Claims
- 1. A projection device, comprising:
a digital micromirror device; a circuit board, further including a first face and a second face; an integrated heat sink/stiffener; and a plurality of engagement mechanisms; wherein the plurality of engagement mechanisms is adapted to operatively couple the digital micromirror device to the first face of the circuit board and to secure the integrated heat sink/stiffener to the second face of the circuit board; and wherein the integrated heat sink/stiffener is adapted to provide structural support to the circuit board and to draw thermal energy away from the digital micromirror device.
- 2. The projection device of claim 1, further including a thermally insulating layer positioned substantially between the heat sink/stiffener and the circuit board.
- 3. The projection device of claim 2, further including a thermally conductive element, wherein each of the circuit board and the insulating layer has an aperture configured to accommodate the thermally conductive element when the digital micromirror device is coupled to the circuit board, such that a first portion of the thermally conductive element is urged against the digital micromirror device and a second portion of the thermally conductive element is urged against the heat sink/stiffener.
- 4. The projection device of claim 3, wherein the aperture in the circuit board is configured such that the thermally conductive element is spaced apart from the circuit board when the digital micromirror device is coupled to the circuit board.
- 5. The projection device of claim 4, further including a spacer positioned substantially between the circuit board and the digital micromirror device.
- 6. The projection device of claim 1, wherein the integrated heat sink/stiffener includes a thermally insulating layer positioned to be adjacent to the circuit board when the integrated heat sink/stiffener is in contact with the second face of the circuit board.
- 7. The projection device of claim 1, wherein each engagement mechanism includes one or more of a screw and a mounting compression spring, and wherein one or more of the integrated heat sink/stiffener and the circuit board include a plurality of openings configured to accommodate the engagement mechanisms.
- 8. The projection device of claim 6, wherein the plurality of openings is disposed at the periphery of one or more of the heat sink/stiffener and the circuit board.
- 9. A mounting system for use with a digital micromirror device, comprising:
a circuit board; an integrated heat sink/stiffener adapted to provide structural support to the circuit board, the integrated heat sink/stiffener including:
a first side contoured similarly to the circuit board; a second side including a plurality of formations to enlarge the surface area of the second side to dissipate thermal energy from the second side; and a plurality of engagement mechanisms; wherein the plurality of engagement mechanisms is adapted to secure the first side of the integrated heat sink/stiffener against the circuit board at a desired compressive force and couple the circuit board with the digital micromirror device in a desired alignment.
- 10. The mounting system of claim 9, further including a thermally conductive element, wherein the circuit board includes an aperture larger than the thermally conductive element, and wherein the thermally conductive element is adapted to be positioned substantially within the aperture such that a first portion of the thermally conductive element is selectively urged against the first side of the integrated heat sink/stiffener.
- 11. The mounting system of claim 9, further including a thermally insulating layer interposed between the circuit board and the integrated heat sink/stiffener.
- 12. The mounting system of claim 11, wherein the insulating layer is formed as a unitary part of the integrated heat sink/stiffener.
- 13. The mounting system of claim 9, wherein the plurality of formations includes a plurality of fins disposed longitudinally across the second side of the circuit board.
- 14. The mounting system of claim 9, wherein each engagement mechanism includes one or more of a screw and a mounting compression spring; wherein the integrated heat sink/stiffener includes a plurality of openings configured to accommodate the engagement devices; and wherein the circuit board includes a corresponding plurality of openings substantially aligned with the plurality of openings of the integrated heat sink/stiffener.
- 15. The mounting system of claim 14, wherein the plurality of openings is disposed at the periphery of heat sink/stiffener.
- 16. The mounting system of claim 9, further including a spacer, wherein the plurality of engagement mechanisms is further adapted to hold at least a portion of the spacer between the circuit board and the digital micromirror device in a desired alignment.
- 17. An integrated heat sink/stiffener for a circuit board, the integrated heat sink/stiffener comprising:
a substantially planar first side; and a second side including at least one formation to enlarge the surface area of the second side so that thermal energy can be drawn away from the first side and dissipated from the second side; wherein the integrated heat sink/stiffener is adapted to provide structural support to a circuit board.
- 18. The integrated heat sink/stiffener of claim 17, wherein the first side includes a thermally insulating layer.
- 19. The integrated heat sink/stiffener of claim 17, wherein at least the second side is fabricated from a thermally conductive material.
- 20. The integrated heat sink/stiffener of claim 17, further including a plurality of fastening mechanisms adapted to secure a circuit board to the first side at a desired compressive force.
- 21. The integrated heat sink/stiffener of claim 20, wherein the plurality of fastening mechanisms is adapted to secure an insulating layer between a circuit board and the first side of the integrated heat sink/stiffener.
- 22. The integrated heat sink/stiffener of claim 20, wherein the plurality of fastening mechanisms is further adapted to couple a secured circuit board with a digital micromirror device in a desired alignment.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application claims priority under 35 U.S.C. § 119 to U.S. Provisional Patent Application Ser. No. 60/475,367, which was filed on Jun. 2, 2003. The disclosure of that application is hereby incorporated by reference in its entirety for all purposes.
Provisional Applications (1)
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Number |
Date |
Country |
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60475367 |
Jun 2003 |
US |