1. Field of the Invention
The present invention relates to a directional coupler and more particularly relates to a directional coupler that is preferably used in wireless communication devices or other devices that perform communication by using high-frequency signals.
2. Description of the Related Art
A directional coupler described in Japanese Unexamined Patent Application Publication No. 8-237012 is a known example of an existing directional coupler. The directional coupler is formed by stacking a plurality of dielectric layers, on which coil-shaped conductors and ground conductors are formed, on top of one another. Two coil-shaped conductors are provided. One of the coil-shaped conductors constitutes a main line and the other coil-shaped conductor constitutes a sub line. The main line and the sub line are electromagnetically coupled to each other. The coil-shaped conductors are interposed between the ground conductors in a stacking direction. A ground potential is applied to the ground conductors. In the above-described directional coupler, when a high-frequency signal is input to the main line, a high-frequency signal having power proportional to the power of the foregoing high-frequency signal is output from the sub line.
However, there is a drawback with the directional coupler described in Japanese Unexamined Patent Application Publication No. 8-237012, in that the degree of coupling between the main line and the sub line increases as the frequency of a high-frequency signal input to the main line increases (that is, the degree-of-coupling characteristic is not uniform). As a result, even if high-frequency signals having the same power are input to the main line, when the frequencies of the high-frequency signals vary, the power of each of the high-frequency signals output from the sub line varies. Hence, an IC connected to the sub line has to have a function of correcting the power of a high-frequency signal on the basis of the frequency of the high-frequency signal.
Preferred embodiments of the present invention provide a directional coupler that has a near-uniform degree-of-coupling characteristic.
A directional coupler according to a preferred embodiment of the present invention is a directional coupler that is used in a certain frequency band. The directional coupler includes a first terminal, a second terminal, a third terminal, a fourth terminal, a main line that is connected between the first terminal and the second terminal, a sub line that is connected between the third terminal and the fourth terminal and that is electromagnetically coupled to the main line, a first low pass filter that includes a first coil which is connected between the first terminal and the main line and that has a characteristic in which attenuation increases with increasing frequency in the certain frequency band, a second low pass filter that includes a second coil which is connected between the second terminal and the main line and that has a characteristic in which attenuation increases with increasing frequency in the certain frequency band, and a high pass filter that is connected, in parallel to the main line, between a point between the first coil and the first terminal and a point between the second coil and the second terminal and that has a characteristic in which attenuation decreases with increasing frequency in the certain frequency band.
According to various preferred embodiments of the present invention, a degree-of-coupling characteristic in a directional coupler is close to uniform.
The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments with reference to the attached drawings.
A directional coupler according to preferred embodiments of the present invention will be described below.
A circuit configuration of the directional coupler 10 will be described. The directional coupler 10 is used in a certain frequency band. A non-limiting example of the certain frequency band is a band of 824 MHz to 2690 MHz in the case of a high-frequency signal having a frequency of 824 MHz to 894 MHz (BAND 5 of W-CDMA) and a high-frequency signal having a frequency of 2500 MHz to 2690 MHz (BAND 7 of W-CDMA) are input to the directional coupler 10. Hereinafter, the frequency band of 824 MHz to 894 MHz (BAND 5 of W-CDMA) is termed a frequency band B1, and the frequency band of 2500 MHz to 2690 MHz (BAND 7 of W-CDMA) is termed a frequency band B2.
As the circuit configuration, the directional coupler 10 includes outer electrodes (terminals) 14a to 14f, a main line M, a sub line S, low pass filters LPF1 and LPF2, and a high pass filter HPF. The main line M is connected between the outer electrodes 14a and 14b. The sub line S is connected between the outer electrodes 14c and 14d and is electromagnetically coupled to the main line M.
The low pass filter LPF1 is connected between the outer electrode 14a and the main line M and has a characteristic in which attenuation increases with increasing frequency in the certain frequency band. The low pass filter LPF1 is a π-type low pass filter that includes capacitors C1 and C2, and a coil L1. The coil L1 is connected between the outer electrode 14a and the main line M. The capacitor C1 is connected between a point between the coil L1 and the outer electrode 14a, and the outer electrodes 14e and 14f. The capacitor C2 is connected between a point between the main line M and the coil L1, and the outer electrodes 14e and 14f.
The low pass filter LPF2 is connected between the outer electrode 14b and the main line M and has a characteristic in which attenuation increases with increasing frequency in the certain frequency band. In the directional coupler 10, the low pass filter LPF1 and the low pass filter LPF2 have the same characteristic. The low pass filter LPF2 preferably is a π-type low pass filter that includes capacitors C3 and C4, and a coil L2. The coil L2 is connected between the outer electrode 14b and the main line M. The capacitor C3 is connected between a point between the coil L2 and the outer electrode 14b, and the outer electrodes 14e and 14f. The capacitor C4 is connected between a point between the main line M and the coil L2, and the outer electrodes 14e and 14f.
The high pass filter HPF is connected, in parallel to the main line M, between a point between the coil L1 and the outer electrode 14a and a point between the coil L2 and the outer electrode 14b, and has a characteristic in which attenuation decreases with increasing frequency in the certain frequency band. The high pass filter HPF preferably includes a capacitor C5.
In the above-described directional coupler 10, the outer electrode 14a preferably defines an input port and the outer electrode 14b preferably defines an output port. The outer electrode 14c preferably defines a coupling port and the outer electrode 14d preferably defines a termination port that is terminated with 50Ω, for example. The outer electrodes 14e and 14f preferably define ground ports that are grounded. When a high-frequency signal is input to the outer electrode 14a, the high-frequency signal is output from the outer electrode 14b. In addition, because the main line M and the sub line S are electromagnetically coupled to each other, a high-frequency signal having power proportional to the power of the high-frequency signal is output from the outer electrode 14c.
The directional coupler 10 having the above-described circuit configuration achieves a degree-of-coupling characteristic close to uniform, as described below.
In the existing directional coupler, the degree of coupling between the main line and the sub line increases as the frequency of a high-frequency signal increases. Hence, as illustrated in
Thus, in the directional coupler 10, the low pass filter LPF1 is connected between the outer electrode 14a and the main line M, and the low pass filter LPF2 is connected between the outer electrode 14b and the main line M. The low pass filters LPF1 and LPF2 have an insertion loss characteristic in which attenuation increases with increasing frequency in the certain frequency band. Hence, as the frequency of a high-frequency signal input from the outer electrode 14a increases, the power of the high-frequency signal that flows through the low pass filters LPF1 and LPF2 to the ground, to which the outer electrodes 14e and 14f are connected, increases. For this reason, in a high frequency range, the power of a high-frequency signal that passes through the main line M becomes smaller than that in a low frequency range. As a result, as illustrated in
However, in the directional coupler, which is the same as the directional coupler 10 but does not include the high pass filter HPF, as illustrated in
Thus, in the directional coupler 10, the high pass filter HPF is connected, in parallel to the main line M, between a point between the coil L1 and the outer electrode 14a and a point between the coil L2 and the outer electrode 14b. The high pass filter HPF has a characteristic in which attenuation decreases with increasing frequency in the certain frequency band. Hence, when the frequency of a high-frequency signal input from the outer electrode 14a increases, the high-frequency signal is almost entirely prevented pass through the low pass filters LPF1 and LPF2 and the main line M, and passes through the high pass filter HPF. As a result, as illustrated in
Next, a specific configuration of the directional coupler 10 will be described with reference to the drawings.
As illustrated in
The outer electrodes 14a, 14e, and 14b are provided on a side surface of the multilayer body 12 on the positive side in the y-axis direction so as to be arranged in this order from the positive side to the negative side in the x-axis direction. The outer electrodes 14c, 14f, and 14d are provided on a side surface of the multilayer body 12 on the negative side in the y-axis direction so as to be arranged in this order from the positive side to the negative side in the x-axis direction.
As illustrated in
As illustrated in
The low pass filter LPF1 includes the coil L1 and the capacitors C1 and C2. The coil L1 includes line portions 22 (22a to 22d) and via hole conductors b1 to b5, and has a spiral shape that spirals clockwise going from the positive side to the negative side in the z-axis direction. Here, in the coil L1, an end portion on the upstream side in the clockwise direction is termed an upstream end and an end portion on the downstream side in the clockwise direction is termed a downstream end. The line portion 22a is a linear conductor layer that is provided on the insulator layer 16d and the upstream end thereof is connected to the outer electrode 14a. The line portions 22b to 22d are linear conductor layers that are provided on the insulator layers 16e to 16g, respectively. The via hole conductor b1 extends through the insulator layer 16d in the z-axis direction and connects the downstream end of the line portion 22a and the upstream end of the line portion 22b to each other. The via hole conductor b2 extends through the insulator layer 16e in the z-axis direction and connects the downstream end of the line portion 22b and the upstream end of the line portion 22c to each other. The via hole conductor b3 extends through the insulator layer 16f in the z-axis direction and connects the downstream end of the line portion 22c and the upstream end of the line portion 22d to each other. The via hole conductors b4 and b5 respectively extend through the insulator layers 16g and 16h in the z-axis direction and are connected to each other. The via hole conductor b4 is connected to the downstream end of the line portion 22d. The via hole conductor b5 is connected to the via hole conductor b6. Thus, the coil L1 is connected between the main line M and the outer electrode 14a.
The capacitor C1 includes a capacitor conductor layer 32a and a ground conductor layer 34. The capacitor conductor layer 32a is provided on the insulator layer 16o and is connected to the outer electrode 14a. The ground conductor layer 34 is provided on the insulator layer 16p and preferably has a rectangular or substantially rectangular shape that covers substantially the entire surface of the insulator layer 16p. Thus, the capacitor conductor layer 32a and the ground conductor layer 34 face each other with the insulator layer 16o interposed therebetween and a capacitance is generated between the capacitor conductor layer 32a and the ground conductor layer 34. The ground conductor layer 34 is connected to the outer electrodes 14e and 14f. Hence, the capacitor C1 is connected between the outer electrode 14a and the outer electrodes 14e and 14f. That is, the capacitor C1 is connected between a point between the coil L1 and the outer electrode 14a, and the outer electrodes 14e and 14f.
The capacitor C2 includes a capacitor conductor layer 26a and ground conductor layers 30a and 30b. The capacitor conductor layer 26a is provided on the insulator layer 16i and is connected to the via hole conductors b5 and b6. The ground conductor layers 30a and 30b are provided on the insulator layers 16h and 16j and preferably have rectangular or substantially rectangular shapes that cover substantially the entire surfaces of the insulator layers 16h and 16j, respectively. Thus, the capacitor conductor layer 26a faces the ground conductor layers 30a and 30b with the insulator layers 16h and 16i interposed between the capacitor conductor layer 26a and the ground conductor layers 30a and 30b, and capacitances are generated between the capacitor conductor layer 26a and the ground conductor layers 30a and 30b. The ground conductor layers 30a and 30b are connected to the outer electrodes 14e and 14f. Hence, the capacitor C2 is connected between a point between the coil L1 and the main line M, and the outer electrodes 14e and 14f.
The low pass filter LPF2 includes the coil L2 and the capacitors C3 and C4. The low pass filter LPF2 has a structure that is symmetric to the low pass filter LPF1 with respect to the perpendicular bisector of the long sides of each of the insulator layers 16 when viewed in plan from the z-axis direction.
The coil L2 includes line portions 24 (24a to 24d) and via hole conductors b9 to b13, and has a spiral shape that spirals counterclockwise going from the positive side to the negative side in the z-axis direction. Here, in the coil L2, an end portion on the upstream side in the counterclockwise direction is termed an upstream end and an end portion on the downstream side in the counterclockwise direction is termed a downstream end. The line portion 24a is a linear conductor layer that is provided on the insulator layer 16d and the upstream end thereof is connected to the outer electrode 14b. The line portions 24b to 24d are linear conductor layers that are provided on the insulator layers 16e to 16g, respectively. The via hole conductor b9 extends through the insulator layer 16d in the z-axis direction and connects the downstream end of the line portion 24a and the upstream end of the line portion 24b to each other. The via hole conductor b10 extends through the insulator layer 16e in the z-axis direction and connects the downstream end of the line portion 24b and the upstream end of the line portion 24c to each other. The via hole conductor b11 extends through the insulator layer 16f in the z-axis direction and connects the downstream end of the line portion 24c and the upstream end of the line portion 24d to each other. The via hole conductors b12 and b13 respectively extend through the insulator layers 16g and 16h in the z-axis direction and are connected to each other. The via hole conductor b12 is connected to the downstream end of the line portion 24d. The via hole conductor b13 is connected to the via hole conductor b14. Thus, the coil L2 is connected between the main line M and the outer electrode 14b.
The capacitor C3 includes a capacitor conductor layer 32b and the ground conductor layer 34. The capacitor conductor layer 32b is provided on the insulator layer 16o and is connected to the outer electrode 14b. The ground conductor layer 34 is provided on the insulator layer 16p and preferably has a rectangular or substantially rectangular shape that covers substantially the entire surface of the insulator layer 16p. Thus, the capacitor conductor layer 32b and the ground conductor layer 34 face each other with the insulator layer 16o interposed therebetween and a capacitance is generated between the capacitor conductor layer 32b and the ground conductor layer 34. The ground conductor layer 34 is connected to the outer electrodes 14e and 14f. Hence, the capacitor C3 is connected between the outer electrode 14b and the outer electrodes 14e and 14f. That is, the capacitor C3 is connected between a point between the coil L2 and the outer electrode 14b, and the outer electrodes 14e and 14f.
The capacitor C4 includes a capacitor conductor layer 26b and the ground conductor layers 30a and 30b. The capacitor conductor layer 26b is provided on the insulator layer 16i and is connected to the via hole conductors b13 and b14. The ground conductor layers 30a and 30b are provided on the insulator layers 16h and 16j and preferably have rectangular or substantially rectangular shapes that cover substantially the entire surfaces of the insulator layers 16h and 16j, respectively. Thus, the capacitor conductor layer 26b faces the ground conductor layers 30a and 30b with the insulator layers 16h and 16i interposed between the capacitor conductor layer 26b and the ground conductor layers 30a and 30b, and capacitances are generated between the capacitor conductor layer 26b and the ground conductor layers 30a and 30b. The ground conductor layers 30a and 30b are connected to the outer electrodes 14e and 14f. Hence, the capacitor C4 is connected between a point between the coil L2 and the main line M, and the outer electrodes 14e and 14f.
The capacitor C5 includes capacitor conductor layers 36 and 38. The capacitor conductor layer 36 is provided on the insulator layer 16b and is connected to the outer electrode 14b. The capacitor conductor layer 38 is provided on the insulator layer 16c and is connected to the outer electrode 14a. The capacitor conductor layer 36 and the capacitor conductor layer face each other with the insulator layer 16b interposed therebetween and a capacitance is generated between the capacitor conductor layer 36 and the capacitor conductor layer 38. Hence, the capacitor C5 is connected, in parallel to the main line M, between a point between the coil L1 and the outer electrode 14a and a point between the coil L2 and the outer electrode 14b.
The above-described directional coupler 10 achieves a degree-of-coupling characteristic that is close to uniform. More specifically, in the directional coupler 10, the low pass filter LPF1 is connected between the outer electrode 14a and the main line M, and the low pass filter LPF2 is connected between the outer electrode 14b and the main line M. The low pass filters LPF1 and LPF2 have an insertion loss characteristic in which attenuation increases with increasing frequency in the certain frequency band. Hence, as the frequency of a high-frequency signal input from the outer electrode 14a increases, the power of the high-frequency signal that flows through the low pass filters LPF1 and LPF2 to the ground, to which the outer electrodes 14e and 14f are connected, increases. For this reason, the power of the high-frequency signal that passes through the main line M becomes small. As a result, as illustrated in
In addition, in the directional coupler 10, the high pass filter HPF is connected, in parallel to the main line M, between a point between the coil L1 and the outer electrode 14a and a point between the coil L2 and the outer electrode 14b. The high pass filter HPF has a characteristic in which attenuation decreases with increasing frequency in the certain frequency band. Hence, when the frequency of a high-frequency signal input from the outer electrode 14a increases, the high-frequency signal is almost entirely prevented from passing through the low pass filters LPF1 and LPF2 and the main line M, and passes through the high pass filter HPF. As a result, as illustrated in
In the directional coupler 10, as illustrated in FIG. 6, the ground conductor layers 30a and 30b are preferably provided between the coils L1 and L2, and the main line M and the sub line S. Consequently, the influence of an electric field and a magnetic field which are generated by the coils L1 and L2 on the main line M and the sub line S, and the influences of an electric field and a magnetic field which are generated by the main line M and the sub line S on the coils L1 and L2 are significantly reduced or prevented.
In the directional coupler 10, among the conductor layers provided on the insulator layers 16, the ground conductor layer 34 is provided on the most negative side in the z-axis direction (the lowest side in the stacking direction). This prevents leakage of an electric field and a magnetic field which are generated in the directional coupler 10 to outside the directional coupler 10 and prevents penetration of an electric field and a magnetic field from outside the directional coupler 10 into the directional coupler 10.
In the directional coupler 10, as illustrated in FIG. 1, the capacitor C5 is connected on the outer electrode 14a side with respect to the capacitor C1 and is connected on the outer electrode 14b side with respect to the capacitor C3. Alternatively, in the directional coupler 10, the capacitor C5 may be connected on the coil L1 side with respect to the capacitor C1 and be connected on the coil L2 side with respect to the capacitor C3.
The low pass filters LPF1 and LPF2 preferably are π-type low pass filters, or alternatively, may be T-type low pass filters or L-type low pass filters, for example.
The high pass filter HPF preferably includes the capacitor C5, or alternatively, may include another high pass filter in which, for example, a plurality of capacitors are provided.
As described above, preferred embodiments of the present invention are useful for directional couplers and are particularly excellent in that a degree-of-coupling characteristic is close to uniform.
While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.
Number | Date | Country | Kind |
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2011-055323 | Mar 2011 | JP | national |
Number | Date | Country | |
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Parent | PCT/JP2012/051047 | Jan 2012 | US |
Child | 13947375 | US |