Claims
- 1. A method of forming an energy converter for converting vibrational energy of the vibrationally energized species into useful form of energy, comprising:
forming a conducting surface on a stabilizing interlayer conductor, the conducting surface being formed from one or more nanostructures in contact with a region having at least some vibrationally energized species; forming the stabilizing interlayer conductor on an ohmic contact conductor, the stabilizing interlayer conductor being formed from one or more nanostructures; forming the ohmic contact conductor on a tailoring conductor, the ohmic contact conductor being formed from one or more nanostructures; forming the tailoring conductor on a semiconductor, the tailoring conductor being formed from one or more nanostructures; and forming the semiconductor into a pn junction.
- 2. The method of claim 1, further including:
choosing the tailoring conductor material from those materials having a surface energy that approximately matches the surface energy of the semiconductor.
- 3. The method of claim 1, further including:
limiting total thickness of the conductors and the nanostructures to a thickness sufficiently small to render the total thickness to be relatively transparent relative to the ballistic transport of hot electrons through the conductors and the nanostructures.
- 4. The method of claim 1, wherein the total dimension of all the layers ranges from sub-monolayer to 200 monolayers.
- 5. The method of claim 1, wherein vibrationally energized species generated on or near the conducting surface transfer a fraction of its vibrational energy to ballistic electrons in the conducting surface when the vibrationally energized species contacts the conducting surface.
- 6. The method of claim 5, wherein kinetic energy of ballistic electrons are converted into a useful diode forward bias voltage in the semiconductor formed into the pn junction.
- 7. The method of claim 1, wherein the one or more nanostructures include nanolayer, nanocluster, quantum well, or combinations thereof.
- 8. A method of forming an energy converter for converting vibrational energy of the vibrationally energized species into useful form of energy, comprising:
forming a conducting surface on a stabilizing interlayer conductor, the conducting surface being formed from one or more nanostructures in contact with a region having at least some vibrationally energized species; forming the stabilizing interlayer conductor on a Schottky conductor, the stabilizing interlayer conductor being formed from one or more nanostructures; forming the Schottky conductor on a tailoring conductor, the Schottky conductor being formed from one or more nanostructures; forming the tailoring conductor on a semiconductor, the tailoring conductor being formed from one or more nanostructures.
- 9. The method of claim 8, further including:
choosing the stabilizing interlayer conductor from materials that block the passage of reactants and reaction products from reacting with or diffusing through the Schottky conductor.
- 10. A method of forming an energy converter for converting vibrational energy of the vibrationally energized species into useful form of energy, comprising:
forming a conducting surface from one or more conductors and conducting catalysts on a stabilizing interlayer conductor; forming the stabilizing interlayer conductor on a conductor material; forming the conductor material on a tailoring conductor; and forming the tailoring conductor on a semiconductor.
- 11. The method of claim 10, wherein the stabilizing interlayer conductor comprises at least gold.
- 12. The method of claim 10, wherein the forming the conductor material includes forming an ohmic contact conductor on a tailoring conductor.
- 13. The method of claim 12, wherein the ohmic contact conductor has a thickness of 50 nanometers or less.
- 14. The method of claim 10, forming the tailoring conductor includes forming the tailoring conductor in contact with the semiconductor.
- 15. The method of claim 10, wherein the tailoring conductor comprises at least chrome.
- 16. The method of claim 10, further including limiting the thickness of the conducting catalysts to under 20 nanometers.
- 17. The method of claim 10, further including limiting the thickness of the stabilizing interlayer conductor to under 50 nanometers.
- 18. The method of claim 10, further including limiting the thickness of the tailoring conductor to 4 monolayers or less.
- 19. The method of claim 10, further including forming the semiconductor with a band gap energy less than a probable energy of ballistic electrons generated in the energy converter.
- 20. The method of claim 10, wherein the one or more conducting catalysts include one or more of platinum, palladium, ruthenium, ruthenium oxides, vanadium, vanadium oxides, transition metals or combinations thereof.
- 21. The method of claim 10, wherein the forming the conductor material includes forming a Schottky conductor.
- 22. The method of claim 21, wherein the Schottky conductor is formed from gold, silver, platinum, palladium, ruthenium and its oxides, vanadium and its oxides, transition metals, or combinations thereof.
- 23. The method of claim 21, further including limiting the thickness of the Schottky conductor to 10 nanometers or less.
- 24. The method of claim 10, wherein the semiconductor is formed from TiO2, a wide bandgap semiconductor, or combinations thereof.
- 25. An energy converter, comprising:
a stabilizing interlayer conductor formed on a conductor material; a conducting surface formed on the stabilizing interlayer conductor, the conducting surface formed from one or more nanostructures in contact with or near a region for containing vibrationally energized species; a tailoring material on which the conductor material is formed; and a semiconductor on which the tailoring material is formed.
- 26. The energy converter of claim 25, wherein at least the conducting surface, the stabilizing interlayer conductor, the tailoring material, or the semiconductor is formed as one or more nanostructures.
- 27. The energy converter of claim 25, wherein the conductor material includes a Schottky conductor.
- 28. The energy converter of claim 25, wherein the conductor material includes an ohmic contact material.
- 29. The energy converter of claim 25, wherein the semiconductor includes p-type and n-type semiconductor forming a pn junction.
- 30. The energy converter of claim 25, further including a substrate on which the semiconductor is formed.
- 31. The energy converter of claim 30, wherein the substrate includes at least a heat conducting substrate.
- 32. The method of claim 8, further including:
limiting total thickness of the conductors and the nanostructures to a thickness sufficiently small to render the total thickness to be relatively transparent relative to the ballistic transport of hot electrons through the conductors and the nanostructures.
- 33. The method of claim 8, wherein the total dimension of all the layers ranges from sub-monolayer to 200 monolayers.
- 34. The method of claim 8, wherein vibrationally energized species generated on or near the conducting surface transfer a fraction of its vibrational energy to ballistic electrons in the conducting surface when the vibrationally energized species contacts the conducting surface.
- 35. The method of claim 1, further including:
choosing the stabilizing interlayer conductor from materials that block the passage of reactants and reaction products from reacting with or diffusing through a Schottky conductor.
REFERENCE TO CROSS-RELATED APPLICATIONS
[0001] This is a continuation-in-part application of U.S. patent application Ser. No. 10/038,257, filed Oct. 24, 2001, which is a continuation of U.S. patent application Ser. No. 09/589,669 filed Jun. 7, 2000 now U.S. Pat. No. 6,327,859, which is a divisional of U.S. patent application Ser. No. 09/304,979 filed May 4, 1999 now U.S. Pat. No. 6,114,620.
Divisions (1)
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Number |
Date |
Country |
Parent |
09304979 |
May 1999 |
US |
Child |
09589669 |
Jun 2000 |
US |
Continuations (1)
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Number |
Date |
Country |
Parent |
09589669 |
Jun 2000 |
US |
Child |
10038257 |
Oct 2001 |
US |
Continuation in Parts (1)
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Number |
Date |
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Parent |
10038257 |
Oct 2001 |
US |
Child |
10759341 |
Jan 2004 |
US |