate.
With respect to the bidirectional communications, the first port transmits a first signal that is received by both the second port and the third port. In addition, the second port transmits, simultaneously with the first signal, a second signal that is received by the first port. Similar to the splitter, a cross section of the first Y-junction waveguide and the second Y-junction waveguide is larger than λ/4 in both height and width. In addition, a fourth port on the first Y-junction may lead to a fourth branch that leads to the bidirectional waveguide section. Such a fourth port on the first Y-junction waveguide is isolated to enable a transmission and receiver pair to be placed on the first port and the fourth port without self-transmission.
To utilize the bidirectional link an a particular environment/communication system, the link may take a variety of forms including a ribbon and/or a tube.
Conclusion
This concludes the description of the preferred embodiment of the invention. In summary, embodiments of the invention provide a dielectric waveguide-based power divider and hybrid/isolator. Embodiments of the invention may be used for communication links between modules on spacecraft, landers, and rovers. Dielectric waveguide technology also provides a low weight, size, and power approach to Gb/s interconnects. For example, embodiments of the invention may be utilized as part of the communication electronics/communication systems in the data-center, server, and desktop markets. Such data-links also offer improved reliability and reduced packaging complexity as they do not depend on physical contact, which allows for added vibration/stress immunity.
The foregoing description of the preferred embodiment of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. It is intended that the scope of the invention be limited not by this detailed description, but rather by the claims appended hereto.
This application claims the benefit under 35 U.S.C. Section 119(e) of the following and commonly-assigned U.S. provisional patent application(s), which is/are incorporated by reference herein: Provisional Application Ser. No. 61/941,886, filed on Feb. 19, 2014, by Adrian J. Tang, Goutam Chattopadhyay, Nacer E. Chahat, and Emmanuel Decrossas, entitled “Dielectric Waveguide Signal Splitter and Combiner for Future Gb/s Network Infrastructure”.
The invention described herein was made in the performance of work under a NASA contract and is subject to the provisions of Public Law 96-517 (35 USC 202) in which the Contractor has elected to retain title.
Number | Name | Date | Kind |
---|---|---|---|
4307938 | Dyott | Dec 1981 | A |
6057747 | Takenoshita | May 2000 | A |
7808439 | Yang | Oct 2010 | B2 |
7876180 | Uchimura | Jan 2011 | B2 |
20140312987 | Morita | Oct 2014 | A1 |
20150109070 | Herbsommer | Apr 2015 | A1 |
Number | Date | Country |
---|---|---|
0318198 | May 1989 | EP |
Entry |
---|
Emami, S., et al., “A 60GHz CMOS Phased-Array Transceiver Pair for Multi-Gb/s Wireless Communications”, IEEE International Solid-State Circuits Conference, 2011, pp. 164-166. |
Hertel, P., “Dielectric Waveguides”, Lectures delivered at TEDA Applied Physics School, Nankai University, Tianjin, PRC, Sep. 2009. |
Kim, Y., et al., “An 8Gb/s/pin 4pJ/b/pin Single-T-Line Dual (Base+RF) Band Simultaneous Bidirectional Mobile Memory I/O Interface with Inter-Channel Interference Suppression”, International Solid-State Circuits Conference 2012, Session 2, pp. 50-52. |
Mitomo, T., et al., “A 2Gb/s-Throughput CMOS Transceiver Chipset with In-Package Antenna for 60GHz Short-Range Wireless Communication”, Proc. International Solid-State Circuits Conference 2012, Session 15, pp. 266-267. |
Natarajan, A., et al., “A Fully-Integrated 16-Element Phased-Array Receiver in SiGe BiCMOS for 60-GHz Communications”, IEEE Journal of Solid-State Circuits, vol. 46, No. 5, pp. 1059-1075, May 2011. |
Tanaka, Y., et al., “A Versatile Multi-Modality Serial Link”, International Solid-State Circuits Conference 2012, Session 19, pp. 332-334. |
Tang, A., et al., “A 155 GHz 220mW Synthesizer-Free Phase Based Radar System in 65nm CMOS Technology”, IEEE International Microwave Symposium, 2013. |
“Dielectric”, Wikipedia, last modified Nov. 22, 2014. http://en.wikipedia.org/wiki/Dielectric. |
“Dielectric-Material”, Whatls.com, last modified Nov. 4, 2010. http://whatis.techtarget.com/definition/dielectric-material?vgnextfmt=print. |
Low-voltage differential signaling, Wikipedia, last modified Dec. 10, 2014. http://en.wikipedia.org/wiki/Low-voltage—differential—signaling. |
Chapter 5—Dielectric waveguides, Photonics Research Group. Last accessed by Wayback Machine on Oct. 29, 2013. http://photonics.intec.ugent.be/download/ocs131.pdf. |
Number | Date | Country | |
---|---|---|---|
20150236396 A1 | Aug 2015 | US |
Number | Date | Country | |
---|---|---|---|
61941886 | Feb 2014 | US |